WO2002099163A2 - Procede de revetement par autocatalyse - Google Patents

Procede de revetement par autocatalyse Download PDF

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Publication number
WO2002099163A2
WO2002099163A2 PCT/GB2002/002470 GB0202470W WO02099163A2 WO 2002099163 A2 WO2002099163 A2 WO 2002099163A2 GB 0202470 W GB0202470 W GB 0202470W WO 02099163 A2 WO02099163 A2 WO 02099163A2
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
autocatalytic
deposition
preparing
solution
Prior art date
Application number
PCT/GB2002/002470
Other languages
English (en)
Other versions
WO2002099163A3 (fr
Inventor
Daniel Robert Johnson
William Norman Damerell
Stephen George Appleton
Gregory Peter Wade Fixter
Original Assignee
Qinetiq Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qinetiq Limited filed Critical Qinetiq Limited
Priority to AU2002302775A priority Critical patent/AU2002302775A1/en
Publication of WO2002099163A2 publication Critical patent/WO2002099163A2/fr
Publication of WO2002099163A3 publication Critical patent/WO2002099163A3/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1651—Two or more layers only obtained by electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/285—Sensitising or activating with tin based compound or composition

Abstract

Le plaquage autocatalytique est une forme de plaquage sans électrode dans lequel un métal, notamment le cobalt, le nickel, l'or, l'argent ou le cuivre, est déposé sur un substrat par un traitement chimique réducteur. Les revêtements obtenus par ce traitement sont généralement plus uniformes et adhérents que ceux que l'on obtient par les autres traitements. Ils conviennent en outre à l'application sur des surfaces aux formes inhabituelles. Ce traitement convient également au revêtement de surfaces non métalliques après susceptibilisation appropriée su substrat. Le dépôt autocatalytique convient au revêtement de surfaces entières, la formation de structures de métal nécessitant un traitement supplémentaire coûteux tel que le mordançage et la photolithogravure. L'invention constitue pour cette raison un procédé permettant de préparer un matériau substrat pour un dépôt ultérieur par autocatalyse d'un revêtement de métal selon un tracé prédéterminé.
PCT/GB2002/002470 2001-06-04 2002-05-27 Procede de revetement par autocatalyse WO2002099163A2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2002302775A AU2002302775A1 (en) 2001-06-04 2002-05-27 Autocatalytic coating method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0113408A GB0113408D0 (en) 2001-06-04 2001-06-04 Autocatalytic coating method
GB0113408.9 2001-06-04

Publications (2)

Publication Number Publication Date
WO2002099163A2 true WO2002099163A2 (fr) 2002-12-12
WO2002099163A3 WO2002099163A3 (fr) 2003-10-16

Family

ID=9915760

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB2002/002470 WO2002099163A2 (fr) 2001-06-04 2002-05-27 Procede de revetement par autocatalyse

Country Status (4)

Country Link
AU (1) AU2002302775A1 (fr)
GB (1) GB0113408D0 (fr)
WO (1) WO2002099163A2 (fr)
ZA (1) ZA200309379B (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2393736A (en) * 2002-10-01 2004-04-07 Qinetiq Ltd A Cathode for use in an Electroplating Cell
WO2006038011A2 (fr) * 2004-10-08 2006-04-13 Qinetiq Limited Particules de charge actives dans des encres
EP1813439A1 (fr) 2006-01-27 2007-08-01 European Central Bank Dispositif de sécurité électronique pour documents de sécurité utilisant un générateur de puissance thermoélectrique
EP1813438A1 (fr) 2006-01-27 2007-08-01 European Central Bank Moyenne de sécurité électronique pour les documents de sécurité avec une pile électrochimique
US7794629B2 (en) 2003-11-25 2010-09-14 Qinetiq Limited Composite materials
WO2010072192A3 (fr) * 2008-12-23 2010-11-18 Bundesdruckerei Gmbh Document de sécurité et/ou de valeur comportant une structure conductrice et procédé de fabrication

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110284126A (zh) * 2019-08-02 2019-09-27 湖州胜僖电子科技有限公司 用于触摸屏的导电膜镀镍金工艺

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0132677A1 (fr) * 1983-07-22 1985-02-13 Bayer Ag Procédé pour l'activation de surfaces de substrat pour la métallisation partielle directe de supports
US4668533A (en) * 1985-05-10 1987-05-26 E. I. Du Pont De Nemours And Company Ink jet printing of printed circuit boards
US5453121A (en) * 1993-07-01 1995-09-26 Tonejet Corporation Pty Ltd. Liquid ink jet ink
DE19823112A1 (de) * 1998-05-22 1999-11-25 Htw Dresden Verfahren zur Sensibilisierung von dielektrischen Oberflächen zur stromlosen Abscheidung haftfester Metallschichten

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0132677A1 (fr) * 1983-07-22 1985-02-13 Bayer Ag Procédé pour l'activation de surfaces de substrat pour la métallisation partielle directe de supports
US4668533A (en) * 1985-05-10 1987-05-26 E. I. Du Pont De Nemours And Company Ink jet printing of printed circuit boards
US5453121A (en) * 1993-07-01 1995-09-26 Tonejet Corporation Pty Ltd. Liquid ink jet ink
DE19823112A1 (de) * 1998-05-22 1999-11-25 Htw Dresden Verfahren zur Sensibilisierung von dielektrischen Oberflächen zur stromlosen Abscheidung haftfester Metallschichten

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2393736A (en) * 2002-10-01 2004-04-07 Qinetiq Ltd A Cathode for use in an Electroplating Cell
US7794629B2 (en) 2003-11-25 2010-09-14 Qinetiq Limited Composite materials
WO2006038011A2 (fr) * 2004-10-08 2006-04-13 Qinetiq Limited Particules de charge actives dans des encres
WO2006038011A3 (fr) * 2004-10-08 2007-08-02 Qinetiq Ltd Particules de charge actives dans des encres
EP1813439A1 (fr) 2006-01-27 2007-08-01 European Central Bank Dispositif de sécurité électronique pour documents de sécurité utilisant un générateur de puissance thermoélectrique
EP1813438A1 (fr) 2006-01-27 2007-08-01 European Central Bank Moyenne de sécurité électronique pour les documents de sécurité avec une pile électrochimique
WO2010072192A3 (fr) * 2008-12-23 2010-11-18 Bundesdruckerei Gmbh Document de sécurité et/ou de valeur comportant une structure conductrice et procédé de fabrication
CN102264946A (zh) * 2008-12-23 2011-11-30 联邦印刷厂有限公司 具有导电结构的安全证件和/或价值证件及其制备方法

Also Published As

Publication number Publication date
WO2002099163A3 (fr) 2003-10-16
GB0113408D0 (en) 2001-07-25
AU2002302775A1 (en) 2002-12-16
ZA200309379B (en) 2005-03-02

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