WO2002098598A3 - Improved solder printing method - Google Patents

Improved solder printing method Download PDF

Info

Publication number
WO2002098598A3
WO2002098598A3 PCT/GB2002/002045 GB0202045W WO02098598A3 WO 2002098598 A3 WO2002098598 A3 WO 2002098598A3 GB 0202045 W GB0202045 W GB 0202045W WO 02098598 A3 WO02098598 A3 WO 02098598A3
Authority
WO
WIPO (PCT)
Prior art keywords
stencil
printing method
solder printing
solder paste
printing
Prior art date
Application number
PCT/GB2002/002045
Other languages
French (fr)
Other versions
WO2002098598A2 (en
Inventor
Deborah Mallon
Andrew David Price
Leela Josephine Sequeira
Robert Derek Williams
Original Assignee
Alpha Fry Ltd
Deborah Mallon
Andrew David Price
Leela Josephine Sequeira
Robert Derek Williams
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alpha Fry Ltd, Deborah Mallon, Andrew David Price, Leela Josephine Sequeira, Robert Derek Williams filed Critical Alpha Fry Ltd
Publication of WO2002098598A2 publication Critical patent/WO2002098598A2/en
Publication of WO2002098598A3 publication Critical patent/WO2002098598A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/127—Lubricants, e.g. during drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Screen Printers (AREA)

Abstract

A method of printing a solder paste formulation onto a substrate surface through a stencil wherein a lubricant additive is included in the solder paste formulation in order to improve the release of the solder paste from the stencil. The method of the present invention provides an improved release of the solder pastes from a stencil during printing and is therefore of particular use in fine pitch stencil printing.
PCT/GB2002/002045 2001-06-07 2002-05-02 Improved solder printing method WO2002098598A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0113898A GB2376439A (en) 2001-06-07 2001-06-07 Improved printing method
GB0113898.1 2001-06-07

Publications (2)

Publication Number Publication Date
WO2002098598A2 WO2002098598A2 (en) 2002-12-12
WO2002098598A3 true WO2002098598A3 (en) 2003-09-25

Family

ID=9916121

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB2002/002045 WO2002098598A2 (en) 2001-06-07 2002-05-02 Improved solder printing method

Country Status (2)

Country Link
GB (1) GB2376439A (en)
WO (1) WO2002098598A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104203492B (en) * 2012-04-05 2015-09-30 千住金属工业株式会社 Scaling powder and soldering paste

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07132395A (en) * 1993-11-15 1995-05-23 Showa Denko Kk Cream solder
JPH08174265A (en) * 1994-12-27 1996-07-09 Matsushita Electric Ind Co Ltd Cream solder
WO1997003788A1 (en) * 1995-07-20 1997-02-06 Matsushita Electric Industrial Co., Ltd. Cream solder
DE19731151C1 (en) * 1997-07-21 1999-01-21 Degussa Solder paste for brazing and coating of aluminum and aluminum alloys

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07132395A (en) * 1993-11-15 1995-05-23 Showa Denko Kk Cream solder
JPH08174265A (en) * 1994-12-27 1996-07-09 Matsushita Electric Ind Co Ltd Cream solder
WO1997003788A1 (en) * 1995-07-20 1997-02-06 Matsushita Electric Industrial Co., Ltd. Cream solder
DE19731151C1 (en) * 1997-07-21 1999-01-21 Degussa Solder paste for brazing and coating of aluminum and aluminum alloys

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
I.W.H. LEE: "Screenable solder paste", WELDING JOURNAL., vol. 56, no. 10, October 1977 (1977-10-01), AMERICAN WELDING SOCIETY. MIAMI., US, pages 32 - 36, XP002210426, ISSN: 0043-2296 *
PATENT ABSTRACTS OF JAPAN vol. 1995, no. 08 29 September 1995 (1995-09-29) *
PATENT ABSTRACTS OF JAPAN vol. 1996, no. 11 29 November 1996 (1996-11-29) *

Also Published As

Publication number Publication date
GB2376439A (en) 2002-12-18
GB0113898D0 (en) 2001-08-01
WO2002098598A2 (en) 2002-12-12

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