GB0113898D0 - Improved printing method - Google Patents

Improved printing method

Info

Publication number
GB0113898D0
GB0113898D0 GBGB0113898.1A GB0113898A GB0113898D0 GB 0113898 D0 GB0113898 D0 GB 0113898D0 GB 0113898 A GB0113898 A GB 0113898A GB 0113898 D0 GB0113898 D0 GB 0113898D0
Authority
GB
United Kingdom
Prior art keywords
printing method
improved printing
improved
printing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GBGB0113898.1A
Other versions
GB2376439A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fernox Ltd
Original Assignee
Alpha Fry Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alpha Fry Ltd filed Critical Alpha Fry Ltd
Priority to GB0113898A priority Critical patent/GB2376439A/en
Publication of GB0113898D0 publication Critical patent/GB0113898D0/en
Priority to US10/036,952 priority patent/US6936115B2/en
Priority to PCT/GB2002/002045 priority patent/WO2002098598A2/en
Publication of GB2376439A publication Critical patent/GB2376439A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/127—Lubricants, e.g. during drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Screen Printers (AREA)
GB0113898A 2001-06-07 2001-06-07 Improved printing method Withdrawn GB2376439A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
GB0113898A GB2376439A (en) 2001-06-07 2001-06-07 Improved printing method
US10/036,952 US6936115B2 (en) 2001-06-07 2001-12-21 Soldering flux vehicle additive and fine pitch printing method
PCT/GB2002/002045 WO2002098598A2 (en) 2001-06-07 2002-05-02 Improved solder printing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0113898A GB2376439A (en) 2001-06-07 2001-06-07 Improved printing method

Publications (2)

Publication Number Publication Date
GB0113898D0 true GB0113898D0 (en) 2001-08-01
GB2376439A GB2376439A (en) 2002-12-18

Family

ID=9916121

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0113898A Withdrawn GB2376439A (en) 2001-06-07 2001-06-07 Improved printing method

Country Status (2)

Country Link
GB (1) GB2376439A (en)
WO (1) WO2002098598A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104203492B (en) * 2012-04-05 2015-09-30 千住金属工业株式会社 Scaling powder and soldering paste

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07132395A (en) * 1993-11-15 1995-05-23 Showa Denko Kk Cream solder
JPH08174265A (en) * 1994-12-27 1996-07-09 Matsushita Electric Ind Co Ltd Cream solder
WO1997003788A1 (en) * 1995-07-20 1997-02-06 Matsushita Electric Industrial Co., Ltd. Cream solder
DE19731151C1 (en) * 1997-07-21 1999-01-21 Degussa Solder paste for brazing and coating of aluminum and aluminum alloys

Also Published As

Publication number Publication date
WO2002098598A2 (en) 2002-12-12
GB2376439A (en) 2002-12-18
WO2002098598A3 (en) 2003-09-25

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)