WO2002095471A1 - Interconnexion optique - Google Patents

Interconnexion optique Download PDF

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Publication number
WO2002095471A1
WO2002095471A1 PCT/US2001/017032 US0117032W WO02095471A1 WO 2002095471 A1 WO2002095471 A1 WO 2002095471A1 US 0117032 W US0117032 W US 0117032W WO 02095471 A1 WO02095471 A1 WO 02095471A1
Authority
WO
WIPO (PCT)
Prior art keywords
optical
lens
interconnect
electrical component
optical interconnect
Prior art date
Application number
PCT/US2001/017032
Other languages
English (en)
Inventor
Rick Lytel
Howard Davidson
Theresa Sze
Nyles Nettleton
Dawei Huang
Original Assignee
Sun Microsystems, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sun Microsystems, Inc. filed Critical Sun Microsystems, Inc.
Priority to GB0229449A priority Critical patent/GB2379283B/en
Priority to PCT/US2001/017032 priority patent/WO2002095471A1/fr
Publication of WO2002095471A1 publication Critical patent/WO2002095471A1/fr

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/424—Mounting of the optical light guide
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4244—Mounting of the optical elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4245—Mounting of the opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • G02B6/426—Details of housings mounting, engaging or coupling of the package to a board, a frame or a panel
    • G02B6/4261—Packages with mounting structures to be pluggable or detachable, e.g. having latches or rails
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/4284—Electrical aspects of optical modules with disconnectable electrical connectors

Definitions

  • This invention s lmg adjacent printed circuit boards, more particularly, this invention relates to using optical signals to connect adjacent circuit boards
  • PCB printed circuit boards
  • back plane provides not only power for the PCB, but also may provide buses or pathways for signal connection between and among PCBs as well as provide physical support
  • back planes may suffer as a technique for moving fast signals from one PCB to another because of inherent inadequacies Signals generated from any location on the PCB must be routed to the back plane connector, the signals must be transmitted through the back plane connector to the back plane and then through a similar reverse path to the ultimate location on the receivmg PCB This signal path is subject to parasitic capacitance, noise, transmission line effects and other such effects which degrade the signal, and significantly slow it down Current electrical techniques for compensatmg for these inadequacies are predicted to become inadequate within a decade
  • One way to alleviate this problem is to augment PCB to PCB connections using a flex ribbon which allows a connection from one PCB to another and by-passes the back plane One end of the flex ribbon is attached to one PCB and then the other end of the ribbon is attached to the other PCB
  • PCBs are located as close together as possible In some instances the spacing between PCBs is around three or so mches Additionally, these PCBs are designed to be inserted and removed without affecting system performance
  • a flex ribbon in such a computer configuration is problematic for at least two reasons
  • One solution to this problem is to place the flex ribbon connector on the edge of the PCB
  • Second, a flex ⁇ bbon typically uses wires to transmit signals In computer systems where speed is important, the inherent slowness of current wiring schemes may not meet system speed performance criteria
  • placmg a flex ribbon connector on the edge of the PCB additional time is added to the signal path because the designer must move the signals to the end of the PCB and signal speed is slower on a flex ribbon compared to a PCB
  • an optical interconnect to connect at least one signal on one electrical component to a second electrical component using optical guides
  • the optical interconnect optically connects two electrical components by having a first frame which is flexibly connected to one electrical component
  • the frame includes a plurality of optical guides which are connected to the electrical component either electronically or optically
  • a second frame, coupled to the second electrical component also contains a plurality of optical guides
  • a mechanical guide assembly positions the first frame and the second frame so that at least one optical guide in the first frame is optically coupled to a respective optical guide m the second frame
  • the optical guide in the second frame connects to the second electrical component providing a path for a signal from the first electrical component to the second electrical component
  • the optical guides could be tubes and the tubes could be adapted to hold receive lenses to focus the light
  • the lens could be a GRIN (graded index) lens
  • the lens is approximately 1 0 mm, but could also be in the range from about 0 25 mm to about 1 2 mm If a lens is in the first frame, it could have a length less than the length of the tube and preferably positioned in the portion of the tube further from the other frame
  • an optical fiber connects a vertical cavity surface emitting laser (VCSEL) on the first electrical component to the GRIN lens
  • a lens could be disposed on the VCSEL
  • a wire connects a signal from the first electrical component to a VCSEL disposed at the first frame
  • a lens could be disposed on the VCSEL between the VCSEL and the second frame
  • the second frame contains GRIN lenses that focus the light to a photodetector coupled to the second electrical component A lens could be disposed on the photodetector between the photodetector and the GRIN lens
  • an optical fiber connects a photodetector on the first electrical component to the GRIN lens
  • a lens could be disposed on the photodetector
  • a wire connects a signal from the first electrical component to a photodetector at the first frame
  • a lens could be disposed on the photodetector between the photodetector and the second frame
  • the second frame contains GRIN lenses that focus the light from a VCSEL coupled to the second electrical component A lens could be disposed on the VCSEL between the VCSEL and the GRIN lens
  • Fig 1 is an illustration of an electrical component rack
  • Fig 2 is an illustration of the optical interconnect
  • Fig 3 is an illustration of alternate embodiments to connect the first frame to signals on the first electrical component
  • Fig 4 is an illustration of alternate embodiments to provide lenses
  • Fig 5 is an illustration of alternate embodiments of the second frame and associated optical devices
  • Fig 6 is a more detailed illustration of one embodiment of the second frame coupled to the second electrical component
  • Fig 7 is a more detailed illustration of one embodiment of the second frame coupled to the second electrical component
  • Fig 8 is a detailed view of one embodiment of the guide assembly
  • Fig. 1 illustrates a typical cabinet 110 for housing the components of a computer system.
  • Cabinet 110 houses various components which are not shown for the sake of simplicity including power supplies, disk drives, input/output units, and various cables and wires.
  • Cabinet 110 includes electrical modules 112 which may be printed circuits boards or any other type of module that could be contained in cabinet 110. Although Fig. 1 illustrates three electrical modules 112, any number is contemplated.
  • Cabinet 110 also includes back plane 114 which provides power to electrical modules 112 and also connects selected signals from electrical modules 112 to other places in cabinet 110.
  • Back plane 114 typically includes one or more buses (not shown) to which each electrical module 112 connects.
  • Electrical modules 112 can typically be inserted and removed without adversely affecting the performance of the computer system.
  • Guides 116 are provided to seat electrical modules 112 along a predefined path and to ensure connection to the back plane 114. Space is an issue in housings such as cabinet 110. Accordingly, designers attempt to position electrical modules 112 close together. For example, a 3 inch spacing between boards is not uncommon among some manufacturers.
  • This limited space between electrical modules 112 does not readily allow a technician to connect one electrical module 112 to another by attaching connectors to internal surfaces 118 and 120 of electrical modules 112a respectively.
  • An optical interconnect according to the invention includes one frame flexibly mounted to one surface of an electrical module, a second frame coupled to a second electrical module, and a guide mechanism for aligning optical paths in the two frames creating an optical path for transmitting signals to and from one electrical module to the other.
  • Fig 2. illustrates an optical interconnect 200 consistent with the principles of the invention that connects, in one embodiment, signals from one surface of an electrical module 112 to the nearest surface of another electrical module 112.
  • Optical interconnect 200 includes an assembly 202, having a frame 210, a flexible mounting assembly 212, a flexible connector 214, and alignment guides 218, and an assembly 204 having a frame 216 and alignment guides 219.
  • Frame 210 connects to a base 220 via flexible mounting assembly 212.
  • the base 220 is attached to electrical module 112 and to flexible mounting assembly 212.
  • a flexible connector 214 provides a path for signals between the base 220 and the frame 210. More specifically, the flexible connector 214 provides a path between the frame 210 and signal interfaces 222. Signal interfaces 222 loosely define the transition between electrical and optical signals and are connected to various points within electrical module 112 via connections between base 220 and electrical module 112. For the sake of simplicity, these later connections are not described but would be well within the knowledge of one skilled in the art.
  • Frame 210 also includes a plurality of optical guides 224 aligned along an axis of transmission 230.
  • Frame 216 is coupled to a base 226. Similar to base 220, base 226 couples signal interfaces 222 to locations within electrical module 112 to which base 226 is connected. Frame 216 also includes a plurality of optical guides 228 aligned along the axis of transmission 230.
  • guide members 118 and 119 provide a mechanism to ensure optical alignment between an optical guide 224 and its counterpart optical guide 228 in the axis of transmission 230. While Fig. 3 only illustrates three optical guide pairs, any number could be implemented.
  • assemblies 202 and 204 are mounted on the surfaces 118 and 120, respectively, prior to electrical module 112 being inserted in a cabinet 110.
  • System designers of electrical modules 112 attempt to ensure that the assemblies are relatively positioned opposite each other when the electrical modules 112 are inserted in the cabinet 110.
  • the flexible mounting assembly 212 positions frame 210 in optical alignment with frame 216.
  • Flexible mounting assembly 121 is pliant enough to provide sufficient optical alignment even in the presence of manufacturing errors.
  • optical interconnect 200 provides a signal transmission path between surfaces 118 and 120. While Fig. 2 illustrates base 220 connected to surface 118 and base 226 connected to surface 120, it is contemplated that the either base could be attached to either surface. Preferably, most electrical modules 112 would have on one surface bases of the same type and on the other surface, bases of the other type for symmetry.
  • Frame 210 provides optical transmission paths for signals originating from either direction via the optical guides 224 and 228.
  • Fig. 3 illustrates embodiments for creating an optical transmission path.
  • Frame 210 is preferably made from plastic via injection molding, but any material would suffice provided it can serve to optically isolate neighboring optical guides 224.
  • Optical guides 224 may include tubes 310 formed during the injection molding or by drilling out material from frame 210.
  • the tubes 310 are formed during the injection molding.
  • the injection molding process creates smoother walls which help to better optically isolate optical guides 224 as compared to drilling.
  • tubes 310 may be formed by any method such that an optical path is created that assists in isolating the optical signal from its neighbors.
  • tubes 310 could simply be represented by boundary between two materials that have a difference in refractive index.
  • tubes 310 have a diameter transverse to the axis of transmission 230 from about 0.8 mm to about 1.0 mm. More preferably, the diameter is about 0.9 mm. Tubes 310 are preferably spaced such that no two tubes 310 are closer than about 0.5 mm.
  • optical guide 224 includes a lens 312.
  • An optical fiber 314 connects lens 312 to signal interface 222.
  • Optical fiber 314 is optically coupled to both lens 312 and signal interface 222 by well known means. If lens 312 is receiving light from frame 216, then signal interface 222 is a photodetector. On the other hand, if lens 312 is to transmit a signal from base 220, then signal interface 222 is a vertical cavity emitting laser (VCSEL) or any other device able to transmit light.
  • a lens 316 is disposed between signal interface 222 and the optical fiber 314. Lens 316 could be a microlens made of glass or another material such that it can serves to focus incoming light to an adjacent signal interface 222 or focus light coming from signal interface 222 toward the optical path defined by optical guides 224 or 228.
  • the tube 310 does not contain a lens 312 and the signal interface 222 is adjacent to frame 210 instead of base 220.
  • a wire 318 transmits the signal between the base 220 and signal interface 222.
  • signal interface 222 may be either a light emitting source, such as a VCSEL, or a photodetector depending on the desired direction of the signal.
  • a lens 316 is disposed between the signal interface 222 and optical guide 224. The light emitting source and photodetector may be coupled to the frame 210 by any well known means.
  • lens 312 is a graded index (GRIN) lens that focuses the light from optical fiber 314 along optical guide 224 in the case of transmission and focuses the light received along optical guide 224 toward optical fiber 314 in the case of signal reception.
  • the length of the GRIN is less than the length of frame 210 in the direction axis of transmission 230 to aid in manufacturing, but the length could be equal to or greater than frame 210.
  • lens 312 is positioned in the portion of the tube 310 closer to base 220. Appropriate mechanisms from the art may be applied to correctly position and secure the lens 312 in the tube 310.
  • an array 410 of lenses 412 is contemplated instead of a physically separate lens 312 in each tube 310.
  • the array of lenses 410 could be made with the use of planar microlenses.
  • signal interface 222 In the case of transmission of an optical signal from base 220, signal interface 222 emits an optical signal which is relayed via optical fiber 314 to lens 312 according to one embodiment.
  • lens 312 focuses the optical signal in the direction of the optical guide 224 which is received by a respective optical guide 228 in frame 216.
  • optical guides 232 may contain tubes 510 similar to tubes 310.
  • optical guide 232 includes a lens 512 to assist in focusing light to/from signal interface 222. If lens 512 is receiving light from frame 210, then the signal interface 222 is a photodetector. On the other hand, if lens 512 is to transmit a signal from base 226, then signal interface 222 is a vertical cavity emitting laser (VCSEL) or any other device able to transmit light. In another embodiment, a lens 316 is disposed between signal interface 222 and lens 512.
  • VCSEL vertical cavity emitting laser
  • frame 216 includes side portions 610 which connect to base 226.
  • Side portions 610 include tabs 612.
  • Base 226 includes cavities 614 adapted to receive tabs 612 such that the combination of tabs 612 and cavities 614 serve to align optical guides 228 along the optical transmission or reception path of an associated signal interface 222.
  • Fig. 6 illustrates two signal interfaces 222 optically aligned with an associated optical guide 228.
  • the two signal interfaces 222 illustrated in Fig. 6 are VCSELs and include driver chips 616, VCSEL cells 618, and wires 620 which connect driver chips 616 and VCSEL cells 618.
  • Fig. 7 illustrates another embodiment of assembly 204 wherein frame 216 further includes side portions 710 and tab 712. As illustrated in Fig. 7, side portions 710 extend down around the circumference of base 226. Tabs 712 are adapted to be inserted in cavities 714 in electrical module 112.
  • tabs 612 and 712 serve to reduce one source of error by defining the location a removable component may be placed.
  • Flexible mounting assembly 212 provides a mechanism whereby frames 210 and 216 may be placed in optical alignment after electrical modules 112 have been inserted in cabinet 110.
  • One embodiment of flexible mounting assembly 212 is illustrated in Fig. 8.
  • Flexible mounting assembly 212 includes semi-rigid support members 810 including pins 812, a spring 814, positioning members 816 and 818, a scissor link 820, and frame support 822.
  • Pins 812 are adapted to insert in appropriate cavities in base 220.
  • Positioning members 816 and 818 are of unequal lengths and connect frame support 822 to semi-rigid support members 810.
  • Spring 814 biases fame support 822 in a direction away from pins 812. Although illustrated as a spring, any device which biases frame support 822 in a direction away from pins 812 would suffice.
  • Positioning members 816 and 818 work in combination with spring 814 to move frame support 822 in the bias direction relatively parallel to base 220.
  • Frame support 822 includes coarse alignment guides 824 and fine alignment guides 826.
  • Frame support 822 includes two course alignment guides 824 disposed on opposite corners of frame support 822.
  • Each coarse alignment guide 824 extends upward from frame support 822 and is generally cylindrical in shape for a distance 826 then changes in shape to become conical and having a cross section tapering as the coarse alignment guide 822 extends away from frame support 822 for a distance 828.
  • Frame support 822 also include fine alignment guides 830 disposed on opposite corners of frame support 822 and which are on adjacent corners to coarse alignment guides 824.
  • Fine alignment guides 830 extend upward from frame support 822 for a distance 832.
  • distance 832 is less than distance 826.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

L'invention concerne une interconnexion optique (200) qui connecte optiquement deux cartes (112) de circuit imprimés adjacents ou deux composants (222) électriques adjacents. L'interconnexion optique comporte un cadre flottant qui est connecté de manière souple à l'un des composants électriques. Ce cadre (210) flottant est doté de plusieurs guides (224) optiques. Ces guides (224) optiques sont connectés au composant électrique soit électroniquement soit optiquement. Un second cadre (216), couplé au second composant électrique contient également plusieurs guides (228) optiques. Un assemblage (218, 219) de guide mécanique place le premier cadre (210) et le second cadre (216) de manière à ce qu'ils soient optiquement couplés. Le guide optique du second cadre se connecte au second composant électrique fournissant un chemin pour un signal provenant du premier composant électrique au second composant électrique.
PCT/US2001/017032 2001-05-24 2001-05-24 Interconnexion optique WO2002095471A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB0229449A GB2379283B (en) 2001-05-24 2001-05-24 Optical interconnect
PCT/US2001/017032 WO2002095471A1 (fr) 2001-05-24 2001-05-24 Interconnexion optique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2001/017032 WO2002095471A1 (fr) 2001-05-24 2001-05-24 Interconnexion optique

Publications (1)

Publication Number Publication Date
WO2002095471A1 true WO2002095471A1 (fr) 2002-11-28

Family

ID=21742597

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/017032 WO2002095471A1 (fr) 2001-05-24 2001-05-24 Interconnexion optique

Country Status (2)

Country Link
GB (1) GB2379283B (fr)
WO (1) WO2002095471A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9377565B2 (en) 2012-08-10 2016-06-28 Corning Cable Systems Llc Processing of gradient index (GRIN) rods into GRIN lenses attachable to optical devices, components, and methods

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0511779A2 (fr) * 1991-05-01 1992-11-04 AT&T Corp. Techniques d'interconnexion optique
US5245680A (en) * 1993-02-05 1993-09-14 Unisys Corporation Grin lens optical backplane with dual transmitter-receiver repeaters
US5371820A (en) * 1990-07-02 1994-12-06 British Telecommunications Public Limited Company Optical hybrid motherboard interconnection system and method of assembling same
US5375184A (en) * 1992-12-29 1994-12-20 Honeywell Inc. Flexible channel optical waveguide having self-aligned ports for interconnecting optical devices
US5416872A (en) * 1993-07-06 1995-05-16 At&T Corp. Arrangement for interconnecting an optical fiber an optoelectronic component
US5420954A (en) * 1993-05-24 1995-05-30 Photonics Research Incorporated Parallel optical interconnect
JPH1144820A (ja) * 1997-07-28 1999-02-16 Nippon Telegr & Teleph Corp <Ntt> 光配線方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5371820A (en) * 1990-07-02 1994-12-06 British Telecommunications Public Limited Company Optical hybrid motherboard interconnection system and method of assembling same
EP0511779A2 (fr) * 1991-05-01 1992-11-04 AT&T Corp. Techniques d'interconnexion optique
US5375184A (en) * 1992-12-29 1994-12-20 Honeywell Inc. Flexible channel optical waveguide having self-aligned ports for interconnecting optical devices
US5245680A (en) * 1993-02-05 1993-09-14 Unisys Corporation Grin lens optical backplane with dual transmitter-receiver repeaters
US5420954A (en) * 1993-05-24 1995-05-30 Photonics Research Incorporated Parallel optical interconnect
US5416872A (en) * 1993-07-06 1995-05-16 At&T Corp. Arrangement for interconnecting an optical fiber an optoelectronic component
JPH1144820A (ja) * 1997-07-28 1999-02-16 Nippon Telegr & Teleph Corp <Ntt> 光配線方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 05 31 May 1999 (1999-05-31) *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9377565B2 (en) 2012-08-10 2016-06-28 Corning Cable Systems Llc Processing of gradient index (GRIN) rods into GRIN lenses attachable to optical devices, components, and methods

Also Published As

Publication number Publication date
GB2379283A (en) 2003-03-05
GB2379283B (en) 2004-10-27
GB0229449D0 (en) 2003-01-22

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