WO2002091435A3 - Vorrichtung zum nassreinigen von scheibenförmigen substraten - Google Patents

Vorrichtung zum nassreinigen von scheibenförmigen substraten Download PDF

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Publication number
WO2002091435A3
WO2002091435A3 PCT/EP2002/004781 EP0204781W WO02091435A3 WO 2002091435 A3 WO2002091435 A3 WO 2002091435A3 EP 0204781 W EP0204781 W EP 0204781W WO 02091435 A3 WO02091435 A3 WO 02091435A3
Authority
WO
WIPO (PCT)
Prior art keywords
processing container
wet cleaning
shaped substrates
substrate
cleaning disc
Prior art date
Application number
PCT/EP2002/004781
Other languages
English (en)
French (fr)
Other versions
WO2002091435A2 (de
Inventor
David Henson
Laurence Kohler
Juergen Lohmueller
Original Assignee
Mattson Wet Products Gmbh
David Henson
Laurence Kohler
Juergen Lohmueller
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mattson Wet Products Gmbh, David Henson, Laurence Kohler, Juergen Lohmueller filed Critical Mattson Wet Products Gmbh
Priority to EP02727587A priority Critical patent/EP1399949A2/de
Publication of WO2002091435A2 publication Critical patent/WO2002091435A2/de
Publication of WO2002091435A3 publication Critical patent/WO2002091435A3/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

Um auf einfache und kostengünstige Weise eine kontinuierliche Reinigung einzelner Wafer zu ermöglichen, ist eine Vorrichtung zum Nassreinigen von scheibenförmigen Substraten, insbesondere Halbleiterwafern vorgesehen, die wenigstens einen mit Behandlungsfluid befüllbaren Behandlungsbehälter (40) mit einer seitlichen Führung (50) zum Aufnehmen eines einzelnen Substrats (2) im Behälter (40), eine Hubvorrichtung (55) im Behandlungsbehälter (40) zum Ein-und Ausbringen eines Substrats (2), und eine oberhalb des Behandlungsbehälters angeordnete Aufnahmevorrichtung (36), mit wenigstens zwei separaten Führungseinrichtungen (92, 93) zur jeweiligen Aufnahme eines Substrats (2) aufweist, wobei die Führungseinrichtungen (92, 93) derart verschiebbar sind, dass sie mit der Führung (50) im Behandlungsbehälter (40) ausrichtbar sind.
PCT/EP2002/004781 2001-05-10 2002-05-02 Vorrichtung zum nassreinigen von scheibenförmigen substraten WO2002091435A2 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP02727587A EP1399949A2 (de) 2001-05-10 2002-05-02 Vorrichtung zum nassreinigen von scheibenförmigen substraten

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2001122669 DE10122669A1 (de) 2001-05-10 2001-05-10 Vorrichtung zum Nassreinigen von scheibenförmigen Substraten
DE10122669.1 2001-05-10

Publications (2)

Publication Number Publication Date
WO2002091435A2 WO2002091435A2 (de) 2002-11-14
WO2002091435A3 true WO2002091435A3 (de) 2003-03-27

Family

ID=7684259

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2002/004781 WO2002091435A2 (de) 2001-05-10 2002-05-02 Vorrichtung zum nassreinigen von scheibenförmigen substraten

Country Status (3)

Country Link
EP (1) EP1399949A2 (de)
DE (1) DE10122669A1 (de)
WO (1) WO2002091435A2 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4300556A1 (de) * 2022-06-27 2024-01-03 Siltronic AG Abdeckung für ein reinigungsmodul zum reinigen einer halbleiterscheibe und verfahren zum reinigen einer halbleiterscheibe in einer reinigungsstrasse

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0385536A1 (de) * 1989-02-27 1990-09-05 Koninklijke Philips Electronics N.V. Verfahren und Vorrichtung zum Trocknen von Substraten nach Behandlung in einer Flüssigkeit
JPH03116731A (ja) * 1989-09-28 1991-05-17 Dan Kagaku:Kk 半導体ウエハ用移送装置
US5566076A (en) * 1993-08-05 1996-10-15 Tokyo Electron Limited Semiconductor process system and positioning method and apparatus for transfer mechanism thereof
DE19706072C1 (de) * 1997-02-17 1998-06-04 Steag Microtech Gmbh Pliezhaus Vorrichtung und Verfahren zum Behandeln von Substraten in einem Fluid-Behälter
US5902402A (en) * 1995-01-05 1999-05-11 Steag Microtech Gmbh Device for chemical wet treatment

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19830162A1 (de) * 1998-07-06 2000-01-20 Steag Electronic Systems Gmbh Verfahren und Vorrichtung zum Reinigen von Substraten
US6328814B1 (en) * 1999-03-26 2001-12-11 Applied Materials, Inc. Apparatus for cleaning and drying substrates

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0385536A1 (de) * 1989-02-27 1990-09-05 Koninklijke Philips Electronics N.V. Verfahren und Vorrichtung zum Trocknen von Substraten nach Behandlung in einer Flüssigkeit
JPH03116731A (ja) * 1989-09-28 1991-05-17 Dan Kagaku:Kk 半導体ウエハ用移送装置
US5566076A (en) * 1993-08-05 1996-10-15 Tokyo Electron Limited Semiconductor process system and positioning method and apparatus for transfer mechanism thereof
US5902402A (en) * 1995-01-05 1999-05-11 Steag Microtech Gmbh Device for chemical wet treatment
DE19706072C1 (de) * 1997-02-17 1998-06-04 Steag Microtech Gmbh Pliezhaus Vorrichtung und Verfahren zum Behandeln von Substraten in einem Fluid-Behälter

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 015, no. 315 (E - 1099) 12 August 1991 (1991-08-12) *

Also Published As

Publication number Publication date
DE10122669A1 (de) 2002-12-12
EP1399949A2 (de) 2004-03-24
WO2002091435A2 (de) 2002-11-14

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