WO2002091435A3 - Vorrichtung zum nassreinigen von scheibenförmigen substraten - Google Patents

Vorrichtung zum nassreinigen von scheibenförmigen substraten Download PDF

Info

Publication number
WO2002091435A3
WO2002091435A3 PCT/EP2002/004781 EP0204781W WO02091435A3 WO 2002091435 A3 WO2002091435 A3 WO 2002091435A3 EP 0204781 W EP0204781 W EP 0204781W WO 02091435 A3 WO02091435 A3 WO 02091435A3
Authority
WO
WIPO (PCT)
Prior art keywords
processing container
wet cleaning
shaped substrates
substrate
cleaning disc
Prior art date
Application number
PCT/EP2002/004781
Other languages
English (en)
French (fr)
Other versions
WO2002091435A2 (de
Inventor
David Henson
Laurence Kohler
Juergen Lohmueller
Original Assignee
Mattson Wet Products Gmbh
David Henson
Laurence Kohler
Juergen Lohmueller
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mattson Wet Products Gmbh, David Henson, Laurence Kohler, Juergen Lohmueller filed Critical Mattson Wet Products Gmbh
Priority to EP02727587A priority Critical patent/EP1399949A2/de
Publication of WO2002091435A2 publication Critical patent/WO2002091435A2/de
Publication of WO2002091435A3 publication Critical patent/WO2002091435A3/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

Um auf einfache und kostengünstige Weise eine kontinuierliche Reinigung einzelner Wafer zu ermöglichen, ist eine Vorrichtung zum Nassreinigen von scheibenförmigen Substraten, insbesondere Halbleiterwafern vorgesehen, die wenigstens einen mit Behandlungsfluid befüllbaren Behandlungsbehälter (40) mit einer seitlichen Führung (50) zum Aufnehmen eines einzelnen Substrats (2) im Behälter (40), eine Hubvorrichtung (55) im Behandlungsbehälter (40) zum Ein-und Ausbringen eines Substrats (2), und eine oberhalb des Behandlungsbehälters angeordnete Aufnahmevorrichtung (36), mit wenigstens zwei separaten Führungseinrichtungen (92, 93) zur jeweiligen Aufnahme eines Substrats (2) aufweist, wobei die Führungseinrichtungen (92, 93) derart verschiebbar sind, dass sie mit der Führung (50) im Behandlungsbehälter (40) ausrichtbar sind.
PCT/EP2002/004781 2001-05-10 2002-05-02 Vorrichtung zum nassreinigen von scheibenförmigen substraten WO2002091435A2 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP02727587A EP1399949A2 (de) 2001-05-10 2002-05-02 Vorrichtung zum nassreinigen von scheibenförmigen substraten

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10122669.1 2001-05-10
DE2001122669 DE10122669A1 (de) 2001-05-10 2001-05-10 Vorrichtung zum Nassreinigen von scheibenförmigen Substraten

Publications (2)

Publication Number Publication Date
WO2002091435A2 WO2002091435A2 (de) 2002-11-14
WO2002091435A3 true WO2002091435A3 (de) 2003-03-27

Family

ID=7684259

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2002/004781 WO2002091435A2 (de) 2001-05-10 2002-05-02 Vorrichtung zum nassreinigen von scheibenförmigen substraten

Country Status (3)

Country Link
EP (1) EP1399949A2 (de)
DE (1) DE10122669A1 (de)
WO (1) WO2002091435A2 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4300556A1 (de) * 2022-06-27 2024-01-03 Siltronic AG Abdeckung für ein reinigungsmodul zum reinigen einer halbleiterscheibe und verfahren zum reinigen einer halbleiterscheibe in einer reinigungsstrasse

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0385536A1 (de) * 1989-02-27 1990-09-05 Koninklijke Philips Electronics N.V. Verfahren und Vorrichtung zum Trocknen von Substraten nach Behandlung in einer Flüssigkeit
JPH03116731A (ja) * 1989-09-28 1991-05-17 Dan Kagaku:Kk 半導体ウエハ用移送装置
US5566076A (en) * 1993-08-05 1996-10-15 Tokyo Electron Limited Semiconductor process system and positioning method and apparatus for transfer mechanism thereof
DE19706072C1 (de) * 1997-02-17 1998-06-04 Steag Microtech Gmbh Pliezhaus Vorrichtung und Verfahren zum Behandeln von Substraten in einem Fluid-Behälter
US5902402A (en) * 1995-01-05 1999-05-11 Steag Microtech Gmbh Device for chemical wet treatment

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19830162A1 (de) * 1998-07-06 2000-01-20 Steag Electronic Systems Gmbh Verfahren und Vorrichtung zum Reinigen von Substraten
US6328814B1 (en) * 1999-03-26 2001-12-11 Applied Materials, Inc. Apparatus for cleaning and drying substrates

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0385536A1 (de) * 1989-02-27 1990-09-05 Koninklijke Philips Electronics N.V. Verfahren und Vorrichtung zum Trocknen von Substraten nach Behandlung in einer Flüssigkeit
JPH03116731A (ja) * 1989-09-28 1991-05-17 Dan Kagaku:Kk 半導体ウエハ用移送装置
US5566076A (en) * 1993-08-05 1996-10-15 Tokyo Electron Limited Semiconductor process system and positioning method and apparatus for transfer mechanism thereof
US5902402A (en) * 1995-01-05 1999-05-11 Steag Microtech Gmbh Device for chemical wet treatment
DE19706072C1 (de) * 1997-02-17 1998-06-04 Steag Microtech Gmbh Pliezhaus Vorrichtung und Verfahren zum Behandeln von Substraten in einem Fluid-Behälter

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 015, no. 315 (E - 1099) 12 August 1991 (1991-08-12) *

Also Published As

Publication number Publication date
DE10122669A1 (de) 2002-12-12
EP1399949A2 (de) 2004-03-24
WO2002091435A2 (de) 2002-11-14

Similar Documents

Publication Publication Date Title
TWI370916B (en) Tape circuit substrate, semiconductor chip package including the same, and liquid crystal display device including the semiconductor chip package
AU2001249659A1 (en) Method of forming vias in silicon carbide and resulting devices and circuits
AU7454501A (en) Nitride semiconductor substrate and method for manufacturing the same, and nitride semiconductor device using nitride semiconductor substrate
EP1045436A4 (de) Halbleitervorrichtung, substrat für elektro-optische vorrichtung, elektro-optische vorrichtung, elektronische anlage, und projektionsanzeigevorrichtung
TW200614420A (en) Semiconductor structure and semiconductor process
SG97858A1 (en) Chip scale surface mount package for semiconductor device and process of fabricating the same
SG106568A1 (en) Chip scale surface mount package for semiconductor device and process of fabricating the same
WO2004111659A3 (en) Methods and apparatus for packaging integrated circuit devices
MX2009004308A (es) Dispositivo para transporte de envases teniendo un disco de alimentacion rotatorio.
MY164303A (en) Method and device for processing silicon substrates
WO2002029862A3 (en) Integrated semiconductor substrate bevel cleaning apparatus and method
AU5117000A (en) Apparatus for processing and sorting semiconductor devices received in trays
WO2003019643A1 (fr) Dispositif semi-conducteur comportant un film isolant presentant une permittivite elevee et son procede de production
AU2003240569A8 (en) Method of making an soi semiconductor device having enhanced, self-aligned dielectric regions in the bulk silicon substrate
TW200722397A (en) Glass substrate for semiconductor devices, and chip scale package using the same
WO2002091435A3 (de) Vorrichtung zum nassreinigen von scheibenförmigen substraten
WO1998059374A3 (en) Insulated gate power semiconductor device having a semi-insulating semiconductor substrate
TWI265582B (en) Various structure/height bumps for wafer level-chip scale package
WO2008021265A3 (en) Semiconductor substrate cleaning apparatus
HK1045024B (zh) 具有深襯底接觸的半導體器件
WO2007062199A3 (en) Device and method for holding a substrate
WO2004070778A3 (en) Apparatus and method for polishing semiconductor wafers using one or more pivotable load-and-unload cups
ATE402126T1 (de) Hydrophile oberfläche mit temporären schutzverkleidungen
DE50212016D1 (de)
AU7381200A (en) Semiconductor wafer level package

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): JP KR US

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
WWE Wipo information: entry into national phase

Ref document number: 2002727587

Country of ref document: EP

WWP Wipo information: published in national office

Ref document number: 2002727587

Country of ref document: EP

WWW Wipo information: withdrawn in national office

Ref document number: 2002727587

Country of ref document: EP

NENP Non-entry into the national phase

Ref country code: JP

WWW Wipo information: withdrawn in national office

Country of ref document: JP