WO2002063682A3 - Lithographic type microelectronic spring structures with improved contours - Google Patents

Lithographic type microelectronic spring structures with improved contours Download PDF

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Publication number
WO2002063682A3
WO2002063682A3 PCT/US2001/049922 US0149922W WO02063682A3 WO 2002063682 A3 WO2002063682 A3 WO 2002063682A3 US 0149922 W US0149922 W US 0149922W WO 02063682 A3 WO02063682 A3 WO 02063682A3
Authority
WO
WIPO (PCT)
Prior art keywords
improved
substrate
lithographic
spring structures
microelectronic spring
Prior art date
Application number
PCT/US2001/049922
Other languages
French (fr)
Other versions
WO2002063682A2 (en
Inventor
Benjamin N Eldridge
Stuart W Wenzel
Original Assignee
Formfactor Inc
Benjamin N Eldridge
Stuart W Wenzel
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/710,539 external-priority patent/US7189077B1/en
Application filed by Formfactor Inc, Benjamin N Eldridge, Stuart W Wenzel filed Critical Formfactor Inc
Priority to AU2002249841A priority Critical patent/AU2002249841A1/en
Publication of WO2002063682A2 publication Critical patent/WO2002063682A2/en
Publication of WO2002063682A3 publication Critical patent/WO2002063682A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06727—Cantilever beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • H05K7/1069—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting with spring contact pieces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
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    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01012—Magnesium [Mg]
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/01013—Aluminum [Al]
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    • H01—ELECTRIC ELEMENTS
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/01023—Vanadium [V]
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/01024—Chromium [Cr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/01029—Copper [Cu]
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    • H01L2924/01046—Palladium [Pd]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/01047—Silver [Ag]
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    • H01L2924/01049—Indium [In]
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    • H01L2924/01074—Tungsten [W]
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    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Geometry (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Measuring Leads Or Probes (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

Improved lithographic type microelectronic spring structures and methods are disclosed, for providing improved tip height over a substrate, an improved elastic range, increased strength and reliability, and increased spring rates. The improved structures are suitable for being formed from a single integrated layer (or series of layers) deposited over a molded sacrificial substrate, thus avoiding multiple stepped lithographic layers and reducing manufacturing costs. The present invention additionally provides a lithographic type spring contact that is corrugated to increase it effective length and elastic range and to reduce its footprint over a substrate, and springs which are contoured in plan view. The present invention further provides combination (both series and parallel) electrical contacts tips for lithographic type microelectronic spring structures. The microelectronic spring structures according to the present invention are particularly useful for making very fine pitch arrays of electrical connectors for use with iUS0150688 circuits and other substrate-mounted electronic devices.
PCT/US2001/049922 2000-11-09 2001-11-08 Lithographic type microelectronic spring structures with improved contours WO2002063682A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2002249841A AU2002249841A1 (en) 2000-11-09 2001-11-08 Lithographic type microelectronic spring structures with improved contours

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/710,539 2000-11-09
US09/710,539 US7189077B1 (en) 1999-07-30 2000-11-09 Lithographic type microelectronic spring structures with improved contours

Publications (2)

Publication Number Publication Date
WO2002063682A2 WO2002063682A2 (en) 2002-08-15
WO2002063682A3 true WO2002063682A3 (en) 2003-12-31

Family

ID=24854441

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/049922 WO2002063682A2 (en) 2000-11-09 2001-11-08 Lithographic type microelectronic spring structures with improved contours

Country Status (3)

Country Link
AU (1) AU2002249841A1 (en)
TW (1) TW558856B (en)
WO (1) WO2002063682A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8964280B2 (en) 2006-06-30 2015-02-24 Qualcomm Mems Technologies, Inc. Method of manufacturing MEMS devices providing air gap control

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7168160B2 (en) 2001-12-21 2007-01-30 Formfactor, Inc. Method for mounting and heating a plurality of microelectronic components
US7010854B2 (en) 2002-04-10 2006-03-14 Formfactor, Inc. Re-assembly process for MEMS structures
US7758351B2 (en) * 2003-04-11 2010-07-20 Neoconix, Inc. Method and system for batch manufacturing of spring elements
US20080043315A1 (en) * 2006-08-15 2008-02-21 Cummings William J High profile contacts for microelectromechanical systems
US7684106B2 (en) 2006-11-02 2010-03-23 Qualcomm Mems Technologies, Inc. Compatible MEMS switch architecture
US7674112B2 (en) 2006-12-28 2010-03-09 Formfactor, Inc. Resilient contact element and methods of fabrication
US8963159B2 (en) 2011-04-04 2015-02-24 Qualcomm Mems Technologies, Inc. Pixel via and methods of forming the same
US9134527B2 (en) 2011-04-04 2015-09-15 Qualcomm Mems Technologies, Inc. Pixel via and methods of forming the same
JP7292921B2 (en) * 2019-03-29 2023-06-19 株式会社日本マイクロニクス Multi-pin structure probe body and probe card
CN113376413B (en) * 2020-03-10 2023-12-19 台湾中华精测科技股份有限公司 Vertical probe head and double-arm probe thereof
US20240125847A1 (en) * 2022-10-12 2024-04-18 Macom Technology Solutions Holdings, Inc. Voice coil leaf spring prober
WO2024189575A1 (en) * 2023-03-14 2024-09-19 Te Connectivity Solutions Gmbh Electrical contact with textured contact interface

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5152695A (en) * 1991-10-10 1992-10-06 Amp Incorporated Surface mount electrical connector
JPH07333232A (en) * 1994-06-13 1995-12-22 Canon Inc Formation of cantilever having probe
WO1997044676A1 (en) * 1996-05-17 1997-11-27 Formfactor, Inc. Microelectronic contact structure and method of making same
WO1998052224A1 (en) * 1997-05-15 1998-11-19 Formfactor, Inc. Lithographically defined microelectronic contact structures
EP0899538A1 (en) * 1997-08-27 1999-03-03 IMEC vzw A probe tip configuration, a method of fabricating probe tips and use thereof
WO1999038229A1 (en) * 1998-01-23 1999-07-29 Kinetrix, Inc. Robust, small scale electrical contactor
WO2000033089A2 (en) * 1998-12-02 2000-06-08 Formfactor, Inc. Lithographic contact elements

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5152695A (en) * 1991-10-10 1992-10-06 Amp Incorporated Surface mount electrical connector
JPH07333232A (en) * 1994-06-13 1995-12-22 Canon Inc Formation of cantilever having probe
WO1997044676A1 (en) * 1996-05-17 1997-11-27 Formfactor, Inc. Microelectronic contact structure and method of making same
WO1998052224A1 (en) * 1997-05-15 1998-11-19 Formfactor, Inc. Lithographically defined microelectronic contact structures
EP0899538A1 (en) * 1997-08-27 1999-03-03 IMEC vzw A probe tip configuration, a method of fabricating probe tips and use thereof
WO1999038229A1 (en) * 1998-01-23 1999-07-29 Kinetrix, Inc. Robust, small scale electrical contactor
WO2000033089A2 (en) * 1998-12-02 2000-06-08 Formfactor, Inc. Lithographic contact elements

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 1996, no. 04 30 April 1996 (1996-04-30) *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8964280B2 (en) 2006-06-30 2015-02-24 Qualcomm Mems Technologies, Inc. Method of manufacturing MEMS devices providing air gap control

Also Published As

Publication number Publication date
WO2002063682A2 (en) 2002-08-15
TW558856B (en) 2003-10-21
AU2002249841A1 (en) 2002-08-19

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