WO2002059704A3 - Procede et appareil de generation automatique de programmes pour traitement de plaquettes dans un dispositif de traitement multichambre de plaquettes a semi-conducteurs - Google Patents

Procede et appareil de generation automatique de programmes pour traitement de plaquettes dans un dispositif de traitement multichambre de plaquettes a semi-conducteurs Download PDF

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Publication number
WO2002059704A3
WO2002059704A3 PCT/US2002/002378 US0202378W WO02059704A3 WO 2002059704 A3 WO2002059704 A3 WO 2002059704A3 US 0202378 W US0202378 W US 0202378W WO 02059704 A3 WO02059704 A3 WO 02059704A3
Authority
WO
WIPO (PCT)
Prior art keywords
wafer processing
wafer
schedules
tool
semiconductor wafer
Prior art date
Application number
PCT/US2002/002378
Other languages
English (en)
Other versions
WO2002059704A2 (fr
Inventor
Dusan B Jevtic
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/771,254 external-priority patent/US6725114B1/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of WO2002059704A2 publication Critical patent/WO2002059704A2/fr
Publication of WO2002059704A3 publication Critical patent/WO2002059704A3/fr

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Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41865—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • General Factory Administration (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

L'invention porte sur un procédé et un appareil de génération de programmes s'appliquant à une plaquette dans un dispositif de traitement multichambre de plaquettes à semi-conducteurs. Ce procédé consiste à reproduire un tracé formant une série de chambres dans lesquelles passe une plaquette lors de son traitement par le dispositif ; initialiser un générateur de séquences avec un noeud définissant le positionnement initial de la plaquette dans le dispositif ; générer tous les noeuds descendants pour produire une série de vecteurs interconnectant les noeuds qui, réunis, produisent un cycle représentant un programme. Tous les éventuels programmes sont analysés pour déterminer celui qui aura le rendement le plus élevé.
PCT/US2002/002378 2001-01-26 2002-01-28 Procede et appareil de generation automatique de programmes pour traitement de plaquettes dans un dispositif de traitement multichambre de plaquettes a semi-conducteurs WO2002059704A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/771,254 US6725114B1 (en) 1997-06-09 2001-01-26 Method and apparatus for automatically generating schedules for wafer processing within a multichamber semiconductor wafer processing tool
US09/771,254 2001-01-26

Publications (2)

Publication Number Publication Date
WO2002059704A2 WO2002059704A2 (fr) 2002-08-01
WO2002059704A3 true WO2002059704A3 (fr) 2003-05-08

Family

ID=25091218

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/002378 WO2002059704A2 (fr) 2001-01-26 2002-01-28 Procede et appareil de generation automatique de programmes pour traitement de plaquettes dans un dispositif de traitement multichambre de plaquettes a semi-conducteurs

Country Status (2)

Country Link
TW (1) TW526530B (fr)
WO (1) WO2002059704A2 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1826645A1 (fr) * 2006-02-25 2007-08-29 MTU Aero Engines GmbH Méthode pour la génération de chaînes de procédé
TWI426459B (zh) * 2007-10-26 2014-02-11 Hon Hai Prec Ind Co Ltd 自動識別模具出庫和入庫動作的系統及方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5444632A (en) * 1994-04-28 1995-08-22 Texas Instruments Incorporated Apparatus and method for controlling and scheduling processing machines
US6074443A (en) * 1996-10-21 2000-06-13 Applied Materials, Inc. Method and apparatus for scheduling wafer processing within a multiple chamber semiconductor wafer processing tool having a multiple blade robot
EP1058172A2 (fr) * 1999-06-01 2000-12-06 Applied Materials, Inc. Techniques de traitement de semi-conducteurs
WO2000079355A1 (fr) * 1999-06-22 2000-12-28 Brooks Automation, Inc. Unite de commande sequentielle utilisee dans la fabrication d'elements de micro-electroniques

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5444632A (en) * 1994-04-28 1995-08-22 Texas Instruments Incorporated Apparatus and method for controlling and scheduling processing machines
US6074443A (en) * 1996-10-21 2000-06-13 Applied Materials, Inc. Method and apparatus for scheduling wafer processing within a multiple chamber semiconductor wafer processing tool having a multiple blade robot
EP1058172A2 (fr) * 1999-06-01 2000-12-06 Applied Materials, Inc. Techniques de traitement de semi-conducteurs
WO2000079355A1 (fr) * 1999-06-22 2000-12-28 Brooks Automation, Inc. Unite de commande sequentielle utilisee dans la fabrication d'elements de micro-electroniques

Also Published As

Publication number Publication date
TW526530B (en) 2003-04-01
WO2002059704A2 (fr) 2002-08-01

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