WO2002058139A3 - Diamondoid-containing materials in microelectronics - Google Patents

Diamondoid-containing materials in microelectronics Download PDF

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Publication number
WO2002058139A3
WO2002058139A3 PCT/US2002/000506 US0200506W WO02058139A3 WO 2002058139 A3 WO2002058139 A3 WO 2002058139A3 US 0200506 W US0200506 W US 0200506W WO 02058139 A3 WO02058139 A3 WO 02058139A3
Authority
WO
WIPO (PCT)
Prior art keywords
diamondoid
diamondoids
integrated circuit
thermally conductive
films
Prior art date
Application number
PCT/US2002/000506
Other languages
French (fr)
Other versions
WO2002058139A2 (en
Inventor
Jeremy E Dahl
Robert M Carlson
Shenggao Liu
Original Assignee
Chevron Usa Inc
Jeremy E Dahl
Robert M Carlson
Shenggao Liu
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chevron Usa Inc, Jeremy E Dahl, Robert M Carlson, Shenggao Liu filed Critical Chevron Usa Inc
Priority to KR10-2003-7009155A priority Critical patent/KR20030090619A/en
Priority to IL15696402A priority patent/IL156964A0/en
Priority to EP02707421A priority patent/EP1368832A2/en
Priority to CA002434791A priority patent/CA2434791A1/en
Priority to JP2002558328A priority patent/JP4178030B2/en
Priority to AU2002241831A priority patent/AU2002241831B2/en
Publication of WO2002058139A2 publication Critical patent/WO2002058139A2/en
Publication of WO2002058139A3 publication Critical patent/WO2002058139A3/en
Priority to AU2007200903A priority patent/AU2007200903A1/en
Priority to AU2007200904A priority patent/AU2007200904A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
    • B82B3/00—Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J1/00—Details of electrodes, of magnetic control means, of screens, or of the mounting or spacing thereof, common to two or more basic types of discharge tubes or lamps
    • H01J1/02—Main electrodes
    • H01J1/30—Cold cathodes, e.g. field-emissive cathode
    • H01J1/304—Field-emissive cathodes
    • H01J1/3048—Distributed particle emitters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C13/00—Cyclic hydrocarbons containing rings other than, or in addition to, six-membered aromatic rings
    • C07C13/28—Polycyclic hydrocarbons or acyclic hydrocarbon derivatives thereof
    • C07C13/32—Polycyclic hydrocarbons or acyclic hydrocarbon derivatives thereof with condensed rings
    • C07C13/62—Polycyclic hydrocarbons or acyclic hydrocarbon derivatives thereof with condensed rings with more than three condensed rings
    • C07C13/64—Polycyclic hydrocarbons or acyclic hydrocarbon derivatives thereof with condensed rings with more than three condensed rings with a bridged ring system
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C17/00—Preparation of halogenated hydrocarbons
    • C07C17/093—Preparation of halogenated hydrocarbons by replacement by halogens
    • C07C17/10—Preparation of halogenated hydrocarbons by replacement by halogens of hydrogen atoms
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C17/00—Preparation of halogenated hydrocarbons
    • C07C17/093—Preparation of halogenated hydrocarbons by replacement by halogens
    • C07C17/16—Preparation of halogenated hydrocarbons by replacement by halogens of hydroxyl groups
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C17/00—Preparation of halogenated hydrocarbons
    • C07C17/38—Separation; Purification; Stabilisation; Use of additives
    • C07C17/383—Separation; Purification; Stabilisation; Use of additives by distillation
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C17/00—Preparation of halogenated hydrocarbons
    • C07C17/38—Separation; Purification; Stabilisation; Use of additives
    • C07C17/395—Separation; Purification; Stabilisation; Use of additives by treatment giving rise to a chemical modification of at least one compound
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C205/00—Compounds containing nitro groups bound to a carbon skeleton
    • C07C205/05—Compounds containing nitro groups bound to a carbon skeleton having nitro groups bound to carbon atoms of rings other than six-membered aromatic rings
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C23/00—Compounds containing at least one halogen atom bound to a ring other than a six-membered aromatic ring
    • C07C23/18—Polycyclic halogenated hydrocarbons
    • C07C23/20—Polycyclic halogenated hydrocarbons with condensed rings none of which is aromatic
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C4/00—Preparation of hydrocarbons from hydrocarbons containing a larger number of carbon atoms
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C47/00—Compounds having —CHO groups
    • C07C47/28—Saturated compounds having —CHO groups bound to carbon atoms of rings other than six—membered aromatic rings
    • C07C47/34—Saturated compounds having —CHO groups bound to carbon atoms of rings other than six—membered aromatic rings polycyclic
    • C07C47/347—Saturated compounds having —CHO groups bound to carbon atoms of rings other than six—membered aromatic rings polycyclic having a —CHO group on a condensed ring system
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C49/00—Ketones; Ketenes; Dimeric ketenes; Ketonic chelates
    • C07C49/385—Saturated compounds containing a keto group being part of a ring
    • C07C49/417—Saturated compounds containing a keto group being part of a ring polycyclic
    • C07C49/423—Saturated compounds containing a keto group being part of a ring polycyclic a keto group being part of a condensed ring system
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C7/00—Purification; Separation; Use of additives
    • C07C7/04—Purification; Separation; Use of additives by distillation
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C7/00—Purification; Separation; Use of additives
    • C07C7/12—Purification; Separation; Use of additives by adsorption, i.e. purification or separation of hydrocarbons with the aid of solids, e.g. with ion-exchangers
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C7/00—Purification; Separation; Use of additives
    • C07C7/135—Purification; Separation; Use of additives by gas-chromatography
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G83/00—Macromolecular compounds not provided for in groups C08G2/00 - C08G81/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L65/00—Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C2603/00—Systems containing at least three condensed rings
    • C07C2603/56—Ring systems containing bridged rings
    • C07C2603/90—Ring systems containing bridged rings containing more than four rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2201/00—Electrodes common to discharge tubes
    • H01J2201/30—Cold cathodes
    • H01J2201/304—Field emission cathodes
    • H01J2201/30446—Field emission cathodes characterised by the emitter material
    • H01J2201/30453—Carbon types
    • H01J2201/30457—Diamond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Nanotechnology (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Analytical Chemistry (AREA)
  • Water Supply & Treatment (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Composite Materials (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Chemical Vapour Deposition (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Formation Of Insulating Films (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

Novel uses of diamondoid-containing materials in the field of microelectronics are disclosed. Embodiments include, but are not limited to, thermally conductive films in integrated circuit packaging, low-k dielectric layers in integrated circuit multilevel interconnects, thermally conductive adhesive films, thermally conductive films in thermoelectric cooling devices, passivation films for integrated circuit devices (ICs), and field emission cathodes. The diamondoids employed in the present invention may be selected from lower diamondoids, as well as the newly provided higher diamondoids, including substituted and unsubstituted diamondoids. The higher diamondoids include tetramantane, pentamantane, hexamantane, heptamantane, octamantane, nonamantane, decamantane, and undecamantane. The diamondoid-containing material may be fabricated as a diamondoid-containing polymer, a diamondoid-containing sintered ceramic, a diamondoid ceramic composite, a CVD diamondoid film, a self-assembled diamondoid film, and a diamondoid-fullerene composite.
PCT/US2002/000506 2001-01-19 2002-01-17 Diamondoid-containing materials in microelectronics WO2002058139A2 (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
KR10-2003-7009155A KR20030090619A (en) 2001-01-19 2002-01-17 Diamondoid-containing materials in microelectronics
IL15696402A IL156964A0 (en) 2001-01-19 2002-01-17 Diamondoid-containing materials in microelectronics
EP02707421A EP1368832A2 (en) 2001-01-19 2002-01-17 Diamondoid-containing materials in microelectronics
CA002434791A CA2434791A1 (en) 2001-01-19 2002-01-17 Diamondoid-containing materials in microelectronics
JP2002558328A JP4178030B2 (en) 2001-01-19 2002-01-17 Diamondoid-containing materials in microelectronics
AU2002241831A AU2002241831B2 (en) 2001-01-19 2002-01-17 Diamondoid-containing materials in microelectronics
AU2007200903A AU2007200903A1 (en) 2001-01-19 2007-03-01 Diamondoid-containing materials in microelectronics
AU2007200904A AU2007200904A1 (en) 2001-01-19 2007-03-01 Diamondoid-containing materials in microelectronics

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US26284201P 2001-01-19 2001-01-19
US60/262,842 2001-01-19
US33493901P 2001-12-04 2001-12-04
US60/334,939 2001-12-04

Publications (2)

Publication Number Publication Date
WO2002058139A2 WO2002058139A2 (en) 2002-07-25
WO2002058139A3 true WO2002058139A3 (en) 2003-10-16

Family

ID=28044627

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/000506 WO2002058139A2 (en) 2001-01-19 2002-01-17 Diamondoid-containing materials in microelectronics

Country Status (7)

Country Link
EP (1) EP1368832A2 (en)
JP (2) JP4178030B2 (en)
KR (1) KR20030090619A (en)
AU (3) AU2002241831B2 (en)
CA (1) CA2434791A1 (en)
IL (1) IL156964A0 (en)
WO (1) WO2002058139A2 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6861481B2 (en) 2000-09-29 2005-03-01 Solvay Engineered Polymers, Inc. Ionomeric nanocomposites and articles therefrom
US7049374B2 (en) 2002-07-18 2006-05-23 Chevron U.S.A. Inc. Heterodiamondoids
US7402835B2 (en) 2002-07-18 2008-07-22 Chevron U.S.A. Inc. Heteroatom-containing diamondoid transistors
DE10253855A1 (en) * 2002-11-14 2004-06-03 Leibniz-Institut für Festkörper- und Werkstoffforschung e.V. Insulation layer material for integrated circuits in Damascene architecture
US7224532B2 (en) 2002-12-06 2007-05-29 Chevron U.S.A. Inc. Optical uses diamondoid-containing materials
US7488565B2 (en) 2003-10-01 2009-02-10 Chevron U.S.A. Inc. Photoresist compositions comprising diamondoid derivatives
US9033908B2 (en) 2006-12-21 2015-05-19 Nederlandse Organisatie Voor Toegepast—Natuurwetenschappelijk Onderzoek Tno Device for the removal of toxic substances from blood
EP2072117A1 (en) 2007-12-19 2009-06-24 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Sorbent material
US8581262B2 (en) * 2009-08-04 2013-11-12 Merck Patent Gmbh Electronic devices comprising multi cyclic hydrocarbons
WO2018123762A1 (en) * 2016-12-27 2018-07-05 Ｎｅｘｔ Ｉｎｎｏｖａｔｉｏｎ合同会社 Diamond-based electrically conducting structure, diamond-based electric component, and method for manufacturing diamond-based electrically conducting structure
JP6699827B2 (en) * 2016-12-27 2020-05-27 Ｎｅｘｔ Ｉｎｎｏｖａｔｉｏｎ合同会社 Method for manufacturing diamond-based conducting structure

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5019660A (en) * 1990-01-30 1991-05-28 Mobil Oil Corporation Diamondoid polymeric compositions
US5053434A (en) * 1989-10-25 1991-10-01 Mobil Oil Corporation Diamondoid polymeric compositions
EP0450315A1 (en) * 1990-04-04 1991-10-09 International Business Machines Corporation Copper device and use thereof
US5146314A (en) * 1990-03-09 1992-09-08 The University Of Colorado Foundation, Inc. Apparatus for semiconductor circuit chip cooling using a diamond layer
US5414189A (en) * 1992-08-24 1995-05-09 Mobil Oil Corporation Isolation of high purity diamondoid fractions and components
EP1052307A2 (en) * 1999-05-10 2000-11-15 Nanyang Technological University Heat transfer surface

Family Cites Families (9)

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Publication number Priority date Publication date Assignee Title
JPS62103367A (en) * 1985-10-28 1987-05-13 Nippon Telegr & Teleph Corp <Ntt> Synthesizing method for carbon film
JPH01181550A (en) * 1988-01-12 1989-07-19 Toppan Printing Co Ltd Multi-layer electronic circuit
US5397558A (en) * 1991-03-26 1995-03-14 Semiconductor Energy Laboratory Co., Ltd. Method of forming diamond or diamond containing carbon film
US5388027A (en) * 1993-07-29 1995-02-07 Motorola, Inc. Electronic circuit assembly with improved heatsinking
ZA954295B (en) * 1994-06-03 1996-11-25 Mobil Oil Corp Carbon-coated barrier films with increased concentration of tetrahedrally-coordinated carbon
DE4423833C2 (en) * 1994-07-07 1998-07-23 Daimler Benz Ag Lacquer layer for later coating with a top layer that is harder than the organic lacquer layer and process for surface treatment of the lacquer layer
JPH08209352A (en) * 1995-02-06 1996-08-13 Hitachi Ltd Plasma treatment and device therefor
JPH11100295A (en) * 1997-09-26 1999-04-13 Nippon Hoso Kyokai <Nhk> Formation of diamond film or diamond-like carbon film and device therefor
JP2000022055A (en) * 1998-07-07 2000-01-21 Furukawa Electric Co Ltd:The Carbon fabric composite radiator plate

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5053434A (en) * 1989-10-25 1991-10-01 Mobil Oil Corporation Diamondoid polymeric compositions
US5019660A (en) * 1990-01-30 1991-05-28 Mobil Oil Corporation Diamondoid polymeric compositions
US5146314A (en) * 1990-03-09 1992-09-08 The University Of Colorado Foundation, Inc. Apparatus for semiconductor circuit chip cooling using a diamond layer
EP0450315A1 (en) * 1990-04-04 1991-10-09 International Business Machines Corporation Copper device and use thereof
US5414189A (en) * 1992-08-24 1995-05-09 Mobil Oil Corporation Isolation of high purity diamondoid fractions and components
EP1052307A2 (en) * 1999-05-10 2000-11-15 Nanyang Technological University Heat transfer surface

Also Published As

Publication number Publication date
JP2008252107A (en) 2008-10-16
KR20030090619A (en) 2003-11-28
AU2007200904A1 (en) 2007-03-22
AU2002241831B2 (en) 2006-12-07
JP2004526305A (en) 2004-08-26
WO2002058139A2 (en) 2002-07-25
IL156964A0 (en) 2004-02-08
EP1368832A2 (en) 2003-12-10
JP4178030B2 (en) 2008-11-12
AU2007200903A1 (en) 2007-03-22
CA2434791A1 (en) 2002-07-25

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