WO2002054442A2 - Ion beam collimating system - Google Patents
Ion beam collimating system Download PDFInfo
- Publication number
- WO2002054442A2 WO2002054442A2 PCT/US2001/049866 US0149866W WO02054442A2 WO 2002054442 A2 WO2002054442 A2 WO 2002054442A2 US 0149866 W US0149866 W US 0149866W WO 02054442 A2 WO02054442 A2 WO 02054442A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- ion beam
- ferromagnetic plate
- magnetization vector
- scanned
- gap
- Prior art date
Links
- 238000010884 ion-beam technique Methods 0.000 title claims abstract description 66
- 230000005291 magnetic effect Effects 0.000 claims abstract description 63
- 239000013598 vector Substances 0.000 claims abstract description 38
- 230000005415 magnetization Effects 0.000 claims abstract description 35
- 230000007935 neutral effect Effects 0.000 claims abstract description 4
- 230000005294 ferromagnetic effect Effects 0.000 claims description 34
- 238000000034 method Methods 0.000 claims description 19
- 150000002500 ions Chemical class 0.000 claims description 17
- 230000037361 pathway Effects 0.000 claims description 12
- 230000007246 mechanism Effects 0.000 claims description 4
- 238000009877 rendering Methods 0.000 claims description 4
- 230000001537 neural effect Effects 0.000 claims description 2
- 238000005468 ion implantation Methods 0.000 abstract description 12
- 230000009471 action Effects 0.000 abstract description 3
- 230000008569 process Effects 0.000 description 12
- 239000002245 particle Substances 0.000 description 6
- 235000012431 wafers Nutrition 0.000 description 6
- 230000005669 field effect Effects 0.000 description 5
- 238000002513 implantation Methods 0.000 description 5
- 238000004364 calculation method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 241000276498 Pollachius virens Species 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000004590 computer program Methods 0.000 description 1
- 239000003302 ferromagnetic material Substances 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
- H01J37/3171—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for ion implantation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
- H01J37/147—Arrangements for directing or deflecting the discharge along a desired path
- H01J37/1472—Deflecting along given lines
- H01J37/1474—Scanning means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/3002—Details
- H01J37/3007—Electron or ion-optical systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/317—Processing objects on a microscale
- H01J2237/31701—Ion implantation
Definitions
- the present invention pertains to the field of particle accelerators and, more particularly, ion beam generators that may be used in ion implantation equipment for semiconductor manufacturing. Still more specifically, the ion implantation equipment is able to focus and render a scanned ion beam into a parallel configuration.
- the electrostatic deflection processes are intended to provide a uniform distribution of ions in terms of density and direction of travel, but in practice many ion beams usually vary in angle by about 3° or more relative to the direction of beam propagation. This variance produces undesirable effects in the ion implantation processes, as reported in United States Patent No. 4,726,689 to Pollock.
- United States Patent 5,350,926 to White et al. describes a high current broad beam ion implanter with emphasis upon systems for beam control to establish uniformity across a large ribbon shaped beam traveling in a single transverse direction.
- the ion implanter uses a Freeman, Bernas, or microwave source, from which the ion beam is extracted from source plasma through a parallel-sided convex slot.
- the ion beam passes through a pair of analyzing magnets to render the beam parallel in both axes normal to the direction of beam propagation.
- United States Patent No. 4,922,106 to Berrian et al. similarly shows an ion beam implantation device having a parallel beam generator together with mechanical and electrical scan controls that facilitate uniform implantation.
- the present invention overcomes the problems outlined above by providing a new type of ion beam collimator system that uses opposed magnetic plates, as opposed to problematic shaped elements, and is readily adaptable ion implantation processes that operate upon broad beams that strongly diverge in a plane.
- the ion beam collimator system operates on a scanned ion beam that travels along a beam pathway.
- An ion beam source produces the ion beam
- a beam deflector produces a scanned ion beam such that the scanned ion beam assumes a flattened fan configuration in which ions in the beam travel in nonparallel paths along the beam pathway.
- a magnetic quadrupole lens system focuses the scanned ion beam and renders the scanned ion beam into a parallel configuration along the beam pathway.
- the quadrupole lens system comprises a first ferromagnetic plate that is magnetized by current in a first electric coil wound around the first ferromagnetic plate to produce a first magnetization vector.
- a second ferromagnetic plate is magnetized by current in a second electric coil wound around the second ferromagnetic plate to produce a second magnetization vector.
- a gap exists between the first ferromagnetic plate and the second ferromagnetic plate to permit passage of the ion beam through the gap.
- the first magnetization vector and the second magnetization vector have opposed pole orientations with respect to one another. By symmetry in the magnetic field, the gap contains a point or line of neutral magnetic field.
- the first and second magnetic vectors are, in preferred but optional embodiments, adjusted or tuned such that net magnetic field in the gap increases linearly with distance from the point of neural magnetic field.
- the term "opposed pole orientations" is defined to mean that the north pole of the first ferromagnetic plate resides over the south pole of the second ferromagnetic plate, and the south pole of the first ferromagnetic plate resides over the north pole of the second ferromagnetic plate.
- the first magnetization vector and the second magnetization vector may have directional orientations that are exactly opposite one another, or the directions may differ by an angle. This angle may comprise a small deviation from an exact opposite orientation, e.g., on the order from 170° to 190° degrees of arc, but the angle may be any angle from 90° to 270°.
- orientations of both the first magnetization vector and the second magnetization vector are perpendicular to the beam pathway.
- a mechanism may be provided to adjust the angular orientation of the first and second ferromagnetic plates, in order to fine-tune the magnetic lens assembly.
- plate may be defined as an object having thickness, width and depth dimensions such that the width and depth dimensions are much larger than the thickness, such as four, eight or ten times larger.
- the ion beam collimator system operates according to a method comprising the steps of generating an ion beam, deflecting the ion beam to produce a scanned ion beam such that the scanned ion beam assumes a flattened fan configuration in which ions in the beam travel in nonparallel paths along the beam pathway; and rendering the scanned ion beam into a parallel configuration by passing the scanned ion beam through a gap between a first ferromagnetic plate and a second ferromagnetic plate.
- the step of rendering the scanned ion beam into a parallel configuration comprises magnetizing the first ferromagnetic plate to produce a first magnetization vector, magnetizing the second ferromagnetic plate to produce a second magnetization vector wherein the first magnetization vector and the second magnetization vector have substantially opposed pole orientations with respect to one another.
- Figure 1 is a block diagram that depicts an ion beam collimator system incorporating a magnetic lens assembly
- Fig.2 is a midsectional view of the magnetic lens assembly
- Fig. 3 is a schematic diagram representing the effect of the magnetic lens assembly upon an ion beam.
- Fig.4 is a plot of distance versus magnetic field showing a linear field effect within the magnetic lens assembly.
- Fig. 1 is a block diagram showing a top plan view of an ion beam collimator system 100 that demonstrates the relationship between various system components according to the instrumentalities described above.
- the various components of Fig. 1 are intended to demonstrate one embodiment of an ion implantation device that may utilize the collimator system and should not be construed in a manner that is unduly limiting.
- the ion source 102, analyzer magnet 104, image slit 106, deflector 108 and accelerator 110 are conventional components of ion implantation systems.
- the ion source 102 may be a conventional a
- Freeman, Bernas, or microwave source from which an ion beam 112 is slot-extracted from source plasma.
- the ion beam 112 passes through the analyzer 104 for particle selection and mass control purposes, and through the image slot 106, which provides an initial beam shaping function.
- Other devices such as a deflector 108 may be provided to scan the ion beam and render the same, for example, into a broadly diverging flattened fan shape 112A that includes ions traveling in non-parallel directions.
- a magnetic lens assembly 114 focuses and renders the ion beam 112A into a parallel orientation 112B, which is accelerated by the accelerator 110 for impingement upon a target 116, such as a silicon wafer.
- Fig. 2 is a midsectional view of the magnetic lens assembly 114 taken on the median plane of magnetic lens assembly 114.
- Fig.2 is also taken along a perpendicular to arrow 118 (see Fig. 1), which represents a direction of ion beam propagation along the ion beam pathway from the ion source 102 to the target 116.
- the magnetic lens assembly 114 includes a first magnetic member 200 and a second magnetic member 202.
- the first magnetic member 200 is identical to the second magnetic member 202, except that the first magnetic member produces a first magnetization vector 204 that is aligned in an opposite direction with respect to a second magnetization vector 206 which is produced by the second magnetic member 202.
- the first magnetic member 200 and the second magnetic member 202 have opposed magnetic orientations, such that a north pole 208 of the first magnetic member 200 resides over a south pole 210 of the second magnetic member 202, and a south pole 212 of the first magnetic member 200 resides over a north pole 214 of the second magnetic member.
- the magnetic field indicated by lines 224 and 226 is a quadrupole field that varies accordingly off the median plane.
- a central line or point 229 at the center of the magnetic lens assembly 114 represents a point of zero field by symmetry. Field in the direction of magnetization vectors 204 or 206 increases linearly with distance from point 228.
- Fig.3 schematically represents the magnetic lens assembly 114 in operation on ion beam 112A.
- the ion beam 112 A contains various particles that travel on paths such as paths 300 and 302. On average, these particles travel in the direction of arrow 118, but the individual paths 300 and 302 differ from directions in parallel with the direction of arrow 118, for example, as angle ⁇ in the case of path 302.
- the action of magnetic lens assembly 114 reduces or eUminates the deviation from parallel because the field effects within gap 228 drive the ion particles towards a parallel path of travel.
- An angle ⁇ taken at a point on path 302 between a line 304 that is parallel to line 118 and a tangent 306 to path 302 is preferably reduced to zero by the action of magnetic lens assembly 114; however, it is acceptable that the magnetic lens assembly provides an angle ⁇ that is less than angle ⁇ .
- the individual particles in ion'beam travel in directions that, in preferred but optional embodiments, deviate from one another by no more that about 0.3°; however, the instrumentalities described above may be used to obtain any tolerance that is useful in parallel ion beam implantation processes. Fig.
- the ferromagnetic plates 216 and 220 have a finite width that is large compared to the dimension of gap 228, so that the fringing field effects do not substantially vary the magnetic field within gap 228.
- the calculation results shown in Fig.4 represent those for a magnetic lens assembly 114 having iron plates with a distance of six centimeters between the plates across gap 228 and a total plate length of forty centimeters.
- the calculation results shown in Fig.4 would apply in an identical manner for all points at any distance taken as a perpendicular to the plane shown in Fig.2.
- a fine tuning mechanism is provided that permits adjustment of the magnetic field in gap 228, as indicated by arrows 118 and 120 in Fig. 1.
- the first and second magnetic members 200 and 202 may be rotated within their existing planes to skew the opposite orientations of the first and second magnetization vectors 204 and 206. This rotation provides a fine tuning mechanism for adjusting the focus and parallel nature of ion beam 112.
- first magnetization vector 204 may differ from the orientation of second magnetization vector 206 by from 170° to 190°, as opposed to being exactly opposed at 180°.
- Rotations of any degree of arc may be performed, for example, such that the difference in directional orientation ranges from 90° to 270°.
Landscapes
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2002239682A AU2002239682A1 (en) | 2000-12-28 | 2001-12-28 | Ion beam collimating system |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US25884400P | 2000-12-28 | 2000-12-28 | |
US60/258,844 | 2000-12-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2002054442A2 true WO2002054442A2 (en) | 2002-07-11 |
WO2002054442A3 WO2002054442A3 (en) | 2003-01-30 |
Family
ID=22982357
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2001/049866 WO2002054442A2 (en) | 2000-12-28 | 2001-12-28 | Ion beam collimating system |
Country Status (2)
Country | Link |
---|---|
AU (1) | AU2002239682A1 (en) |
WO (1) | WO2002054442A2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006049817A2 (en) * | 2004-10-18 | 2006-05-11 | Axcelis Technologies, Inc. | Systems and methods for ion beam focusing |
CN103779161A (en) * | 2012-11-08 | 2014-05-07 | 北京中科信电子装备有限公司 | Broadband beam scanning method for uniform ion implantation |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2052146A (en) * | 1979-06-04 | 1981-01-21 | Varian Associates | Unitary Electromagnet for Double Deflection Scanning of Charged Particle Beam |
US4578663A (en) * | 1984-11-29 | 1986-03-25 | Lockheed Missiles & Space Company, Inc. | Magnetic assembly |
EP0473097A2 (en) * | 1990-08-29 | 1992-03-04 | Nissin Electric Company, Limited | System for irradiating a surface with atomic and molecular ions using two dimensional magnetic scanning |
US5483077A (en) * | 1990-08-29 | 1996-01-09 | Nissin Electric Co., Ltd. | System and method for magnetic scanning, accelerating, and implanting of an ion beam |
US5751002A (en) * | 1995-01-31 | 1998-05-12 | Nihon Shinku Gijutsu Kabushiki Kaisha | Ion implantation apparatus |
US6060715A (en) * | 1997-10-31 | 2000-05-09 | Applied Materials, Inc. | Method and apparatus for ion beam scanning in an ion implanter |
-
2001
- 2001-12-28 WO PCT/US2001/049866 patent/WO2002054442A2/en not_active Application Discontinuation
- 2001-12-28 AU AU2002239682A patent/AU2002239682A1/en not_active Abandoned
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2052146A (en) * | 1979-06-04 | 1981-01-21 | Varian Associates | Unitary Electromagnet for Double Deflection Scanning of Charged Particle Beam |
US4578663A (en) * | 1984-11-29 | 1986-03-25 | Lockheed Missiles & Space Company, Inc. | Magnetic assembly |
EP0473097A2 (en) * | 1990-08-29 | 1992-03-04 | Nissin Electric Company, Limited | System for irradiating a surface with atomic and molecular ions using two dimensional magnetic scanning |
US5483077A (en) * | 1990-08-29 | 1996-01-09 | Nissin Electric Co., Ltd. | System and method for magnetic scanning, accelerating, and implanting of an ion beam |
US5751002A (en) * | 1995-01-31 | 1998-05-12 | Nihon Shinku Gijutsu Kabushiki Kaisha | Ion implantation apparatus |
US6060715A (en) * | 1997-10-31 | 2000-05-09 | Applied Materials, Inc. | Method and apparatus for ion beam scanning in an ion implanter |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006049817A2 (en) * | 2004-10-18 | 2006-05-11 | Axcelis Technologies, Inc. | Systems and methods for ion beam focusing |
WO2006049817A3 (en) * | 2004-10-18 | 2006-08-03 | Axcelis Tech Inc | Systems and methods for ion beam focusing |
JP2008517441A (en) * | 2004-10-18 | 2008-05-22 | アクセリス テクノロジーズ インコーポレーテッド | System and method for focusing an ion beam |
KR101244116B1 (en) * | 2004-10-18 | 2013-03-18 | 액셀리스 테크놀로지스, 인크. | Systems and methods for ion beam focusing |
CN103779161A (en) * | 2012-11-08 | 2014-05-07 | 北京中科信电子装备有限公司 | Broadband beam scanning method for uniform ion implantation |
Also Published As
Publication number | Publication date |
---|---|
AU2002239682A1 (en) | 2002-07-16 |
WO2002054442A3 (en) | 2003-01-30 |
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