WO2002049775A1 - Procede de fabrication d'une sonde acoustique multielements utilisant un film polymere metallise et ablate comme plan de masse - Google Patents
Procede de fabrication d'une sonde acoustique multielements utilisant un film polymere metallise et ablate comme plan de masse Download PDFInfo
- Publication number
- WO2002049775A1 WO2002049775A1 PCT/FR2001/003931 FR0103931W WO0249775A1 WO 2002049775 A1 WO2002049775 A1 WO 2002049775A1 FR 0103931 W FR0103931 W FR 0103931W WO 0249775 A1 WO0249775 A1 WO 0249775A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- film
- manufacturing
- layer
- acoustic probe
- acoustic
- Prior art date
Links
- 239000000523 sample Substances 0.000 title claims abstract description 45
- 238000000034 method Methods 0.000 title claims abstract description 19
- 229920000642 polymer Polymers 0.000 title description 2
- 239000000463 material Substances 0.000 claims description 31
- 238000004519 manufacturing process Methods 0.000 claims description 26
- 238000005520 cutting process Methods 0.000 claims description 17
- 230000006978 adaptation Effects 0.000 claims description 13
- 238000000151 deposition Methods 0.000 claims description 12
- 230000008021 deposition Effects 0.000 claims description 11
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 238000002679 ablation Methods 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 4
- 238000005507 spraying Methods 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229910000510 noble metal Inorganic materials 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 230000003647 oxidation Effects 0.000 claims description 2
- 238000007254 oxidation reaction Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 claims 13
- 239000012790 adhesive layer Substances 0.000 claims 2
- 238000002360 preparation method Methods 0.000 claims 1
- 238000009466 skin packaging Methods 0.000 abstract 1
- 239000010408 film Substances 0.000 description 71
- 238000001465 metallisation Methods 0.000 description 18
- 239000000919 ceramic Substances 0.000 description 7
- 239000006096 absorbing agent Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000002059 diagnostic imaging Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
- B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49005—Acoustic transducer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Definitions
- the field of the invention is that of acoustic probes in particular used for medical imaging and more specifically that of probes composed of several elements (or channels) excited independently of each other.
- This method consists first of all in assembling: a printed circuit comprising an interconnection network / layer of piezoelectric material / acoustic adaptation blades. More precisely, the printed circuit includes conductive tracks making it possible to address different acoustic elements.
- the ground electrode is common to all the elements and is produced by interposing between the acoustic adaptation blades and the layer of piezoelectric material, a thin metallic film or metallized polymer.
- FIG. 1 represents transducer elements Ty (made of piezoelectric material), and acoustic adaptation elements A j i and A j2 whose impedance varies so as to ensure effective acoustic adaptation.
- Each elementary transducer can thus be controlled between the ground plane P and a metallization Mey connected to the interconnection network 1.
- the flexible ground plane is folded over the lateral faces of the probe, leading to because of the radius of curvature of said plane has a dimension typically of the order of 500 ⁇ m, thereby increasing the footprint of the probe.
- this ground plane located between the piezoelectric elements and the acoustic adaptation elements introduces a disturbing element at the level of the propagation of the acoustic waves and causes a degradation of the acoustic performances of the probe.
- the present invention proposes a new method of manufacturing an acoustic probe using an original method of manufacturing the ground plane.
- the subject of the invention is a method for manufacturing an acoustic probe comprising unitary piezoelectric transducers, characterized in that it comprises the following steps:
- connection network comprising primary connections and ground pads, on the surface of a dielectric film
- the flexible film is a polyimide film
- the conductive film is a metallic film
- the metallic film can be produced in two stages. A first metallization is carried out on the surface of the flexible film, then a second metallization is carried out to increase the thickness of metallization.
- the flexible film can have a thickness of the order of 10 to 25 ⁇ m, and the dielectric film can have a thickness of the order of 25 to 50 ⁇ m.
- the first metallization step is carried out by spraying or by electroless (electroless or metallization by chemical means consists in dipping the film in a bath saturated with ions of the metal to be deposited. Saturation makes it possible to have a metallic deposit on the surface of the film).
- the second step can be carried out by electroplating. In fact, during the first metallization step, it is typically possible to obtain a thickness of the order of a micron, while the second step makes it possible to obtain a thickness of up to ten microns.
- the flexible film can be ablated locally by a C0 2 type laser, with the aim of locally removing the flexible film and leaving only the metal layer.
- the metallic film can be made of copper or nickel.
- the method according to the invention can also include a third metallization step, with a noble metal of the gold type to avoid oxidation of the metallic film obtained by the preceding steps.
- the assembly of the flexible film on the surface of the dielectric film can also be carried out using an adhesive type liquid adhesive polymerizable at room temperature or hot.
- the method can comprise the deposition of an adhesive conductive layer intermediate between the piezoelectric material and the dielectric film.
- the localized ablation of the flexible film makes it possible to leave only the conductive film in an area of contact with the layer of piezoelectric material.
- the thin thickness of the conductive film does not therefore cause a significant change in the acoustic properties of the probe.
- this thin metallic film is easy to handle because it is supported on its device by the flexible film.
- FIG. 3 illustrates a sectional view of a probe manufactured according to the method described in Figures 2a to 2f;
- FIG. 4 illustrates a process step according to the invention comprising the deposition of a conductive layer intermediate between the piezoelectric material and the dielectric film;
- FIG. 5 illustrates a sectional view of a probe fabricated using a conductive intermediate layer
- FIG. 6 illustrates a cutting step to obtain unitary transducers, included in the method of the invention
- FIG. 7 illustrates a step of cutting piezoelectric transducers in a second example of a probe manufacturing method according to the invention
- FIG. 8 illustrates a sectional view of a probe manufactured according to the second example illustrated in Figure 7;
- Figure 9 illustrates a sectional view of a probe manufactured according to Figure 7 and further comprising an intermediate conductive layer.
- the probe comprises a set of unitary piezoelectric transducers each comprising a ground electrode and a control electrode also called "hot spot", in the field of ultrasonic sensors.
- the dielectric film Fd comprises so-called primary connection pads Pc p intended to be opposite the piezoelectric transducers, so-called secondary connection pads Pc s offset relative to the transducers and ground pads P M intended for addressing the electrodes of mass.
- the primary connection pads and the secondary connection pads are connected by means of via conductors and conductive tracks produced on the face of the flexible dielectric film opposite to that on which the piezoelectric transducers are connected. With this type of configuration it is possible to address all the electrodes of the transducers from the same face.
- the primary connection pads Pc p (FIG. 2a) intended for electrically and mechanically connecting a layer of piezoelectric material intended for the manufacture of piezoelectric transducers (FIG. 2b) are deposited.
- the layer Cr does not come to cover the areas of mass P M and the areas of secondary connection Pc s which must be able to be accessible from the face shown in FIG. 2b.
- the layer of piezoelectric material is metallized on its two faces.
- a conductive film is produced on the surface of a flexible film.
- the flexible film can be a polyimide type film with a thickness of between approximately 10 and 25 ⁇ m and metallized on one side as illustrated in FIG. 2c.
- a first metallization mi can be carried out by spraying or electroless on the flexible film F s .
- This mid metallization can typically have a thickness of less than about 1 ⁇ m.
- a second metallization m 2 can then be carried out on the surface of the metallization mi by electrolytic recharging of the same metal to reach a thickness of between approximately 5 and 10 ⁇ m.
- a flash (spraying on a small thickness) of noble metal which does not oxidize can be carried out (metallization m 3 ) on the surface of the second metallization m 2 and of very small thickness of the order of 0.3 ⁇ m . All of the metallizations m ⁇ / m 2 / m 3 thus constitute the conductive film F c , with a thickness of the order of 5 to 10 ⁇ m.
- the flexible film F s is locally etched by laser C0 2 for example, to leave the conductive film F c bare at the surface S.
- another gold flash can be produced at the level of the surface S constituting the metallization m ′ 3 .
- the draping can be carried out by pressing under pressure at ambient temperature or at high temperature.
- a hot-polymerizable liquid adhesive is used to bond the assembly (piezoelectric layer / film F c interface and film F s / film Fd interface).
- Figure 3 illustrates a sectional view along the axis AA 'shown in Figure 2f.
- the film F s is positioned, covered with the film F c , intended to drape the entire ceramic layer on the dielectric film Fd.
- the film F s ablated has a larger area than the piezoelectric material so as to achieve an effective layup, falling on the dielectric film ( Figure 2e).
- Figure 3 highlights the electrical contact between the lower metallization of the ceramic and the primary connection area, and the electrical contact between the upper metallization Me s of the ceramic layer and the mass area P M by virtue of the conductive film F c supported by the film F s .
- the electrical contacts between the different layers are made using the roughness of the surfaces.
- the layer of very fine glue (less than one micron) is not shown, it flows in cavities due to the roughness of the different layers and allows both to assemble the surfaces, while not disturbing electrical contacts.
- This intermediate conductive layer C1 can advantageously be of the anisotropic conductive material type, that is to say which has the property of being conductive in a preferred direction and which hot pressed makes it possible to ensure electrical contact only according to for example a direction perpendicular to the plane of the dielectric film Fd, ie along an axis Z, perpendicular to the plane (X, Y) shown in Figure 4.
- Such a resin thus allows while ensuring continuous and uniform adhesion at the level of a layer of piezoelectric material deposited on a substrate to connect only along an axis Z and not of the axes X or Y of the piezoelectric elements to electrical connections located at the level of the dielectric film Fd.
- this material can comprise a binder loaded with conductive particles.
- a layer CT of piezoelectric material is then superimposed on the intermediate conductive layer Ci. It should be noted that the layers Ci and CT do not come to cover the mass areas PM and the secondary connection areas Pc s which must be able to be accessible from the face shown in Figures 2b and 4.
- Figure 5 illustrates a sectional view of a probe according to the invention comprising the layer Ci.
- the first layer Ca-i has a relatively high acoustic impedance and the layer Ca 2 represents an acoustic adaptation layer of lower acoustic impedance.
- the Ca-i layer can be produced with a mixture of thermosetting or thermoplastic resin with metallic fillers, of the epoxy resin type charged with nickel.
- the volume resistivity of such a material can typically be less than 10 "3 ⁇ .m and its acoustic impedance of the order of 9M Rayleigh, the Ca 2 layer advantageously has an impedance of the order of 3 Mega Rayleigh.
- thickness of the film F s may advantageously be between approximately 10 and 30 microns to allow correct draping (that is to say, to conform to the shape of the layer of piezoelectric material: it is most often a blade of PZT type ceramic with a thickness of the order of 150 - 600 ⁇ m) and to keep the flexibility of the mass ranges. we can thus reduce the size of the probe by folding and gluing the mass range on the side faces of the absorber.
- the assembly operations can be carried out under vacuum or under pressure. Typically, it is possible either to exert a pressure above the draping film F s , or to exert a vacuum below this film. It is also possible to combine the two effects by creating a depression at the level of the film F s and by enclosing the whole in an envelope on which one exerts a pressure.
- a cutting operation T j is then carried out of the assembly so as to identify individual piezoelectric transducers TPj as illustrated in FIG. 6.
- This cutting operation can be carried out with a diamond saw in the direction Dy illustrated in Figure 6. This defines linear transducers whose width can typically vary between 50 and 500 microns.
- the cutting lines stop in the thickness of the dielectric film Fd.
- the acoustic adaptation blades can be cut with a laser while the piezoelectric material, in this case ceramic, can be cut using a mechanical saw.
- This last cutting method makes it possible to release the thermal stresses due to the bonding of materials having different coefficients of thermal expansion.
- a conformation operation can be carried out in a conventional manner which makes it possible to produce curved probes, which are particularly sought after in the field of ultrasound.
- the procedure is the same as in the method of manufacturing unidirectional probes for depositing a layer of piezoelectric material via a flexible film F s on a flexible dielectric film Fd ( Figure 2b).
- FIG. 8 illustrates a sectional view along the axis BB ′, when successive depositions of the film F s / F c , of the layer Cj and of the layers Cai and Ca 2 have been carried out .
- FIG. 9 illustrates a sectional view along the axis BB 'in the case of the use of a conductive intermediate layer Ci. The cuts Tj along the axis Y, are then made in the entire assembly
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
- Transducers For Ultrasonic Waves (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
- Apparatuses For Generation Of Mechanical Vibrations (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002551105A JP2004526345A (ja) | 2000-12-19 | 2001-12-11 | メタライゼーションが施されアブレーションされたポリマーフィルムを接地面として用いて、複数要素からなる音響プローブを製造する方法 |
US10/450,813 US20040049901A1 (en) | 2000-12-19 | 2001-12-11 | Method for making a multielement acoustic probe using a metallised and ablated polymer as ground plane |
EP01271261A EP1345706A1 (fr) | 2000-12-19 | 2001-12-11 | Procede de fabrication d'une sonde acoustique multielements utilisant un film polymere metallise et ablate comme plan de masse |
KR10-2003-7008162A KR20030062435A (ko) | 2000-12-19 | 2001-12-11 | 금속화 및 제거된 폴리머를 접지면으로서 이용하는 다중소자 음향 프로브 제조 방법 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR00/16594 | 2000-12-19 | ||
FR0016594A FR2818170B1 (fr) | 2000-12-19 | 2000-12-19 | Procede de fabrication d'une sonde acoustique multielements utilisant un film polymere metallise et ablate comme plan de masse |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2002049775A1 true WO2002049775A1 (fr) | 2002-06-27 |
Family
ID=8857877
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/FR2001/003931 WO2002049775A1 (fr) | 2000-12-19 | 2001-12-11 | Procede de fabrication d'une sonde acoustique multielements utilisant un film polymere metallise et ablate comme plan de masse |
Country Status (7)
Country | Link |
---|---|
US (1) | US20040049901A1 (fr) |
EP (1) | EP1345706A1 (fr) |
JP (1) | JP2004526345A (fr) |
KR (1) | KR20030062435A (fr) |
CN (1) | CN1481284A (fr) |
FR (1) | FR2818170B1 (fr) |
WO (1) | WO2002049775A1 (fr) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7449821B2 (en) * | 2005-03-02 | 2008-11-11 | Research Triangle Institute | Piezoelectric micromachined ultrasonic transducer with air-backed cavities |
US9445211B2 (en) * | 2005-04-11 | 2016-09-13 | St. Jude Medical, Atrial Fibrillation Division, Inc. | Methods for manufacturing high intensity ultrasound transducers |
EP1915753B1 (fr) | 2005-08-08 | 2019-04-10 | Koninklijke Philips N.V. | Transducteur matriciel large bande a troisieme couche d'adaptation en polyethylene |
KR101031010B1 (ko) * | 2008-10-29 | 2011-04-25 | 삼성메디슨 주식회사 | 피씨비 및 이를 구비하는 프로브 |
CN102736756A (zh) * | 2011-03-31 | 2012-10-17 | 汉王科技股份有限公司 | 一种压电式传感器及其安装方法 |
US10710116B2 (en) * | 2017-09-21 | 2020-07-14 | General Electric Company | Methods and systems for manufacturing an ultrasound probe |
CN113011264B (zh) * | 2021-02-22 | 2024-02-02 | 业泓科技(成都)有限公司 | 辨识传感结构、指纹识别组件及终端 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0040374A1 (fr) * | 1980-05-21 | 1981-11-25 | Siemens Aktiengesellschaft | Transducteur ultrasonique et procédé de fabrication dudit transducteur |
US4701659A (en) * | 1984-09-26 | 1987-10-20 | Terumo Corp. | Piezoelectric ultrasonic transducer with flexible electrodes adhered using an adhesive having anisotropic electrical conductivity |
EP0615294A1 (fr) * | 1993-03-08 | 1994-09-14 | Ngk Insulators, Ltd. | Dispositif piézoélectrique |
WO1997017145A1 (fr) * | 1995-11-03 | 1997-05-15 | Thomson-Csf | Sonde acoustique et procede de realisation |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4385255A (en) * | 1979-11-02 | 1983-05-24 | Yokogawa Electric Works, Ltd. | Linear array ultrasonic transducer |
CA2139151A1 (fr) * | 1994-01-14 | 1995-07-15 | Amin M. Hanafy | Reseau acoustique bidimensionnel et sa methode de fabrication |
US5497540A (en) * | 1994-12-22 | 1996-03-12 | General Electric Company | Method for fabricating high density ultrasound array |
FR2756447B1 (fr) * | 1996-11-26 | 1999-02-05 | Thomson Csf | Sonde acoustique multielements comprenant une electrode de masse commune |
US5844349A (en) * | 1997-02-11 | 1998-12-01 | Tetrad Corporation | Composite autoclavable ultrasonic transducers and methods of making |
FR2779575B1 (fr) * | 1998-06-05 | 2003-05-30 | Thomson Csf | Sonde acoustique multielements comprenant un film composite conducteur et procede de fabrication |
FR2789822B1 (fr) * | 1999-02-12 | 2001-06-08 | Thomson Csf | Dispositif a ondes de surface connecte a une embase avec un adhesif conducteur |
FR2799883B1 (fr) * | 1999-10-15 | 2003-05-30 | Thomson Csf | Procede d'encapsulation de composants electroniques |
-
2000
- 2000-12-19 FR FR0016594A patent/FR2818170B1/fr not_active Expired - Fee Related
-
2001
- 2001-12-11 JP JP2002551105A patent/JP2004526345A/ja active Pending
- 2001-12-11 US US10/450,813 patent/US20040049901A1/en not_active Abandoned
- 2001-12-11 CN CNA018208010A patent/CN1481284A/zh active Pending
- 2001-12-11 WO PCT/FR2001/003931 patent/WO2002049775A1/fr not_active Application Discontinuation
- 2001-12-11 KR KR10-2003-7008162A patent/KR20030062435A/ko not_active Application Discontinuation
- 2001-12-11 EP EP01271261A patent/EP1345706A1/fr not_active Withdrawn
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0040374A1 (fr) * | 1980-05-21 | 1981-11-25 | Siemens Aktiengesellschaft | Transducteur ultrasonique et procédé de fabrication dudit transducteur |
US4701659A (en) * | 1984-09-26 | 1987-10-20 | Terumo Corp. | Piezoelectric ultrasonic transducer with flexible electrodes adhered using an adhesive having anisotropic electrical conductivity |
EP0615294A1 (fr) * | 1993-03-08 | 1994-09-14 | Ngk Insulators, Ltd. | Dispositif piézoélectrique |
WO1997017145A1 (fr) * | 1995-11-03 | 1997-05-15 | Thomson-Csf | Sonde acoustique et procede de realisation |
Also Published As
Publication number | Publication date |
---|---|
EP1345706A1 (fr) | 2003-09-24 |
JP2004526345A (ja) | 2004-08-26 |
CN1481284A (zh) | 2004-03-10 |
FR2818170A1 (fr) | 2002-06-21 |
KR20030062435A (ko) | 2003-07-25 |
FR2818170B1 (fr) | 2003-03-07 |
US20040049901A1 (en) | 2004-03-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0883447B1 (fr) | Sonde acoustique multielements comprenant une electrode de masse commune | |
EP0851465B1 (fr) | Procédé de séparation d'au moins deux éléments d'une structure en contact entre eux par implantation ionique | |
CA2321360C (fr) | Procede d'encapsulation de composants electroniques | |
EP1060562B1 (fr) | Dispositif a ondes acoustiques guidees dans une fine couche piezo-electrique collee sur un substrat porteur et procede de fabrication | |
EP0182700B1 (fr) | Elément de connexion miniature à faible pas, et procédé de fabrication d'un tel élément de connexion | |
EP0354117B1 (fr) | Transducteur piézoélectrique pour générer des ondes de volume | |
EP0872720A1 (fr) | Microsystème à membrane souple pour capteur de pression et procédé de réalisation | |
FR2460085A1 (fr) | Procede pour la realisation de transducteurs ultra-acoustiques a raies ou a matrice de points et transducteurs ainsi obtenus | |
FR2641646A1 (fr) | Cellule solaire et son procede de fabrication | |
FR2798224A1 (fr) | Realisation d'un collage electriquement conducteur entre deux elements semi-conducteurs. | |
WO2002049775A1 (fr) | Procede de fabrication d'une sonde acoustique multielements utilisant un film polymere metallise et ablate comme plan de masse | |
WO1999064169A1 (fr) | Sonde acoustique multielements comprenant un film composite conducteur et procede de fabrication | |
FR2770932A1 (fr) | Procede de fabrication d'une sonde acoustique | |
EP1157460B1 (fr) | Dispositif a ondes de surface connecte a une embase avec un adhesif conducteur | |
EP1274518B1 (fr) | Sonde acoustique unidirectionnelle et procede de fabrication | |
EP0270448A1 (fr) | Sonde d'appareil à ultrasons à barrette d'éléments piézoélectriques | |
EP1938863A1 (fr) | Procédé d'assemblage mécanique et d'interconnexion électrique des éléments fonctionnels d'un dispositif médical implantable actif | |
EP0793269B1 (fr) | Dispositif semiconducteur incluant une puce munie d'une ouverture de via et soudée sur un support, et procédé de réalisation de ce dispositif | |
FR2810907A1 (fr) | Procede de fabrication d'une sonde acoustique multielements utilisant une nouvelle methode de realisation de la masse electrique | |
FR2738705A1 (fr) | Dispositif capteur electromecanique et procede de fabrication d'un tel dispositif | |
EP3776640B1 (fr) | Substrat pour applications radiofrequences et procede de fabrication associe | |
FR2802449A1 (fr) | Sonde acoustique lineaire multi-elements et procede de fabrication collective de sondes acoustiques | |
CA1294700C (fr) | Sonde d'echographe a arrangement d'elements piezo-electriques | |
WO1997016801A1 (fr) | Carte comprenant une unite electronique et procede de fabrication d'une telle carte | |
FR2829626A1 (fr) | Structure equipee d'au moins une connexion electrique sur un relief |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): CN JP KR US |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
DFPE | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101) | ||
WWE | Wipo information: entry into national phase |
Ref document number: 2001271261 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 10450813 Country of ref document: US Ref document number: 1020037008162 Country of ref document: KR Ref document number: 018208010 Country of ref document: CN |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2002551105 Country of ref document: JP |
|
WWP | Wipo information: published in national office |
Ref document number: 1020037008162 Country of ref document: KR |
|
WWP | Wipo information: published in national office |
Ref document number: 2001271261 Country of ref document: EP |
|
WWW | Wipo information: withdrawn in national office |
Ref document number: 2001271261 Country of ref document: EP |