WO2002043940A1 - Procede de modification et de conservation des proprietes de surface d'un tampon de polissage et applications specifiques associees - Google Patents

Procede de modification et de conservation des proprietes de surface d'un tampon de polissage et applications specifiques associees Download PDF

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Publication number
WO2002043940A1
WO2002043940A1 PCT/US2001/044175 US0144175W WO0243940A1 WO 2002043940 A1 WO2002043940 A1 WO 2002043940A1 US 0144175 W US0144175 W US 0144175W WO 0243940 A1 WO0243940 A1 WO 0243940A1
Authority
WO
WIPO (PCT)
Prior art keywords
recited
group
polymer
thermoplastic foam
polishing
Prior art date
Application number
PCT/US2001/044175
Other languages
English (en)
Inventor
Yaw S. Obeng
Edward M. Yokley
Original Assignee
Exigent
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Exigent filed Critical Exigent
Priority to AU2002225745A priority Critical patent/AU2002225745A1/en
Publication of WO2002043940A1 publication Critical patent/WO2002043940A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/14—Surface shaping of articles, e.g. embossing; Apparatus therefor by plasma treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0063—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by extrusion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/009—Tools not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/22—Rubbers synthetic or natural
    • B24D3/26—Rubbers synthetic or natural for porous or cellular structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/04—Condition, form or state of moulded material or of the material to be shaped cellular or porous

Definitions

  • the present invention provides a polishing apparatus.
  • This particular embodiment includes a mechanically driven carrier head, a polishing platen, and a polishing pad attached to the polishing platen.
  • the carrier head is positionable against the polishing platen to impart a polishing force against the polishing platen.
  • the polishing pad includes a polishing body comprising a material wherein the material is a thermoplastic foam polymer.
  • the excited state sites generated by exposing polymers, such as thermoplastic foam polymers, to the initial plasma reactant are thought to provide an attractive base on which to selectively graft polymerized numerous inorganic and organic materials.
  • the modified surface of the polymer incorporating such functional groups is designated as a grafted surface.
  • Such grafted surfaces are particularly useful in CMP processes due to the grafting process's ability to introduce very fine hard groups onto the grafted surface, which is then incorporated into a polishing pad. Such pads may enable the use of reduced or no abrasive slurries, which may improve thermal management. Additionally, the grafting process produces thermoplastic foam polymers with certain desirable physical and chemical properties, such as controlled wetability surfaces, and renders such grafted surfaces permanent.
  • Polishing pads may be employed in a variety of CMP polishing apparatus 150, one embodiment of which is displayed in FIGURE 1.
  • the thermoplastic foam polymers of the present invention may be incorporated into a polishing body 100 that includes a base pad 110, where a thermoplastic foam polymer 120 forms a polishing surface located over the base pad 110.
  • a first adhesive material 130 such as acrylate-based, silicone- based, epoxy or other materials well known to those skilled in the art, may be used to couple the base pad 110 to the thermoplastic foam polymers 120.
  • the polishing pads thus formed may also have a second adhesive material 140, well known to those skilled in the art, applied to the platen side. The polishing pad may then be cleaned and packaged for use.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)

Abstract

L'invention concerne, en général, un matériau amélioré et un procédé de planarisation d'une surface sur une plaquette de semi-conducteur et, plus particulièrement, un procédé de modification des propriétés des polymères, de préférence, des polymères en mousse thermoplastique, utilisé dans des applications de polissage. Les propriétés chimiques et mécaniques des substrats en mousse thermoplastique peuvent être transformées au moyen de techniques de greffage inorganique, inorganique-organique, et ou organique-organique, de sorte à fournir à la mousse polymère un nouvel ensemble de propriétés plus satisfaisantes et plus appropriées au polissage.
PCT/US2001/044175 2000-11-29 2001-11-27 Procede de modification et de conservation des proprietes de surface d'un tampon de polissage et applications specifiques associees WO2002043940A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2002225745A AU2002225745A1 (en) 2000-11-29 2001-11-27 A method of altering and preserving the surface properties of a polishing pad and specific applications therefor

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US25029900P 2000-11-29 2000-11-29
US60/250,299 2000-11-29
US29531501P 2001-06-01 2001-06-01
US60/295,315 2001-06-01

Publications (1)

Publication Number Publication Date
WO2002043940A1 true WO2002043940A1 (fr) 2002-06-06

Family

ID=26940772

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/044175 WO2002043940A1 (fr) 2000-11-29 2001-11-27 Procede de modification et de conservation des proprietes de surface d'un tampon de polissage et applications specifiques associees

Country Status (2)

Country Link
AU (1) AU2002225745A1 (fr)
WO (1) WO2002043940A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108214280A (zh) * 2016-12-09 2018-06-29 智胜科技股份有限公司 研磨垫及研磨方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4346142A (en) * 1979-09-04 1982-08-24 Celanese Corporation Hydrophilic monomer treated microporous films and process
JPS5864948A (ja) * 1981-09-29 1983-04-18 昭和電工株式会社 可燃性液体容器
EP0104608A1 (fr) * 1982-09-24 1984-04-04 Becton Dickinson and Company Surface modifiée chimiquement pour la fixation de grandes molécules
US4845132A (en) * 1986-05-07 1989-07-04 Agency Of Industrial Science And Technology Hydrophilic porous membrane, method for production thereof, and plasma separator using said membrane
EP0352199A2 (fr) * 1988-07-22 1990-01-24 Terumo Kabushiki Kaisha Matériau hydrophile et son procédé de fabrication
WO1996023834A1 (fr) * 1995-02-01 1996-08-08 Schneider (Usa) Inc. Procede pour rendre hydrophiles des polymeres hydrophobes
US5814567A (en) * 1996-06-14 1998-09-29 Kimberly-Clark Worldwide, Inc. Durable hydrophilic coating for a porous hydrophobic substrate
US5993917A (en) * 1996-06-19 1999-11-30 Hewlett-Packard Co. Method and apparatus for improving wettability of foam

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4346142A (en) * 1979-09-04 1982-08-24 Celanese Corporation Hydrophilic monomer treated microporous films and process
JPS5864948A (ja) * 1981-09-29 1983-04-18 昭和電工株式会社 可燃性液体容器
EP0104608A1 (fr) * 1982-09-24 1984-04-04 Becton Dickinson and Company Surface modifiée chimiquement pour la fixation de grandes molécules
US4845132A (en) * 1986-05-07 1989-07-04 Agency Of Industrial Science And Technology Hydrophilic porous membrane, method for production thereof, and plasma separator using said membrane
EP0352199A2 (fr) * 1988-07-22 1990-01-24 Terumo Kabushiki Kaisha Matériau hydrophile et son procédé de fabrication
WO1996023834A1 (fr) * 1995-02-01 1996-08-08 Schneider (Usa) Inc. Procede pour rendre hydrophiles des polymeres hydrophobes
US5814567A (en) * 1996-06-14 1998-09-29 Kimberly-Clark Worldwide, Inc. Durable hydrophilic coating for a porous hydrophobic substrate
US5993917A (en) * 1996-06-19 1999-11-30 Hewlett-Packard Co. Method and apparatus for improving wettability of foam

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108214280A (zh) * 2016-12-09 2018-06-29 智胜科技股份有限公司 研磨垫及研磨方法
US10518386B2 (en) 2016-12-09 2019-12-31 Iv Technologies Co., Ltd. Polishing pad and polishing method

Also Published As

Publication number Publication date
AU2002225745A1 (en) 2002-06-11

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