WO2002043922A1 - Tampon de polissage en polyéthylène réticulé destiné à polir de façon chimico-mecanique, appareil et procédé de polissage - Google Patents

Tampon de polissage en polyéthylène réticulé destiné à polir de façon chimico-mecanique, appareil et procédé de polissage Download PDF

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Publication number
WO2002043922A1
WO2002043922A1 PCT/US2001/044177 US0144177W WO0243922A1 WO 2002043922 A1 WO2002043922 A1 WO 2002043922A1 US 0144177 W US0144177 W US 0144177W WO 0243922 A1 WO0243922 A1 WO 0243922A1
Authority
WO
WIPO (PCT)
Prior art keywords
polishing
recited
cross
linked polymer
pad
Prior art date
Application number
PCT/US2001/044177
Other languages
English (en)
Inventor
Yaw S. Obeng
Edward M. Yokley
Original Assignee
Psiloquest, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Psiloquest, Inc. filed Critical Psiloquest, Inc.
Priority to AU2002217867A priority Critical patent/AU2002217867A1/en
Priority to EP01998427A priority patent/EP1345734B1/fr
Priority to DE60118963T priority patent/DE60118963T2/de
Publication of WO2002043922A1 publication Critical patent/WO2002043922A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/003—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving acoustic means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0063—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by extrusion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/009—Tools not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/22—Rubbers synthetic or natural
    • B24D3/26—Rubbers synthetic or natural for porous or cellular structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C44/00—Shaping by internal pressure generated in the material, e.g. swelling or foaming ; Producing porous or cellular expanded plastics articles
    • B29C44/34—Auxiliary operations
    • B29C44/56—After-treatment of articles, e.g. for altering the shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/14—Surface shaping of articles, e.g. embossing; Apparatus therefor by plasma treatment

Abstract

L'invention concerne, en général, un procédé de polissage d'une surface sur des substrats, tels que des plaquettes de semi-conducteur et, plus particulièrement, un tampon de polissage à cet effet. Ce tampon de polissage comprend un corps de polissage comportant un matériau polymère réticulé, et peut être incorporé dans un appareil de polissage. Le polissage consiste à positionner le substrat possédant au moins une couche contre le corps de polissage et à polir ladite couche.
PCT/US2001/044177 2000-11-29 2001-11-27 Tampon de polissage en polyéthylène réticulé destiné à polir de façon chimico-mecanique, appareil et procédé de polissage WO2002043922A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
AU2002217867A AU2002217867A1 (en) 2000-11-29 2001-11-27 Crosslinked polyethylene polishing pad for chemical-mechnical polishing, polishing apparatus and polishing method
EP01998427A EP1345734B1 (fr) 2000-11-29 2001-11-27 Tampon de polissage en polyethylene reticule destine a polir de facon chimico-mecanique et appareil de polissage
DE60118963T DE60118963T2 (de) 2000-11-29 2001-11-27 Polierkissen aus vernetztem polyethylen zum chemisch-mechanischen polieren und poliervorrichtung

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US25029900P 2000-11-29 2000-11-29
US60/250,299 2000-11-29
US30437501P 2001-07-10 2001-07-10
US60/304,375 2001-07-10

Publications (1)

Publication Number Publication Date
WO2002043922A1 true WO2002043922A1 (fr) 2002-06-06

Family

ID=26940773

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/044177 WO2002043922A1 (fr) 2000-11-29 2001-11-27 Tampon de polissage en polyéthylène réticulé destiné à polir de façon chimico-mecanique, appareil et procédé de polissage

Country Status (1)

Country Link
WO (1) WO2002043922A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112179915A (zh) * 2019-07-04 2021-01-05 深圳长城开发科技股份有限公司 一种用于定位裸片内部损伤点的去除层次方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4613345A (en) * 1985-08-12 1986-09-23 International Business Machines Corporation Fixed abrasive polishing media
JPS6464776A (en) * 1987-08-26 1989-03-10 Lach Spezial Werkzeuge Gmbh Method and device for controlling positioning and contact motion of grinding disk
JPH0878369A (ja) * 1994-09-06 1996-03-22 Sony Corp 研磨の終点検出方法及びその研磨装置
JPH09132661A (ja) * 1995-11-08 1997-05-20 Hitachi Chem Co Ltd Ｃｍｐパッド用発泡体の製造方法
JPH11245164A (ja) * 1998-02-26 1999-09-14 Seiko Seiki Co Ltd 研磨装置
WO1999062673A1 (fr) * 1998-06-02 1999-12-09 Scapa Group Plc Tampon a polir ameliore avec une moindre absorption d'humidite
US6063306A (en) * 1998-06-26 2000-05-16 Cabot Corporation Chemical mechanical polishing slurry useful for copper/tantalum substrate
US6132298A (en) * 1998-11-25 2000-10-17 Applied Materials, Inc. Carrier head with edge control for chemical mechanical polishing

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4613345A (en) * 1985-08-12 1986-09-23 International Business Machines Corporation Fixed abrasive polishing media
JPS6464776A (en) * 1987-08-26 1989-03-10 Lach Spezial Werkzeuge Gmbh Method and device for controlling positioning and contact motion of grinding disk
JPH0878369A (ja) * 1994-09-06 1996-03-22 Sony Corp 研磨の終点検出方法及びその研磨装置
JPH09132661A (ja) * 1995-11-08 1997-05-20 Hitachi Chem Co Ltd Ｃｍｐパッド用発泡体の製造方法
JPH11245164A (ja) * 1998-02-26 1999-09-14 Seiko Seiki Co Ltd 研磨装置
WO1999062673A1 (fr) * 1998-06-02 1999-12-09 Scapa Group Plc Tampon a polir ameliore avec une moindre absorption d'humidite
US6063306A (en) * 1998-06-26 2000-05-16 Cabot Corporation Chemical mechanical polishing slurry useful for copper/tantalum substrate
US6132298A (en) * 1998-11-25 2000-10-17 Applied Materials, Inc. Carrier head with edge control for chemical mechanical polishing

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 1996, no. 07 31 July 1996 (1996-07-31) *
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 14 22 December 1999 (1999-12-22) *
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 17 5 June 2001 (2001-06-05) *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112179915A (zh) * 2019-07-04 2021-01-05 深圳长城开发科技股份有限公司 一种用于定位裸片内部损伤点的去除层次方法

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