WO2002039487A3 - Device and method for encasing an electronic component - Google Patents

Device and method for encasing an electronic component Download PDF

Info

Publication number
WO2002039487A3
WO2002039487A3 PCT/DE2001/003881 DE0103881W WO0239487A3 WO 2002039487 A3 WO2002039487 A3 WO 2002039487A3 DE 0103881 W DE0103881 W DE 0103881W WO 0239487 A3 WO0239487 A3 WO 0239487A3
Authority
WO
WIPO (PCT)
Prior art keywords
encasing
electronic component
casting compound
sleeve
water molecules
Prior art date
Application number
PCT/DE2001/003881
Other languages
German (de)
French (fr)
Other versions
WO2002039487A2 (en
Inventor
Bernhard Just
Richard Spitz
Wolfgang Endres
Alexander Goelz
Original Assignee
Bosch Gmbh Robert
Bernhard Just
Richard Spitz
Wolfgang Endres
Alexander Goelz
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert, Bernhard Just, Richard Spitz, Wolfgang Endres, Alexander Goelz filed Critical Bosch Gmbh Robert
Priority to EP01993942A priority Critical patent/EP1336196A2/en
Publication of WO2002039487A2 publication Critical patent/WO2002039487A2/en
Publication of WO2002039487A3 publication Critical patent/WO2002039487A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Dispersion Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

The invention relates to a device (1) and to a method for encasing an electronic component (10). According to the invention, the device (1) comprises a sleeve (100) and a casting compound (200), whereby said casting compound (200) is hardened. The casting compound (200) is one that hardens at an accelerated rate when exposed to water molecules, and the sleeve (100) provides the water molecules.
PCT/DE2001/003881 2000-11-08 2001-10-10 Device and method for encasing an electronic component WO2002039487A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP01993942A EP1336196A2 (en) 2000-11-08 2001-10-10 Device and method for encasing an electronic component

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10055247.1 2000-11-08
DE10055247A DE10055247A1 (en) 2000-11-08 2000-11-08 Device and method for wrapping an electronic component

Publications (2)

Publication Number Publication Date
WO2002039487A2 WO2002039487A2 (en) 2002-05-16
WO2002039487A3 true WO2002039487A3 (en) 2002-11-28

Family

ID=7662502

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2001/003881 WO2002039487A2 (en) 2000-11-08 2001-10-10 Device and method for encasing an electronic component

Country Status (3)

Country Link
EP (1) EP1336196A2 (en)
DE (1) DE10055247A1 (en)
WO (1) WO2002039487A2 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0034207A1 (en) * 1980-02-13 1981-08-26 Robert Bosch Gmbh Semiconductor device
JPH02199117A (en) * 1989-01-27 1990-08-07 Nec Corp Production of cured epoxy resin product
DE3913488A1 (en) * 1989-04-25 1990-10-31 Bosch Gmbh Robert Casting compsn. e.g. for encapsulating semiconductor - contg. cyclo-aliphatic and/or novolak epoxide] resin, methyl-nadic anhydride, imidazole and filler

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0034207A1 (en) * 1980-02-13 1981-08-26 Robert Bosch Gmbh Semiconductor device
JPH02199117A (en) * 1989-01-27 1990-08-07 Nec Corp Production of cured epoxy resin product
DE3913488A1 (en) * 1989-04-25 1990-10-31 Bosch Gmbh Robert Casting compsn. e.g. for encapsulating semiconductor - contg. cyclo-aliphatic and/or novolak epoxide] resin, methyl-nadic anhydride, imidazole and filler

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
DATABASE WPI Section Ch Week 199037, Derwent World Patents Index; Class A21, AN 1990-280335, XP002189512 *

Also Published As

Publication number Publication date
WO2002039487A2 (en) 2002-05-16
DE10055247A1 (en) 2002-05-16
EP1336196A2 (en) 2003-08-20

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