WO2002037914A1

WO2002037914A1 - Arrangement for cooling a component generating heat energy using cooling fluid

Info

Publication number: WO2002037914A1
Application number: PCT/FI2001/000957
Authority: WO
Inventors: Jyrki Mustakallio
Original assignee: Nokia Corporation
Priority date: 2000-11-02
Filing date: 2001-11-01
Publication date: 2002-05-10
Also published as: FI20002415A; AU2002214062A1; FI20002415A0

Abstract

The invention relates to an arrangement for cooling a component (2) generating heat energy. The component (2) is placed in an enclosure (3). The enclosure (3) comprises cooling fluid input means (5) for directing cooling fluid to the enclosure (3) and cooling fluid output means (6) and for removing cooling fluid from the enclosure (3). The enclosure (3) is of such a type that is arranged to be mounted into an apparatus rack (1). The arrangement comprises a cooling fluid distribution system (7) having second cooling fluid input and output elements (8a and 8b) to which the cooling fluid input and output means (5 and 6) of the enclosure (3) are connected, so that cooling fluid can be directed to the enclosure (3) from the cooling fluid distribution system (7) and removed from the enclosure (3) to the cooling fluid distribution system (7).

Description

ARRANGEMENT FOR COOLING A COMPONENT GENERATING HEAT ENERGY USING COOLING FLUID

BACKGROUND OF THE INVENTION

[0001] The invention relates to an arrangement for cooling a com- ponent generating heat energy using a cooling fluid, wherein the component generating heat energy is placed in an enclosure, wherein the enclosure comprises cooling fluid input means for directing cooling fluid to the enclosure, wherein the enclosure comprises cooling fluid output means for removing cooling fluid heated by the component generating heat energy from the enclosure, wherein the enclosure comprises at least one first electrical and/or signal connector for externally connecting the component to electrical and/or signal means outside the enclosure, wherein the enclosure is of such a type that is arranged to be mounted into an apparatus rack or the like, and wherein the arrangement comprises a cooling fluid distribution system having second cool- ing fluid input elements and second cooling fluid output elements to which the cooling fluid input means and the cooling fluid output means of the enclosure are connected, so that cooling fluid can be directed to the enclosure from the cooling fluid distribution system and correspondingly removed from the enclosure to the cooling fluid distribution system. [0002] Different arrangements for cooling a component generating heat energy using a cooling fluid are previously known in the art.

[0003] US patent 4,498,118 discloses such an arrangement for cooling a component generating heat energy using a cooling fluid, where a cooling module is mounted into an apparatus rack provided with guide rails for circuit boards. The cooling module is mounted into the rack between two circuit boards using the guide rails for the circuit boards in the apparatus rack. The sides of the cooling module comprise orifices, through which pressurized cooling fluid is directed towards adjacent boards of the cooling module. In this solution, the cooling module requires specific guide rails in the apparatus rack that increase the size and costs of the apparatus.

[0004] US patents 4,674,004, 4,851,965 and 5,218,513 disclose other arrangements in which circuit boards are blown with cooling fluid.

[0005] What these known solutions have in common is that they are designed for open circuit boards, where the components are often placed in even lines and where the components are almost without exceptions of the same size. These prior art solutions generally comprise a cooling module or the like for distributing cooling fluid. In some prior art solutions, such as US patent 4,498,118, the cooling module is a complex pressure-sealed compart- mental structure, where circuit boards are mounted into the board locations between two cooling modules. These known systems can be applied to individual apparatuses, such as server computers, but cannot be used as such on apparatuses consisting of different emc-protected or encased plug-in units such as the base stations in mobile systems. In these known solutions the heated cooling fluid cannot be removed in a controlled manner. Furthermore, these prior art solutions are noisy, as they require an ample amount of cooling power, and as some of the cooling power is wasted, or used to cool the environment.

[0006] A solution to these problems is presented in US patent 5,740,018. This US patent discloses an apparatus for cooling an electronic circuit board and a cabinet for holding multiple enclosures. The circuit board is mounted within an enclosure comprising an electrical connector allowing electrical leads to be connected both internally and externally to said enclosure and coolant input and output ports for leading a coolant into and respectively out of the enclosure. The cabinet comprises a housing having a plurality of slots for mounting a plurality of enclosures inside the housing. The cabinet also comprises means for supplying coolant from a cooling unit to the input ports of the housings and means for supplying coolant from the coolant output ports of the housings to a cooling unit.

[0007] The disadvantage with this known solution is that it is difficult to connect the coolant input and coolant output ports to the cooling unit, when mounting the enclosure into the cabinet.

BRIEF DESCRIPTION OF THE INVENTION

[0008] It is an object of the invention to provide an arrangement for cooling a component generating heat energy using a cooling fluid, thus solving the above problems.

[0009] The object of the invention is achieved with an arrangement for cooling a component generating heat energy using a cooling fluid, characterized in that the cooling fluid input means and the cooling fluid output means comprise first cooling fluid connectors, in that the second cooling fluid input elements and cooling fluid output means comprise co-operating second cooling fluid connectors, and in that the first cooling fluid connectors are ar- ing fluid connectors, and in that the first cooling fluid connectors are arranged to be automatically connected to the co-operating second cooling fluid connectors, when the enclosure is mounted into the apparatus rack or the like.

[0010] The preferred embodiments of the invention are disclosed in the dependent claims.

[0011] The enclosure preferably comprises such first electrical and/or signal connectors which are also arranged to be automatically connected to the co-operating second electrical and/or signal connectors in the apparatus rack, when the enclosure is mounted into the apparatus rack or the like. In such an arrangement, the first cooling fluid connectors of the enclosure are therefore adapted to be automatically connected to the co-operating second cooling fluid connectors and the first electrical and/or signal connectors of the enclosure are adapted to be automatically connected to the co-operating second signal and/or electrical connectors, when the enclosure is mounted, for example pushed in place in an apparatus rack or the like. This makes it easy to mount the enclosure into the rack. The automatic connection of the cooling fluid connectors can take place at the same time or at different times as the automatic connection of the electrical and/or signal connectors, when mounting the enclosure into the rack. [0012] As the cooling fluid is lead into the enclosure, the arrangement of the invention enables to carry out cooling in such a system where the positions of the plug-in units are not furnished. Since the cooling fluid is blown into a closed enclosure, the arrangement of the invention enables the enclosures to be mounted and dismounted without disturbing the entire structure, for example when the apparatus is operating. The arrangement of the invention is applicable to be used in sub-rack mounting and in direct mounting. As the arrangement of the invention is formed of small functional entities, it allows the use of an easily controllable and also a modular cooling system.

[0013] The arrangement of the invention allows using, for example plug-in unit-specific forced-air cooling, where low-pressure air (<1 bar) is directed through a connector inside the plug-in unit, i.e. the enclosure, and guided in point-like flows towards the hot components. The heated air is removed from the plug-in unit, or the enclosure, from the connector on the motherboard to a discharge flue and then further to the outside the apparatus cabi- net. [0014] The arrangement of the invention enables to direct the cooling power more accurately, since the component generating heat energy is placed in the enclosure. The arrangement of the invention responds more accurately than prior art solutions to the challenges concerning greater power densities, size requirements of the apparatuses and noiselessness.

[0015] The arrangement of the invention provides such an advantage that the cooling fluid heated by the component generating heat energy can be removed from the system more efficiently, since the heated cooling fluid can be directed away from the enclosure in a controlled manner. In the arrangement of the invention the heat load can thus easily be directed away from the apparatus chamber and from the other mounting surroundings.

[0016] Another advantage provided by the arrangement of the invention is that the same encased units can be used in both internal and external apparatuses, as the pressure of the cooling fluid prevents the particles and the moisture from penetrating inside the enclosure.

[0017] A further advantage achieved with the arrangement of the invention is that a blower of the cooling fluid or a corresponding device arranged to move the cooling fluid can be placed more freely than in conventional solutions, as the cooling fluid can be directed along a pipe system to the enclosure. [0018] Another advantage achieved with the arrangement of the invention is that the components can freely be placed onto the circuit board and the different sizes and shapes of the components do not cause any problems, since a closed space, or the interior of the enclosure, is cooled in the arrangement of the invention. [0019] Still another advantage provided with the arrangement of the invention is that since the cooling fluid is directed to the enclosure, smaller blowers or compressors can be used, as the cooling effect of the cooling fluid is more efficient, since a closed space, or the interior of the enclosure, is cooled. Consequently the noise level also decreases. [0020] Still a further advantage achieved with a preferred embodiment of the arrangement of the invention is that the cooling is concentrated more accurately on top of the components generating heat energy or to the vicinity thereof, since the arrangement comprises a control arrangement of the cooling fluid. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In the following the invention will be described in greater detail by means of the preferred embodiments with reference to the accompanying drawings, in which Figure 1 shows a disassembled arrangement for cooling a component generating heat energy using a cooling fluid,

Figure 2 shows another disassembled arrangement for cooling a component generating heat energy using a cooling fluid,

Figure 3 shows an apparatus rack comprising the arrangement ac- cording to Figure 2 for cooling a component generating heat energy using a cooling fluid, and

Figures 4, 5 and 6 show different arrangements for directing cooling fluid to the interior of the enclosure and for removing heated cooling fluid from the enclosure.

DETAILED DESCRIPTION OF THE INVENTION

[0022] Figure 3 shows an apparatus rack 1 comprising an arrangement for cooling a component 2 generating heat energy using a cooling fluid (not shown).

[0023] In the Figures, the component 2 generating heat energy is an electronic component on a circuit board 24. Several of such heat energy generating components 2 can be placed on the same circuit board 24.

[0024] The component 2 generating heat energy is placed in an enclosure 3. In the Figures the entire circuit board 24, on top of which the component 2 generating heat energy is placed, is located in the enclosure 3. [0025] The enclosure 3 is of such a type that is arranged to be mounted into the apparatus rack 1 or the like.

[0026] The enclosure 3 and the parts therein form a plug-in unit provided with first electrical and/or signal connectors 4 for connecting the components in the enclosure 3 to an external system (not shown). [0027] The enclosure 3 comprises cooling fluid input means 5 for directing cooling fluid to the enclosure 3 and cooling fluid output means 6 for removing cooling fluid heated by the component 2 generating heat energy from the enclosure 3.

[0028] The arrangement comprises a cooling fluid distribution sys- tem 7 having second cooling fluid input elements 8a and second cooling fluid output elements 8b to which the cooling fluid input means 5 and the cooling fluid output means 6 of the enclosure 3 are connected. The cooling fluid distribution system 7 preferably comprises a discharge flue (not shown) or the like, by which the heated cooling fluid removed form the enclosure can be lead to the outside of the apparatus rack 1.

[0029] The cooling fluid is for example a gas, such as air. The cooling fluid is preferably, but not necessarily, pressurized air. The cooling fluid can alternatively be another gas. The cooling fluid is preferably such that does not affect the operation of the component 2 generating heat energy or any other component inside the enclosure 3.

[0030] The cooling fluid input means 5 and the cooling fluid output means 6 comprise first cooling fluid connectors 17 and 18. The second cooling fluid input elements 8a and output elements 8b comprise co-operating second cooling fluid connectors 19 and 20. The first cooling fluid connectors 17 and 18 are arranged to be automatically connected to the co-operating second cooling fluid connectors 19 and 20, when the enclosure 3 is mounted into the apparatus rack 1 or the like, so that cooling fluid can be directed to the enclosure 3 from the cooling fluid distribution system 7 and correspondingly removed from the enclosure 3 to the cooling fluid distribution system 7. [0031] The first cooling fluid connectors 17 and 18 and the cooperating second cooling fluid connectors 19 and 20 are preferably adapted to automatically open and close when mounting the enclosure 3 to the apparatus rack 1 and when detaching the enclosure 3 from the apparatus rack 1. In the Figures, the first cooling fluid connectors 17 and 18 are rapid connectors. In Figure 3, the co-operating second cooling fluid connectors 19 and 20 of the cooling fluid distribution system 7 are rapid connectors.

[0032] In the Figures, the enclosure 3 is substantially shaped as a rectangular prism, having six sides (not indicated with a reference numeral). The enclosure 3 may also be shaped differently. In the Figures, the electrical and/or signal connectors 4 and the cooling fluid connectors 17 and 18 are placed on the same side of the enclosure 3.

[0033] In Figure 3, the enclosure 3 and the apparatus rack 1 comprise guiding means 16 for guiding the enclosure 3 in the apparatus rack 1 to a position where the first fluid connectors 17 and 18 will automatically be con- nected to the co-operating second cooling fluid connectors 19 and 20, when the enclosure 3 is pushed into the apparatus rack 1. Said guiding means 16 for guiding the enclosure 3 in the apparatus rack 1 are preferably also arranged to guide the enclosure 3 to the position where the first electrical and/or signal connectors 4 will automatically be connected to the co-operating second electrical and/or signal connectors (not shown), when the enclosure 3 is pushed into the apparatus rack 1.

[0034] The arrangement of the invention preferably also comprises means for cooling the cooling fluid (not shown). The arrangement of the invention preferably comprises a filter arrangement (not shown) for removing particles and/or moisture from the cooling fluid to be fed into the enclosure 3. The number of control valves and back valves (not shown) possibly required in the system can be minimized by accurately measuring the pipe system. The rotation speed of the compressor (not shown) and in special cases (for example in cold conditions) constricting the amount of cooling fluid directed to the enclosures 3 in accordance with need can be used to adjust the temperature. If low pressure is used in the arrangement as well as a low pressurized capacity, then the system does not necessarily require a pressure vessel approval.

[0035] The enclosure 3 is preferably at least substantially tight so that the cooling fluid exchange in the enclosure 3 is substantially carried out only through the cooling fluid input means 5 and the cooling fluid output means 6. Thus, the cooling fluid may flow more efficiently in the enclosure 3. However, the enclosure 3 does not have to be sealed (or tight) as a bottle.

[0036] The interior (not indicated with a reference numeral) of the enclosure 3 shown in the Figures 1 , 3 and 4 to 6 is divided into several compartments 13 with partition walls 27. By dividing the interior into smaller compartments 13, the temperature conditions can be controlled individually in different parts of the enclosure 3. Cooling fluid can be fed into at least one of the compartments 13, preferably to each compartment 13. Figure 1 shows such an arrangement in which the inner space of the enclosure 3 is divided into compartments 13, into which cooling fluid can be blown using the inlet openings 11 in the cooling fluid control plate 10 and from which sections the cooling fluid heated by the component 2 generating heat energy can be removed using the outlet openings 15 in the cooling fluid control plate 10. Such a compartment 13 can naturally also contain more than one components 2 generating heat energy. [0037] The enclosure 3 preferably also forms the emc protection.

The enclosure 3 may also include smaller emc-protected parts. A compartment 13 may form such an emc protection. Placing selected components in different compartments 13 can prevent the components in the enclosure 3 from disturbing each others function. Since the emc-protection is known as such and is not the subject of this application, it is not described in more detail in this context. [0038] The enclosure 3 preferably comprises a control arrangement

(not indicated with a reference numeral) for directing cooling fluid towards the component 2 generating heat energy or into the vicinity thereof. In this way, the cooling fluid can be more accurately directed to the location where cooling is required. [0039] The enclosures 3 shown in the Figures include a first wall

(not indicated with a reference numeral) comprising a first cover plate 9 forming one of the six external walls of the enclosure 3 and a first cooling fluid control plate 10 forming one of the six internal walls of the enclosure 3. The first cooling fluid control plate 10 comprises a control arrangement for cooling fluid (not indicated with a reference numeral) for directing the cooling fluid towards the component 2 generating heat energy or into the vicinity thereof. In the Figures, the cooling fluid input means 5 are arranged to direct the cooling fluid between the first cover plate 9 and the first cooling fluid control plate 10. The control arrangement for cooling fluid in the first cooling fluid control plate 10 is arranged to guide the cooling fluid directed between the first cover plate 9 and the first cooling control plate 10 towards the component 2 generating heat energy.

[0040] The control arrangement for cooling fluid shown in the Figures comprises inlet openings 11 in the first cooling fluid control plate 10. The control arrangement for cooling fluid shown in the Figures also comprises outlet openings 15. The size of the inlet openings 11 and outlet openings 15 can be used to adjust the cooling fluid flow. The inlet openings 11 preferably taper towards the enclosure 3, thus enabling to spray cooling fluid more efficiently towards the component 2 generating heat energy. [0041] In the Figures, a first frame plate 12 is placed between the cover plate 9 and the first cooling fluid control plate 10. The first frame plate 12 is arranged to keep the first cover plate 9 at a distance from the first cooling fluid control plate 10 in such a manner that cooling fluid may flow between the first cover plate 9 and the first cooling fluid control plate 10. On account of the low pressure and a cooling stiffener, the total thickness of the wall may be approximately 5 to 6 mm. The first wall operates in the Figures as a cover for the enclosure 3. In the units including several circuit boards 24 the first wall may function as a cooling partition wall between two enclosures 3, in which case it is perforated, or provided with cooling fluid outlet openings 11 , from both sides. As to the different units, the cooling fluid control plate 10 may vary regarding an aperture field.

[0042] Placing partition walls 23 into appropriate places in the first frame plate 12 allows the cooling fluid to be directed in inlet channels 25 to the enclosure 3 preferably to particular sections 13 in the enclosure from the cooling fluid input means 5 and to remove the heated cooling fluid in outlet chan- nels 26 from the enclosure 3 advantageously from said particular sections 13 in the enclosure 3 to the cooling fluid output means 6 so that both cold and warm cooling fluids flow between the cooling fluid control plate 10 and the first cover plate 9 in such a manner that they are not mixed with one another and that the cooling fluid can flow in the enclosure 3 or in a particular section 13 in the enclosure 3.

[0043] If the interior of the enclosure 3 is divided into several compartments 13 in order to form emc protection, then an inlet channel 25 to a certain compartment 13 and an outlet channel 26 leading from a certain compartment 13 are preferably long. All inlet channels 25 merge preferably as close to the first cooling fluid connectors 17 as possible and all outlet channels 26 merge preferably as close to the first cooling fluid connectors 18 as possible. The inlet openings 11 and outlet openings 15, which open up towards a compartment 13, are preferably also relatively small in size. This minimizes the risk of spreading disturbing radiation via the inlet channels 25 and outlet channels 26 from one compartment 13 to another.

[0044] The cooling fluid output means 6 for removing the cooling fluid heated by the component 2 generating heat energy from the enclosure 3 are preferably arranged to remove the heated cooling fluid from the enclosure 3 adjacent to the component 2 generating heat energy. An example of this is shown in Figures 5 and 6. Thus, the warm cooling fluid can be removed from the enclosure 3 at the place where it is created. The enclosure 3 may for example comprise an outlet channel 26 for the heated cooling fluid that starts from an outlet opening 15 in the vicinity of the component 2 generating heat energy, whereby the heated cooling fluid can be led out from the enclosure, from the place where it is created. Figure 5 shows the outlet openings 15 made into the circuit board 24 on which the component 2 generating heat energy is placed.

[0045] The enclosure 3 shown in Figure 5 includes a second wall (not indicated with a reference numeral) comprising a second cover plate 21 and a second cooling fluid control plate (not indicated with a reference numeral), which in Figure 5 is the circuit board 24. The circuit board 24 comprises an arrangement for removing heated cooling fluid form the enclosure, which arrangement is arranged to remove the heated cooling fluid from the enclosure 3 adjacent to the component 2 generating heat energy. The cooling fluid output means 6 for removing the cooling fluid heated by the component 2 generating heat energy from the enclosure 3 is arranged in this embodiment to remove the heated cooling fluid from the enclosure 3 between the second cover plate

21 and the second cooling fluid control plate, which in Figure 5 is the circuit board 24. The embodiment shown in Figure 5 includes between the second cover plate 21 and the second cooling fluid control plate a second frame plate

22 arranged to keep the second cover plate 21 at a distance from the second cooling fluid control plate, in Figure 5 the circuit board 24, so that the cooling fluid may flow between the second cover plate 21 and the second cooling fluid control plate. In Figure 5, the second wall is placed at the other side of the en- closure 3 seen from the first wall. It is also possible that an enclosure 3 including such a second wall does not include "a first wall".

[0046] The first wall shown in the Figures may also comprise a third cover plate (not shown) placed at a distance from the first cover plate 9 shown in the Figures. In this embodiment, a pipe (not shown) is preferably directed through the first cover plate 9 and the first cooling fluid control plate 10 in order to direct the heated cooling fluid from the enclosure 3 through the first cover plate 9 and the first cooling fluid control plate 10 between the first cover plate 9 and the third cover plate. Alternatively the first cooling fluid control plate 10 and the first cover plate 9 may include holes (not shown) at the same place. The cooling fluid output means 6 are arranged in this embodiment to remove the heated cooling fluid between the first cover plate 9 and the third cover plate.

[0047] Figure 6 shows an arrangement having "a first wall" on two opposite sides. The upper first wall in Figure 6 functions as the first wall shown in Figure 4 and the lower first wall in Figure 6 functions as the first wall shown in Figure 5. An outlet channel 26 is formed between the circuit boards 24. [0048] Figure 2 shows such an arrangement, in which the first cover plate 9 comprises second openings 14 for directing the cooling fluid to the component 2 generating heat energy placed outside the enclosure 3. Such an embodiment is advantageous, for example if the apparatus comprises both enclosed and open entities including components 2 generating heat energy.

[0049] It is obvious for those skilled in the art that as technology advances the basic idea of the invention can be implemented in a number of various ways. The invention and the preferred embodiments thereof are thus not restricted to the above examples but may deviate within the scope of the claims.

Claims

1. An arrangement for cooling a component (2) generating heat energy using a cooling fluid, wherein the component (2) generating heat energy is placed in an enclosure (3), wherein the enclosure (3) comprises cooling fluid input means (5) for directing cooling fluid to the enclosure (3), wherein the enclosure (3) comprises cooling fluid output means (6) for removing cooling fluid heated by the component (2) generating heat energy from the enclosure (3), wherein the enclosure (3) comprises at least one first electrical and/or signal connector (4) for externally connecting the component (2) to electrical and/or signal means outside the enclosure (3), wherein the enclosure (3) is of such a type that is arranged to be mounted into an apparatus rack (1) or the like, and wherein the arrangement comprises a cooling fluid distribution system (7) having second cooling fluid input elements (8a) and second cooling fluid output elements (8b) to which the cooling fluid input means (5) and the cooling fluid output means (6) of the enclosure (3) are connected, so that cool- ing fluid can be directed to the enclosure (3) from the cooling fluid distribution system (7) and correspondingly removed from the enclosure (3) to the cooling fluid distribution system (7), c h a r a c t e r i z e d in that the cooling fluid input means (5) and the cooling fluid output means (6) comprise first cooling fluid connectors (17 and 18), in that the second cooling fluid input elements (8a) and cooling fluid output elements (8b) comprise co-operating second cooling fluid connectors (19 and 20), and in that the first cooling fluid connectors (17 and 18) are arranged to be automatically connected to the co-operating second cooling fluid connectors (19 and 20), when the enclosure (3) is mounted into the apparatus rack (1) or the like.

2. An arrangement as claimed in claim 1, c h a ra c t e r i z e d by comprising guiding means (16) for guiding the enclosure (3) in the apparatus rack (1) to a position where the first fluid connectors (17 and 18) will automati- cally be connected to the co-operating second cooling fluid connectors (19 and 20), when the enclosure (3) is pushed into the apparatus rack (1).

3. An arrangement as claimed in claim 1 or 2, characterized in that the first electrical and/or signal connector (4) is arranged to be auto- matically connected to a co-operating second electrical and/or signal connector in the apparatus rack (1), when the enclosure (3) is mounted into the apparatus rack (1) or the like.

4. An arrangement as claimed in claim 3, characterized by comprising guiding means (16) for guiding the enclosure (3) in the apparatus rack (1) to the position where the first electrical and/or signal connector (4) will automatically be connected to the co-operating second electrical and/or signal connectors, when the enclosure (3) is pushed into the apparatus rack (1).

5. An arrangement as claimed in claim 3 or 4, characterized in that the enclosure (3) is shaped as a rectangular prism having six sides, and in that the first electrical and/or signal connector (4) and the first cooling fluid connectors (16 and 17) are arranged on the same side of the enclosure (3).

6. An arrangement as claimed in any of claims 1 to 5, charac- t e r i z e d in that the enclosure (3) is at least substantially tight so that the cooling fluid exchange in the enclosure (3) is substantially carried out only through the cooling fluid input means (5) and the cooling fluid output means

(6).

7. An arrangement as claimed in any of claims 1 to6, charac- t e r i z e d in that the enclosure (3) comprises a control arrangement for directing cooling fluid towards the component (2) generating heat energy.

8. An arrangement as claimed in any of claims 1 to 6, characterized in that the enclosure (3) comprises a wall including a first cover plate (9) forming a part of the outer surface of the enclosure (3) and a first cooling fluid control plate (10) forming a part of the inner surface of the enclosure (3), in that the cooling fluid input means (5) are arranged to direct cooling fluid between the first cover plate (9) and the first cooling fluid control plate (10), and in that the first cooling fluid control plate (10) comprises a control arrangement for cooling fluid arranged to direct cooling fluid directed between the first cover plate (9) and the first cooling fluid control plate (10) towards the component (2) generating heat energy.

9. An arrangement as claimed in claim 8, characterized in that the first cooling fluid control plate (10) comprises an inlet opening (11).

10. An arrangement as claimed in claim 9, characterized in that the inlet opening (11) tapers in the direction towards the enclosure (3).

11. An arrangement as claimed in any one of claims 8 to 10, characterized in that a first frame plate (12) is placed between the first cover plate (9) and the first cooling fluid control plate (10), the frame plate being arranged to keep the first cover plate (9) at a distance from the first cooling fluid control plate (10).

12. An arrangement as claimed in any one of the claims 1 to 11, characterized in that the cooling fluid output means (6) for removing cooling fluid from the enclosure (3) are arranged to remove cooling fluid from the enclosure (3) adjacent the component (2) generating heat energy or in the vicinity thereof.

13. An arrangement as claimed in any one of claims 1 to 12, characterized by comprising a filter arrangement for removing particles and/or moisture from the cooling fluid to be fed into the enclosure (3).

14. An arrangement as claimed in any one of claims 1 to 13, characterized in that the interior of the enclosure (3) is divided into at least two compartments (13), in that the component (2) generating heat energy is placed in a compartment (13), in that the cooling fluid input means (5) for directing cooling fluid to the enclosure (3) end at said compartment (13) containing the component (2) generating heat energy, and in that the cooling fluid output means (6) for removing cooling fluid heated by the component (2) generating heat energy from the enclosure (3) starts from said compartment (13) containing the component (2) generating heat energy.

15. An arrangement for cooling a component (2) generating heat energy using a cooling fluid, wherein the component (2) generating heat energy is placed in an enclosure (3), wherein the enclosure (3) comprises cooling fluid input means (5) for directing cooling fluid to the enclosure (3), wherein the enclosure (3) comprises cooling fluid output means (6) for removing cooling fluid heated by the component (2) generating heat energy from the enclosure (3), wherein the enclosure (3) comprises at least one first electrical and/or signal connector (4) for externally connecting the component (2) to elec- trical and/or signal means outside the enclosure (3), wherein the enclosure (3) is of such a type that is arranged to be mounted into an apparatus rack (1) or the like, and wherein the arrangement comprises a cooling fluid distribution system (7) having second cooling fluid input elements (8a) and second cooling fluid output elements (8b) to which the cooling fluid input means (5) and the cooling fluid output means (6) of the enclosure (3) are connected, so that cooling fluid can be directed to the enclosure (3) from the cooling fluid distribution system (7) and correspondingly removed from the enclosure (3) to the cooling fluid distribution system (7), c h a r a c t e r i z e d in that the interior of the enclosure (3) is divided into at least two compartments (13), in that the component (2) generating heat energy is placed in a compartment (13), in that the cooling fluid input means (5) for directing cooling fluid to the enclosure (3) end at said compartment (13) containing the component (2) generating heat energy, and in that the cooling fluid output means (6) for removing cooling fluid heated by the component (2) generating heat energy from the enclosure (3) start from said compartment (13) containing the component (2) generating heat energy. AMENDED CLAIMS

[received by the International Bureau on 22 March 2002 (22.03.02); original claims 1-15 replaced by new claims 1-13 (3 pages)]

1. An arrangement for cooling a component (2) generating heat energy using a cooling fluid, wherein the component (2) generating heat energy is placed in an enclosure (3), wherein the enclosure (3) comprises cooling fluid input means (5) for directing cooling fluid to the enclosure (3), wherein the enclosure (3) comprises cooling fluid output means (6) for removing cooling fluid heated by the component (2) generating heat energy from the enclosure (3), wherein the enclosure (3) comprises at least one first electrical and/or signal connector (4) for externally connecting the component (2) to electrical and/or signal means outside the enclosure (3), wherein the enclosure (3) is of such a type that is arranged to be mounted into an apparatus rack (1 ) or the like, and wherein the arrangement comprises a cooling fluid distribution system (7) having second cooling fluid input elements (8a) and second cooling fluid output elements (8b) to which the cooling fluid input means (5) and the cooling fluid output means (6) of the enclosure (3) are connected, so that cool- ing fluid can be directed to the enclosure (3) from the cooling fluid distribution system (7) and correspondingly removed from the enclosure (3) to the cooling fluid distribution system (7), wherein the cooling fluid input means (5) and the cooling fluid output means (6) comprise first cooling fluid connectors (17 and 18), wherein the second cooling fluid input elements (8a) and cooling fluid output elements (8b) comprise co-operating second cooling fluid connectors (19 and 20), and wherein the first cooling fluid connectors (17 and 18) are arranged to be automatically connected to the co-operating second cooling fluid connec- tors (19 and 20), when the enclosure (3) is mounted into the apparatus rack (1 ) or the like, c h a r a c t e r i z e d in that the enclosure (3) comprises a wall including a first cover plate (9) forming a part of the outer surface of the enclosure (3) and a first cooling fluid control plate (10) forming a part of the inner surface of the enclosure (3), in that the cooling fluid input means (5) are arranged to direct cooling fluid between the first cover plate (9) and the first cooling fluid control plate (10), and in that the first cooling fluid control plate (10) comprises a control ar- rangement for cooling fluid arranged to direct cooling fluid directed between the first cover plate (9) and the first cooling fluid control plate (10) towards the component (2) generating heat energy.

2. An arrangement as claimed in claim 1, characterized by comprising guiding means (16) for guiding the enclosure (3) in the apparatus rack (1) to a position where the first fluid connectors (17 and 18) will automatically be connected to the co-operating second cooling fluid connectors (19 and 20), when the enclosure (3) is pushed into the apparatus rack (1).

4. An arrangement as claimed in claim 3, characterized by comprising guiding means (16) for guiding the enclosure (3) in the apparatus rack (1 ) to the position where the first electrical and/or signal connector (4) will automatically be connected to the co-operating second electrical and/or signal connectors, when the enclosure (3) is pushed into the apparatus rack (1).

(6).

7. An arrangement as claimed in any of claims 1 to 6, charac- t e r i z e d in that the enclosure (3) comprises a control arrangement for directing cooling fluid towards the component (2) generating heat energy.

8. An arrangement as claimed in claim 1, characterized in that the first cooling fluid control plate (10) comprises an inlet opening (11).

9. An arrangement as claimed in 8, characterized in that the inlet opening (11) tapers in the direction towards the enclosure (3). 10. An arrangement as claimed in any one of claims 8 to 9, c h a r - acterized in that a first frame plate (12) is placed between the first cover plate (9) and the first cooling fluid control plate (10), the frame plate being arranged to keep the first cover plate (9) at a distance from the first cooling fluid control plate (10). 11. An arrangement as claimed in any one of the claims 1 to 10, characterized in that the cooling fluid output means (6) for removing cooling fluid from the enclosure (3) are arranged to remove cooling fluid from the enclosure (3) adjacent the component (2) generating heat energy or in the vicinity thereof. 12. An arrangement as claimed in any one of claims 1 to 11, characterized by comprising a filter arrangement for removing particles and/or moisture from the cooling fluid to be fed into the enclosure (3).

13. An arrangement as claimed in any one of claims 1 to 12, characterized in that the interior of the enclosure (3) is divided into at least two compartments (13), in that the component (2) generating heat energy is placed in a compartment (13), in that the cooling fluid input means (5) for directing cooling fluid to the enclosure (3) end at said compartment (13) containing the component (2) generating heat energy, and in that the cooling fluid output means (6) for removing cooling fluid heated by the component (2) generating heat energy from the enclosure (3) starts from said compartment (13) containing the component (2) generating heat energy.