FI20002415A - Arrangement for cooling a component that generates heat energy with cooling fluid - Google Patents

Arrangement for cooling a component that generates heat energy with cooling fluid Download PDF

Info

Publication number
FI20002415A
FI20002415A FI20002415A FI20002415A FI20002415A FI 20002415 A FI20002415 A FI 20002415A FI 20002415 A FI20002415 A FI 20002415A FI 20002415 A FI20002415 A FI 20002415A FI 20002415 A FI20002415 A FI 20002415A
Authority
FI
Finland
Prior art keywords
cooling
arrangement
component
heat energy
generates heat
Prior art date
Application number
FI20002415A
Other languages
Finnish (fi)
Swedish (sv)
Other versions
FI20002415A0 (en
Inventor
Jyrki Mustakallio
Original Assignee
Nokia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nokia Corp filed Critical Nokia Corp
Priority to FI20002415A priority Critical patent/FI20002415A/en
Publication of FI20002415A0 publication Critical patent/FI20002415A0/en
Priority to PCT/FI2001/000957 priority patent/WO2002037914A1/en
Priority to AU2002214062A priority patent/AU2002214062A1/en
Publication of FI20002415A publication Critical patent/FI20002415A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
FI20002415A 2000-11-02 2000-11-02 Arrangement for cooling a component that generates heat energy with cooling fluid FI20002415A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FI20002415A FI20002415A (en) 2000-11-02 2000-11-02 Arrangement for cooling a component that generates heat energy with cooling fluid
PCT/FI2001/000957 WO2002037914A1 (en) 2000-11-02 2001-11-01 Arrangement for cooling a component generating heat energy using cooling fluid
AU2002214062A AU2002214062A1 (en) 2000-11-02 2001-11-01 Arrangement for cooling a component generating heat energy using cooling fluid

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20002415A FI20002415A (en) 2000-11-02 2000-11-02 Arrangement for cooling a component that generates heat energy with cooling fluid

Publications (2)

Publication Number Publication Date
FI20002415A0 FI20002415A0 (en) 2000-11-02
FI20002415A true FI20002415A (en) 2002-07-18

Family

ID=8559425

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20002415A FI20002415A (en) 2000-11-02 2000-11-02 Arrangement for cooling a component that generates heat energy with cooling fluid

Country Status (3)

Country Link
AU (1) AU2002214062A1 (en)
FI (1) FI20002415A (en)
WO (1) WO2002037914A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104126274B (en) 2012-02-21 2015-12-09 华为技术有限公司 Liquid-cooling system and the method for cooling at least one radio unit

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5424916A (en) * 1989-07-28 1995-06-13 The Charles Stark Draper Laboratory, Inc. Combination conductive and convective heatsink
US5131859A (en) * 1991-03-08 1992-07-21 Cray Research, Inc. Quick disconnect system for circuit board modules
US5740018A (en) * 1996-02-29 1998-04-14 The United States Of America As Represented By The Secretary Of The Navy Environmentally controlled circuit pack and cabinet
US5999404A (en) * 1998-10-14 1999-12-07 Sun Microsystems, Inc. Spray cooled module with removable spray cooled sub-module

Also Published As

Publication number Publication date
WO2002037914A1 (en) 2002-05-10
AU2002214062A1 (en) 2002-05-15
FI20002415A0 (en) 2000-11-02

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