WO2002032624A1 - Segmented wafer polishing pad - Google Patents

Segmented wafer polishing pad Download PDF

Info

Publication number
WO2002032624A1
WO2002032624A1 PCT/GB2001/004654 GB0104654W WO0232624A1 WO 2002032624 A1 WO2002032624 A1 WO 2002032624A1 GB 0104654 W GB0104654 W GB 0104654W WO 0232624 A1 WO0232624 A1 WO 0232624A1
Authority
WO
WIPO (PCT)
Prior art keywords
lapping
working plate
plate
grooves
working
Prior art date
Application number
PCT/GB2001/004654
Other languages
French (fr)
Inventor
Stephen Victor Middleton
John Edmund Leigh Kruger
Original Assignee
H K Founders Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by H K Founders Ltd filed Critical H K Founders Ltd
Priority to US10/399,949 priority Critical patent/US20040029501A1/en
Priority to EP01976480A priority patent/EP1328377A1/en
Priority to AU2001295749A priority patent/AU2001295749A1/en
Publication of WO2002032624A1 publication Critical patent/WO2002032624A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

Working plate (10) is formed of forty-eight sections (10'), with groove (12) extending through the majority of the thickness of the plate. In one form, dovetail grooves are machined to the back of the sections of the plates (10') attached to the base plate (19). In an alternative arrangement, fixing rails are attached to the backs of the sections and the dovetail grooves are in the base plate (19).

Claims

21CLAIMS
1. Lapping apparatus for flat lapping application using multi-groove slurry distribution, the apparatus comprising means to rotate a lapping plate, the lapping plate comprising a base plate having detachably mounted thereon a working plate for abutment against material during the lapping operation, the working plate being rigid and having a cross-hatch arrangement of grooves on the surface for abutment against a semi- conductor wafer in the lapping operation, the cross-hatch arrangement of grooves comprise two sets of continuous grooves.
2. Lapping apparatus for the manufacture of semi-conductor wafers, the lapping apparatus comprising means to rotate a lapping plate, said lapping plate comprising a base plate having detachably mounted thereon a working plate for abutment against a semi-conductor wafer during the lapping operation, the working plate being rigid and having a cross-hatch arrangement of grooves on the surface for abutment against a semiconductor wafer in the lapping operation, the cross-hatch arrangement of grooves comprising two sets of continuous grooves.
3. Lapping apparatus according to Claim 1 or 2 wherein the working plate is segmented to form a plurality of equi-planar sections.
4. Lapping apparatus according to any preceding claim wherein the working plate is segmented in strips.
5. Lappmg apparatus according to any preceding claim wherein the working plate is segmented in columns and rows. 22
6. Lapping apparatus according to any preceding claim wherein the sets of grooves are mutually orthogonal.
7. Lapping apparatus according to any preceding claim, comprising two lapping plates each having a base plate with a working plate detachably mounted thereon, the working plates abutting opposing faces of a semiconductor wafer during the lapping operation.
8. Lapping apparatus according to any preceding claim comprising at least one fixing rail attached to the base plate.
9. Lapping apparatus according to Claim 8 wherein the fixing rail has a dovetail profile.
10. Lapping apparatus according to Claim 8 wherein the fixing rail has an ovoid profile.
11. Lapping apparatus according to Claim 9 or 10 wherein the at least one rail comprises a load distribution strip to effect clamping of the rail at the edges.
12. Lapping apparatus according to any preceding claim wherein the or each working plate is formed of a plurality of sections.
13. Lapping apparatus according to Claim 12 wherein the sections of a plate are joined at lines which are groove lines of the working plate when complete. 23
14. Lapping apparatus according to Claim 1 wherein the working plate includes one or more further grooves extending generally diagonally relative to the arrangement of grooves.
15. Lapping apparatus according to any preceding claim, wherein the base plate is formed of one of the following materials :-
Stainless steel, treated aluminum, treated mild steel, gray cast iron, Kevlar/epoxy composite, carbon/epoxy composite, glass/epoxy composite, glass/polyester composite.
16. Lapping apparatus according to any preceding claim wherein the working plate is formed of one of the following materials:-
spheroidal cast irons, ceramics.
17. Lapping apparatus according to any preceding claim wherein the working plate is detachably mounted on a base plate by means of one or more of the following: - • Magnetic clamping;
• Male/female arrangements incorporating the plate as one of the attachment;
• Male/female arrangements with other mechanical fixings;
• Other mechanical means of attachment e.g. cotter of dowel pins, taper pins, circlips;
• Advesively bonding the working surface to the base plate other fastening media, e.g. Velcro (RTM) or adhesive tapes.
• Hydraulic or Pneumatically operated retention methods. 24
18. A working plate for lapping apparatus according to any preceding claim.
19. A working plate according to Claim 14 being rigid and having means to attach the plate onto a base plate of a lapping apparatus and working plate has a cross-hatch arrangement of grooves on the surface for abutment against a semi-conductor wafer in the lapping operation the cross-hatch arrangement of grooves comprise two sets of continuous grooves.
20. A working plate according to Claim 19 wherein the attachment means comprises one or more of the following:
• Magnetic clamping;
• Male/female arrangements incorporating the plate as one of the attachment; • Male/female arrangements with other mechanical fixings;
• Other mechanical means of attachment e.g. cotter of dowel pins, taper pins, circlips;
• Advesively bonding the working surface to the base plate other fastening media, e.g. Nelcro (RTM) or adhesive tapes. • Hydraulic or Pneumatically operated retention methods.
21. A working plate according to Claim 18 or 19 wherein the working plate is formed of a plurality of sections.
22. A working plate according to Claim 20 wherein the working plate is formed of sections for joining at lines which are groove lines of the working plate when complete. 25
23. A working plate according to any of Claims 18 to 22 wherein the working plate has a cross-hatch arrangement of grooves on the surface for abutment against a semi-conductor wafer in operation.
24. A working plate according to any of Claims 20 or 21 wherein the working plate is formed of one of the following materials :-
spheroidal cast iron, ceramics.
PCT/GB2001/004654 2000-10-20 2001-10-19 Segmented wafer polishing pad WO2002032624A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US10/399,949 US20040029501A1 (en) 2000-10-20 2001-10-19 Segmented wafer polishing pad
EP01976480A EP1328377A1 (en) 2000-10-20 2001-10-19 Segmented wafer polishing pad
AU2001295749A AU2001295749A1 (en) 2000-10-20 2001-10-19 Segmented wafer polishing pad

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0025745.1 2000-10-20
GBGB0025745.1A GB0025745D0 (en) 2000-10-20 2000-10-20 Semiconductor wafer manufacturing equipment

Publications (1)

Publication Number Publication Date
WO2002032624A1 true WO2002032624A1 (en) 2002-04-25

Family

ID=9901684

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB2001/004654 WO2002032624A1 (en) 2000-10-20 2001-10-19 Segmented wafer polishing pad

Country Status (5)

Country Link
US (1) US20040029501A1 (en)
EP (1) EP1328377A1 (en)
AU (1) AU2001295749A1 (en)
GB (1) GB0025745D0 (en)
WO (1) WO2002032624A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101034506B1 (en) * 2008-11-28 2011-05-17 세메스 주식회사 Polishing unit, substrate polishing apparatus having the same and method of polishing substrate using the same
JP7158813B2 (en) * 2018-06-28 2022-10-24 株式会社ディスコ grinding wheel

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5718620A (en) * 1992-02-28 1998-02-17 Shin-Etsu Handotai Polishing machine and method of dissipating heat therefrom
WO1998017438A1 (en) * 1996-10-18 1998-04-30 Kanebo Limited Surface polishing apparatus
US5888121A (en) * 1997-09-23 1999-03-30 Lsi Logic Corporation Controlling groove dimensions for enhanced slurry flow

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4037367A (en) * 1975-12-22 1977-07-26 Kruse James A Grinding tool
JPS60242975A (en) * 1984-05-14 1985-12-02 Kanebo Ltd Surface grinding device
US4996798A (en) * 1989-05-31 1991-03-05 Moore Steven C Ultra-precision lapping apparatus
US5076024A (en) * 1990-08-24 1991-12-31 Intelmatec Corporation Disk polisher assembly
AU654901B2 (en) * 1992-03-16 1994-11-24 De Beers Industrial Diamond Division (Proprietary) Limited Polishing pad
US5243790A (en) * 1992-06-25 1993-09-14 Abrasifs Vega, Inc. Abrasive member
JPH09510405A (en) * 1994-09-08 1997-10-21 ストルエルス アクチェ セルスカプ Grinding / polishing cover sheet for placement on a rotatable grinding / polishing disc
US5873772A (en) * 1997-04-10 1999-02-23 Komatsu Electronic Metals Co., Ltd. Method for polishing the top and bottom of a semiconductor wafer simultaneously
GB2345255B (en) * 1998-12-29 2000-12-27 United Microelectronics Corp Chemical-Mechanical Polishing Pad
JP2000326235A (en) * 1999-05-17 2000-11-28 Inst Of Physical & Chemical Res Grinding wheel for elid and surface grinding machine therewith

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5718620A (en) * 1992-02-28 1998-02-17 Shin-Etsu Handotai Polishing machine and method of dissipating heat therefrom
WO1998017438A1 (en) * 1996-10-18 1998-04-30 Kanebo Limited Surface polishing apparatus
US5888121A (en) * 1997-09-23 1999-03-30 Lsi Logic Corporation Controlling groove dimensions for enhanced slurry flow

Also Published As

Publication number Publication date
GB0025745D0 (en) 2000-12-06
EP1328377A1 (en) 2003-07-23
AU2001295749A1 (en) 2002-04-29
US20040029501A1 (en) 2004-02-12

Similar Documents

Publication Publication Date Title
US5197249A (en) Diamond tool with non-abrasive segments
US8303374B2 (en) Carrier plate holding an abrading element and abrading plate
TW358764B (en) A method of double-side lapping a wafer and an apparatus therefor
ZA957039B (en) Coated abrasive article, method for preparing the same, and method of using a coated abrasive article to abrade a hard workpiece.
EP0627281A3 (en) Rotary pads for finishing marble, granite and stone
EP1197296A3 (en) Pad conditioning disk
DK0465770T3 (en) End Abrasive Tools
WO2002032624A1 (en) Segmented wafer polishing pad
WO2021233089A1 (en) Grinding plate of electric motor-driven floor grinder
CN109736009B (en) Suit coiled hair moving platform of tricot machine
EP1125686A4 (en) Work holding disc for polishing, work polishing apparatus, and work polishing method
US2378271A (en) Reinforced abrasive article mounted on a backing plate
DE8426106U1 (en) One-piece shaped eccentric disc for holding Velcro or self-adhesive grinding discs with exchangeable wear ring and suction
CN87208852U (en) Granding head with demountable diamond grinding strips
CN2579605Y (en) Polishing disc
CN220429522U (en) Corrosion-resistant lining plate
CN210115807U (en) Efficient plate rust removal three-jaw disc and polisher using three-jaw disc
CN114182585B (en) General laying platform of magnetic type turnout
CN220113098U (en) Concrete polishing device
CN211615271U (en) Movable cushion block for compression grinding tool
CN209919385U (en) Machining clamp for ensuring flatness of television back panel
WO2007071156A1 (en) A combined static pressure track and an assembled method for the same
CN209395043U (en) A kind of diamond saw blade
CA1115195A (en) Wear resistant interlocking tile with magnetic backing
KR100198887B1 (en) Dual-face polishing apparatus

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ PH PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG US UZ VN YU ZA ZW

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 2001976480

Country of ref document: EP

WWP Wipo information: published in national office

Ref document number: 2001976480

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 10399949

Country of ref document: US

REG Reference to national code

Ref country code: DE

Ref legal event code: 8642

WWW Wipo information: withdrawn in national office

Ref document number: 2001976480

Country of ref document: EP

NENP Non-entry into the national phase

Ref country code: JP