EP1328377A1 - Segmented wafer polishing pad - Google Patents

Segmented wafer polishing pad

Info

Publication number
EP1328377A1
EP1328377A1 EP01976480A EP01976480A EP1328377A1 EP 1328377 A1 EP1328377 A1 EP 1328377A1 EP 01976480 A EP01976480 A EP 01976480A EP 01976480 A EP01976480 A EP 01976480A EP 1328377 A1 EP1328377 A1 EP 1328377A1
Authority
EP
European Patent Office
Prior art keywords
lapping
working plate
plate
grooves
working
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP01976480A
Other languages
German (de)
French (fr)
Inventor
Stephen Victor Middleton
John Edmund Leigh Kruger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
H K Founders Ltd
Original Assignee
H K Founders Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by H K Founders Ltd filed Critical H K Founders Ltd
Publication of EP1328377A1 publication Critical patent/EP1328377A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

Working plate (10) is formed of forty-eight sections (10'), with groove (12) extending through the majority of the thickness of the plate. In one form, dovetail grooves are machined to the back of the sections of the plates (10') attached to the base plate (19). In an alternative arrangement, fixing rails are attached to the backs of the sections and the dovetail grooves are in the base plate (19).

Claims

21CLAIMS
1. Lapping apparatus for flat lapping application using multi-groove slurry distribution, the apparatus comprising means to rotate a lapping plate, the lapping plate comprising a base plate having detachably mounted thereon a working plate for abutment against material during the lapping operation, the working plate being rigid and having a cross-hatch arrangement of grooves on the surface for abutment against a semi- conductor wafer in the lapping operation, the cross-hatch arrangement of grooves comprise two sets of continuous grooves.
2. Lapping apparatus for the manufacture of semi-conductor wafers, the lapping apparatus comprising means to rotate a lapping plate, said lapping plate comprising a base plate having detachably mounted thereon a working plate for abutment against a semi-conductor wafer during the lapping operation, the working plate being rigid and having a cross-hatch arrangement of grooves on the surface for abutment against a semiconductor wafer in the lapping operation, the cross-hatch arrangement of grooves comprising two sets of continuous grooves.
3. Lapping apparatus according to Claim 1 or 2 wherein the working plate is segmented to form a plurality of equi-planar sections.
4. Lapping apparatus according to any preceding claim wherein the working plate is segmented in strips.
5. Lappmg apparatus according to any preceding claim wherein the working plate is segmented in columns and rows. 22
6. Lapping apparatus according to any preceding claim wherein the sets of grooves are mutually orthogonal.
7. Lapping apparatus according to any preceding claim, comprising two lapping plates each having a base plate with a working plate detachably mounted thereon, the working plates abutting opposing faces of a semiconductor wafer during the lapping operation.
8. Lapping apparatus according to any preceding claim comprising at least one fixing rail attached to the base plate.
9. Lapping apparatus according to Claim 8 wherein the fixing rail has a dovetail profile.
10. Lapping apparatus according to Claim 8 wherein the fixing rail has an ovoid profile.
11. Lapping apparatus according to Claim 9 or 10 wherein the at least one rail comprises a load distribution strip to effect clamping of the rail at the edges.
12. Lapping apparatus according to any preceding claim wherein the or each working plate is formed of a plurality of sections.
13. Lapping apparatus according to Claim 12 wherein the sections of a plate are joined at lines which are groove lines of the working plate when complete. 23
14. Lapping apparatus according to Claim 1 wherein the working plate includes one or more further grooves extending generally diagonally relative to the arrangement of grooves.
15. Lapping apparatus according to any preceding claim, wherein the base plate is formed of one of the following materials :-
Stainless steel, treated aluminum, treated mild steel, gray cast iron, Kevlar/epoxy composite, carbon/epoxy composite, glass/epoxy composite, glass/polyester composite.
16. Lapping apparatus according to any preceding claim wherein the working plate is formed of one of the following materials:-
spheroidal cast irons, ceramics.
17. Lapping apparatus according to any preceding claim wherein the working plate is detachably mounted on a base plate by means of one or more of the following: - • Magnetic clamping;
• Male/female arrangements incorporating the plate as one of the attachment;
• Male/female arrangements with other mechanical fixings;
• Other mechanical means of attachment e.g. cotter of dowel pins, taper pins, circlips;
• Advesively bonding the working surface to the base plate other fastening media, e.g. Velcro (RTM) or adhesive tapes.
• Hydraulic or Pneumatically operated retention methods. 24
18. A working plate for lapping apparatus according to any preceding claim.
19. A working plate according to Claim 14 being rigid and having means to attach the plate onto a base plate of a lapping apparatus and working plate has a cross-hatch arrangement of grooves on the surface for abutment against a semi-conductor wafer in the lapping operation the cross-hatch arrangement of grooves comprise two sets of continuous grooves.
20. A working plate according to Claim 19 wherein the attachment means comprises one or more of the following:
• Magnetic clamping;
• Male/female arrangements incorporating the plate as one of the attachment; • Male/female arrangements with other mechanical fixings;
• Other mechanical means of attachment e.g. cotter of dowel pins, taper pins, circlips;
• Advesively bonding the working surface to the base plate other fastening media, e.g. Nelcro (RTM) or adhesive tapes. • Hydraulic or Pneumatically operated retention methods.
21. A working plate according to Claim 18 or 19 wherein the working plate is formed of a plurality of sections.
22. A working plate according to Claim 20 wherein the working plate is formed of sections for joining at lines which are groove lines of the working plate when complete. 25
23. A working plate according to any of Claims 18 to 22 wherein the working plate has a cross-hatch arrangement of grooves on the surface for abutment against a semi-conductor wafer in operation.
24. A working plate according to any of Claims 20 or 21 wherein the working plate is formed of one of the following materials :-
spheroidal cast iron, ceramics.
EP01976480A 2000-10-20 2001-10-19 Segmented wafer polishing pad Withdrawn EP1328377A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GBGB0025745.1A GB0025745D0 (en) 2000-10-20 2000-10-20 Semiconductor wafer manufacturing equipment
GB0025745 2000-10-20
PCT/GB2001/004654 WO2002032624A1 (en) 2000-10-20 2001-10-19 Segmented wafer polishing pad

Publications (1)

Publication Number Publication Date
EP1328377A1 true EP1328377A1 (en) 2003-07-23

Family

ID=9901684

Family Applications (1)

Application Number Title Priority Date Filing Date
EP01976480A Withdrawn EP1328377A1 (en) 2000-10-20 2001-10-19 Segmented wafer polishing pad

Country Status (5)

Country Link
US (1) US20040029501A1 (en)
EP (1) EP1328377A1 (en)
AU (1) AU2001295749A1 (en)
GB (1) GB0025745D0 (en)
WO (1) WO2002032624A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101034506B1 (en) * 2008-11-28 2011-05-17 세메스 주식회사 Polishing unit, substrate polishing apparatus having the same and method of polishing substrate using the same
JP7158813B2 (en) * 2018-06-28 2022-10-24 株式会社ディスコ grinding wheel

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4037367A (en) * 1975-12-22 1977-07-26 Kruse James A Grinding tool
JPS60242975A (en) * 1984-05-14 1985-12-02 Kanebo Ltd Surface grinding device
US4996798A (en) * 1989-05-31 1991-03-05 Moore Steven C Ultra-precision lapping apparatus
US5076024A (en) * 1990-08-24 1991-12-31 Intelmatec Corporation Disk polisher assembly
JP2985490B2 (en) * 1992-02-28 1999-11-29 信越半導体株式会社 Heat removal method of polishing machine
AU654901B2 (en) * 1992-03-16 1994-11-24 De Beers Industrial Diamond Division (Proprietary) Limited Polishing pad
US5243790A (en) * 1992-06-25 1993-09-14 Abrasifs Vega, Inc. Abrasive member
JPH09510405A (en) * 1994-09-08 1997-10-21 ストルエルス アクチェ セルスカプ Grinding / polishing cover sheet for placement on a rotatable grinding / polishing disc
WO1998017438A1 (en) * 1996-10-18 1998-04-30 Kanebo Limited Surface polishing apparatus
US5873772A (en) * 1997-04-10 1999-02-23 Komatsu Electronic Metals Co., Ltd. Method for polishing the top and bottom of a semiconductor wafer simultaneously
US5888121A (en) * 1997-09-23 1999-03-30 Lsi Logic Corporation Controlling groove dimensions for enhanced slurry flow
GB2345255B (en) * 1998-12-29 2000-12-27 United Microelectronics Corp Chemical-Mechanical Polishing Pad
JP2000326235A (en) * 1999-05-17 2000-11-28 Inst Of Physical & Chemical Res Grinding wheel for elid and surface grinding machine therewith

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO0232624A1 *

Also Published As

Publication number Publication date
WO2002032624A1 (en) 2002-04-25
GB0025745D0 (en) 2000-12-06
AU2001295749A1 (en) 2002-04-29
US20040029501A1 (en) 2004-02-12

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Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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17P Request for examination filed

Effective date: 20030520

AK Designated contracting states

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

AX Request for extension of the european patent

Extension state: AL LT LV MK RO SI

17Q First examination report despatched

Effective date: 20040616

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20041228