WO2002013223A1

WO2002013223A1 - Method of producing planar type light-emitting display panels

Info

Publication number: WO2002013223A1
Application number: PCT/JP2000/005289
Authority: WO
Inventors: Hisatoshi Kishi; Hideo Yamada; Isamu Makita
Original assignee: Mitsubishi Denki Kabushiki Kaisha
Priority date: 2000-08-07
Filing date: 2000-08-07
Publication date: 2002-02-14
Also published as: EP1308981A4; JP3759727B2; KR100445954B1; KR20020048950A; EP1308981A1

Abstract

A method of producing planar type light-emitting display panels which comprises the steps of pressing a back panel (2) against a front panel (1) by a flat plate (11) which is formed with openings at positions corresponding to pin electrodes (6), applying frit to the pin electrodes (6) with the two panels held in intimate contact, drying and temporarily fixing the two panels and then releasing the flat plate (11), applying frit to the ends of the front panel (1) and the sides of the back panel (2), and firing the whole. The processing order may be switched between the step of applying frit to the pin electrodes (6) and the step of applying frit to the ends of the front panel (1) and the sides of the back panel (2). The frit applied to the sides of the panel has lower fluidity than the frit applied to the pin electrodes (6).

Description

Specification

Method of manufacturing flat type light emitting display panel

Technical field

The present invention relates to a method for manufacturing a flat-type light-emitting display panel in which electrodes are drawn out to the back and the periphery of the panel is sealed with frit glass. Background art

With the progress of the information-oriented society in recent years, the demand for large-screen display is increasing. In general, it is technically or costly difficult to construct a large screen with a single display element (hereinafter referred to as a panel). For this reason, a large screen is formed by arranging a plurality of panels.

In this case, if the non-display area provided at the end of each panel is large, the seam between adjacent panels becomes conspicuous, and the screen display quality on the entire large screen deteriorates. Therefore, the non-display area of each panel is small.

There is a demand for the development of a flat-type light-emitting display panel capable of high-quality large-screen display.

In response to such demands, the present applicant has previously proposed a structure of a flat panel light emitting display panel in which a plurality of panels are arranged.

FIG. 1 is a cross-sectional view showing a side sealing structure in a flat-type light emitting display panel (hereinafter, referred to as a display panel) according to the prior application. In the figure, reference numeral 1 denotes a transparent front panel, and 2 denotes a rear panel which is disposed parallel to the front panel 1 and has a plurality of recesses 2a serving as discharge spaces for display cells. An insulating glass layer (not shown) is formed on the bottom surface and the inner wall surface of the concave portion 2a of the back panel 2, and the phosphor 3 is applied on the insulating glass layer. Previous A pin electrode (not shown) penetrating the rear panel 2 is provided inside the front panel 1. Further, a pair of cell electrodes (not shown) are provided on the front panel 1 in a region facing the recess 2 a of the rear panel 2. In the display panel having such a configuration, in order to reduce the non-display area at the end of the panel, electrodes are taken out from the electrodes on the front panel 1 side to the rear surface by pin electrodes (not shown). In addition, the outer dimensions of the front panel 1 are made larger than the outer dimensions of the rear panel 2 and the protruding area 1a of the front panel 1 which protrudes from the rear panel 2 and the side part 2b of the rear panel 2 have a fit 4 Is applied and fired to seal around the front panel 1 and the rear panel 2.

Next, a method for manufacturing the display panel will be described in the order of steps.

(Step 1) A transparent electrode (not shown) including a discharge gap is formed on the front panel 1 by using ITO (indium tin oxide) or nesa (tin oxide).

(Step 2) An electrode terminal (not shown) is formed on one end of the transparent electrode (not shown) formed in step 1 using a conductive material such as Ag by a screen printing method.

(Step 3) An insulating glass layer (not shown) is formed by screen printing on the entire front panel 1 except for the electrode terminals (not shown) formed in step 2

(Step 4) Pin electrodes (not shown) are erected on the electrode terminals (not shown).

(Step 5) A MgO film is formed on the insulating glass layer (not shown) formed in Step 3, and the processing for the front panel 1 is completed.

(Step 6) Through holes (not shown) for penetrating pin electrodes (not shown) in the rear panel 2 and concave portions 2a serving as discharge spaces of display cells are formed by a sandblast method or the like. (Step 7) The phosphor 3 (R, G, B) is applied to the bottom surface and the inner wall surface of the concave portion 2a formed in the step 6 by a screen printing method or the like, and the application to the back panel 2 is completed.

(Step 8) Align the pin electrodes (not shown) standing on the front panel 1 with the through holes (not shown) on the rear panel 2 so that the phosphor 3 faces the front panel 1 Lay 2 on the front panel 1.

(Step 9) With no pin electrodes, sandwich the end of front panel 1 and the end of rear panel 2 with a clip spring (not shown) to fix both panels.

(Step 10) Frit 4 is applied to a pin electrode (not shown) with a dispenser (not shown).

(Step 11) After drying the applied flip 4 in step 10, the clip spring (not shown) is removed, and the tip tube (not shown) and the outer periphery of the panel, ie, the front panel 1 The frit 4 is applied to the protruding area 1a and the side 2b of the rear panel 2 with a dispenser (not shown).

(Step 12) A weight (not shown) is placed on the part excluding the tip tube (not shown) and the pin electrode (not shown), and the flit 4 is baked. Is enclosed.

(Step 13) MgO adhering to the pin electrode (not shown) is removed by a sand blast method or the like to obtain a display panel.

When a plurality of display panels according to the preceding application manufactured by the above-described processes are arranged and lit and displayed, a display gap may be generated between adjacent panels.

The present inventor has conducted intensive investigations on the causes of the gaps in the display, and found that the sealing frit formed on the protruding area 1a of the front panel 1 and the side 2b of the rear panel 2 bleeds into the display cell. Was found. That is, the sealing frit that has oozed into the display cell is the fluorescent light applied to the rear panel 2. If the body 3 or the area of the front panel 1 corresponding to the phosphor 3 is covered, the covered portion does not emit light or the light emission is blocked, so that the non-light-emitting area at the panel edge increases, and a plurality of panels are arranged side by side. This is considered to be a mechanism in which a gap appears between adjacent panels when turned on.

The occurrence of flit bleeding occurs when a gap 4 is formed between the front panel 1 and the rear panel 2 when the flip 4 is applied to the protruding area 1a of the front panel 1 and the side 2b of the rear panel 2. It is thought that there is a cause. In step 11, the clip spring (not shown) was removed, and the gap between the front panel 1 and the rear panel 2 was measured with a clearance gauge (not shown) before the sealing of the flip. A gap of about 5 mm was confirmed. If there is a large gap in this part, the amount of penetration of the frit 4 into the gap when the frit 4 is applied increases, and the frit 4 softens when the frit 4 is fired in the process 12.ヅ The amount of the part 4 that enters the cell increases.

Such a gap is caused by warpage of the front panel 1 and the rear panel 2 as shown in FIG. An insulating glass layer (not shown) having a thickness of about 30 μm is formed on the surface of the front panel 1, and a concave portion 2 a is formed on the surface of the rear panel 2. The surface (opposite surface) is inclined to protrude. In this state, as shown in Fig. 3, when the ends of both panels are sandwiched by clip springs 5 (step 9), the center portions of both panels 1 and 2 are in a floating state, so that they are located on the center portion side. The pin electrode to be fixed is temporarily fixed by a flit (step 10). 2 and 3, illustration of the concave portion 2a of the rear panel 2, the pin electrode, and the like is omitted. Next, when the clip spring 5 is removed to apply the frit 4 to the protruding area 1a of the front panel 1 and the side face 2b of the rear panel 2, the two panels attempt to return to their original shapes. As shown in the figure, a gap is created between the ends of both panels. Another factor in the occurrence of frit bleeding is that the frit 4 softened and flowed on the side surface passes through the minute gap between the front panel 1 and the back panel 2 during firing due to capillary action, and enters the cell. May flow. In order to reduce such bleeding of the frit, it is only necessary to reduce the fluidity of the frit 4 during softening. To this end, the firing conditions of the frit 4 are weakened (the temperature is lowered). And shorten the time).

However, if the firing conditions for the frit 4 are weakened, the bleeding of the frit 4 into the cell can be reduced.However, when a voltage is applied, abnormal discharge may occur at the pin electrode when voltage is applied. is there. This is because when the firing conditions of the frit 4 are weakened, the fluidity of the frit 4 is reduced, so that the flow of the frit 4 does not sufficiently flow into the pin electrode, and the insulation of the pin electrode is reduced due to insufficient coating of the pin electrode. It is considered that abnormal discharge occurs when voltage is applied.

Conversely, if the firing conditions of the frit 4 are increased (higher temperature and longer time) to completely cover the pin electrode, the frit 4 at the end of the panel will seep into the cell. Is generated. In other words, the coating of the pin electrode and the oozing of the flat panel edges are in a reciprocal relationship, and it is difficult to achieve both.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and a method of manufacturing a flat-type light-emitting display panel capable of completely covering a pin electrode with a frit and reducing flit bleeding at an end of the panel. The purpose is to provide. Disclosure of the invention

A method of manufacturing a flat light-emitting display panel according to the present invention includes: a transparent front panel; and a rear panel provided in parallel with the front panel and arranged with a plurality of recesses serving as discharge spaces of display cells. Penetrating the rear panel, the front A pin electrode provided upright on the inside of the face panel; and a pair of cell electrodes provided in a region of the front panel opposed to the concave portion of the back panel, from the pin electrode to the cell electrode. In the method for manufacturing a flat light emitting display panel in which the voltage is supplied, the back panel is pressed against the front panel with a flat plate having an opening at a position corresponding to the pin electrode, and the two panels are brought into close contact with each other. Then, a frit is applied to the pin electrode, dried, and the two panels are temporarily fixed, the flat plate is removed, and frit is applied to the end of the front panel and the side of the back panel. It is characterized by applying and baking the whole. As a result, by temporarily fixing both panels in a state in which both panels are evenly adhered to each other with a flat plate, the occurrence of a gap between the panels due to the warpage of the panels is prevented, and the gap between the flit panels is prevented. Intrusion into gaps can be prevented. Also, since it is not necessary to adjust the conditions for firing the frit, it is possible to fire the frit under conditions that can sufficiently cover the pin electrodes.

The method of manufacturing a flat-type light-emitting display panel according to the present invention includes a step of placing a front panel and a rear panel superimposed on the front panel on a base plate having a flat surface, and screwing the flat plate to the base plate. It is characterized by the following. As a result, the front panel and the rear panel are sandwiched between the flat plate and the base plate and uniformly adhered to each other, so that bleeding due to a gap between the two panels can be reliably prevented during frit application and baking.

The method of manufacturing a flat-type light-emitting display panel according to the present invention includes the steps of: placing a front panel and a back panel superimposed on the front panel on a base plate having a flat surface; It is characterized by including a step of screwing to the pace plate. As a result, the front panel and the rear panel are sandwiched between the flat plate and the base plate and uniformly adhered to each other, so that bleeding due to a gap between the panels during the application and firing of the frit is ensured. Can be prevented.

The method of manufacturing a flat light-emitting display panel according to the present invention is characterized in that the fluid applied to the edge of the front panel and the side surface of the rear panel has lower fluidity than the fluid applied to the pin electrode. It is characterized by having. As a result, the amount of flit seeping into the inside from the periphery of both panels can be minimized.

A method of manufacturing a flat light-emitting display panel according to the present invention includes: a transparent front panel; and a rear panel provided in parallel with the front panel and arranged with a plurality of recesses serving as discharge spaces of display cells. A pin electrode penetrating through the rear panel and standing inside the front panel; and a pair of cell electrodes respectively disposed in a region of the front panel facing a recess of the rear panel. In the method of manufacturing a flat light emitting display panel in which a voltage is supplied from the pin electrode to the cell electrode, the back panel is pressed against the front panel by a flat plate having an opening at a position corresponding to the pin electrode. In a state where both panels are brought into close contact with each other, a flint is applied to the end of the front panel and the side of the rear panel, dried, and the panels are temporarily fixed, and then the flat panel is removed. , The flipped preparative applied to serial pin electrodes, is characterized in firing the whole. As a result, by temporarily fixing both panels while the two panels are evenly adhered to each other with a flat plate, it is possible to prevent the occurrence of a gap between the panels due to the warpage of the panels, and to prevent the gap between the flit panels. Can be prevented from entering the gap. In addition, since it is not necessary to add strength to the firing conditions of the frit, the frit can be fired under conditions that can sufficiently cover the pin electrode.

A method of manufacturing a flat light-emitting display panel according to the present invention includes the steps of: mounting a front panel and a back panel superimposed on the front panel on a base plate having a flat surface; and screwing the flat plate to the base plate. Is also characterized by containing It is. As a result, the front panel and the rear panel are sandwiched between the flat plate and the base plate and are uniformly adhered to each other, so that bleeding due to a gap between the panels can be reliably prevented during application and firing of the frit.

The method of manufacturing a flat-type light-emitting display panel according to the present invention includes the steps of: placing a front panel and a back panel superimposed on the front panel on a base plate having a flat surface; It is characterized by including a step of screwing to the pace plate. As a result, the front panel and the rear panel are sandwiched between the flat plate and the base plate and uniformly adhered to each other, so that bleeding due to a gap between the two panels can be reliably prevented during frit application and baking.

In the method for manufacturing a flat panel light emitting display panel according to the present invention, the fluid applied to the edge of the front panel and the side surface of the rear panel has lower fluidity than the fluid applied to the pin electrode. The present invention is characterized in that This minimizes the amount of the fluid that seeps into the inside from the surroundings of both panels. BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 is a cross-sectional view showing a side sealing structure in a display panel according to a prior application.

FIG. 2 is a cross-sectional view showing a warped state of the front panel and the rear panel. FIG. 3 is a cross-sectional view for explaining a method of correcting the warpage of the front panel and the rear panel shown in FIG.

FIG. 4 is a plan view for explaining the first half of steps in the method of manufacturing a display panel according to Embodiment 1 of the present invention.

FIG. 5 is a sectional view taken along line VV of FIG.

FIG. 6 shows a method of manufacturing a display panel according to Embodiment 1 of the present invention. It is a top view for explaining the latter half of the process.

FIG. 7 is a cross-sectional view taken along the line VII-VII in FIG.

FIG. 8 is an enlarged cross-sectional view for explaining a step of applying a flint to a pin electrode in a method of manufacturing a display panel according to Embodiment 1 of the present invention. FIG. 9 is a plan view for explaining steps in a method for manufacturing a display panel according to Embodiment 2 of the present invention.

FIG. 10 is a sectional view taken along line XX of FIG.

FIG. 11 is an enlarged cross-sectional view for explaining one step in a method of manufacturing a display panel according to Embodiment 3 of the present invention. BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, in order to explain this invention in greater detail, the preferred embodiments of the present invention will be described with reference to the accompanying drawings.

Embodiment 1

FIG. 4 is a plan view for explaining the first half of the steps in the method of manufacturing a display panel according to Embodiment 1 of the present invention. FIG. 5 is a sectional view taken along line VV of FIG. FIG. 6 is a plan view for explaining the latter half of the steps in the method of manufacturing the display panel according to Embodiment 1 of the present invention. FIG. 7 is a sectional view taken along the line VII-VII of FIG. FIG. 4 is an enlarged cross-sectional view for explaining a step of applying a flint to the bin electrode in the method of manufacturing a display panel according to Embodiment 1 of the present invention. Note that among the components of the first embodiment, the same components as those of the display panel according to the prior application shown in FIGS. 1 to 3 are denoted by the same reference numerals, and the description of those portions is omitted. ο

In the figure, 6 is an electrode pin attached to the electrode section of the front panel 1, and 7 is formed on the rear panel 2 and penetrates the electrode pin 6 of the front panel 1. 8 is a positioning base plate (base plate) for setting the relative positions of the front panel 1 and the rear panel 2, and 9 is formed at the four corners of the base plate 8. Reference numeral 10 denotes a positioning pin provided upright at a predetermined position of the base plate 8. The positioning pin 10 is stepped, and the diameter of the upper part 10a, which the side of the rear panel 2 contacts, is the same as the diameter of the lower part 10b, which the side part of the front panel 1 contacts ( (Length of one side of front panel 1-length of one side of rear panel 2) / 2 is set large.

Next, a method for manufacturing a display panel according to the first embodiment will be described in the order of steps.

First, the front panel 1 and the rear panel 2 are placed on the pace plate 8 in a stacked state. At this time, as shown in FIGS. 4 and 5, the electrode pins 6 of the front panel 1 are passed through the through-slot holes 7 of the rear panel 2, and the side of the front panel 1 is connected to the positioning pins 10. Press the lower panel 1 O b with the force indicated by the arrow F 1, and press the side of the rear panel 2 against the upper part 10 a of the positioning pin 10 with the force indicated by the arrow F 2. Center the center of panel 2. The pressing force indicated by F1 and F2 may be manual pressing, a biasing force of a spring or the like, a screw tightening force, a pneumatic pressure, or the like.

Next, as shown in FIGS. 6 and 7, the rear panel 2 is pressed from above by a pressing plate (flat plate) 11. At this time, the holding plate 11 has a slit hole 12 at a position corresponding to the electrode pin 6 like the through slit hole 7 of the rear panel 2. The electrode pin 6 is passed through. Next, screws 13 are screwed into the screw holes 9 of the base plate 8 and tightened to temporarily fix the base plate 8 with the holding plate 11. At this time, the front panel 1 and the rear panel 2 are pressed over the entire surface. Therefore, both panels 1 and 2 adhere uniformly. The fixing with the screws 13 is performed at least to the screw holes 9 formed at the four corners of the base plate 8, but if necessary, as shown in FIG. For example, it may be performed for eight places around.

Next, with the holding plate 11 fixed to the base plate 8 and the entire surface of both panels 1 and 2 held down, as shown in FIG. Apply frit 4 into dispenser hole 7 with dispenser 14. The slit 4 covers the electrode pin 6 through the through slit hole 7. The pressing plate 11 needs a certain thickness to prevent deformation, but if it is too thick, it becomes difficult to apply the frit 4 to the electrode pins 6. The thickness is preferably about 3 mm, but is not limited thereto. Further, in order to facilitate the application of the slit 4, as shown in FIG. 8, a taper 12a is provided in the opening of the slit hole 12 of the holding plate 11 as shown in FIG. Next, after the frit 4 is dried, the panels 1 and 2 are removed from the jig composed of the base plate 8 and the holding plate 11. In this state, the electrode pins 6 are temporarily fixed by the dried slits 4. There is a tendency that the electrode pin 6 temporarily fixed is used as a fulcrum to deform due to the warping force of the panel.However, there is almost no deformation because the electrode pin 6 is located near the end of the panel, and both panels 1 and 2 are base plates. It is in a flat state along 8.

In this state, apply frits 4 to both sides of panels 1 and 2 with dispenser 14. At this time, since the front panel 1 and the rear panel 2 are fixed in a good flat state, the gap at the end is small (less than 0.04 mm). The amount of 4 is also very small. Next, after fixing the tip tube with the frit 4, the frit 4 is fired with the weight (not shown) placed on both panels 1 and 2, and the periphery of both panels 1 and 2 is cleaned. Seal. This weight (not shown) is for electrode pin 5 and tip A hole is provided in the tube (not shown) to avoid pressing against both panels 1 and 2, and to press the other parts uniformly. If this pressing method is not uniform, bleeding occurs because the frits 4 are softened during firing.

As described above, according to the first embodiment, the two panels 1 and 2 are temporarily fixed in a state in which both the panels 1 and 2 are uniformly adhered to each other by the holding plate 11, thereby causing warpage of the panels. The gap between the panels 1 and 2 is prevented from being generated, and the intrusion of the slit 4 into the gap between the panels can be prevented.

In the first embodiment, it is not necessary to make the firing conditions of the flit strong or weak, so that the frit can be fired under conditions that can sufficiently cover the pin electrode 6. Embodiment 2

FIG. 9 is a plan view for explaining steps in a method of manufacturing a display panel according to Embodiment 2 of the present invention, and FIG. 10 is a cross-sectional view taken along line XX of FIG. Note that, of the components of the second embodiment, parts that are common to the components of the first embodiment are given the same reference numerals, and descriptions of those parts are omitted.

A feature of the second embodiment is that a plurality of coil springs (biasing means) 15 acting in a direction in which a gap is to be provided between the rear panel 2 and the holding plate 11 at appropriate intervals. At the point where they are placed. The urging force of the coil spring 15 pushes the back panel 2 and the holding plate 11 in a direction in which the distance between the back panel 2 and the holding plate 11 1 is increased. Therefore, the stress from the holding plate 11 to the back panel 2 causes the front panel 1 and the back panel 2 to be pressed. Can be uniformly adhered to each other.

In the second embodiment, a concave portion is provided on the lower surface of the plate 11 for holding the coil spring 15 as an urging means, and a part of the coil spring 15 is fitted. However, the biasing means is not limited to the form of the coil spring 15 described above, but any other elastic means such as a leaf spring, an air spring or a rubber pusher can be used. It can be used as appropriate, taking into account the required degree of adhesion and the cost. Embodiment 3.

In the first or second embodiment, the flit is applied to the electrode pins 6 and then the flit is applied to the side of the panel. In the third embodiment, the frit is applied. The feature is that the order of application is reversed. That is, in the third embodiment, a frit is applied to the sides of the panels while uniformly pressing the entire surfaces of the panels 1 and 2, dried, and the panels 1 and 2 are temporarily fixed. Apply frit to pin 6 and bake.

According to the third embodiment, similarly to the first or second embodiment, the front panel 1 and the rear panel 2 can be temporarily fixed while the entire surfaces of both panels 1 and 2 are uniformly pressed. The gap between the panels 1 and 2 due to the warpage of the panels can be prevented, and the frit 4 can be prevented from entering the gap between the panels.

Further, in the third embodiment, similarly to the first or second embodiment, the pressing plate 8 is used to uniformly press the entire surfaces of both panels 1 and 2, but as shown in FIG. G 16 can also be used. That is, a recess 16 a is provided on the lower surface of the weight 16 to avoid contact with the pin electrode 6, and the weight 16 is placed on the rear panel 2 laid on the front panel 1. In this state, the weight is applied to the sides of the panels 1 and 2 so that the weight 16 is heavier than the holding plate 11 in the first or second embodiment. Since the gap generated between 1 and 2 can be made as small as possible, the bleeding of the frit 4 can be reliably prevented. Also, this In the third embodiment using the weight 16, it is not necessary to use the holding plate 11, so that parts can be reduced and the process can be simplified.

In place of the light 16 for uniformly pressing the entire surfaces of both panels 1 and 2, for example, a spring member, pressurized air, or the like can be suitably used. Embodiment 4.

The feature of the fourth embodiment is that the frit applied to the side of the panel is lower in fluidity than the frit applied to the electrode pins 6. As a result, it is possible to more reliably achieve the covering property due to the frit and the reduction of the flint bleeding on the side of the panel.

Frits is obtained by mixing the example P b 0 · B ₂ 0 ₃ system FILLER one such as glass powder and ceramic box powder material and the mixing ratio of the filler, flowability during softening by changing the particle diameter, etc. Can be adjusted. Examples of frit combinations with different fluidity include LS-111 and LS-206 manufactured by NEC Corporation. The recommended sealing temperature conditions are 43 0 ° C; 10 minutes, 450 ° C: 15 minutes. That is, in this combination, LS-0206 has lower fluidity than LS-0118 under the same temperature and simultaneous firing conditions. Taking advantage of this property, LS-018 with relatively high fluidity is used for application to the electrode pins 6, and LS-02 is relatively low for application to the side of the panel. For example, baking at 445 ° C for 15 minutes is used to completely cover the electrode pin 6 with a frit having high fluidity and to flow to the side of the panel. The bleeding can be completely suppressed by the low-performance flits. Instead of the above-mentioned LS-0118 frit, DT-430 manufactured by Iwaki Glass Co., Ltd. having similar characteristics can also be used.

As described above, according to the fourth embodiment, the flow depends on the location to be applied. The display quality required for the display panel can be realized by properly using the flit with different dynamics. Industrial applicability

As described above, the method for manufacturing a flat light-emitting display panel according to the present invention is suitable for manufacturing a display panel that does not generate a display gap between the panels. This display panel has a large size in which a plurality of panels are arranged. Suitable for screen display.

Claims

Scope of Claim 1. A transparent front panel, a rear panel arranged in parallel to the front panel and having a plurality of recesses arranged as discharge spaces for display cells, and a transparent panel that penetrates the rear panel. A pin electrode provided upright on the inside of the front panel; and a pair of cell electrodes respectively disposed in a region of the front panel opposed to a concave portion of the back panel, from the pin electrode to the cell electrode. In a method of manufacturing a flat-type light-emitting display panel in which voltage supply is performed,

The back panel is pressed against the front panel with a flat plate having an opening at a position corresponding to the pin electrode, and the two panels are brought into close contact with each other. After the two panels are temporarily fixed, the flat plate is removed, and an edge is applied to the end of the front panel and a side surface of the rear panel is coated with a fire. Method for manufacturing a light emitting display panel.

2. The method according to claim 1, further comprising a step of mounting the front panel on the base plate having a flat surface and the back panel superimposed on the front panel, and screwing a flat plate to the base plate. 13. The method for manufacturing a flat-type light-emitting display panel according to the above.

3. A step of placing the front panel and the back panel superimposed on the front panel on a base plate having a flat surface, and screwing the flat plate to the base plate via a plurality of biasing means. 2. The method for manufacturing a flat panel light emitting display panel according to claim 1, wherein:

4. Fit the paint on the edges of the front panel and the sides of the back panel. 2. The method for manufacturing a flat light-emitting display panel according to claim 1, wherein the fluidity is lower than a frit applied to the anode.

5. A transparent front panel, a rear panel arranged in parallel with the front panel and having a plurality of recesses arranged as discharge spaces for display cells, and penetrating through the rear panel and inside the front panel. A pin electrode provided upright, and a pair of cell electrodes respectively disposed in a region of the front panel facing a recess of the rear panel, and a voltage is supplied from the pin electrode to the cell electrode. In the method of manufacturing a flat type light emitting display panel,

In a state where the rear panel is pressed against the front panel with a flat plate having an opening at a position corresponding to the pin electrode and the two panels are brought into close contact with each other, an end of the front panel and a side portion of the rear panel are provided. A flat type light emitting device, comprising applying a frit to the panel, drying the panel and temporarily fixing the panels, removing the flat plate, applying a frit to the pin electrode, and firing the whole. Display panel manufacturing method.

6. The method according to claim 5, further comprising a step of placing the front panel and the back panel superimposed on the front panel on a base plate having a flat surface, and screwing a flat plate to the pace plate. Method for manufacturing flat type light emitting display panel.

7. The method includes a step of placing a front panel and a back panel superimposed on the front panel on a base plate having a flat surface, and screwing the flat plate to the base plate via a plurality of biasing means. 6. The method for manufacturing a flat panel light emitting display panel according to claim 5, wherein:

8. The method according to claim 1, wherein the fluid applied to the edge of the front panel and the side surface of the rear panel has a lower fluidity than the fluid applied to the bin electrode. 6. The method for manufacturing a flat light-emitting display panel according to claim 5.