WO2002011201A3 - Verfahren und vorrichtung zur herstellung von anschlusssubstraten für elektronische bauelemente - Google Patents
Verfahren und vorrichtung zur herstellung von anschlusssubstraten für elektronische bauelemente Download PDFInfo
- Publication number
- WO2002011201A3 WO2002011201A3 PCT/DE2001/002891 DE0102891W WO0211201A3 WO 2002011201 A3 WO2002011201 A3 WO 2002011201A3 DE 0102891 W DE0102891 W DE 0102891W WO 0211201 A3 WO0211201 A3 WO 0211201A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electronic components
- embossing
- connection substrates
- producing connection
- substrates
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/119—Details of rigid insulating substrates therefor, e.g. three-dimensional details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
- H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/44—Compression means for making articles of indefinite length
- B29C43/46—Rollers
- B29C2043/461—Rollers the rollers having specific surface features
- B29C2043/463—Rollers the rollers having specific surface features corrugated, patterned or embossed surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09045—Locally raised area or protrusion of insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
- H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
Abstract
Zur Herstellung von Anschlußsubstraten für Halbleiterchips, vorzugsweise von PSGA (Polymer Stud Grid Array)-Substraten, wird ein Rohkörper (1), vorzugsweise eine Folie erwärmt, und auf mindestens einer ihrer Oberflächen werden Höcker (3) und/oder Vertiefungen mittels eines Prägestempels oder einer Prägewalze erzeugt. Als Material für den Substratkörper die-nen hochtemperaturfeste Thermoplaste, vorzugsweise LCP (Li-quid Crystal Polymers). Deren Oberfläche kann vorzugsweise mit einer Metallschicht versehen sein, die als Prägehilfe mit Durchbrüchen versehen ist.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2000137292 DE10037292A1 (de) | 2000-07-31 | 2000-07-31 | Verfahren zur Herstellung von Anschlußsubstraten für Halbleiterkomponenten |
DE10037292.9 | 2000-07-31 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2002011201A2 WO2002011201A2 (de) | 2002-02-07 |
WO2002011201A3 true WO2002011201A3 (de) | 2002-09-19 |
Family
ID=7650849
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2001/002892 WO2002011202A2 (de) | 2000-07-31 | 2001-07-31 | Verfahren und vorrichtung zur herstellung von anschlusssubstraten für elektronische bauelemente |
PCT/DE2001/002891 WO2002011201A2 (de) | 2000-07-31 | 2001-07-31 | Verfahren und vorrichtung zur herstellung von anschlusssubstraten für elektronische bauelemente |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2001/002892 WO2002011202A2 (de) | 2000-07-31 | 2001-07-31 | Verfahren und vorrichtung zur herstellung von anschlusssubstraten für elektronische bauelemente |
Country Status (3)
Country | Link |
---|---|
DE (1) | DE10037292A1 (de) |
TW (1) | TW531817B (de) |
WO (2) | WO2002011202A2 (de) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10225431A1 (de) * | 2002-06-07 | 2004-01-08 | Siemens Dematic Ag | Verfahren zur Anschlußkontaktierung von elektronischen Bauelementen auf einem isolierenden Substrat und nach dem Verfahren hergestelltes Bauelement-Modul |
DE10225685A1 (de) * | 2002-06-10 | 2003-12-24 | Siemens Dematic Ag | Verfahren zur Erzeugung von Löchern in einem elektrischen Schaltungssubstrat |
EP2747132B1 (de) | 2012-12-18 | 2018-11-21 | IMEC vzw | Verfahren zur Übertragung von Graphenfolie-Metall-Kontaktkügelchen eines Substrates zur Verwendung in einem Halbleitervorrichtungspaket |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2558763A1 (fr) * | 1984-01-27 | 1985-08-02 | Thomson Csf | Procede de fabrication d'un substrat ceramique, avec plots de connexion electriques transversaux |
US4814295A (en) * | 1986-11-26 | 1989-03-21 | Northern Telecom Limited | Mounting of semiconductor chips on a plastic substrate |
US5310333A (en) * | 1989-04-26 | 1994-05-10 | Canon Kabushiki Kaisha | Roll stamper for molding substrate used for optical recording medium |
US5831832A (en) * | 1997-08-11 | 1998-11-03 | Motorola, Inc. | Molded plastic ball grid array package |
US6005198A (en) * | 1997-10-07 | 1999-12-21 | Dimensional Circuits Corporation | Wiring board constructions and methods of making same |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3193198B2 (ja) * | 1993-07-30 | 2001-07-30 | 京セラ株式会社 | 半導体素子の実装方法 |
ES2148564T3 (es) * | 1994-09-23 | 2000-10-16 | Siemens Nv | Bloque de matriz con proyecciones de polimero. |
DE19732353A1 (de) * | 1996-09-27 | 1999-02-04 | Fraunhofer Ges Forschung | Verfahren zur Herstellung kontaktloser Chipkarten und kontaktlose Chipkarte |
-
2000
- 2000-07-31 DE DE2000137292 patent/DE10037292A1/de not_active Withdrawn
-
2001
- 2001-07-27 TW TW90118392A patent/TW531817B/zh active
- 2001-07-31 WO PCT/DE2001/002892 patent/WO2002011202A2/de active Application Filing
- 2001-07-31 WO PCT/DE2001/002891 patent/WO2002011201A2/de active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2558763A1 (fr) * | 1984-01-27 | 1985-08-02 | Thomson Csf | Procede de fabrication d'un substrat ceramique, avec plots de connexion electriques transversaux |
US4814295A (en) * | 1986-11-26 | 1989-03-21 | Northern Telecom Limited | Mounting of semiconductor chips on a plastic substrate |
US5310333A (en) * | 1989-04-26 | 1994-05-10 | Canon Kabushiki Kaisha | Roll stamper for molding substrate used for optical recording medium |
US5831832A (en) * | 1997-08-11 | 1998-11-03 | Motorola, Inc. | Molded plastic ball grid array package |
US6005198A (en) * | 1997-10-07 | 1999-12-21 | Dimensional Circuits Corporation | Wiring board constructions and methods of making same |
Non-Patent Citations (4)
Title |
---|
"METHOD TO CONTROL THE GEOMETRY AND VERTICAL PROFILE OF VIA HOLES IN SUBSTRATE MATERIALS", IBM TECHNICAL DISCLOSURE BULLETIN, IBM CORP. NEW YORK, US, vol. 35, no. 5, 1 October 1992 (1992-10-01), pages 211 - 216, XP000312938, ISSN: 0018-8689 * |
"USE OF HIGH PRECISION SILICON MOLDS FOR REPLICATING MICROELECTRONIC PACKAGING STRUCTURES", IBM TECHNICAL DISCLOSURE BULLETIN, IBM CORP. NEW YORK, US, vol. 30, no. 5, October 1987 (1987-10-01), pages 306 - 311, XP002156789, ISSN: 0018-8689 * |
BECKER H ET AL: "Hot embossing as a method for the fabrication of polymer high aspect ratio structures", SENSORS AND ACTUATORS A, ELSEVIER SEQUOIA S.A., LAUSANNE, CH, vol. 83, no. 1-3, May 2000 (2000-05-01), pages 130 - 135, XP004198304, ISSN: 0924-4247 * |
DREUTH H ET AL: "Thermoplastic structuring of thin polymer films", SENSORS AND ACTUATORS A, ELSEVIER SEQUOIA S.A., LAUSANNE, CH, vol. 78, no. 2-3, 14 December 1999 (1999-12-14), pages 198 - 204, XP004252972, ISSN: 0924-4247 * |
Also Published As
Publication number | Publication date |
---|---|
TW531817B (en) | 2003-05-11 |
WO2002011202A2 (de) | 2002-02-07 |
DE10037292A1 (de) | 2002-02-21 |
WO2002011202A3 (de) | 2003-01-23 |
WO2002011201A2 (de) | 2002-02-07 |
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