WO2002008836A3 - Verfahren und vorrichtung zur thermischen behandlung einer fotolackschicht auf einem schaltungssubstrat, insbesondere halbleiterwafer - Google Patents

Verfahren und vorrichtung zur thermischen behandlung einer fotolackschicht auf einem schaltungssubstrat, insbesondere halbleiterwafer Download PDF

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Publication number
WO2002008836A3
WO2002008836A3 PCT/EP2001/008419 EP0108419W WO0208836A3 WO 2002008836 A3 WO2002008836 A3 WO 2002008836A3 EP 0108419 W EP0108419 W EP 0108419W WO 0208836 A3 WO0208836 A3 WO 0208836A3
Authority
WO
WIPO (PCT)
Prior art keywords
semiconductor wafer
photoresist layer
circuit substrate
thermally treating
exposure
Prior art date
Application number
PCT/EP2001/008419
Other languages
English (en)
French (fr)
Other versions
WO2002008836A2 (de
Inventor
Rainer Gaus
Kai K O Baer
Thorsten Huelsmann
Rolf Wirth
Original Assignee
Advanced Photonics Tech Ag
Rainer Gaus
Kai K O Baer
Thorsten Huelsmann
Rolf Wirth
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Photonics Tech Ag, Rainer Gaus, Kai K O Baer, Thorsten Huelsmann, Rolf Wirth filed Critical Advanced Photonics Tech Ag
Priority to AU2001289712A priority Critical patent/AU2001289712A1/en
Publication of WO2002008836A2 publication Critical patent/WO2002008836A2/de
Publication of WO2002008836A3 publication Critical patent/WO2002008836A3/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/38—Treatment before imagewise removal, e.g. prebaking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

Verfahren zur thermischen Behandlung zum Trocknen oder Hartbacken einer Fotolackschicht auf einem Schaltungssubstrat, insbesondere Halbleiterwafer, wobei eine Bestrahlung mit elektromagnetischer Strahlung, die einen Wirkanteil im Bereich des nahen Infrarots, insbesondere im Wellenlängenbereich zwischen 0,8 νm und 1,5 νm, hat.
PCT/EP2001/008419 2000-07-20 2001-07-20 Verfahren und vorrichtung zur thermischen behandlung einer fotolackschicht auf einem schaltungssubstrat, insbesondere halbleiterwafer WO2002008836A2 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2001289712A AU2001289712A1 (en) 2000-07-20 2001-07-20 Method and device for thermally treating a photoresist layer on a circuit substrate, especially a semiconductor wafer

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10035430.0 2000-07-20
DE2000135430 DE10035430B4 (de) 2000-07-20 2000-07-20 Verfahren und Vorrichtung zur thermischen Behandlung einer Fotolackschicht auf einem Schaltungssubstrat, insbesondere Halbleiterwafer

Publications (2)

Publication Number Publication Date
WO2002008836A2 WO2002008836A2 (de) 2002-01-31
WO2002008836A3 true WO2002008836A3 (de) 2002-07-18

Family

ID=7649660

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2001/008419 WO2002008836A2 (de) 2000-07-20 2001-07-20 Verfahren und vorrichtung zur thermischen behandlung einer fotolackschicht auf einem schaltungssubstrat, insbesondere halbleiterwafer

Country Status (3)

Country Link
AU (1) AU2001289712A1 (de)
DE (1) DE10035430B4 (de)
WO (1) WO2002008836A2 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10038895B4 (de) * 2000-08-09 2006-04-06 Advanced Photonics Technologies Ag Verfahren und Verwendung einer Vorrichtung zur Herstellung eines halbleitenden und/oder Elektrolumineszenz zeigenden organischen Schichtaufbaus
DE10131620B4 (de) 2001-06-29 2007-10-25 Adphos Advanced Photonics Technologies Ag Verfahren und Vorrichtung zum Trocknen und/oder Vernetzen oder Erwärmen mittels elektromagnetischer Strahlung
WO2003074193A2 (de) * 2002-03-01 2003-09-12 Advanced Photonics Technologies Ag Verfahren und vorrichtung zur herstellung einer oberflächenbeschichtung durch nir- und uv-nachbehandlung
CN1839354B (zh) * 2003-07-17 2010-09-29 柯达彩色绘图有限责任公司 处理成像材料的设备及方法
EP1916101B1 (de) 2003-08-13 2009-11-18 Agfa Graphics N.V. Verfahren zum Nacheinbrennen lithographischer Druckplatten
DE102004042300A1 (de) * 2004-08-27 2006-03-30 Infineon Technologies Ag Lithographieverfahren zur Herstellung hochaufgelöster Fotoresiststrukturen durch Wärmebestrahlung
US7225560B2 (en) 2005-02-04 2007-06-05 Printing Research, Inc. Computer to plate curing system
US7685738B2 (en) 2005-02-04 2010-03-30 Printing Research, Inc. Computer to plate color sensor and drying/curing system and method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000038487A1 (de) * 1998-12-22 2000-06-29 Vantico Ag Herstellung von photoresistbeschichtungen

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4004511A1 (de) * 1990-02-14 1991-08-22 Hoechst Ag Vorrichtung zum einbrennen von lichtempfindlichen schichten waehrend der herstellung von druckformen
DE9210462U1 (de) * 1992-08-05 1992-09-24 Hoechst Ag, 6230 Frankfurt, De
JPH103171A (ja) * 1996-02-27 1998-01-06 Fuji Photo Film Co Ltd 加熱装置及び熱現像装置
DE19905985C2 (de) * 1999-02-12 2003-06-18 Advanced Photonics Tech Ag Vorrichtung zum Trocknen von Personen und/oder Körperteilen

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000038487A1 (de) * 1998-12-22 2000-06-29 Vantico Ag Herstellung von photoresistbeschichtungen

Also Published As

Publication number Publication date
AU2001289712A1 (en) 2002-02-05
DE10035430B4 (de) 2005-06-16
DE10035430A1 (de) 2002-02-07
WO2002008836A2 (de) 2002-01-31

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