AU2001289712A1 - Method and device for thermally treating a photoresist layer on a circuit substrate, especially a semiconductor wafer - Google Patents

Method and device for thermally treating a photoresist layer on a circuit substrate, especially a semiconductor wafer

Info

Publication number
AU2001289712A1
AU2001289712A1 AU2001289712A AU8971201A AU2001289712A1 AU 2001289712 A1 AU2001289712 A1 AU 2001289712A1 AU 2001289712 A AU2001289712 A AU 2001289712A AU 8971201 A AU8971201 A AU 8971201A AU 2001289712 A1 AU2001289712 A1 AU 2001289712A1
Authority
AU
Australia
Prior art keywords
semiconductor wafer
photoresist layer
circuit substrate
thermally treating
thermally
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001289712A
Inventor
Kai K. O. Bar
Rainer Gaus
Thorsten Hulsmann
Rolf Wirth
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Photonics Technologies AG
Original Assignee
Advanced Photonics Technologies AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Photonics Technologies AG filed Critical Advanced Photonics Technologies AG
Publication of AU2001289712A1 publication Critical patent/AU2001289712A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/38—Treatment before imagewise removal, e.g. prebaking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
AU2001289712A 2000-07-20 2001-07-20 Method and device for thermally treating a photoresist layer on a circuit substrate, especially a semiconductor wafer Abandoned AU2001289712A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE2000135430 DE10035430B4 (en) 2000-07-20 2000-07-20 Method and device for the thermal treatment of a photoresist layer on a circuit substrate, in particular semiconductor wafers
DE10035430.0 2000-07-20
DE10035430 2000-07-20
PCT/EP2001/008419 WO2002008836A2 (en) 2000-07-20 2001-07-20 Method and device for thermally treating a photoresist layer on a circuit substrate, especially a semiconductor wafer

Publications (1)

Publication Number Publication Date
AU2001289712A1 true AU2001289712A1 (en) 2002-02-05

Family

ID=7649660

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001289712A Abandoned AU2001289712A1 (en) 2000-07-20 2001-07-20 Method and device for thermally treating a photoresist layer on a circuit substrate, especially a semiconductor wafer

Country Status (3)

Country Link
AU (1) AU2001289712A1 (en)
DE (1) DE10035430B4 (en)
WO (1) WO2002008836A2 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10038895B4 (en) * 2000-08-09 2006-04-06 Advanced Photonics Technologies Ag Method and use of a device for producing a semiconductive and / or electroluminescent organic layer structure
DE10131620B4 (en) 2001-06-29 2007-10-25 Adphos Advanced Photonics Technologies Ag Method and device for drying and / or crosslinking or heating by means of electromagnetic radiation
AU2002308228A1 (en) * 2002-03-01 2003-09-16 Advanced Photonics Technologies Ag Method and device for the production of a surface coating by means of nir and uv aftertreatment
CN1839354B (en) * 2003-07-17 2010-09-29 柯达彩色绘图有限责任公司 Apparatus and method for treating imaging material
EP1506854B1 (en) 2003-08-13 2008-04-23 Agfa Graphics N.V. Method for postbaking a lithographic printing plate
DE102004042300A1 (en) * 2004-08-27 2006-03-30 Infineon Technologies Ag High resolution photoresist process especially for the production of semiconductors using radiant heating of the resist layer
US7685738B2 (en) 2005-02-04 2010-03-30 Printing Research, Inc. Computer to plate color sensor and drying/curing system and method
US7225560B2 (en) 2005-02-04 2007-06-05 Printing Research, Inc. Computer to plate curing system

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4004511A1 (en) * 1990-02-14 1991-08-22 Hoechst Ag DEVICE FOR BURNING IN LIGHT SENSITIVE LAYERS DURING THE PRODUCTION OF PRINTING FORMS
DE9210462U1 (en) * 1992-08-05 1992-09-24 Hoechst Ag, 6230 Frankfurt Post-treatment device for image-wise exposed printing plates
JPH103171A (en) * 1996-02-27 1998-01-06 Fuji Photo Film Co Ltd Heating device and thermal developing device
CA2357001C (en) * 1998-12-22 2009-01-20 Vantico Ag Production of photoresist coatings
DE19905985C2 (en) * 1999-02-12 2003-06-18 Advanced Photonics Tech Ag Device for drying people and / or body parts

Also Published As

Publication number Publication date
WO2002008836A3 (en) 2002-07-18
WO2002008836A2 (en) 2002-01-31
DE10035430B4 (en) 2005-06-16
DE10035430A1 (en) 2002-02-07

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