WO2001096117A1 - Method for making smart cards by extrusion - Google Patents

Method for making smart cards by extrusion Download PDF

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Publication number
WO2001096117A1
WO2001096117A1 PCT/FR2001/001819 FR0101819W WO0196117A1 WO 2001096117 A1 WO2001096117 A1 WO 2001096117A1 FR 0101819 W FR0101819 W FR 0101819W WO 0196117 A1 WO0196117 A1 WO 0196117A1
Authority
WO
WIPO (PCT)
Prior art keywords
extruded
manufacturing
strip
micromodules
cavities
Prior art date
Application number
PCT/FR2001/001819
Other languages
French (fr)
Inventor
Gilles Dhers
Original Assignee
Gemplus
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemplus filed Critical Gemplus
Priority to AU2001267634A priority Critical patent/AU2001267634A1/en
Publication of WO2001096117A1 publication Critical patent/WO2001096117A1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/20—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of continuous webs only
    • B32B37/203—One or more of the layers being plastic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/03—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
    • B29C48/07—Flat, e.g. panels
    • B29C48/08—Flat, e.g. panels flexible, e.g. films
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/15—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state
    • B32B37/153—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state at least one layer is extruded and immediately laminated while in semi-molten state
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/02—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/34—Inserts
    • B32B2305/342—Chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2367/00—Polyesters, e.g. PET, i.e. polyethylene terephthalate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2425/00—Cards, e.g. identity cards, credit cards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2519/00—Labels, badges
    • B32B2519/02—RFID tags
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/06—Embossing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item

Definitions

  • the lamination then consists in raising the temperature while pressing these sheets 101, 102, 103 so as to produce a plate 0.76 mm thick in which it is then possible to cut card bodies 100 in ISO format (or any other appropriate format).
  • the card body 100 must then be machined so as to form a cavity 130 capable of accommodating an electronic micromodule 30.
  • This cavity 130 can be produced by milling, for example.
  • the micromodule 30 generally consists of a support 25 carrying metallic patterns defining contact pads 35 for an electrical connection with a card reader, an integrated circuit chip 10 being transferred onto this support 25 and connected to the contact pads 35 Chip 10 and its connections
  • micromodule 30 is then fixed in the cavity 130 by gluing 40 for example.
  • This conventional manufacturing process has drawbacks. On the one hand, the number of steps is important, and on the other hand, it cannot be carried out continuously.
  • Another conventional technique of the prior art consists in making the card body by an injection technique which makes it possible to eliminate the steps of machining the cavity and cutting out the card bodies, the injection mold having the dimensions of the card body.
  • the cavity is made directly in the. injection mold (not by machining) by pressing a pin which sinks into the injected material.
  • This process however has several drawbacks. On the one hand, the cavity must be very precisely produced at a precise moment in the process, which complicates its implementation.
  • the geometry of the cavity is limited to what it is possible to do in the mold, as well as the choice of the thermoplastic materials that can be used (essentially Acrylonytrile Butadiene Styrene (ABS). injected undergoes great stresses in the injection operation, which degrades the mechanical properties of the card body obtained by such a process.
  • ABS Acrylonytrile Butadiene Styrene
  • An object of the present invention is to solve the drawbacks of the prior art, and in particular to propose a method of manufacturing smart cards with contact which satisfies the objectives of manufacturing automation and mass production at high speed. .
  • the present invention provides a continuous manufacturing process which consists in producing the card bodies by extrusion of thermoplastic material, and in carrying out all the stages of manufacturing contact smart cards on the same line.
  • a more particular subject of the present invention is a method of continuously manufacturing contact smart cards, said cards each comprising a card body and an electronic micromodule comprising an integrated circuit chip connected to contact pads flush with the surface of the body. card, characterized in that it comprises the following stages:
  • the method further comprises a step of online transfer of electronic micromodules by pressure in the extruded strip.
  • the method further comprises a step of thermoforming in-line cavities in the extruded strip, the electronic micromodules being transferred into said cavities.
  • the extruded strip is a thermoplastic or thermosetting material.
  • the material of the extruded strip is chosen from Polyethylene terephthalate (PET), Polyvinyl chloride (PVC), Acrylonitryl Butadiene Styrene (ABS),
  • the material of the extruded strip is a polyester.
  • the step of online thermoforming of the cavities and / or of online transfer of the micromodules is carried out by a tool consisting of a roller and / or a presser moving at the same speed and along the same axis. than the extruded strip.
  • the tool for thermoforming the cavities and / or for transferring the micromodules is maintained at a temperature below the temperature of the back of the extruded strip so as to freeze the material of the extruded strip around the cavities and / or micromodules.
  • the tool for thermoforming the cavities and / or for transferring the micromodules is maintained at a temperature higher than the temperature on the back of the extruded strip so as to soften the material of the extruded strip around the cavities and / or micromodules.
  • the transfer of the electronic micromodules is carried out by chemical and / or mechanical attachment in the material of the extruded strip.
  • the extrusion step consists in carrying out the extrusion of at least three strips and in assembling said strips in line so as to form a single strip cut in the format of the card bodies.
  • the assembly of the three extruded bands - is carried out by chemical and / or mechanical bonding.
  • the assembly of the three extruded bands is carried out by calendering.
  • At least two of the three extruded bands have cutouts intended to accommodate the electronic micromodules after assembly of said bands into a single band.
  • an antenna is produced on one of the three extruded bands.
  • prints are made on at least one of the extruded bands.
  • security elements are arranged on at least one of the extruded bands.
  • the method according to the invention further comprises at least one step of calendering the extruded strip in line before it is cut into the format of the card bodies.
  • a cutting mark is produced in the extruded strip during the online step of thermoforming of the cavities and / or transfer of the micromodules.
  • the method further comprises a step of recycling the scrap from the cutting of the extruded strip.
  • the present invention also relates to a contact chip card comprising a card body and an electronic micromodule comprising an integrated circuit chip connected to contact pads flush with the surface of the card body, characterized in that the card body is composed of '' an extruded thermoplastic material.
  • the card body is composed of a plurality of layers of extruded thermoplastic materials.
  • the electronic micromodule is fixed in the card body directly in the material of said card body.
  • the method according to the invention has the advantage of allowing the continuous production of smart cards, by carrying out the essential steps on the same line.
  • the invention advantageously exploits the properties of the extruded thermoplastic material to produce cavities and / or transfer micromodules, then cut the cards to the desired format.
  • the classic steps of machining the cavity and gluing the micromodule are removed in their current state, which represents a significant saving of time and manufacturing cost.
  • the process according to the invention thus enables the mass production and at a high rate of chip cards, while limiting costs' of manufacture.
  • FIG. 1 schematically illustrates the steps for manufacturing a contact smart card according to a first embodiment of the invention
  • Figure 3 schematically illustrates the transfer step according to the first embodiment illustrated in Figure 2;
  • FIG. 4 schematically illustrates the steps for manufacturing a contact smart card according to a second embodiment of the invention
  • - Figures - 5A and 5B schematically illustrate two possible embodiments of the thermoforming step according to the second embodiment illustrated in Figure 4
  • FIG. 6 schematically illustrates the steps for manufacturing a contact smart card according to a third embodiment of the invention
  • - Figure 7 schematically illustrates the assembly step according to the third embodiment illustrated in Figure 6;
  • FIG. 2 illustrates the essential steps of the manufacturing method according to a first embodiment.
  • a first step consists in carrying out the extrusion of a strip 50.
  • a thermoplastic material is hot pushed through an extrusion die which defines the geometry of the profile of constant cross section, said profile being
  • the extruded strip 50 has a thickness of 800 ⁇ m.
  • the material used to extrude this strip 50 can be chosen from several known thermoplastics and / or thermosets, such as for example Polyethylene Terephthalate (PET), Polyvinyl Chloride (PNC), 1 Acrylonitryl Butadiene Styrene (ABS), Polystyrene , Polyamide, Polyethylene, Polypropylene, Polycarbonate, or members of the polyester family, biodegradable or not.
  • PET Polyethylene Terephthalate
  • PNC Polyvinyl Chloride
  • ABS Acrylonitryl Butadiene Styrene
  • Polystyrene Polyamide, Polyethylene, Polypropylene, Polycarbonate, or members of the polyester family, biodegradable or not.
  • the thermoplastic material is present, at the extruder inlet, in the form of granules whose cost is low and easy to manage.
  • An optional calendering step can be carried out at the extrusion outlet of the strip 50 so as to erase the creep effects of the extruded material.
  • a step, not illustrated, of printing the extruded strip 50 can be carried out online, this printing possibly having as its object security and / or decorative elements.
  • Such printing can be carried out by ink jet for example.
  • a step of transferring electronic micromodules 30 directly into the extruded strip 50 is carried out online, without breaking the strip 50, by means of a suitable tool, such as a pressure roller 300.
  • FIG. 3 illustrates in detail this deferral step.
  • the transfer stage of the micromodules 30 exploits the adhesive and softening properties of the material used to extrude the strip 50.
  • the transfer tool 300 comprises pressing elements 310 which seek the micromodules 30 in a coil parallel to the line of the strip 50 for pressing them at regular intervals into the still soft material of the extruded strip 50.
  • the micromodules 30 are thus fixed in the extruded strip 50 by chemical attachment (bonding) and / or mechanical (diffusion of material).
  • the transfer tool 300 is maintained at a temperature lower than that of another roller 320 located on the back of the strip 50. This temperature difference makes it possible to freeze the material around the micromodules 30 in 10
  • the temperature difference is reversed, the transfer tool 300 being maintained at a temperature higher than that of the roller 320 on the back of the strip 50 so as to soften the material around the microcircuit 30.
  • cutting marks 80 can be produced in the extruded strip 50 so as to facilitate the subsequent step of cutting the card bodies 100 in said strip 50.
  • An in-line calendering step is then carried out in order to erase the creep effects of the material linked to the insertion of the micromodules 30 into the extruded strip 50.
  • the calendering tool can be hollowed out in certain places to avoid pressing the micromodules 30.
  • the order and the number of calendering rollers can also vary depending on the implementation of the process.
  • An in-line cutting step can then be carried out, the card bodies 100 being directly cut from the extruded strip 50.
  • the extruded strip 50 can bear, over its width, between 2 and 4 card bodies 100
  • the cutting can be carried out according to any conventional technique such as laser cutting or by water jet, for example or cutting by means of punches, dies, blades or the like. This cutting must be precise because the location of the microcircuit 30 is precisely defined by ISO standards. This precision can be obtained by Computer Aided Vision and / or by the marks 80 marked in the strip 50.
  • This second embodiment repeats most of the steps of the first embodiment, with the exception of the step of transferring the micromodules 30 directly into the extruded strip 50.
  • this carry-over step is replaced by an online step of
  • thermoforming of cavities 130 in the extruded strip 50 by means of a suitable tool, such as a roller or a presser.
  • FIGS. 5A and 5B illustrate two possible implementations of this thermoforming step.
  • the production of the cavities 130 exploits the softening properties of the material used to extrude the strip 50.
  • a stamping is thus possible by means of rollers 200, 220 located on either side of the extruded strip 50, one of which 200 is provided with punches 210 which penetrate at regular intervals into the still soft material of the extruded strip 50.
  • These cavities 130 can also be produced using a pressing tool 230 provided with punches 210 and coupled to a roller 220 on the back of the extruded strip 50. This pressing tool 230 moves at the same speed and along the same axis as the extruded strip 50 and has 12
  • thermoforming tool 200 or 230 is maintained at a temperature lower than that of the roller 220 situated on the back of the strip 50. This temperature difference makes it possible to freeze the material around the cavities 130 by moving the deformations linked to the creep of the material rather towards the back of the strip 50. These cavities 130 are then able to receive electronic micromodules 30, either by an online transfer as described with reference to the first embodiment, or after cutting of the bodies card 100 in the extruded strip 50 according to conventional insertion techniques.
  • the step of extruding the strip 50 consists in carrying out the extrusion of at least three strips 51, 52, 53 and assembling them in line so as to form a single strip 50 which will be cut in the format of the card bodies 100.
  • the thickness of each strip 51, 52, 53 can vary, for example, between 100 ⁇ m and 600 ⁇ m to obtain a single assembled strip 800 ⁇ m thick.
  • the assembly of the three extruded strips 51, 52, 53 is carried out by gluing or by calendering for example.
  • This embodiment advantageously makes it possible to use three different materials for each extruded strip 51, 52, 53, these materials being compatible, 13
  • prints of security and / or decorative elements can be produced independently on one or the other extruded strip 51, 52, 53.
  • the upper strip 51 may be transparent and the intermediate strip 52 may comprise a printed bar code, the lower strip 53 comprising a decorative print on the back.
  • At least two 51, 52 of the three extruded bands have cutouts 61, 62 intended for
  • micromodules 30 can be transferred online by a suitable tool using the adhesive properties of the assembled extruded strip 50 for chemical and / or mechanical bonding, or according to a conventional insertion technique after cutting the card bodies 100.
  • the micromodules 30 can be transferred in line to an intermediate extruded strip 52 in order to provide additional mechanical grip by partial covering of the upper extruded strip 51.
  • the method according to the invention makes it possible to mass-produce and at high speed contact smart cards comprising a card body 100 composed of an extruded thermoplastic material.
  • the body 100 of the card can optionally be composed of a plurality of layers of extruded thermoplastic materials.
  • the electronic micromodule 30 is fixed in the card body 100 directly in the extruded material of said card body 100, that is to say without the addition of glue necessary for conventional insertion techniques.

Abstract

The invention concerns a method for continuously making contact smart cards, said cards comprising each a card body (100) and an electronic micromodule (30) comprising an integrated circuit chip (10) connected to contact pads (35) flush with the card body (100) surface. The invention is characterised in that it comprises the following steps: extruding at least a strip (50), on-line cutting of said strip (50) to the card body (100) format. The method further comprises a step which consists in on-line thermoforming of cavities (130) and/or transferring micromodules (30) into the extruded strip (50).

Description

épaisseurs variables. La lamination consiste ensuite à élever la température tout en pressant ces feuilles 101, 102, 103 de manière à réaliser une plaque de 0,76 mm d'épaisseur dans laquelle il est alors possible de découper des corps de carte 100 au format ISO (ou tout autre format approprié) . variable thicknesses. The lamination then consists in raising the temperature while pressing these sheets 101, 102, 103 so as to produce a plate 0.76 mm thick in which it is then possible to cut card bodies 100 in ISO format (or any other appropriate format).
Le corps de carte 100 doit ensuite être usiné de manière à former une cavité 130 apte à accueillir un micromodule électronique 30. Cette cavité 130 peut être réalisée par fraisage par exemple.The card body 100 must then be machined so as to form a cavity 130 capable of accommodating an electronic micromodule 30. This cavity 130 can be produced by milling, for example.
Le micromodule 30 est généralement constitué d'un support 25 portant des motifs métalliques définissant des plages de contact 35 pour une liaison électrique avec un lecteur de carte, une puce de circuit intégré 10 étant reportée sur ce support 25 et connectée aux plages de contact 35. La puce 10 et ses connectionsThe micromodule 30 generally consists of a support 25 carrying metallic patterns defining contact pads 35 for an electrical connection with a card reader, an integrated circuit chip 10 being transferred onto this support 25 and connected to the contact pads 35 Chip 10 and its connections
(généralement des fils de soudure en or) sont(usually gold solder wires) are
- généralement protégés dans une goutte de résine 20. Le micromodule 30 est ensuite fixé dans la cavité 130 par collage 40 par exemple.- generally protected in a drop of resin 20. The micromodule 30 is then fixed in the cavity 130 by gluing 40 for example.
Ce procédé de fabrication classique présente des inconvénients. D'une part, le nombre d'étapes est important, et d'autre part, il ne peut être réalisé en continu. Une autre technique classique de l'art antérieur consiste à réaliser le corps de carte par une technique d'injection qui permet de supprimer les étapes d'usinage de la cavité et de découpe des corps de carte, le moule d'injection présentant les dimensions du corps de carte. La cavité est réalisée directement dans le. moule d'injection (et non par usinage) par pression d'un pion qui s'enfonce dans la matière injectée. Ce procédé présente cependant plusieurs inconvénients. D'une part, la cavité doit être très précisément réalisée à un moment précis du procédé, ce qui complique sa mise en œuvre. D'autre part, la géométrie de la cavité est limitée à ce qu'il est possible de faire dans le moule, ainsi que le choix des matériaux thermoplastiques utilisables (essentiellement de l'Acrylonytrile Butadiène Styrène (ABS) . En outre, la matière injectée subit de grosses contraintes dans l'opération d'injection, ce qui dégrade les propriétés mécaniques du corps de carte obtenu par un tel procédé.This conventional manufacturing process has drawbacks. On the one hand, the number of steps is important, and on the other hand, it cannot be carried out continuously. Another conventional technique of the prior art consists in making the card body by an injection technique which makes it possible to eliminate the steps of machining the cavity and cutting out the card bodies, the injection mold having the dimensions of the card body. The cavity is made directly in the. injection mold (not by machining) by pressing a pin which sinks into the injected material. This process however has several drawbacks. On the one hand, the cavity must be very precisely produced at a precise moment in the process, which complicates its implementation. On the other hand, the geometry of the cavity is limited to what it is possible to do in the mold, as well as the choice of the thermoplastic materials that can be used (essentially Acrylonytrile Butadiene Styrene (ABS). injected undergoes great stresses in the injection operation, which degrades the mechanical properties of the card body obtained by such a process.
Un but de la présente invention consiste à résoudre les inconvénients de l'art antérieur, et en particulier de proposer un procédé de fabrication de cartes à puce à contact qui satisfasse les objectifs d'automatisation de fabrication et de production en grande série à cadence élevée.An object of the present invention is to solve the drawbacks of the prior art, and in particular to propose a method of manufacturing smart cards with contact which satisfies the objectives of manufacturing automation and mass production at high speed. .
A cet effet, la présente invention propose un procédé de fabrication en continu qui consiste à réaliser les corps de carte par extrusion de matière thermoplastique, et à réaliser l'ensemble des étapes de fabrication des cartes à puce à contact sur une même ligne. La présente invention a plus particulièrement pour objet un procédé de fabrication en continu de cartes à puce à contact, lesdites cartes comportant chacune un corps de carte et un micromodule électronique comprenant une puce de circuit intégré reliée à des plages de contact affleurant la surface du corps de carte, caractérisé en ce qu'il comporte les étapes suivantes :To this end, the present invention provides a continuous manufacturing process which consists in producing the card bodies by extrusion of thermoplastic material, and in carrying out all the stages of manufacturing contact smart cards on the same line. A more particular subject of the present invention is a method of continuously manufacturing contact smart cards, said cards each comprising a card body and an electronic micromodule comprising an integrated circuit chip connected to contact pads flush with the surface of the body. card, characterized in that it comprises the following stages:
- extrusion d'au moins une bande, - découpe en ligne de ladite bande au format des corps de carte.- extrusion of at least one strip, - online cutting of said strip in card body format.
Selon un premier mode de réalisation, le procédé comprend en outre une étape de report en ligne de micromodules électroniques par pression dans la bande extrudée.According to a first embodiment, the method further comprises a step of online transfer of electronic micromodules by pressure in the extruded strip.
Selon un deuxième mode de réalisation, le procédé comprend en outre une étape de thermoformage en ligne de cavités dans la bande extrudée, les micromodules électroniques étant reportés dans lesdites cavités.According to a second embodiment, the method further comprises a step of thermoforming in-line cavities in the extruded strip, the electronic micromodules being transferred into said cavities.
Selon une caractéristique de l'invention, la bande extrudée est une matière thermoplastique ou thermodurcissable .According to a characteristic of the invention, the extruded strip is a thermoplastic or thermosetting material.
Selon les variantes de réalisation, la matière de la bande extrudée est choisie parmi du Polyéthylène- téraphtalate (PET) , du Polychlorure de vinyle (PVC) , de l'Acrylonitryle Butadiène Styrène (ABS) , duAccording to the variant embodiments, the material of the extruded strip is chosen from Polyethylene terephthalate (PET), Polyvinyl chloride (PVC), Acrylonitryl Butadiene Styrene (ABS),
- Polystyrène, du Polyamide, du Polyéthylène, du- Polystyrene, Polyamide, Polyethylene,
Polypropylène, le Polycarbonate. Selon une autre variante, la matière de la bande extrudée est un polyester.Polypropylene, Polycarbonate. According to another variant, the material of the extruded strip is a polyester.
Selon une caractéristique, l'étape de thermoformage en ligne des cavités et/ou de report en ligne des micromodules est réalisée par un outil constitué d'un rouleau et/ou d'un presseur se déplaçant à la même vitesse et selon le même axe que la bande extrudée.According to one characteristic, the step of online thermoforming of the cavities and / or of online transfer of the micromodules is carried out by a tool consisting of a roller and / or a presser moving at the same speed and along the same axis. than the extruded strip.
Selon une variante, l'outil de thermoformage des cavités et/ou de report des micromodules est maintenu à une température inférieure à la température du verso de la bande extrudée de manière à figer la matière de la bande extrudée autours des cavités et/ou des micromodules. Selon une autre variante, l'outil de thermoformage des cavités et/ou de report des micromodules est maintenu à une température supérieure à la température du verso de la bande extrudée de manière à ramollir la matière de la bande extrudée autours des cavités et/ou des micromodules.According to a variant, the tool for thermoforming the cavities and / or for transferring the micromodules is maintained at a temperature below the temperature of the back of the extruded strip so as to freeze the material of the extruded strip around the cavities and / or micromodules. According to another variant, the tool for thermoforming the cavities and / or for transferring the micromodules is maintained at a temperature higher than the temperature on the back of the extruded strip so as to soften the material of the extruded strip around the cavities and / or micromodules.
Selon une caractéristique, le report des micromodules électroniques est réalisé par accroche chimique et/ou mécanique dans la matière de la bande extrudée.According to one characteristic, the transfer of the electronic micromodules is carried out by chemical and / or mechanical attachment in the material of the extruded strip.
Selon un troisième mode de réalisation, l'étape d' extrusion consiste à réaliser l' extrusion d'au moins trois bandes et à assembler en ligne lesdites bandes de manière à former une bande unique découpée au format des corps de carte.According to a third embodiment, the extrusion step consists in carrying out the extrusion of at least three strips and in assembling said strips in line so as to form a single strip cut in the format of the card bodies.
Selon une mise en œuvre du troisième mode de réalisation, l'assemblage des trois bandes extrudées - est réalisé par collage chimique et/ou mécanique.According to an implementation of the third embodiment, the assembly of the three extruded bands - is carried out by chemical and / or mechanical bonding.
Selon autre une mise en œuvre du troisième mode de réalisation, l'assemblage des trois bandes extrudées est réalisé par calandrage.According to another implementation of the third embodiment, the assembly of the three extruded bands is carried out by calendering.
Selon une caractéristique du troisième mode de réalisation, au moins deux des trois bandes extrudées comportent des découpes destinées à accueillir les micromodules électroniques après assemblage desdites bandes en une bande unique.According to a characteristic of the third embodiment, at least two of the three extruded bands have cutouts intended to accommodate the electronic micromodules after assembly of said bands into a single band.
Selon une autre caractéristique du troisième mode de réalisation, une antenne est réalisée sur une des trois bandes extrudées. Selon une caractéristique, des impressions sont réalisées sur au moins une des bandes extrudées.According to another characteristic of the third embodiment, an antenna is produced on one of the three extruded bands. According to one characteristic, prints are made on at least one of the extruded bands.
Selon une autre caractéristique, des éléments sécuritaires sont disposés sur au moins une des bandes extrudées. Selon une caractéristique, le procédé selon l'invention comporte en outre au moins une étape de calandrage en ligne de la bande extrudée avant sa découpe au format des corps de carte. Selon .une autre caractéristique, un repère de découpe est réalisé dans la bande extrudée lors de l'étape en ligne de thermoformage des cavités et/ou de report des micromodules.According to another characteristic, security elements are arranged on at least one of the extruded bands. According to one characteristic, the method according to the invention further comprises at least one step of calendering the extruded strip in line before it is cut into the format of the card bodies. According to another characteristic, a cutting mark is produced in the extruded strip during the online step of thermoforming of the cavities and / or transfer of the micromodules.
Selon une autre caractéristique, le procédé comporte en outre une étape de recyclage des chutes de découpe de la bande extrudée.According to another characteristic, the method further comprises a step of recycling the scrap from the cutting of the extruded strip.
La présente invention concerne également une carte à puce contact comportant un corps de carte et un micromodule électronique comprenant une puce de circuit intégré reliée à des plages de contact affleurant la surface du corps de carte, caractérisé en ce que le corps de carte est composé d'un matériau -thermoplastique extrudé.The present invention also relates to a contact chip card comprising a card body and an electronic micromodule comprising an integrated circuit chip connected to contact pads flush with the surface of the card body, characterized in that the card body is composed of '' an extruded thermoplastic material.
Selon une caractéristique, le corps de carte est composé d'une pluralité de couches de matériaux thermoplastiques extrudés.According to one characteristic, the card body is composed of a plurality of layers of extruded thermoplastic materials.
Selon une autre caractéristique, le micromodule électronique est fixé dans le corps de carte directement dans la matière dudit corps de carte.According to another characteristic, the electronic micromodule is fixed in the card body directly in the material of said card body.
Le procédé selon l'invention présente l'avantage de permettre la fabrication en continu de cartes à puce, en réalisant les étapes essentielles sur une même ligne. L'invention exploite avantageusement les propriétés de la matière thermoplastique extrudée pour réaliser des cavités et/ou reporter des micromodules, puis découper les cartes au format voulu. Les étapes classiques d'usinage de la cavité et de collage du micromodule sont supprimées dans leur état actuel, ce qui représente un important gain de temps et de coût de fabrication.The method according to the invention has the advantage of allowing the continuous production of smart cards, by carrying out the essential steps on the same line. The invention advantageously exploits the properties of the extruded thermoplastic material to produce cavities and / or transfer micromodules, then cut the cards to the desired format. The classic steps of machining the cavity and gluing the micromodule are removed in their current state, which represents a significant saving of time and manufacturing cost.
Le procédé selon l'invention permet ainsi la production en grande série et à forte cadence de cartes à puce, tout en limitant les coûts' de fabrication.The process according to the invention thus enables the mass production and at a high rate of chip cards, while limiting costs' of manufacture.
En outre, le procédé selon l'invention permet un grand choix de matériaux pour constituer le corps de carte. D'autres particularités et avantages de la présente invention apparaîtront à la lecture de la description donnée à titre d'exemple illustratif et non limitatif et faite en référence aux figures annexées dans lesquelles : - la figure 1, déjà décrites, est une vue en coupe d'une carte à puce à contact réalisée selon un procédé de fabrication de l'art antérieur; la figure 2 illustre schématiquement les étapes de fabrication d'une carte à puce à contact selon un premier mode de réalisation de l'invention; la figure 3, illustre schématiquement l'étape de report selon le premier mode de réalisation illustré sur la figure 2; la figure 4 illustre schématiquement les étapes de fabrication d'une carte à puce à contact selon un deuxième mode de réalisation de l'invention; - les figures - 5A et 5B illustrent schématiquement deux modes de réalisation possibles de l'étape de thermoformage selon le deuxième mode de réalisation illustré sur la figure 4; la figure 6, illustre schématiquement les étapes de fabrication d'une carte à puce à contact selon un troisième mode de réalisation de l'invention; - la figure 7 illustre schématiquement l'étape d'assemblage selon le troisième mode de réalisation illustré sur la figure 6;In addition, the method according to the invention allows a large choice of materials to constitute the card body. Other features and advantages of the present invention will appear on reading the description given by way of illustrative and nonlimiting example and made with reference to the appended figures in which: - Figure 1, already described, is a sectional view a contact smart card produced according to a manufacturing method of the prior art; FIG. 2 schematically illustrates the steps for manufacturing a contact smart card according to a first embodiment of the invention; Figure 3 schematically illustrates the transfer step according to the first embodiment illustrated in Figure 2; FIG. 4 schematically illustrates the steps for manufacturing a contact smart card according to a second embodiment of the invention; - Figures - 5A and 5B schematically illustrate two possible embodiments of the thermoforming step according to the second embodiment illustrated in Figure 4; FIG. 6 schematically illustrates the steps for manufacturing a contact smart card according to a third embodiment of the invention; - Figure 7 schematically illustrates the assembly step according to the third embodiment illustrated in Figure 6;
Le procédé selon l'invention va être décrit dans un premier temps en référence au schéma de la figure 2 qui illustre les étapes essentielles du procédé de fabrication selon un premier mode de réalisation.The method according to the invention will first be described with reference to the diagram in FIG. 2 which illustrates the essential steps of the manufacturing method according to a first embodiment.
Une première étape consiste à réaliser l' extrusion d'une bande 50. Selon l'invention, une matière thermoplastique est poussée à chaud à travers une filière d' extrusion qui définit la géométrie du profilé à section droite constante, ledit profilé étantA first step consists in carrying out the extrusion of a strip 50. According to the invention, a thermoplastic material is hot pushed through an extrusion die which defines the geometry of the profile of constant cross section, said profile being
- refroidi pour obtenir une forme de bande 50 dont l'épaisseur et l'aspect sont parfaitement contrôlées de manière connue en soi. En l'espèce, la bande extrudée 50 présente une épaisseur de 800μm.- cooled to obtain a strip shape 50 whose thickness and appearance are perfectly controlled in a manner known per se. In this case, the extruded strip 50 has a thickness of 800 μm.
La matière utilisée pour extruder cette bande 50 peut être choisie parmi plusieurs thermoplastiques et/ou thermodurcissables connus, tels que par exemple le Polyéthylène Téréphtalate (PET) , le Polychlorure de Vinyle ( PNC) , 1 'Acrylonitryle Butadiène Styrène (ABS), le Polystyrène, le Polyamide, le Polyéthylène, le Polypropylène, le Polycarbonate, ou des membres de la famille des polyesters, biodégradables ou non. Ce choix n'est limité que par la compatibilité du matériau avec les procédés d' extrusion, d'encartage et les caractéristiques mécaniques de la carte finie. La matière thermoplastique se présente, en entrée d'extrudeuse, sous forme de granulés dont le coût est faible et la gestion facile.The material used to extrude this strip 50 can be chosen from several known thermoplastics and / or thermosets, such as for example Polyethylene Terephthalate (PET), Polyvinyl Chloride (PNC), 1 Acrylonitryl Butadiene Styrene (ABS), Polystyrene , Polyamide, Polyethylene, Polypropylene, Polycarbonate, or members of the polyester family, biodegradable or not. This choice is only limited by the compatibility of the material with the extrusion and inserting processes and the mechanical characteristics of the finished card. The thermoplastic material is present, at the extruder inlet, in the form of granules whose cost is low and easy to manage.
Une étape facultative de calandrage peut être menée en sortie d' extrusion de la bande 50 de manière à gommer les effets de fluage de la matière extrudée.An optional calendering step can be carried out at the extrusion outlet of the strip 50 so as to erase the creep effects of the extruded material.
Eventuellement, une étape, non illustrée, d'impression de la bande extrudée 50 peut être réalisée en ligne, cette impression pouvant avoir pour objet des éléments sécuritaires et/ou décoratifs. Une telle impression peut être réalisée par jet d'encre par exemple.Optionally, a step, not illustrated, of printing the extruded strip 50 can be carried out online, this printing possibly having as its object security and / or decorative elements. Such printing can be carried out by ink jet for example.
Selon le premier mode de réalisation, une étape de report de micromodules électroniques 30 directement dans la bande extrudée 50 est réalisée en ligne, sans rupture de la bande 50, au moyen d'un outil adapté, tel qu'un rouleau presseur 300.According to the first embodiment, a step of transferring electronic micromodules 30 directly into the extruded strip 50 is carried out online, without breaking the strip 50, by means of a suitable tool, such as a pressure roller 300.
La figure 3 illustre en détail cette étape de report. L'étape de report des micromodules 30 exploite les propriétés adhesives et de ramollissement de la matière utilisée pour extruder la bande 50. L'outil de report 300 comporte des éléments presseurs 310 qui cherchent les micromodules 30 dans une bobine parallèle 350 à la ligne de la bande 50 pour les enfoncer à intervalles réguliers dans la matière encore molle de la bande extrudée 50. Les micromodules 30 sont ainsi fixés dans la bande extrudée 50 par accroche chimique (collage) et/ou mécanique (diffusion de matière) . Selon une particularité avantageuse, l'outil de report 300 est maintenu à une température inférieure à celle d'un autre rouleau 320 situé sur le verso de la bande 50. Cette différence de température permet de figer la matière aux abords des micromodules 30 en 10Figure 3 illustrates in detail this deferral step. The transfer stage of the micromodules 30 exploits the adhesive and softening properties of the material used to extrude the strip 50. The transfer tool 300 comprises pressing elements 310 which seek the micromodules 30 in a coil parallel to the line of the strip 50 for pressing them at regular intervals into the still soft material of the extruded strip 50. The micromodules 30 are thus fixed in the extruded strip 50 by chemical attachment (bonding) and / or mechanical (diffusion of material). According to an advantageous feature, the transfer tool 300 is maintained at a temperature lower than that of another roller 320 located on the back of the strip 50. This temperature difference makes it possible to freeze the material around the micromodules 30 in 10
déportant les déformations liées au fluage de la matière plutôt vers le verso de la bande 50. Selon une variante, la différence de température est inversée, l'outil de report 300 étant maintenu à une température supérieure à celle du rouleau 320 sur le verso de la bande 50 de manière à ramollir la matière aux abords du microcircuit 30.offset the deformations linked to the creep of the material rather towards the back of the strip 50. According to a variant, the temperature difference is reversed, the transfer tool 300 being maintained at a temperature higher than that of the roller 320 on the back of the strip 50 so as to soften the material around the microcircuit 30.
Selon une autre particularité, des repères de découpe 80 peuvent être réalisés dans la bande extrudée 50 de manière à faciliter l'étape ultérieure de découpe des corps de carte 100 dans ladite bande 50.According to another particularity, cutting marks 80 can be produced in the extruded strip 50 so as to facilitate the subsequent step of cutting the card bodies 100 in said strip 50.
Une étape de calandrage en ligne, totale ou partiel, est alors réalisée afin de gommer les effets de fluage de la matière liés à l'insertion des micromodules 30 dans la bande extrudée 50. L'outil de calandrage peut être évidé en certains endroits pour éviter de presser les micromodules 30. La disposition,An in-line calendering step, total or partial, is then carried out in order to erase the creep effects of the material linked to the insertion of the micromodules 30 into the extruded strip 50. The calendering tool can be hollowed out in certain places to avoid pressing the micromodules 30. The arrangement,
- l'ordre et le nombre de rouleaux de calandrage peut également varier selon les mises en œuvre du procédé. Une étape de découpe en ligne peut ensuite être réalisée, les corps de cartes 100 étant directement découpées dans la bande extrudée 50. Selon les variantes de mise en œuvre, la bande extrudée 50 peut porter sur sa largeur entre 2 et 4 corps de carte 100. La découpe peut être réalisée selon une quelconque technique classique telle que la découpe au laser ou par jet d'eau, par exemple ou la découpe au moyen de poinçons, matrices, lames ou autres. Cette découpe doit être précise car l'emplacement du microcircuit 30 est précisément défini par les normes ISO. Cette précision peut être obtenue par Vision Assistée par Ordinateur et/ou par les repères 80 marqués dans la bande 50.- The order and the number of calendering rollers can also vary depending on the implementation of the process. An in-line cutting step can then be carried out, the card bodies 100 being directly cut from the extruded strip 50. According to the variant embodiments, the extruded strip 50 can bear, over its width, between 2 and 4 card bodies 100 The cutting can be carried out according to any conventional technique such as laser cutting or by water jet, for example or cutting by means of punches, dies, blades or the like. This cutting must be precise because the location of the microcircuit 30 is precisely defined by ISO standards. This precision can be obtained by Computer Aided Vision and / or by the marks 80 marked in the strip 50.
Suite à cette étape de découpe, qui termine la ligne de fabrication en continue, des étapes de mises 11Following this cutting step, which completes the continuous production line, setting steps 11
en boîtes des cartes découpées et de récupération des chutes 70 de découpe peuvent être réalisées. La récupération des chutes 70 est possible de par la nature du procédé d' extrusion qui autorise un tel recyclage. L'étape de récupération des chutes 70 et de recyclage peut éventuellement être réalisée en ligne avec l' extrusion de la bande 50.in boxes cut cards and 70 cut scrap recovery can be made. The recovery of scrap 70 is possible by the nature of the extrusion process which allows such recycling. The step of recovering offcuts 70 and of recycling can optionally be carried out in line with the extrusion of the strip 50.
Le procédé selon l'invention va maintenant être décrit en référence au schéma 4 qui illustre un deuxième mode de réalisation.The method according to the invention will now be described with reference to diagram 4 which illustrates a second embodiment.
Ce deuxième mode de réalisation reprend la plupart des étapes du premier mode de réalisation, à l'exception de l'étape de report des micromodules 30 directement dans la bande extrudée 50.This second embodiment repeats most of the steps of the first embodiment, with the exception of the step of transferring the micromodules 30 directly into the extruded strip 50.
Selon ce deuxième mode de réalisation, cette étape de report est remplacée par une étape en ligne deAccording to this second embodiment, this carry-over step is replaced by an online step of
- thermoformage de cavités 130 dans la bande extrudée 50 au moyen d'un outil adapté, tel qu'un rouleau ou un presseur.thermoforming of cavities 130 in the extruded strip 50 by means of a suitable tool, such as a roller or a presser.
Les figures 5A et 5B illustrent deux mises en œuvre possibles de cette étape de thermoformage.FIGS. 5A and 5B illustrate two possible implementations of this thermoforming step.
La réalisation des cavités 130 exploite les propriétés de ramollissement de la matière utilisée pour extruder la bande 50. Un matriçage est ainsi possible au moyen de rouleaux 200, 220 situés de part et d'autre de la bande extrudée 50 dont un 200 est muni de poinçons 210 qui pénètrent à intervalles réguliers dans la matière encore molle de la bande extrudée 50. On peut également réaliser ces cavités 130 à l'aide d'un outil presseur 230 muni de poinçons 210 et couplé à un rouleau 220 sur le verso de la bande extrudée 50. Cet outil presseur 230 se déplace à la même vitesse et selon le même axe que la bande extrudée 50 et présente 12The production of the cavities 130 exploits the softening properties of the material used to extrude the strip 50. A stamping is thus possible by means of rollers 200, 220 located on either side of the extruded strip 50, one of which 200 is provided with punches 210 which penetrate at regular intervals into the still soft material of the extruded strip 50. These cavities 130 can also be produced using a pressing tool 230 provided with punches 210 and coupled to a roller 220 on the back of the extruded strip 50. This pressing tool 230 moves at the same speed and along the same axis as the extruded strip 50 and has 12
l'avantage de permettre la réalisation de cavités 130 à parois verticales dans la bande extrudée 50.the advantage of allowing cavities 130 with vertical walls to be produced in the extruded strip 50.
Selon une particularité avantageuse, l'outil de thermoformage 200 ou 230 est maintenu à une température inférieure à celle du rouleau 220 situé sur le verso de la bande 50. Cette différence de température permet de figer la matière aux abords des cavités 130 en déportant les déformations liées au fluage de la matière plutôt vers le verso de la bande 50. Ces cavités 130 sont alors aptes à recevoir des micromodules électroniques 30, soit par un report en ligne comme décrit en référence au premier mode de réalisation, soit après découpe des corps de carte 100 dans la bande extrudée 50 selon des techniques d'encartage classiques.According to an advantageous feature, the thermoforming tool 200 or 230 is maintained at a temperature lower than that of the roller 220 situated on the back of the strip 50. This temperature difference makes it possible to freeze the material around the cavities 130 by moving the deformations linked to the creep of the material rather towards the back of the strip 50. These cavities 130 are then able to receive electronic micromodules 30, either by an online transfer as described with reference to the first embodiment, or after cutting of the bodies card 100 in the extruded strip 50 according to conventional insertion techniques.
Le procédé selon l'invention va maintenant être - décrit en référence aux schémas 6 et 7 qui illustrent un troisième mode de réalisation. Selon ce mode de réalisation, l'étape d' extrusion de la bande 50 consiste à réaliser l' extrusion d'au moins trois bandes 51, 52, 53 et à les assembler en ligne de manière à former une bande unique 50 qui sera découpée au format des corps de carte 100. L'épaisseur de chaque bande 51, 52, 53 peut varier, par exemple, entre lOOμm et 600μm pour obtenir une bande unique assemblée de 800μm d'épaisseur.The method according to the invention will now be - described with reference to diagrams 6 and 7 which illustrate a third embodiment. According to this embodiment, the step of extruding the strip 50 consists in carrying out the extrusion of at least three strips 51, 52, 53 and assembling them in line so as to form a single strip 50 which will be cut in the format of the card bodies 100. The thickness of each strip 51, 52, 53 can vary, for example, between 100 μm and 600 μm to obtain a single assembled strip 800 μm thick.
Selon les variantes de mise en œuvre de ce troisième mode de réalisation, l'assemblage des trois bandes extrudées 51, 52, 53 est réalisé par collage ou par calandrage par exemple.According to the variant embodiments of this third embodiment, the assembly of the three extruded strips 51, 52, 53 is carried out by gluing or by calendering for example.
Ce mode de réalisation permet avantageusement d'utiliser trois matériaux différents pour chaque bande extrudée 51, 52, 53, ces matériaux étant compatibles, 13This embodiment advantageously makes it possible to use three different materials for each extruded strip 51, 52, 53, these materials being compatible, 13
afin d'affiner les propriétés de tenue mécanique du corps de carte 100 obtenus par la découpe d'une telle bande 50.in order to refine the mechanical strength properties of the card body 100 obtained by cutting such a strip 50.
En outre, des impressions d'éléments sécuritaires et/ou décoratifs peuvent être réalisés indépendamment sur l'une ou l'autre bande extrudée 51, 52, 53. Par exemple, la bande supérieure 51 peut être transparente et la bande intermédiaire 52 peut comporter un code barre imprimé, la bande inférieure 53 comportant une impression décorative sur le verso.In addition, prints of security and / or decorative elements can be produced independently on one or the other extruded strip 51, 52, 53. For example, the upper strip 51 may be transparent and the intermediate strip 52 may comprise a printed bar code, the lower strip 53 comprising a decorative print on the back.
Il peut également être envisagé de réaliser une antenne sur la bande intermédiaire, par exemple par sérigraphie d'une bobine de manière à réaliser des cartes dites à fonctionnement mixte. Selon une particularité de ce troisième mode de réalisation, au moins deux 51, 52 des trois bandes extrudées comportent des découpes 61, 62 destinées àIt can also be envisaged to produce an antenna on the intermediate strip, for example by screen printing of a coil so as to produce so-called cards with mixed operation. According to a feature of this third embodiment, at least two 51, 52 of the three extruded bands have cutouts 61, 62 intended for
- accueillir les micromodules électroniques 30 après assemblage desdites bandes 51, 52, 53 en une bande unique 50. On évite ainsi l'étape de thermoformage des cavités 130. Les micromodules 30 peuvent être reportés en ligne par un outil adapté en utilisant les propriétés adhesives de la bande extrudée assemblée 50 pour une accroche chimique et/ou mécanique, ou selon une technique classique d'encartage après découpe des corps de carte 100.- accommodate the electronic micromodules 30 after assembly of said strips 51, 52, 53 into a single strip 50. This avoids the thermoforming step of the cavities 130. The micromodules 30 can be transferred online by a suitable tool using the adhesive properties of the assembled extruded strip 50 for chemical and / or mechanical bonding, or according to a conventional insertion technique after cutting the card bodies 100.
Selon un mode de réalisation, les micromodules 30 peuvent être reportés en ligne sur une bande extrudée intermédiaire 52 afin d'assurer une accroche supplémentaire mécanique par recouvrement partielle de la bande extrudée supérieure 51.According to one embodiment, the micromodules 30 can be transferred in line to an intermediate extruded strip 52 in order to provide additional mechanical grip by partial covering of the upper extruded strip 51.
Les autres étapes du procédé restent identiques à celles décrites en référence au deux premiers modes de réalisation. 14The other steps of the method remain identical to those described with reference to the first two embodiments. 14
Le procédé selon l'invention permet de fabriquer en série et à grande cadence des cartes à puce à contact comportant un corps de carte 100 composé d'un matériau thermoplastique extrudé.The method according to the invention makes it possible to mass-produce and at high speed contact smart cards comprising a card body 100 composed of an extruded thermoplastic material.
Selon le troisième mode de réalisation, le corps 100 de la carte peut éventuellement être composé d'une pluralité de couches de matériaux thermoplastiques extrudés . Selon une particularité de l'invention, le micromodule électronique 30 est fixé dans le corps de carte 100 directement dans la matière extrudée dudit corps de carte 100, c'est à dire sans adjonction de colle nécessaire aux techniques classiques d'encartage. According to the third embodiment, the body 100 of the card can optionally be composed of a plurality of layers of extruded thermoplastic materials. According to a feature of the invention, the electronic micromodule 30 is fixed in the card body 100 directly in the extruded material of said card body 100, that is to say without the addition of glue necessary for conventional insertion techniques.

Claims

15REVENDICATIONS 15REVENDICATIONS
1. Procédé de fabrication en continu de cartes à puce à contact, lesdites cartes comportant chacune un corps de carte (100) et un micromodule électronique1. A method of continuously manufacturing contact smart cards, said cards each comprising a card body (100) and an electronic micromodule
(30) comprenant une puce de circuit intégré (10) reliée à des plages de contact (35) affleurant la surface du corps de carte (100), caractérisé en ce qu'il comporte les étapes suivantes :(30) comprising an integrated circuit chip (10) connected to contact pads (35) flush with the surface of the card body (100), characterized in that it comprises the following steps:
- extrusion d'au moins une bande (50),- extrusion of at least one strip (50),
- découpe en ligne de ladite bande (50) au- format des corps de carte (100) .- Online cutting of said strip (50) in the format of the card bodies (100).
2. Procédé de fabrication selon la revendication 1, caractérisé en ce qu'il comprend en outre une étape de report en ligne de micromodules électroniques (30) " par pression dans la bande extrudée (50) .2. The manufacturing method according to claim 1, characterized in that it further comprises a step of online transfer of electronic micromodules (30) " by pressure in the extruded strip (50).
3. Procédé de fabrication selon la revendication 1, caractérisé en ce qu'il comprend en outre une étape de thermoformage en ligne de cavités (130) dans la bande extrudée (50), les micromodules électroniques (30) étant reportés dans lesdites cavités (130) .3. The manufacturing method according to claim 1, characterized in that it further comprises a step of thermoforming in line of cavities (130) in the extruded strip (50), the electronic micromodules (30) being transferred into said cavities ( 130).
4. Procédé de fabrication selon l'une quelconque des revendications précédentes, caractérisé en ce que la bande extrudée (50) est une matière thermoplastique.4. Manufacturing method according to any one of the preceding claims, characterized in that the extruded strip (50) is a thermoplastic material.
5. Procédé de fabrication selon l'une quelconque des revendications précédentes, caractérisé en ce que la bande extrudée (50) est une matière thermodurcissable. 165. Manufacturing method according to any one of the preceding claims, characterized in that the extruded strip (50) is a thermosetting material. 16
6. Procédé de fabrication selon l'une des revendications précédentes, caractérisé en ce que la matière de la bande extrudée (50) est choisie parmi du Polyéthylène-téraphtalate (PET) , du Polychlorure de vinyle (PVC) , de l'Acrylonitryle Butadiène Styrène (ABS) , du Polystyrène, du Polyamide, du Polyéthylène, du Polypropylène, le Polycarbonate.6. Manufacturing process according to one of the preceding claims, characterized in that the material of the extruded strip (50) is chosen from Polyethylene terephthalate (PET), Polyvinyl chloride (PVC), Acrylonitryl Butadiene Styrene (ABS), Polystyrene, Polyamide, Polyethylene, Polypropylene, Polycarbonate.
7. Procédé de fabrication selon l'une des revendications précédentes, caractérisé en ce que la matière de la bande extrudée (50) est un polyester.7. Manufacturing method according to one of the preceding claims, characterized in that the material of the extruded strip (50) is a polyester.
8. Procédé de fabrication selon les revendications 2 et 3, caractérisé en ce que l'étape de ther oformage en ligne des cavités (130) et/ou de report en ligne des micromodules (30) est réalisée par un outil constitué d'un rouleau et/ou d'un presseur se déplaçant à la même8. The manufacturing method according to claims 2 and 3, characterized in that the step of ther online forming of the cavities (130) and / or online transfer of the micromodules (30) is carried out by a tool consisting of a roller and / or presser moving at the same
- vitesse et selon le même axe que la bande extrudée- speed and along the same axis as the extruded strip
(50) .(50).
9. Procédé de fabrication selon la revendication 8, caractérisé en ce que l'outil de thermoformage des cavités (130) et/ou de report des micromodules (30) est maintenu à une température inférieure de la température du verso de la bande extrudée (50) de manière à figer la matière de la bande extrudée (50) autour des cavités (130) et/ou des micromodules (30) .9. The manufacturing method according to claim 8, characterized in that the tool for thermoforming the cavities (130) and / or for transferring the micromodules (30) is maintained at a temperature lower than the temperature of the back of the extruded strip ( 50) so as to freeze the material of the extruded strip (50) around the cavities (130) and / or micromodules (30).
10. Procédé de fabrication selon la revendication 8, caractérisé en ce que l'outil de thermoformage des cavités (130) et/ou de report des micromodules (30) est maintenu à une température supérieure de la température du verso de la bande extrudée (50) de manière à 1710. The manufacturing method according to claim 8, characterized in that the tool for thermoforming the cavities (130) and / or for transferring the micromodules (30) is maintained at a temperature higher than the temperature of the back of the extruded strip ( 50) so that 17
ramollir la matière de la bande extrudée (50) autour des cavités (130) et/ou des micromodules (30) .soften the material of the extruded strip (50) around the cavities (130) and / or micromodules (30).
11. Procédé de fabrication selon l'une quelconque des revendications précédentes, caractérisé en ce que le report des micromodules électroniques (30) est réalisé par accroche chimique et/ou mécanique dans la matière de la bande extrudée (50) .11. Manufacturing process according to any one of the preceding claims, characterized in that the transfer of the electronic micromodules (30) is carried out by chemical and / or mechanical attachment in the material of the extruded strip (50).
12. Procédé de fabrication selon l'une des revendications précédentes, caractérisé en ce que l'étape d' extrusion consiste à réaliser l' extrusion d'au moins trois bandes (51, 52, 53) et à assembler en ligne lesdites bandes (51, 52, 53) de manière à former une bande unique (50) découpée au format des corps de carte (100) .12. Manufacturing method according to one of the preceding claims, characterized in that the extrusion step consists in carrying out the extrusion of at least three strips (51, 52, 53) and in assembling said strips in line ( 51, 52, 53) so as to form a single strip (50) cut in the format of the card bodies (100).
13. Procédé de fabrication selon la revendication 12, caractérisé en ce que l'assemblage des trois bandes extrudées (51, 52, 53) est réalisé par collage chimique et/ou mécanique.13. The manufacturing method according to claim 12, characterized in that the assembly of the three extruded bands (51, 52, 53) is carried out by chemical and / or mechanical bonding.
14. Procédé de fabrication selon la revendication 12, caractérisé en ce que l'assemblage des trois bandes extrudées (51, 52, 53) est réalisé par calandrage.14. The manufacturing method according to claim 12, characterized in that the assembly of the three extruded bands (51, 52, 53) is carried out by calendering.
15. Procédé de fabrication selon l'une des revendications 12 à 14, caractérisé en ce qu'au moins deux (51, 52) des trois bandes extrudées comportent des découpes (61, 62) destinées à accueillir les micromodules électroniques (30) après assemblage desdites bandes (51, 52, 53) en une bande unique (50) . 1815. The manufacturing method according to one of claims 12 to 14, characterized in that at least two (51, 52) of the three extruded bands have cutouts (61, 62) intended to accommodate the electronic micromodules (30) after assembling said strips (51, 52, 53) into a single strip (50). 18
16. Procédé de fabrication selon l'une des revendications 12 à 15, caractérisé en ce qu'une antenne est réalisée sur une des trois bandes extrudées (52) .16. The manufacturing method according to one of claims 12 to 15, characterized in that an antenna is produced on one of the three extruded bands (52).
17. Procédé de fabrication selon l'une des revendications précédentes, caractérisé en ce que des impressions sont réalisées sur au moins une des bandes extrudées (50, 51, 52, 53) .17. Manufacturing method according to one of the preceding claims, characterized in that prints are made on at least one of the extruded strips (50, 51, 52, 53).
18. Procédé de fabrication selon l'une des revendications précédentes, caractérisé en ce que des éléments sécuritaires sont disposés sur au moins une des trois bandes extrudées (50, 51, 52, 53) .18. Manufacturing method according to one of the preceding claims, characterized in that security elements are arranged on at least one of the three extruded strips (50, 51, 52, 53).
19. Procédé de fabrication selon l'une quelconque des revendications précédentes, caractérisé en ce qu'il19. Manufacturing method according to any one of the preceding claims, characterized in that it
- comporte en outre au moins une étape de calandrage en ligne de la bande extrudée (50) avant sa découpe au format des corps de carte (100) .- Also comprises at least one step of calendering in line the extruded strip (50) before it is cut to the format of the card bodies (100).
20. Procédé de fabrication selon quelconque des revendications précédentes, caractérisé en ce que des repères de découpe (80) sont réalisés dans la bande extrudée (50) lors de l'étape en ligne de thermoformage des cavités (130) et/ou de report des micromodules (30).20. Manufacturing method according to any one of the preceding claims, characterized in that cutting marks (80) are produced in the extruded strip (50) during the online step of thermoforming of the cavities (130) and / or of transfer micromodules (30).
21. Procédé de fabrication selon l'une quelconque des revendications précédentes, caractérisé en ce qu'il comporte en outre une étape de recyclage des chutes de découpe (70) de la bande extrudée (50) . 1921. The manufacturing method according to any one of the preceding claims, characterized in that it further comprises a step of recycling the cutting scraps (70) of the extruded strip (50). 19
22. Carte à puce à contact comportant un corps de carte (100) et un micromodule électronique (30) comprenant une puce de circuit intégré (10) reliée à des plages de contact (35) affleurant la surface du corps de carte (100), caractérisé en ce que le corps de carte (100) est composé d'un matériau thermoplastique extrudé.22. Contact chip card comprising a card body (100) and an electronic micromodule (30) comprising an integrated circuit chip (10) connected to contact pads (35) flush with the surface of the card body (100) , characterized in that the card body (100) is composed of an extruded thermoplastic material.
23. Carte à puce à contact selon la revendication 22, caractérisé en ce que le corps de carte (100) est composé d'une pluralité de couches de matériaux thermoplastiques extrudés .23. Contact chip card according to claim 22, characterized in that the card body (100) is composed of a plurality of layers of extruded thermoplastic materials.
24. Carte à puce à contact selon l'une des revendications 22 à 23, caractérisé en ce que le micromodule électronique (30) est fixé dans le corps de carte (100) directement dans la matière extrudée dudit - corps de carte (100) . 24. Contact smart card according to one of claims 22 to 23, characterized in that the electronic micromodule (30) is fixed in the card body (100) directly in the extruded material of said - card body (100) .
PCT/FR2001/001819 2000-06-13 2001-06-12 Method for making smart cards by extrusion WO2001096117A1 (en)

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Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0007532A FR2809986B1 (en) 2000-06-13 2000-06-13 METHOD FOR MANUFACTURING EXTRUSION CHIP CARDS
FR00/07532 2000-06-13

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US8770488B2 (en) * 2010-08-12 2014-07-08 Fofitec Ag Method for the production of punched parts in web- or sheet-like print substrates and their further processing
FR2974753B1 (en) * 2011-05-04 2014-03-14 Evolis MAP INTENDED TO BE PRINTED BY A PRINTER

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