WO2001088975A3 - Method for producing a component - Google Patents

Method for producing a component Download PDF

Info

Publication number
WO2001088975A3
WO2001088975A3 PCT/EP2001/005040 EP0105040W WO0188975A3 WO 2001088975 A3 WO2001088975 A3 WO 2001088975A3 EP 0105040 W EP0105040 W EP 0105040W WO 0188975 A3 WO0188975 A3 WO 0188975A3
Authority
WO
WIPO (PCT)
Prior art keywords
protuberance
producing
component
hardened
potting compound
Prior art date
Application number
PCT/EP2001/005040
Other languages
German (de)
French (fr)
Other versions
WO2001088975A2 (en
Inventor
Guenter Igel
Original Assignee
Micronas Gmbh
Guenter Igel
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micronas Gmbh, Guenter Igel filed Critical Micronas Gmbh
Publication of WO2001088975A2 publication Critical patent/WO2001088975A2/en
Publication of WO2001088975A3 publication Critical patent/WO2001088975A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4251—Sealed packages
    • G02B6/4253—Sealed packages by embedding housing components in an adhesive or a polymer material
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4255—Moulded or casted packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05599—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8538—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/85399—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01049—Indium [In]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

The invention relates to a method for producing a component (1). According to said method, at least one protuberance (4) is formed on a body (3) which has a microstructure (2), said protuberance projecting from the body. A free-flowing potting compound (10), which laterally borders and covers the protuberance(s) (4), is then applied to the body (3) and hardened. The hardened potting compound (10) is then removed on the opposite surface to the body (3), until sections of the protuberance(s) (4) are exposed.
PCT/EP2001/005040 2000-05-13 2001-05-04 Method for producing a component WO2001088975A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10023539A DE10023539B4 (en) 2000-05-13 2000-05-13 Method for producing a component
DE10023539.5 2000-05-13

Publications (2)

Publication Number Publication Date
WO2001088975A2 WO2001088975A2 (en) 2001-11-22
WO2001088975A3 true WO2001088975A3 (en) 2002-06-20

Family

ID=7641961

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2001/005040 WO2001088975A2 (en) 2000-05-13 2001-05-04 Method for producing a component

Country Status (3)

Country Link
DE (1) DE10023539B4 (en)
TW (1) TW503488B (en)
WO (1) WO2001088975A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10302007B4 (en) * 2003-01-21 2006-09-07 Leuze Electronic Gmbh & Co Kg Optical sensor
CN101252155B (en) * 2008-03-14 2010-10-13 厦门大学 Method for preparation of polycrystalline silicon solar cell textile layer
CN104730656A (en) * 2015-04-01 2015-06-24 苏州旭创科技有限公司 Optical module and manufacturing method thereof

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60113950A (en) * 1983-11-25 1985-06-20 Hitachi Ltd Semiconductor device
JPS6333851A (en) * 1986-07-28 1988-02-13 Matsushita Electric Works Ltd Package for ic
JPH01300530A (en) * 1988-05-30 1989-12-05 Nissan Motor Co Ltd Manufacture of semiconductor element package
US4971930A (en) * 1985-12-20 1990-11-20 Sgs Microelectronics S.P.A. EPROM semiconductor device erasable with ultraviolet rays and manufacturing process thereof
JPH04217375A (en) * 1990-12-18 1992-08-07 Sumitomo Electric Ind Ltd Semiconductor device and preparation thereof
FR2704690A1 (en) * 1993-04-27 1994-11-04 Thomson Csf Method for encapsulating semiconductor wafers, device obtained by this process and application to the interconnection of wafers in three dimensions.
JPH07307409A (en) * 1994-05-12 1995-11-21 Fujitsu Ltd Semiconductor device and its production method
JPH0864725A (en) * 1994-08-18 1996-03-08 Sony Corp Resin-sealed semiconductor device and its manufacture
US5622873A (en) * 1994-01-24 1997-04-22 Goldstar Electron Co., Ltd. Process for manufacturing a resin molded image pick-up semiconductor chip having a window
EP0771029A2 (en) * 1995-10-24 1997-05-02 Oki Electric Industry Co., Ltd. Semiconductor device having an improved structure for preventing cracks, and method of manufacturing the same
EP0901165A1 (en) * 1997-09-05 1999-03-10 Matra Marconi Space France Housing for integrated circuit and method for mounting integrated circuit
JPH11150090A (en) * 1991-08-23 1999-06-02 Sony Corp Manufacture of semiconductor device
JP2000058569A (en) * 1998-08-06 2000-02-25 Sony Corp Method for forming semiconductor package

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2531302A1 (en) * 1982-07-30 1984-02-03 Xerox Corp METHODS OF FORMING A HIGH DENSITY ELECTRICAL CIRCUIT AND INTERCONNECTING ELEMENTS FOR THE CIRCUIT
US4955523A (en) * 1986-12-17 1990-09-11 Raychem Corporation Interconnection of electronic components
JPH05203522A (en) * 1992-01-23 1993-08-10 Mitsubishi Electric Corp Pressure sensor for molded package semiconductor and manufacture thereof
JP3209119B2 (en) * 1996-07-30 2001-09-17 松下電工株式会社 Pressure sensor
US5848214A (en) * 1997-07-16 1998-12-08 The United States Of America As Represented By The Secretary Of The Air Force Optically-guiding multichip module

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60113950A (en) * 1983-11-25 1985-06-20 Hitachi Ltd Semiconductor device
US4971930A (en) * 1985-12-20 1990-11-20 Sgs Microelectronics S.P.A. EPROM semiconductor device erasable with ultraviolet rays and manufacturing process thereof
JPS6333851A (en) * 1986-07-28 1988-02-13 Matsushita Electric Works Ltd Package for ic
JPH01300530A (en) * 1988-05-30 1989-12-05 Nissan Motor Co Ltd Manufacture of semiconductor element package
JPH04217375A (en) * 1990-12-18 1992-08-07 Sumitomo Electric Ind Ltd Semiconductor device and preparation thereof
JPH11150090A (en) * 1991-08-23 1999-06-02 Sony Corp Manufacture of semiconductor device
FR2704690A1 (en) * 1993-04-27 1994-11-04 Thomson Csf Method for encapsulating semiconductor wafers, device obtained by this process and application to the interconnection of wafers in three dimensions.
US5622873A (en) * 1994-01-24 1997-04-22 Goldstar Electron Co., Ltd. Process for manufacturing a resin molded image pick-up semiconductor chip having a window
JPH07307409A (en) * 1994-05-12 1995-11-21 Fujitsu Ltd Semiconductor device and its production method
JPH0864725A (en) * 1994-08-18 1996-03-08 Sony Corp Resin-sealed semiconductor device and its manufacture
EP0771029A2 (en) * 1995-10-24 1997-05-02 Oki Electric Industry Co., Ltd. Semiconductor device having an improved structure for preventing cracks, and method of manufacturing the same
EP0901165A1 (en) * 1997-09-05 1999-03-10 Matra Marconi Space France Housing for integrated circuit and method for mounting integrated circuit
JP2000058569A (en) * 1998-08-06 2000-02-25 Sony Corp Method for forming semiconductor package

Non-Patent Citations (8)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 009, no. 270 (E - 353) 26 October 1985 (1985-10-26) *
PATENT ABSTRACTS OF JAPAN vol. 012, no. 244 (E - 631) 9 July 1988 (1988-07-09) *
PATENT ABSTRACTS OF JAPAN vol. 014, no. 095 (E - 0892) 21 February 1990 (1990-02-21) *
PATENT ABSTRACTS OF JAPAN vol. 016, no. 567 (E - 1296) 8 December 1992 (1992-12-08) *
PATENT ABSTRACTS OF JAPAN vol. 1996, no. 03 29 March 1996 (1996-03-29) *
PATENT ABSTRACTS OF JAPAN vol. 1996, no. 07 31 July 1996 (1996-07-31) *
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 11 30 September 1999 (1999-09-30) *
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 05 14 September 2000 (2000-09-14) *

Also Published As

Publication number Publication date
DE10023539B4 (en) 2009-04-09
TW503488B (en) 2002-09-21
DE10023539A1 (en) 2001-11-29
WO2001088975A2 (en) 2001-11-22

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