WO2001078118A1 - Wafer preparation systems and methods for preparing wafers - Google Patents
Wafer preparation systems and methods for preparing wafers Download PDFInfo
- Publication number
- WO2001078118A1 WO2001078118A1 PCT/US2001/040362 US0140362W WO0178118A1 WO 2001078118 A1 WO2001078118 A1 WO 2001078118A1 US 0140362 W US0140362 W US 0140362W WO 0178118 A1 WO0178118 A1 WO 0178118A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- wafer
- recited
- unit
- dryer
- station
- Prior art date
Links
- 238000002360 preparation method Methods 0.000 title claims abstract description 48
- 238000000034 method Methods 0.000 title claims abstract description 31
- 235000012431 wafers Nutrition 0.000 title description 192
- 238000005201 scrubbing Methods 0.000 claims abstract description 38
- 238000001035 drying Methods 0.000 claims abstract description 27
- 238000004140 cleaning Methods 0.000 claims abstract description 25
- 239000000126 substance Substances 0.000 claims description 19
- 239000004065 semiconductor Substances 0.000 claims description 10
- 230000007704 transition Effects 0.000 claims description 6
- 230000008569 process Effects 0.000 description 17
- 239000012636 effector Substances 0.000 description 10
- 239000012530 fluid Substances 0.000 description 9
- 238000005530 etching Methods 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 238000001465 metallisation Methods 0.000 description 6
- 230000008901 benefit Effects 0.000 description 4
- KRHYYFGTRYWZRS-UHFFFAOYSA-N hydrofluoric acid Substances F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- 239000004372 Polyvinyl alcohol Substances 0.000 description 3
- 229920002451 polyvinyl alcohol Polymers 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000007792 addition Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- QPJSUIGXIBEQAC-UHFFFAOYSA-N n-(2,4-dichloro-5-propan-2-yloxyphenyl)acetamide Chemical compound CC(C)OC1=CC(NC(C)=O)=C(Cl)C=C1Cl QPJSUIGXIBEQAC-UHFFFAOYSA-N 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000009987 spinning Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000002457 bidirectional effect Effects 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000010981 drying operation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000011112 process operation Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/906—Cleaning of wafer as interim step
Definitions
- the wafer cleaning systems and a dryer system are also arranged horizontally but handle the wafer in a vertical orientation.
- An end effector robot is configured to handle the wafers and transport them between each cleaning station and the dryer system.
- This arrangement although efficient in cleaning wafers in vertical orientations, takes up substantial clean room area. Additionally, this arrangement requires that the robot handle the wafer at each stage of the process. That is, the robot is required to bring wafers into and out of each cleaning station and also into and out of the dryer. This level of interaction, although configured to be as clean as possible, can introduce particulates and can slow down the process.
- the semiconductor wafer preparation apparatus includes a wafer cleaning station and a drying station that is mounted over the wafer cleaning station.
- the moveable dryer housing 104a can proceed to the load/unload position.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE60128338T DE60128338T2 (en) | 2000-03-31 | 2001-03-22 | METHOD AND DEVICE FOR PREPARING WAFER |
EP01931115A EP1269523B1 (en) | 2000-03-31 | 2001-03-22 | Wafer preparation systems and methods for preparing wafers |
AU2001257584A AU2001257584A1 (en) | 2000-03-31 | 2001-03-22 | Wafer preparation systems and methods for preparing wafers |
JP2001575474A JP4731785B2 (en) | 2000-03-31 | 2001-03-22 | Wafer processing system and method for processing a wafer |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/540,421 | 2000-03-31 | ||
US09/540,421 US6482678B1 (en) | 2000-03-31 | 2000-03-31 | Wafer preparation systems and methods for preparing wafers |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2001078118A1 true WO2001078118A1 (en) | 2001-10-18 |
Family
ID=24155382
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2001/040362 WO2001078118A1 (en) | 2000-03-31 | 2001-03-22 | Wafer preparation systems and methods for preparing wafers |
Country Status (9)
Country | Link |
---|---|
US (1) | US6482678B1 (en) |
EP (1) | EP1269523B1 (en) |
JP (1) | JP4731785B2 (en) |
KR (1) | KR100779443B1 (en) |
CN (1) | CN1205647C (en) |
AU (1) | AU2001257584A1 (en) |
DE (1) | DE60128338T2 (en) |
TW (1) | TW494452B (en) |
WO (1) | WO2001078118A1 (en) |
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---|---|---|---|---|
US6949411B1 (en) * | 2001-12-27 | 2005-09-27 | Lam Research Corporation | Method for post-etch and strip residue removal on coral films |
US20040200409A1 (en) * | 2002-12-16 | 2004-10-14 | Applied Materials, Inc. | Scrubber with integrated vertical marangoni drying |
WO2005009633A1 (en) * | 2003-07-22 | 2005-02-03 | Arizona Board Of Regents | System and method of dry contract cleaning for removing particles from semiconductor wafers |
CN102354675A (en) * | 2011-11-02 | 2012-02-15 | 上海宏力半导体制造有限公司 | Vertical processing device and method of wafer |
CN102768974B (en) * | 2012-07-23 | 2014-11-26 | 清华大学 | Wafer cleaning equipment |
WO2014033055A1 (en) | 2012-08-27 | 2014-03-06 | Aktiebolaget Electrolux | Robot positioning system |
TWI478264B (en) * | 2013-02-25 | 2015-03-21 | Grand Plastic Technology Corp | Multi-functional substrate processing apparatus |
CN105101855A (en) | 2013-04-15 | 2015-11-25 | 伊莱克斯公司 | Robotic vacuum cleaner with protruding sidebrush |
US10448794B2 (en) | 2013-04-15 | 2019-10-22 | Aktiebolaget Electrolux | Robotic vacuum cleaner |
JP6750921B2 (en) | 2013-12-19 | 2020-09-02 | アクチエボラゲット エレクトロルックス | Robot vacuum cleaner |
CN105793790B (en) | 2013-12-19 | 2022-03-04 | 伊莱克斯公司 | Prioritizing cleaning zones |
KR102137857B1 (en) | 2013-12-19 | 2020-07-24 | 에이비 엘렉트로룩스 | Robotic cleaning device and method for landmark recognition |
WO2015090402A1 (en) | 2013-12-19 | 2015-06-25 | Aktiebolaget Electrolux | Robotic cleaning device with perimeter recording function |
EP3082542B1 (en) | 2013-12-19 | 2018-11-28 | Aktiebolaget Electrolux | Sensing climb of obstacle of a robotic cleaning device |
WO2015090398A1 (en) | 2013-12-19 | 2015-06-25 | Aktiebolaget Electrolux | Robotic vacuum cleaner with side brush moving in spiral pattern |
KR102159206B1 (en) | 2013-12-19 | 2020-09-23 | 에이비 엘렉트로룩스 | Adaptive speed control of rotating side brush |
KR102116595B1 (en) | 2013-12-20 | 2020-06-05 | 에이비 엘렉트로룩스 | Dust container |
WO2016005012A1 (en) | 2014-07-10 | 2016-01-14 | Aktiebolaget Electrolux | Method for detecting a measurement error in a robotic cleaning device |
US10729297B2 (en) | 2014-09-08 | 2020-08-04 | Aktiebolaget Electrolux | Robotic vacuum cleaner |
CN106659345B (en) | 2014-09-08 | 2019-09-03 | 伊莱克斯公司 | Robotic vacuum cleaner |
US10877484B2 (en) | 2014-12-10 | 2020-12-29 | Aktiebolaget Electrolux | Using laser sensor for floor type detection |
CN114668335A (en) | 2014-12-12 | 2022-06-28 | 伊莱克斯公司 | Side brush and robot dust catcher |
KR102339531B1 (en) | 2014-12-16 | 2021-12-16 | 에이비 엘렉트로룩스 | Experience-based roadmap for a robotic cleaning device |
WO2016095966A1 (en) | 2014-12-16 | 2016-06-23 | Aktiebolaget Electrolux | Cleaning method for a robotic cleaning device |
EP3282912B1 (en) | 2015-04-17 | 2020-06-10 | Aktiebolaget Electrolux | Robotic cleaning device and a method of controlling the robotic cleaning device |
JP6736831B2 (en) | 2015-09-03 | 2020-08-05 | アクチエボラゲット エレクトロルックス | Robot cleaning device system, method for controlling cleaning device, computer program and computer program product |
JP7035300B2 (en) | 2016-03-15 | 2022-03-15 | アクチエボラゲット エレクトロルックス | Robot Cleaning Devices, Methods for Performing Escarpment Detection in Robot Cleaning Devices, Computer Programs, and Computer Program Products |
CN109068908B (en) | 2016-05-11 | 2021-05-11 | 伊莱克斯公司 | Robot cleaning device |
JP7243967B2 (en) | 2017-06-02 | 2023-03-22 | アクチエボラゲット エレクトロルックス | Method for Detecting Level Differences on a Surface in Front of a Robotic Cleaning Device |
CN111093447B (en) | 2017-09-26 | 2022-09-02 | 伊莱克斯公司 | Movement control of a robotic cleaning device |
CN111009482B (en) * | 2019-12-18 | 2022-06-07 | 福建北电新材料科技有限公司 | Wafer cleaning device and wafer cleaning equipment |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4722752A (en) * | 1986-06-16 | 1988-02-02 | Robert F. Orr | Apparatus and method for rinsing and drying silicon wafers |
JPH06163491A (en) * | 1992-11-25 | 1994-06-10 | Sony Corp | Method and apparatus for washing semiconductor substrate |
JPH10189528A (en) * | 1996-12-27 | 1998-07-21 | Dainippon Screen Mfg Co Ltd | Apparatus and method for cleaning of substrate |
US5974680A (en) * | 1996-03-11 | 1999-11-02 | Memc Electronic Materials, Inc. | Apparatus for use in cleaning wafers |
US6032683A (en) * | 1998-02-09 | 2000-03-07 | International Business Machines Corporation | System for cleaning residual paste from a mask |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3347814B2 (en) * | 1993-05-17 | 2002-11-20 | 大日本スクリーン製造株式会社 | Substrate cleaning / drying processing method and processing apparatus |
US6230753B1 (en) * | 1996-07-15 | 2001-05-15 | Lam Research Corporation | Wafer cleaning apparatus |
JPH10189530A (en) * | 1996-12-20 | 1998-07-21 | Dainippon Screen Mfg Co Ltd | Rotary substrate drier |
JP3643218B2 (en) * | 1997-08-13 | 2005-04-27 | 大日本スクリーン製造株式会社 | Substrate processing method, processing apparatus therefor, and computer-readable recording medium on which processing program is recorded |
JP3980210B2 (en) * | 1998-02-27 | 2007-09-26 | 株式会社東芝 | Wafer drying apparatus and wafer drying method |
US5913981A (en) * | 1998-03-05 | 1999-06-22 | Micron Technology, Inc. | Method of rinsing and drying semiconductor wafers in a chamber with a moveable side wall |
-
2000
- 2000-03-31 US US09/540,421 patent/US6482678B1/en not_active Expired - Lifetime
-
2001
- 2001-03-22 KR KR1020027012938A patent/KR100779443B1/en not_active IP Right Cessation
- 2001-03-22 EP EP01931115A patent/EP1269523B1/en not_active Expired - Lifetime
- 2001-03-22 CN CNB01807670XA patent/CN1205647C/en not_active Expired - Fee Related
- 2001-03-22 JP JP2001575474A patent/JP4731785B2/en not_active Expired - Fee Related
- 2001-03-22 WO PCT/US2001/040362 patent/WO2001078118A1/en active IP Right Grant
- 2001-03-22 AU AU2001257584A patent/AU2001257584A1/en not_active Abandoned
- 2001-03-22 DE DE60128338T patent/DE60128338T2/en not_active Expired - Fee Related
- 2001-03-29 TW TW090107615A patent/TW494452B/en not_active IP Right Cessation
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4722752A (en) * | 1986-06-16 | 1988-02-02 | Robert F. Orr | Apparatus and method for rinsing and drying silicon wafers |
JPH06163491A (en) * | 1992-11-25 | 1994-06-10 | Sony Corp | Method and apparatus for washing semiconductor substrate |
US5974680A (en) * | 1996-03-11 | 1999-11-02 | Memc Electronic Materials, Inc. | Apparatus for use in cleaning wafers |
JPH10189528A (en) * | 1996-12-27 | 1998-07-21 | Dainippon Screen Mfg Co Ltd | Apparatus and method for cleaning of substrate |
US6032683A (en) * | 1998-02-09 | 2000-03-07 | International Business Machines Corporation | System for cleaning residual paste from a mask |
Non-Patent Citations (2)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 018, no. 477 (E - 1602) 6 September 1994 (1994-09-06) * |
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 12 31 October 1998 (1998-10-31) * |
Also Published As
Publication number | Publication date |
---|---|
DE60128338T2 (en) | 2008-01-10 |
KR20020087439A (en) | 2002-11-22 |
CN1205647C (en) | 2005-06-08 |
AU2001257584A1 (en) | 2001-10-23 |
DE60128338D1 (en) | 2007-06-21 |
KR100779443B1 (en) | 2007-11-26 |
CN1439168A (en) | 2003-08-27 |
EP1269523A1 (en) | 2003-01-02 |
US6482678B1 (en) | 2002-11-19 |
EP1269523B1 (en) | 2007-05-09 |
TW494452B (en) | 2002-07-11 |
JP2003530714A (en) | 2003-10-14 |
JP4731785B2 (en) | 2011-07-27 |
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