WO2001057793A1

WO2001057793A1 - Portable data supports

Info

Publication number: WO2001057793A1
Application number: PCT/DE2001/000143
Authority: WO
Inventors: Jürgen Fischer; Manfred Fries; Frank PÜSCHNER; Annemarie Seidl
Original assignee: Infineon Technologies Ag
Priority date: 2000-02-02
Filing date: 2001-01-15
Publication date: 2001-08-09
Also published as: CN1213386C; EP1122685B1; RU2234130C2; JP2003521787A; US6778407B2; EP1122685A1; US20030016507A1; ATE404941T1; CN1397048A; DE50015305D1; JP4284021B2; ES2312310T3; RU2002123376A

Abstract

A portable data support is disclosed comprising a card-shaped body (1), with a recess (2) for mounting a chip module (3). Said chip module contains at least one semiconductor chip (4) on a first main side (5), a chip support (18) connected to the card-shaped body and a metallisation on a second main side (6) with a tab. The chip support comprises pre-determined bending points (9), which, when bending strains occur, reduce the forces on the semiconductor chip and the wire connections.

Description

description

Portable disk

The invention relates to a portable data carrier with a card-shaped body which has a recess for receiving a chip module, the chip module having at least one semiconductor chip on a first main side of a chip carrier connected to the card-shaped body and a metallization having contact tabs on a second main side of the chip carrier includes.

Such portable data carriers are well known from the prior art. They are typically designed in a card form (for example in credit card format) with an integrated integrated circuit module. These data carriers are then called chip cards. Data carriers of the type mentioned are exposed to a wide variety of stresses during use. Due to the structural conditions with a card body and a chip module, high bending loads can act on the arrangement, which, depending on the structural design, can lead to failures, for example caused by a chip break or a broken electrical connection. The susceptibility of such an arrangement depends on the chip size, on the length of one

Bond wire connection between the contact pads of a semiconductor chip and the materials used.

A chip module known from the prior art usually has a carrier which consists of epoxy resin. A semiconductor chip is applied to a first main side of the carrier and is connected to the carrier, for example by means of adhesive or laminating. Metallization is applied to a second main side of the carrier opposite the first main side. The metallization shows

Contact tabs and forms the later accessible contacts of the chip module. Typically, the metal Isolation six or eight electrically isolated contact lugs, each of which is connected to contact pads of the semiconductor chip via bond wires. The bond wires are passed through recesses in the carrier. For mechanical protection of the semiconductor chip and the bond wires, a potting compound is applied to the first main side, which surrounds the semiconductor chip and the bond wires.

If the data carrier is exposed to bending stresses, such as occur in mail sorting systems when sent by post, it can be damaged. Due to the design, a high kinetic energy acts on the data carrier in a letter envelope, which is caused on the one hand by high speed and on the other hand by frequent changes of direction via movable rollers of the letter sorting system.

In order to keep the forces acting on the data carrier arrangement as low as possible, attempts have been made to either attack the tensile and compressive forces by increasing the module bending resistance in the semiconductor chip and in the bond wire area

Using particularly hard covers or by using stiffening elements, for example frames on the first main side of the chip carrier, to redirect the adhesive connection between the chip module and the card-shaped body of the data carrier. Based on the good practical experience, the use of a so-called "hot-melt adhesive" for connecting the chip module to the card-shaped body was adopted, since this has proven to be particularly advantageous due to its elastic properties.

Nevertheless, the semiconductor chip or the bond wire connections in the chip module can be damaged if the bending stresses are high.

The object of the present invention is therefore to provide a portable data carrier arrangement that also has high reliability at high bending loads.

This object is achieved with the features of claim 1.

The invention is based on the finding that the smaller the dimensions of the chip module, the smaller the deflection of the semiconductor chip or the entire chip module. However, since the chip modules or portable data carrier arrangements described at the outset must correspond to specified standards (ISO standard), any size reduction of the chip module is not possible. The invention therefore provides that the chip carrier has predetermined bending points. Since the weakest point basically yields when bending stresses occur, the semiconductor chip and the electrical connections (bonding wires) can be accommodated on a rigid surface by a suitable arrangement of the predetermined bending points in the chip carrier. In other words, the invention therefore provides to extend a rigid area of the chip module such that not only the semiconductor chip but also the wire bond connections are located in the rigid area.

Advantageous refinements result from the subclaims.

In an advantageous embodiment, the predetermined bending points are located in an area outside the semiconductor chip. It is even more advantageous if the predetermined bending points are arranged outside a cover surrounding the semiconductor chip. If the predetermined bending points are simultaneously located in an area within the side edges of the recess, the forces acting on the portable data carrier can be kept as far away as possible from the semiconductor chip and the electrical connections. OJ t M I- ¹

LΠ o LΠ O LΠ o LΠ

O CD ≤ öd 3 α

C rr Φ i Φ P- 3

^ P- co φ 3 Φ o 3 φ P- Φ

3 ^{^} 3 3 rt> P- rr rt φ C φ 3

, _- ^■ CQ s: Φ

P- p- α co Φ ri

Φ α n Φ <xi P- p- 3 ^J Q OJ I- ¹ >

> Φ Φ H, P- C

3 3 P- c LQ t »l- 3 3 3 Φ LQ

0 P- QJ LQ 3 Φ

P, 3 φ α CQ

QJ P- H Φ ≤ co rt φ 3 H, Φ rt J n SD ω CD Φ

C P- Φ LQ rt

3 φ 0 3 Φ C Q 3 LQ 3 rt 3

Φ 0 = Φ rt ≤ LQ

3 Q ≤ OJ P- Φ

P-? O P- Oi

QJ p- QJ rt 3 "CQ Φ

Φ n Φ l-h Φ ri

CQ 3 'H, 0J LQ 3 φ co "Φ M

M rt 3 ri Φ l-i to SD Φ P- P- l-h J ^

Φ n 3 3 3 P-

? r φ o! LQ Φ 3 rr P- φ Φ

^ rt o * i P, LQ C

0 Φ φ er Φ Φ 3

1 H LQ LQ

^• V QJ Φ öd φ φ co P- H 3 CQ

OJ CQ 0 er φ C = P- rr H Φ P- er 3

P-co 3 rt Φ Oi

3 rr er o Φ Q Φ P- Φ Oi

CQ LQ Φ 3 J or P-

Φ LQ C Φ φ

CQ Φ D l-h

CO rt • co φ rt Φ N 0

P, Φ LQ ö c t- ¹

LQ _- ^■ Φ c 3 i— ^y

P- co ri P- er er φ Ω 3 P- rt ≤ 3 'QJ φ er P- Φ LQ

CQ φ H o O Φ

P- 1 & P- rt CQ Φ rt

3 ^J P- Φ φ

3 P- 1

Alternatively, the metallization could also end in an area within the predetermined bending points. This means nothing other than that the first area of the contact tab formed by the cutout is omitted.

The invention is explained in more detail with reference to the following figures. Show it:

FIG. 1 shows a cross section through the portable data carrier according to the invention in accordance with a first embodiment,

FIG. 2 shows the top view of the metallization of the chip module from FIG. 1,

FIG. 3 shows in cross section a second exemplary embodiment of the portable data carrier according to the invention,

FIG. 4 shows a plan view of an alternative embodiment of the metallization of a chip module and

Figure 5 shows a portable data carrier, in which the position of the predetermined bending points to the card-shaped body can be seen.

FIG. 1 shows a section of a portable data carrier according to the invention. A chip module 3 is introduced in a recess 2 of a card-shaped body 1 in a known manner. The chip module 3 consists of a chip carrier 18, on the first main side 5 of which a semiconductor chip 4 is applied. A metallization 7 is applied to a second main side 6 of the chip carrier 18. The metallization has a plurality of contact lugs (not visible in this figure), of which each contact lug is connected to a contact pad of the semiconductor chip 4 via bond wires 11. The bond wires 11 are guided through recesses 19 through the chip carrier 18 in order to be connected to the contacts 19 in the recess 19.

OJ 3 ι-i öd Φ NO ö 3 <_ι. CQ ω ₅ co 3 N α σ rt LQ LQ CQ 1— 'CD α O ^• V rt φ 3 Φ φ Φ φ • - • OJ φ C P- Φ Φ rr P- o C P- P- Φ P- φ P- φ ^• n P- O P- Φ P- P ¹ OJ

P- rt P- CD i-i Φ tr s =: φ 3 φ Φ SD 3 Φ Φ 3 SD: CQ φ ≤ P- φ P- Φ 3 Ω PJ K

CQ O Φ Ω φ 3 LQ Ω 0 LQ ι-i LQ LQ rt P- Φ 3 Φ tr CQ ω rr rt Φ 3 n P- rt Φ rt tr <τi co Ω Φ er rt LQ CQ φ Φ Φ 2 I— ¹ ^? P rt P-

3 tr Ω 3 P- rt tr Φ er OJ P- to ^ -i P- rt P. Φ Φ CQ CQ CD SD 3 P- 3 OJ

Φ Öd P- tr P- S. LQ Φ 3 Φ 3 φ 0 = Ω rt Ξ Φ s: Φ P, X ¹ tr

O 3 φ 3 • ö CD oo φ Φ s; P- 3 SD P- LQ C ≤ & ö tr C φ OJ m Φ tr er rt ⁾ <3 c H P- rt er Ω H. ι-i ri (=: OJ 3 CQ Φ 3 Φ rt Φ 3 3 rt P - P- Φ φ SD = Φ Ξ φ

H Φ rt ι-i Φ tr J φ Φ ^ er CQ Ω CQ 3 3 α H OJ CQ CQ <; 3 3 ι-i Φ

Ω Φ P- 0J = lh c Φ 3 M 3 - ^• n tr rt 3 0 = φ P- 3 Φ Φ Φ lh LQ P- N tr H, Ω CQ LQ P- LQ 3 LQ Φ φ SD LQ ι-i Φ O CO H 0 = Φ C rt c tr Φ Φ 3 Φ. Ω N Öd φ c 3 C 3 P- P- P- OJ Φ SD σ H ta Φ o 3 P- P rt tr Φ Φ Φ H 0 Ω tΛ P- P- t Φ φ Φ OJ c X c P- 3 3 3

P- P- tr 3 CQ φ H, σ 0 = CB P- H P- tr tr Φ Φ Φ Ω SD i C CQ P- co 3 P- PJ tr ι-i φ Ω P- Φ rt φ P- 3 rt LQ Φ 3 Φ S- ^ SD 3 ι-i CQ er co C er LQ O- CD P- Φ tr 3 3 _^ -_. 3 φ 3 SD rt P- LQ P- 3 LQ tr Φ Φ er P- Φ 0 3 • ^ Φ a Φ Φ CO 3 öd rt J 3 ra 3 co Φ Ω Φ LQ Φ? R SD P- ¹ Φ CQ LQ c ^• v 3 3 CQ Φ

0 C * J P- P- rt φ 3 rt Φ tr J 11 0 = P- s: φ LQ 0 ^• n • 0 LQ <! Φ

3 LQ CD SD = Ω Ω • C P- c c 3 er 3 P- P- Φ 3 er 3 X t ^ n C 0 3

O Φ • 3 tr ^{^} co 3 3 ii 3 3 3 3 -i rt 3 o P- C Φ ö P- to 0 = tr 3 3 •

N rt P- α LQ Φ Φ JD = P- LQ Φ Φ Φ φ φ ι-i ι-i P- JH P- CQ ι-i φ s φ SD 3 3 P- co Ω s 3 Φ ι-ic ι -i P- ι-i LQ Ω Φ Φ ^• υ Ό Φ Φ α

0J = P- P- LQ C α Φ CO α rt φ ι-i tr 3 Ω φ Φ tr 3 er CQ φ rt er P- Φ tr LQ rt 3 Φ O π Φ 3 rt c = P- OJ LQ tr Φ CQ er Φ S Φ 0 P. H Φ 3 rt rt N Φ s OJ tr σ 3 P- SD r ι-i co CO Φ CD £ SD = 3 Φ

Φ Φ 3 Φ 3 C φ c P- c-- t O Φ & er Ό c Φ 0 rt rr et rt P- P ¹ LQ • to P- P- Φ P rt er ^• er OJ Φ HO Φ Φ co Ω Φ Φ J φ φ Φ SD tr O Ω LQ π 3 Ω SD P- 3 Φ - ¹ P 3 P- Φ 0- ι-i. π LQ ^• - • tr tr tr <H ö

P- tr CQ 3 "rt P- tr φ P- 0 ι-i er Φ Φ Ω Φ ≤ φ Φ φ rt rt φ CQ PJ & er σ

3 P- P- rt - LQ rt LQ Ω rt π 3 ^J CQ ι-i CO c Φ co 3 3 Φ ^ P- - »Φ P. co O-

^• V 3 Φ> P- Φ tr s = H Φ tr 3 Φ C 0 3 P- rt 3 o H er c-- Φ φ c: rt O c-- Φ LQ to c CD CD rt OJ P- P- φ 3 3 Λ CD SD U3 P- €. P- CD er o Ω P-

HH, he P- Φ co P- rt CQ LQ rt ^► 0 3 LQ Φ Φ h- ¹ CQ Φ Φ P- o 3 Φ tr rt

Ω SD = O Φ 3 3 o Φ φ SD Φ Φ rr • P- rt rt Φ P- 3 tr ι-i P- c Φ tr LQ P- H s == LQ ^• n PC 3 HH SD rt P- P- OJ C P- ~ ι-i CQ C P- φ ^• n 3 HQ φ Φ tu er Φ SD c p- Ω 0J = Cd O φ φ Φ c 3 φ rt 3 Ό 3 Ά 3 LQ Ω φ ι- i OJ Φ ^* ι-i 3 Φ φ ≤ _r LQ φ 3 LQ Λ LQ Φ S LQ PJ rt o tr lh co Φ ι-i Φ E- LQ 3 Φ LQ Φ P- Φ P- N Φ öd φ CQ 3 φ c H Φ P> P- c-- rt 3 er 3 3 P- φ H ^ HC SD CQ 0 H 0 rt rt φ -J 0J = er co • n tr P- Φ P- 3 LQ £ P- 3 3 Oi φ P- 3 3 rt 3 tr Φ 3 CQ OJ LQ LQ Φ »ii φ 3 Φ φ N Φ Φ 3 Φ Φ S- ^ SD P- Φ rt φ SD ι-i P- rt 0 tr Ii φ &> rr P- P- LQ Φ 3 P- 3 3 3 3 Φ rt Φ Ω P- c H Φ N

> φ rt rt φ P- CQ α S - Φ ^• Tl P- 3 H er 2 tr P- tr 3 3 HC c

C c 3 Φ 3 Ω t rt Φ Φ H C Φ φ S: Φ Φ co LQ er 3 3

3 co t H tr tυ 3 rt α φ 3 LQ P ¹ 3 3 ^{^} rt 3 P- Φ Φ 00 P- tß

3 LQ I- ¹ Ω Φ 3 OJ OJ OJ P- 3 OJ Ϊ φ to rt Φ PJ ι-i φ P- LQ P- 3 rt öd φ Φ tr 3 Φ <; Ω n Φ C rt 3 s; Φ CQ Ω CQ H 3 Φ 3 ^J φ

3 tr LQ P- rt o tr tr O P- P- tr 0 s =; Φ 3 ι-S & C SD P- P-

P- 3 Φ Φ) tu Φ 3 rt P- P- P- öd o rt 0 Φ HP ¹ ω P- 3 3 3 - Φ Φ 3 3 CD φ r C 3? • OJ 3 Φ O CQ φ o 1— 'ι-i 3 0 Φ ω P- LQ P LQ ^• V

3 3 Φ £ P- ^ rt P- tn 3 h- ¹ Φ 3 ι-i P- Φ rt - tr O Φ P- öd

O LQ N 3 α O 3 0 H, Φ φ sQi er rt Φ 3> er Φ φ 3 o P- S er 3 Φ φ 0

Φ Φ Φ 3 P- rt Q SD 3 0J = i P- Φ P- φ c OJ Φ P- H co 0> tr φ 0 ⁾ Φ 3 h- ¹ 3

3 3 P- N φ co rt 3 rt LQ C P- ι-i Φ 3 3 3 CD 3 Ω c o 0 3 Φ r P- t α

Ω Φ CQ Φ Φ 0 ⁾ φ 3 3 0> = LQ Φ • 3 3 P- tr 3 tr 3 er Φ J CQ φ o.

, ; OJ tr P- Φ P- P- Φ? ι-i LQ 3 "Φ Φ Φ 3 co LQ P- i Φ H Φ P-

0 C 3 Ω ι-i rt ih ι-i rr Φ rt 3 ö tr Φ - ^• xi er Φ öd P- P- 3 P- 3 S:

3 l-h Φ tr Φ Φ Φ -0 P- Φ P- ι-i φ LQ P- 3 P- OJ P- rt Φ tr rt 3 ι-S Φ 3 P- φ φ Φ Φ rt ι-i rt

3 3 Φ

to t P ¹ H

LΠ o LΠ o LΠ O LΠ

Oi φ

P

P-

3

^

P-Q

C

P

P ¹ Q φ

N

Φ

P- Q rt

Φ

3

>

3

0

P>

Si o

3

C

3 Q

Φ

O

P-Q

P-

Ω tr o

SD or

C

P.

Ω tr c

3 rt

Φ

H

separates that the metallization 7 is completely omitted from the contact surfaces C1 ... C8 specified by the ISO standard. This creates an uneven surface between the card-shaped body 1 and the metallization 7 of the chip module 3. Although this is not a disadvantage from a technical point of view, it could be undesirable for aesthetic reasons.

FIG. 4 shows a top view of an alternatively designed metallization 7, the contact lugs 8 located in the upper area each having two cutouts 13, so that a web 16 is formed approximately in the middle of each contact lug. The recesses 13 of the adjacent contact tabs are located such that they lie in one axis. This axis runs approximately parallel to the position of the semiconductor chip (not shown) on the opposite main side of the chip carrier. In the exemplary embodiments shown, the webs 16 are made considerably narrower in relation to the width of the contact tabs. This does not necessarily have to be the case, the webs 16 could also be wider and thus the recesses 13 correspondingly narrower. The width of the webs 16 results in the desired bendability at the predetermined bending points according to the invention.

FIG. 4 shows a further variant in the lower half of how the predetermined bending points can be generated in the chip carrier. In this variant, the contact tabs 8 each consist only of the second area 15. The first area 14 formed by the cutouts 13, as shown in the upper half, has completely disappeared from the lower contact tabs. This results in the depression in the surface of the portable data carrier arrangement already described above. However, this variant is only suitable if the contact surfaces are refined by galvanic means. A refinement using electroplating is then no longer possible with the common tools. t to

LΠ o LΠ LΠ

Claims

claims

1. Portable data carrier with a card-shaped body (1) which has a recess (2) for receiving a chip module (3), the chip module (3) having at least one semiconductor chip (4) on a first main side (5) with the card-shaped one Contains body (1) connected chip carrier (18) and a metallization (7) having contact tabs (8) on a second main side (6) of the chip carrier (18), characterized in that the chip carrier (18) has predetermined bending points (9).

2. Portable data carrier according to claim 1, so that the predetermined bending points (9) are located in an area outside the semiconductor chip (4).

3. Portable data carrier according to claim 1 or 2, so that the predetermined bending points (9) are located outside a cover (10) surrounding the semiconductor chip (4).

4. Portable data carrier according to one of claims 1 to 3, d a d u r c h g e k e n n z e i c h n e t that the predetermined bending points (9) are located in an area within the side edges (12) of the recess (2).

5. Portable data carrier according to one of claims 1 to 4, characterized in that the predetermined bending points (9) are formed by at least one recess (13) in each contact lug (8) which the respective contact lug (8) in a first and a second region (14, 15) divided.

6. Portable data carrier according to claim 5, characterized in that the first and the second region (14, 15) are connected to one another by at least one web.

7. Portable data carrier according to claim 5 or 6, so that the recesses (13) run in the direction in which the contact lugs (8) are adjacent to one another.

8. Portable data carrier according to one of claims 5 to 7, d a d u r c h g e k e n n z e i c h n e t that the webs (16) have a substantially smaller width than the at least one recess (13).

9. Portable data carrier according to one of claims 1 to 4, d a d u r c h g e k e n n z e i c h n e t that the metallization (7) ends in an area within the predetermined bending points (9).