DE50015305D1 - Chip card with predetermined bending points - Google Patents

Chip card with predetermined bending points

Info

Publication number
DE50015305D1
DE50015305D1 DE50015305T DE50015305T DE50015305D1 DE 50015305 D1 DE50015305 D1 DE 50015305D1 DE 50015305 T DE50015305 T DE 50015305T DE 50015305 T DE50015305 T DE 50015305T DE 50015305 D1 DE50015305 D1 DE 50015305D1
Authority
DE
Germany
Prior art keywords
chip
bending points
chip card
predetermined bending
card
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE50015305T
Other languages
German (de)
Inventor
Frank Pueschner
Manfred Fries
Annemarie Seidl
Juergen Fischer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
Original Assignee
Infineon Technologies AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=8167756&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE50015305(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Infineon Technologies AG filed Critical Infineon Technologies AG
Application granted granted Critical
Publication of DE50015305D1 publication Critical patent/DE50015305D1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Abstract

A portable data support is disclosed comprising a card-shaped body (1), with a recess (2) for mounting a chip module (3). Said chip module contains at least one semiconductor chip (4) on a first main side (5), a chip support (18) connected to the card-shaped body and a metallisation on a second main side (6) with a tab. The chip support comprises pre-determined bending points (9), which, when bending strains occur, reduce the forces on the semiconductor chip and the wire connections.
DE50015305T 2000-02-02 2000-02-02 Chip card with predetermined bending points Expired - Lifetime DE50015305D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP00102073A EP1122685B1 (en) 2000-02-02 2000-02-02 Chip card with predefined bending locations

Publications (1)

Publication Number Publication Date
DE50015305D1 true DE50015305D1 (en) 2008-09-25

Family

ID=8167756

Family Applications (1)

Application Number Title Priority Date Filing Date
DE50015305T Expired - Lifetime DE50015305D1 (en) 2000-02-02 2000-02-02 Chip card with predetermined bending points

Country Status (9)

Country Link
US (1) US6778407B2 (en)
EP (1) EP1122685B1 (en)
JP (1) JP4284021B2 (en)
CN (1) CN1213386C (en)
AT (1) ATE404941T1 (en)
DE (1) DE50015305D1 (en)
ES (1) ES2312310T3 (en)
RU (1) RU2234130C2 (en)
WO (1) WO2001057793A1 (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10208172B4 (en) * 2002-02-26 2005-07-07 Infineon Technologies Ag Intermediate carrier for insertion into a carrier and carrier with an intermediate carrier
JP4103653B2 (en) * 2003-03-27 2008-06-18 株式会社デンソー IC card
US7556746B2 (en) * 2004-06-03 2009-07-07 Nantero, Inc. Method of making an applicator liquid for electronics fabrication process
US7911699B2 (en) * 2005-12-22 2011-03-22 Guardian Industries Corp. Optical diffuser with UV blocking coating
DE602005013807D1 (en) * 2005-12-30 2009-05-20 Incard Sa IC card with improved printed circuit board
DE602005014498D1 (en) * 2005-12-30 2009-06-25 Incard Sa Module of an IC card
US7850468B2 (en) * 2007-06-28 2010-12-14 Super Talent Electronics, Inc. Lipstick-type USB device
WO2010040645A2 (en) * 2008-10-08 2010-04-15 Osram Gesellschaft mit beschränkter Haftung Circuit carrier
TWM362572U (en) * 2009-04-13 2009-08-01 Phytrex Technology Corp Signal convertor
US8649820B2 (en) 2011-11-07 2014-02-11 Blackberry Limited Universal integrated circuit card apparatus and related methods
US8936199B2 (en) 2012-04-13 2015-01-20 Blackberry Limited UICC apparatus and related methods
USD703208S1 (en) 2012-04-13 2014-04-22 Blackberry Limited UICC apparatus
USD701864S1 (en) 2012-04-23 2014-04-01 Blackberry Limited UICC apparatus
CN104182793B (en) * 2014-08-28 2017-03-08 绵阳市绵州通有限责任公司 A kind of anti-twist mass transit card of self-adjustable
US10410996B2 (en) * 2016-12-02 2019-09-10 Dialog Semiconductor (Uk) Limited Integrated circuit package for assembling various dice in a single IC package
DE102021001814A1 (en) 2021-04-08 2022-10-13 Giesecke+Devrient Mobile Security Gmbh chip module and chip card

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2580416B1 (en) * 1985-04-12 1987-06-05 Radiotechnique Compelec METHOD AND DEVICE FOR MANUFACTURING AN ELECTRONIC IDENTIFICATION CARD
FR2634095A1 (en) * 1988-07-05 1990-01-12 Bull Cp8 Flexible printed circuit, especially for a card having electronic microcircuits, and card incorporating such a circuit
JPH0230598A (en) * 1988-07-20 1990-01-31 Dainippon Printing Co Ltd Ic module and ic card
FR2639763B1 (en) * 1988-11-29 1992-12-24 Schlumberger Ind Sa METHOD FOR PRODUCING AN ELECTRONIC MODULE AND ELECTRONIC MODULE AS OBTAINED BY THIS PROCESS
DE4406704C1 (en) * 1994-03-02 1995-07-20 Angewandte Digital Elektronik Smart card
DE4443767A1 (en) * 1994-12-08 1996-06-13 Giesecke & Devrient Gmbh Electronic module and data carrier with electrical module
DE19710144C2 (en) * 1997-03-13 1999-10-14 Orga Kartensysteme Gmbh Method for producing a chip card and chip card produced according to the method

Also Published As

Publication number Publication date
EP1122685B1 (en) 2008-08-13
ATE404941T1 (en) 2008-08-15
EP1122685A1 (en) 2001-08-08
JP4284021B2 (en) 2009-06-24
ES2312310T3 (en) 2009-03-01
US20030016507A1 (en) 2003-01-23
RU2234130C2 (en) 2004-08-10
US6778407B2 (en) 2004-08-17
WO2001057793A1 (en) 2001-08-09
RU2002123376A (en) 2004-02-20
JP2003521787A (en) 2003-07-15
CN1397048A (en) 2003-02-12
CN1213386C (en) 2005-08-03

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Legal Events

Date Code Title Description
8363 Opposition against the patent