WO2001053868A3 - Herstellungsverfahren für eine optische sendebaugruppe - Google Patents

Herstellungsverfahren für eine optische sendebaugruppe Download PDF

Info

Publication number
WO2001053868A3
WO2001053868A3 PCT/DE2001/000229 DE0100229W WO0153868A3 WO 2001053868 A3 WO2001053868 A3 WO 2001053868A3 DE 0100229 W DE0100229 W DE 0100229W WO 0153868 A3 WO0153868 A3 WO 0153868A3
Authority
WO
WIPO (PCT)
Prior art keywords
transmission assembly
optical transmission
production method
rod
reflective coating
Prior art date
Application number
PCT/DE2001/000229
Other languages
English (en)
French (fr)
Other versions
WO2001053868A2 (de
Inventor
Ralf Dietrich
Mathias Kaempf
Wolfgang Gramann
Martin Weigert
Original Assignee
Infineon Technologies Ag
Ralf Dietrich
Mathias Kaempf
Wolfgang Gramann
Martin Weigert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies Ag, Ralf Dietrich, Mathias Kaempf, Wolfgang Gramann, Martin Weigert filed Critical Infineon Technologies Ag
Priority to EP01909501A priority Critical patent/EP1252541A2/de
Publication of WO2001053868A2 publication Critical patent/WO2001053868A2/de
Publication of WO2001053868A3 publication Critical patent/WO2001053868A3/de
Priority to US10/200,420 priority patent/US6693312B2/en

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Semiconductor Lasers (AREA)
  • Optical Elements Other Than Lenses (AREA)

Abstract

Eine lichtoptische Sende-Baugruppe wird geformt, indem auf einem transparenten Submountwafer (1) ein Glaswafer (2) befe-stigt und anschließend durch gezielte Sägeschnitte eine V-förmige Ausnehmung (20) zwischen optischen Prismenelementen (2a, 2b) erzeugt wird. In die V-förmige Ausnehmung (20) wird ein stabförmiges Element (12) mit einer Reflexionsbeschich-tung (9) eingebracht, so daß von einem Halbleiterlaser (6) emittierte Laserstrahlung (S) an dem reflexionsbeschichteten stabförmigen Element (12) um 90° umgelenkt wird und durch den Submountwafer (1) hindurchtritt.
PCT/DE2001/000229 2000-01-20 2001-01-15 Herstellungsverfahren für eine optische sendebaugruppe WO2001053868A2 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP01909501A EP1252541A2 (de) 2000-01-20 2001-01-15 Herstellungsverfahren für eine optische sendebaugruppe
US10/200,420 US6693312B2 (en) 2000-01-20 2002-07-22 Method for fabricating an optical transmitting subassembly

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10002329A DE10002329A1 (de) 2000-01-20 2000-01-20 Herstellungsverfahren für eine optische Sende-Baugruppe
DE10002329.0 2000-01-20

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US10/200,420 Continuation US6693312B2 (en) 2000-01-20 2002-07-22 Method for fabricating an optical transmitting subassembly

Publications (2)

Publication Number Publication Date
WO2001053868A2 WO2001053868A2 (de) 2001-07-26
WO2001053868A3 true WO2001053868A3 (de) 2002-03-21

Family

ID=7628154

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2001/000229 WO2001053868A2 (de) 2000-01-20 2001-01-15 Herstellungsverfahren für eine optische sendebaugruppe

Country Status (4)

Country Link
US (1) US6693312B2 (de)
EP (1) EP1252541A2 (de)
DE (1) DE10002329A1 (de)
WO (1) WO2001053868A2 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10002329A1 (de) * 2000-01-20 2001-08-02 Infineon Technologies Ag Herstellungsverfahren für eine optische Sende-Baugruppe
EP1568158B1 (de) * 2002-12-04 2006-08-23 Infineon Technologies AG Bidirektionales sende- und empfangsmodul
US7136552B2 (en) * 2003-06-19 2006-11-14 Emcore Corporation TO-packaged optic-fiber receiving interface and method
US7011455B2 (en) * 2003-06-19 2006-03-14 Emcore Corporation Opto-electronic TO-package and method for laser
JP2015530739A (ja) * 2012-08-03 2015-10-15 ホーヤ コーポレイション ユーエスエイＨｏｙａ Ｃｏｒｐｏｒａｔｉｏｎ Ｕｓａ 光電子コンポーネント、光学コンポーネント又はフォトニック・コンポーネント用のサブマウント
US10283018B1 (en) 2018-05-11 2019-05-07 Jack B. Martin Sign manufacturing system

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61121014A (ja) * 1984-11-16 1986-06-09 Nec Corp 光・電気混成集積回路
DE3819811A1 (de) * 1988-06-10 1989-12-14 Bosch Gmbh Robert T-koppler fuer lichtwellenleiter
JPH0513749A (ja) * 1991-06-28 1993-01-22 Nippon Telegr & Teleph Corp <Ntt> 光接続回路
US5650123A (en) * 1994-02-25 1997-07-22 Fci-Fiberchem, Inc. Chip level waveguide sensor
EP0822430A2 (de) * 1996-07-31 1998-02-04 Nippon Telegraph And Telephone Corporation Optischer Ablenker in einem Lichtwellenleiter, Verfahren zu dessen Hestellung,und Sägeblatt zur Verwendung bei diesem Verfahren

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4211899C2 (de) 1992-04-09 1998-07-16 Daimler Benz Aerospace Ag Mikrosystem-Laseranordnung und Mikrosystem-Laser
EP0660467B1 (de) * 1993-12-22 1997-03-19 Siemens Aktiengesellschaft Optoelektronisches Bauelement und Verfahren zu dessen Herstellung
DE19810624A1 (de) * 1998-03-12 1999-09-16 Bosch Gmbh Robert Elektrooptisches Modul
DE10002329A1 (de) * 2000-01-20 2001-08-02 Infineon Technologies Ag Herstellungsverfahren für eine optische Sende-Baugruppe

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61121014A (ja) * 1984-11-16 1986-06-09 Nec Corp 光・電気混成集積回路
DE3819811A1 (de) * 1988-06-10 1989-12-14 Bosch Gmbh Robert T-koppler fuer lichtwellenleiter
JPH0513749A (ja) * 1991-06-28 1993-01-22 Nippon Telegr & Teleph Corp <Ntt> 光接続回路
US5650123A (en) * 1994-02-25 1997-07-22 Fci-Fiberchem, Inc. Chip level waveguide sensor
EP0822430A2 (de) * 1996-07-31 1998-02-04 Nippon Telegraph And Telephone Corporation Optischer Ablenker in einem Lichtwellenleiter, Verfahren zu dessen Hestellung,und Sägeblatt zur Verwendung bei diesem Verfahren

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 010, no. 308 (P - 508) 21 October 1986 (1986-10-21) *
PATENT ABSTRACTS OF JAPAN vol. 017, no. 276 (E - 1372) 27 May 1993 (1993-05-27) *

Also Published As

Publication number Publication date
WO2001053868A2 (de) 2001-07-26
US20030057443A1 (en) 2003-03-27
EP1252541A2 (de) 2002-10-30
DE10002329A1 (de) 2001-08-02
US6693312B2 (en) 2004-02-17

Similar Documents

Publication Publication Date Title
EP1022822A4 (de) Optisches modul und dessen herstellungsverfahren
EP1341019A3 (de) Dreidimensionaler optischer Wellenleiter und dessen Herstellungsverfahren
MXPA05006114A (es) Fibra optica o lente guiaondas.
DE60300891D1 (de) Einrichtung zur ausrichtung faseroptischer verbinder
EP1263098A3 (de) Oberflächenemitierender Laser und sein Herstellungsverfahren, Lichtempfangselement und sein Herstellungsverfahren, und optischesTranceivermodul
WO2003005509A1 (fr) Module laser a semiconducteur, amplificateur de lumiere et procede de production de module laser a semiconducteur
WO2005043697A3 (en) Surface emitting and receiving photonic device with lens
WO2002063349A3 (en) Enhanced waveguide and method
WO2002082148A3 (de) Optisches oder optoelektronisches modul
WO2003052481A3 (en) Precisely aligned lens structure and a method for its fabrication
JP2004191989A (ja) 光源からの出力光を光導波路に結合する光学装置及び方法
WO2004025704A3 (en) Contact lens package and storage case, holder, and system and method of making and using
EP0948104A3 (de) Halbleiterlaser-Modul und Herstellungsverfahren
WO2003015226A3 (en) Method and system for selecting an output of a vcsel array
WO2003023460A3 (en) Glass bonded fiber array and method for the fabrication thereof
WO2001053868A3 (de) Herstellungsverfahren für eine optische sendebaugruppe
EP1199583A3 (de) Glasfaser Dispersions-Kompensator
WO2002052324A3 (en) Process for coupling optical elements to optoelectronic devices
WO2002063728A8 (en) Raman fiber laser
EP1435535A3 (de) Faseroptisches Kopplungssystem und sein Herstellungsverfahren
EP1272878A4 (de) Hochleistungs-superleuchtdiode mit einem gekrümmten mehrfachdurchgangs-wellenleiter
EP1059711A3 (de) Halbleiterlaservorrichtung
WO2002073276A3 (de) Optoelektronisches sendemodul und verfahren zu dessen herstellung
EP0846966A3 (de) Optischer Wellenleiter
WO2003055021A3 (fr) Procede d&#39;amelioration des caracteristiques optiques de composants optoelectroniques multicouches

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): JP US

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
AK Designated states

Kind code of ref document: A3

Designated state(s): JP US

AL Designated countries for regional patents

Kind code of ref document: A3

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR

WWE Wipo information: entry into national phase

Ref document number: 2001909501

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 10200420

Country of ref document: US

WWP Wipo information: published in national office

Ref document number: 2001909501

Country of ref document: EP

NENP Non-entry into the national phase

Ref country code: JP

WWW Wipo information: withdrawn in national office

Ref document number: 2001909501

Country of ref document: EP