WO2001042152A2 - Verfahren und vorrichtung zum durchtrennen von flachen werkstücken aus sprödbrüchigem material - Google Patents
Verfahren und vorrichtung zum durchtrennen von flachen werkstücken aus sprödbrüchigem material Download PDFInfo
- Publication number
- WO2001042152A2 WO2001042152A2 PCT/EP2000/012331 EP0012331W WO0142152A2 WO 2001042152 A2 WO2001042152 A2 WO 2001042152A2 EP 0012331 W EP0012331 W EP 0012331W WO 0142152 A2 WO0142152 A2 WO 0142152A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- focal spot
- line
- dividing line
- spot
- contour
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/04—Cutting or splitting in curves, especially for making spectacle lenses
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T225/00—Severing by tearing or breaking
- Y10T225/10—Methods
- Y10T225/12—With preliminary weakening
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T225/00—Severing by tearing or breaking
- Y10T225/30—Breaking or tearing apparatus
- Y10T225/304—Including means to apply thermal shock to work
Definitions
- the invention relates to a method for severing flat workpieces made of brittle material, in particular glass or ceramic, in which a laser beam with a linear beam profile with a trailing cooling spot is moved along a dividing line with a predetermined contour.
- a preferred application is the cutting of flat glass.
- the invention further relates to a device for cutting through such a workpiece by means of a laser beam in the form of a linear beam profile with a trailing cooling spot.
- Conventional separation processes for flat glass are based on first generating a scratch mark in the glass using a diamond or a cutting wheel, in order to then break the glass along the weak point generated by an external mechanical force (Ritz-Brech method).
- a disadvantage of this method is that particles (splinters) are released from the surface by the scratch mark, which particles can deposit on the glass and can lead to scratches there, for example. So-called mussels on the cut edge can also occur, which lead to an uneven glass edge.
- the microcracks in the cutting edge that occur during scribing lead to reduced mechanical stress, ie to an increased risk of breakage.
- One approach to avoiding splinters as well as mussels and microcracks is to separate glass on the basis of thermally generated mechanical stress.
- a heat source directed at the glass is moved at a fixed speed relative to the glass and so high a thermomechanical stress is generated that the glass forms cracks.
- the necessary property of the heat source to be able to position the thermal energy locally ie with an accuracy better than a millimeter, which corresponds to the typical cutting accuracy, is satisfied by infrared radiators, special gas burners and in particular lasers. Lasers have proven themselves and become established due to their good focusability, good controllability of the power as well as the possibility of beam shaping and thus the intensity distribution on glass. It is possible to first scratch the glass with the laser beam in order to subsequently break it mechanically, as well as to cut through the glass directly with the beam in connection with a mechanically applied tear. Both the "crack breaking" and the "cutting" are intended to be encompassed by the terms “severing" and "severing”.
- the aforementioned laser beam separation processes differ in particular in the configuration of the focal spot.
- the method according to DE 693 04 194 T 2 uses a laser beam with an elliptical cross-section with a trailing cooling spot.
- EP 0 872 303 A 2 already cited, describes a laser beam separation method that uses a focal spot with a U-shaped or V-shaped contour provides that opens in the separation direction. Contours modified from this, such as X-shaped focal spots, are also described. In both cases, the laser beam focal spots have a two-dimensional structure that has proven itself well when performing straight cuts. When performing free-form cuts, a curved, two-dimensional focal spot that would be adapted to the contour of the dividing line would have to be generated and the contour, including the subsequent cooling, would have to be traced. This would in particular require a coupling of the scanner device producing the respective two-dimensional focal spot and the cooling spot device to a path control, the implementation of which is very problematic on the one hand due to the large amounts of data to be exchanged and the required cutting speeds.
- a laser beam separation method is known in which the laser beam is shaped so that its beam cross-section on the surface of the workpiece has a linear shape, in which the ratio of length and width of the incident beam cross-section by means of a Aperture in the laser beam path is adjustable.
- This method is also very limited in its usability. No free-form cuts can be made, and, since the cooling only takes place after the separation line has been fully heated, e.g. by blowing with cold compressed air, the known method is also practically only suitable for the described cutting of the press rim of hollow glasses, in which the hollow glass rotates in the fixed laser beam, the periphery first being heated by the laser beam and then by inflation of the gas is cooled to support it.
- the invention has for its object to carry out the method described at the outset or to design the associated device in such a way that free-form cuts can be carried out in a relatively simple manner using the laser beam separation method.
- the problem is solved procedurally in that a freeform cut is made on the workpiece line-shaped focal spot with significant increases in intensity is produced at both ends, in which at least 60% of the beam power is concentrated at the ends of the line-shaped focal spot, and which is moved along the dividing line in such a way that even when the dividing line is curved, both ends lie on the dividing line and its length is set depending on the curvature of the contour of the dividing line.
- the method according to one embodiment of the invention is carried out in such a way that the laser power is set depending on the length of the linear focal spot.
- the method can advantageously be carried out in a relatively simple manner if the linear focal spot is generated by scanning the laser beam.
- the object is achieved in that an optical arrangement for generating a linear focal spot with significant increases in intensity at both ends, in which at least 60% of the beam power is concentrated, is provided, which is also controlled via a profile control a numerical path control is coupled that both ends of the linear focal spot are positioned on the dividing line of the free-form cut even with curved dividing lines and the length of the focal spot is set depending on the curvature of the contour of the dividing line.
- the optical arrangement can be carried out relatively simply and conventional path controls can also be used for moving the ends of the focal spot on the dividing line and for adapting the length of the focal spot to the contour of the dividing line.
- Optimal separation is ensured if, according to one embodiment of the invention, further axes coupled to the path control are provided for positioning the cooling spot in relation to the linear focal spot and the workpiece.
- the device can be constructed in a particularly simple manner if the optical arrangement has a scanner with an oscillating mirror. To change the length of the line-shaped focal spot, it is then only necessary to change the amplitude of the oscillating mirror, so that the profile control and the path control can be designed relatively simply.
- FIG. 1 is a schematic block diagram representation of the basic structure of the contour control of the device according to the invention.
- Fig. 2 is a schematic, diagrammatic representation of the shape of the focal spot and the cooling spot and the associated axes of motion that are to be processed by the contour control.
- FIG. 1 and 2 illustrate the principle according to the invention of severing a flat workpiece made of brittle material, in particular flat glass, by means of the laser beam separation method
- FIG. 1 showing the basic structure of the control of the motion sequences along a predetermined contour
- FIG. 2 shows the focal spot geometry of the laser beam with the trailing cooling spot and the assignment of the axes of motion to the contour control according to FIG. 1.
- the separation principle according to the invention is based on a linear focal spot 1, at the two ends 1 a and 1 b of which the intensity maxima are in the corresponding laser beam profile.
- These increases in intensity at the end of the line contain, for example, approximately 80% of the total thermal energy of the laser beam which is used to generate the thermomechanical voltage field, i.e. only approx. 20% of the energy is located next to the contour to be cut, the dividing line 2.
- a known laser beam scanner e.g. 5 of EP 0 872 303 A 2 cited at the outset, but one of the two deflecting mirrors can be omitted, since only one axis has to be scanned. A deflection axis is sufficient for the generation of a line, which advantageously indicates a reduced technical effort.
- the laser beam By scanning the laser beam with oscillating mirrors or polygon wheels with a sinusoidal speed curve, the laser beam remains longer on the workpiece to be separated in the reversal points of the scanner movement than in the area in between, i.e. when the line-shaped focal spot 1 is generated by scanning, there is typically an increase in intensity at the end points of line 1.
- the oscillation width of the oscillating mirrors determining the line length S in FIG. 1.
- the scanner is controlled by a profile controller 3 in FIG. 1.
- This controller receives from an NC control the setpoint for the length S of the focal spot 1 required at the respective point of the dividing line 2.
- the profile control now controls an oscillator motor 3 a of the oscillating mirror in such a way that it carries out the oscillation corresponding to the required length S of the profile ,
- the profile controller 3 generates an analog voltage oscillation as a setpoint, which is converted directly by the oscillator motor into an oscillating movement.
- the setpoint which is given by the NC controller 4 to the profile controller 3, is either passed in the form of an analog constant voltage signal, for example 0-10 N, the length S being proportional to the magnitude of the voltage, or in the form of a digital value with a resolution of at least 8 bit.
- the shown actual value feedback of the measuring system of the oscillator motor 3 a can be omitted if a calibration curve is stored in the profile controller 3 or the ⁇ C controller 4 for the oscillator motor.
- the ⁇ C controller 4 controls the ⁇ C axes 8 (X, Y and C) and the profile length S via the setpoint specification to the profile controller 3 according to a known ⁇ C program 5 and corresponding interpolation algorithms stored in the ⁇ C control.
- the ⁇ C control is able to determine the end points 1 a and 1 b of the focal line 1 so that they follow the dividing line with a maximum deviation of typically less than 0.2 mm.
- the tracing of the dividing line is all the more precise the faster the ⁇ C control is able to generate new setpoints for the axes 8 and the profile control 3 and the faster these can be implemented by the axes 8 and the oscillator motor 3 a. According to the current state of control technology, typical values for the application will be approx. 3 ms.
- the width of the focal line 1 is predetermined by the diameter of the focused laser beam on the workpiece surface.
- the diameter on the workpiece surface is typically between 0.3 mm and several millimeters. Optical elements are used to focus the laser beam.
- the aim is to make the intensity distribution along the line between the end points 1 a and 1 b as uniform as possible without local intensity peaks, and to keep the maximum intensity in the end points as low as possible. In this way, most of the laser energy can be coupled into the workpiece without the glass softening temperature being exceeded.
- Long focal length focusing elements from approx. 300 mm, top hat lenses, axicons or lasers with a ring mode or multimode can be used for this purpose.
- the width of the line depends on the required laser power, cooling, material type, material thickness and feed rate.
- cooling in the form of a cooling spot 6 is carried out in a known manner at a defined distance on the contour 2 to be cut behind the laser profile, i.e. the focal line 1, tracked.
- This cooling spot 6 is generated, for example, by blowing cold air or gas / liquid mixtures through a nozzle.
- the advantage of cutting is that no subsequent breaking is necessary, thus saving one manufacturing step.
- the advantage of scribing is that the material was cut almost splinter-free at much higher speeds (up to 1000 mm / s), even after breaking, and a significantly higher edge strength is achieved due to the lack of micro-cracks and shells.
- cooling i.e. the cooling spot 6 can be adjusted very precisely in its position relative to the focal line 1.
- the axes A and B also interpolate with the axes X, Y, C and the axis specified by the oscillator motor 3 a.
- the task of axes A and B is to keep the distance between cooling spot 6 and starting point 1b of focal line 1 constant.
- the profile controller 3 can be designed so that the lowest voltage value of the oscillating voltage for the oscillator of the oscillating mirror always remains constant. In this way, point 1 b is stationary. Axes 7 A and B therefore only have to perform short strokes.
- Axes in the sense of the invention are not only to be understood as the geometrical axes, but also the associated movement elements which specify the axes, such as actuators and the like.
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Toxicology (AREA)
- Thermal Sciences (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Laser Beam Processing (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AT00981346T ATE245611T1 (de) | 1999-12-11 | 2000-12-07 | Verfahren und vorrichtung zum durchtrennen von flachen werkstücken aus sprödbrüchigem material |
US10/130,522 US6635848B2 (en) | 1999-12-11 | 2000-12-07 | Method and device for cutting flat work pieces of a brittle material |
DE50003042T DE50003042D1 (de) | 1999-12-11 | 2000-12-07 | Verfahren und vorrichtung zum durchtrennen von flachen werkstücken aus sprödbrüchigem material |
JP2001543456A JP3687070B2 (ja) | 1999-12-11 | 2000-12-07 | 脆い材料から作られた平らな加工物を切断するための方法及び装置 |
EP00981346A EP1242322B1 (de) | 1999-12-11 | 2000-12-07 | Verfahren und vorrichtung zum durchtrennen von flachen werkstücken aus sprödbrüchigem material |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19959921A DE19959921C1 (de) | 1999-12-11 | 1999-12-11 | Verfahren und Vorrichtung zum Durchtrennen von flachen Werkstücken aus sprödbrüchigem Material |
DE19959921.1 | 1999-12-11 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2001042152A2 true WO2001042152A2 (de) | 2001-06-14 |
WO2001042152A3 WO2001042152A3 (de) | 2001-11-01 |
Family
ID=7932385
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2000/012331 WO2001042152A2 (de) | 1999-12-11 | 2000-12-07 | Verfahren und vorrichtung zum durchtrennen von flachen werkstücken aus sprödbrüchigem material |
Country Status (7)
Country | Link |
---|---|
US (1) | US6635848B2 (de) |
EP (1) | EP1242322B1 (de) |
JP (1) | JP3687070B2 (de) |
AT (1) | ATE245611T1 (de) |
DE (2) | DE19959921C1 (de) |
ES (1) | ES2203535T3 (de) |
WO (1) | WO2001042152A2 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6919531B2 (en) | 2002-03-25 | 2005-07-19 | Agilent Technologies, Inc. | Methods for producing glass substrates for use in biopolymeric microarrays |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19963939B4 (de) * | 1999-12-31 | 2004-11-04 | Schott Spezialglas Gmbh | Verfahren und Vorrichtung zum Durchtrennen von flachen Werkstücken aus sprödbrüchigem Material |
DE10016628A1 (de) | 2000-04-04 | 2001-10-18 | Schott Glas | Verfahren zum Herstellen von kleinen Dünnglasscheiben und größere Dünnglasscheibe als Halbfabrikat für dieses Herstellen |
WO2003076150A1 (fr) | 2002-03-12 | 2003-09-18 | Mitsuboshi Diamond Industrial Co., Ltd. | Procede et systeme d'usinage d'un materiau fragile |
DE102004012402B3 (de) * | 2004-03-13 | 2005-08-25 | Schott Ag | Verfahren zum Freiformschneiden von gewölbten Substraten aus sprödbrüchigem Material |
US8378258B2 (en) * | 2004-08-02 | 2013-02-19 | Ipg Microsystems Llc | System and method for laser machining |
US8350187B2 (en) * | 2009-03-28 | 2013-01-08 | Electro Scientific Industries, Inc. | Method and apparatus for laser machining |
US8171753B2 (en) * | 2009-11-18 | 2012-05-08 | Corning Incorporated | Method for cutting a brittle material |
KR102421381B1 (ko) * | 2014-02-20 | 2022-07-18 | 코닝 인코포레이티드 | 얇은 가요성 유리에 반경을 절단하기 위한 방법 및 장치 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1993020015A1 (en) * | 1992-04-02 | 1993-10-14 | Fonon Technology Limited | Splitting of non-metallic materials |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5120926A (en) * | 1990-11-26 | 1992-06-09 | General Motors Corporation | Method and apparatus for high speed laser cutting |
DE4305107C2 (de) * | 1993-02-19 | 1995-02-23 | Fraunhofer Ges Forschung | Verfahren und Vorrichtung zum Schneiden eines spröden Körpers mit Laserstrahlung |
US5776220A (en) * | 1994-09-19 | 1998-07-07 | Corning Incorporated | Method and apparatus for breaking brittle materials |
MY120533A (en) * | 1997-04-14 | 2005-11-30 | Schott Ag | Method and apparatus for cutting through a flat workpiece made of brittle material, especially glass. |
KR100283415B1 (ko) * | 1998-07-29 | 2001-06-01 | 구자홍 | 레이저를이용한투명매질의가공방법및장치 |
DE19915000C2 (de) * | 1999-04-01 | 2002-05-08 | Microlas Lasersystem Gmbh | Vorrichtung und Verfahren zum Steuern der Intensitätsverteilung eines Laserstrahls |
-
1999
- 1999-12-11 DE DE19959921A patent/DE19959921C1/de not_active Expired - Fee Related
-
2000
- 2000-12-07 DE DE50003042T patent/DE50003042D1/de not_active Expired - Lifetime
- 2000-12-07 EP EP00981346A patent/EP1242322B1/de not_active Expired - Lifetime
- 2000-12-07 US US10/130,522 patent/US6635848B2/en not_active Expired - Lifetime
- 2000-12-07 ES ES00981346T patent/ES2203535T3/es not_active Expired - Lifetime
- 2000-12-07 AT AT00981346T patent/ATE245611T1/de active
- 2000-12-07 JP JP2001543456A patent/JP3687070B2/ja not_active Expired - Fee Related
- 2000-12-07 WO PCT/EP2000/012331 patent/WO2001042152A2/de active Search and Examination
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1993020015A1 (en) * | 1992-04-02 | 1993-10-14 | Fonon Technology Limited | Splitting of non-metallic materials |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6919531B2 (en) | 2002-03-25 | 2005-07-19 | Agilent Technologies, Inc. | Methods for producing glass substrates for use in biopolymeric microarrays |
US7026573B2 (en) | 2002-03-25 | 2006-04-11 | Agilent Technologies, Inc. | Methods for producing glass substrates for use in biopolymeric microarrays |
Also Published As
Publication number | Publication date |
---|---|
DE50003042D1 (de) | 2003-08-28 |
EP1242322B1 (de) | 2003-07-23 |
JP3687070B2 (ja) | 2005-08-24 |
ES2203535T3 (es) | 2004-04-16 |
DE19959921C1 (de) | 2001-10-18 |
WO2001042152A3 (de) | 2001-11-01 |
ATE245611T1 (de) | 2003-08-15 |
US6635848B2 (en) | 2003-10-21 |
EP1242322A2 (de) | 2002-09-25 |
US20020170895A1 (en) | 2002-11-21 |
JP2003516236A (ja) | 2003-05-13 |
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