WO2001040884A3 - Überwachungssystem für eine transportvorrichtung von flachteilen, insbesondere wafer-scheiben - Google Patents

Überwachungssystem für eine transportvorrichtung von flachteilen, insbesondere wafer-scheiben Download PDF

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Publication number
WO2001040884A3
WO2001040884A3 PCT/EP2000/012103 EP0012103W WO0140884A3 WO 2001040884 A3 WO2001040884 A3 WO 2001040884A3 EP 0012103 W EP0012103 W EP 0012103W WO 0140884 A3 WO0140884 A3 WO 0140884A3
Authority
WO
WIPO (PCT)
Prior art keywords
light
carriage
monitoring system
aperture
conveying device
Prior art date
Application number
PCT/EP2000/012103
Other languages
English (en)
French (fr)
Other versions
WO2001040884A9 (de
WO2001040884A2 (de
Inventor
Hans Leitner
Xaver Kollmer
Guenther Schindler
Ernst Georg Frisch
Original Assignee
Logitex Reinstmedientechnik Gm
Hans Leitner
Xaver Kollmer
Guenther Schindler
Ernst Georg Frisch
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Logitex Reinstmedientechnik Gm, Hans Leitner, Xaver Kollmer, Guenther Schindler, Ernst Georg Frisch filed Critical Logitex Reinstmedientechnik Gm
Priority to US10/149,046 priority Critical patent/US6681148B2/en
Priority to EP00993283A priority patent/EP1234323A2/de
Publication of WO2001040884A2 publication Critical patent/WO2001040884A2/de
Publication of WO2001040884A3 publication Critical patent/WO2001040884A3/de
Publication of WO2001040884A9 publication Critical patent/WO2001040884A9/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/404—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by control arrangements for compensation, e.g. for backlash, overshoot, tool offset, tool wear, temperature, machine construction errors, load, inertia
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/37—Measurements
    • G05B2219/37555—Camera detects orientation, position workpiece, points of workpiece
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/37—Measurements
    • G05B2219/37571—Camera detecting reflected light from laser
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Human Computer Interaction (AREA)
  • Automation & Control Theory (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Controlling Sheets Or Webs (AREA)

Abstract

Die Erfindung betrifft ein Überwachungssystem für eine Transportvorrichtung von Flachteilen, insbesondere Wafer-Scheiben, welche Transportvorrichtung einen längs einer vorbestimmten Bahn neben ein an einer vorbestimmten Entnahmestelle befindliches Flachteil (10) bewegbaren Schlitten (28) mit einer Aufnahmeeinrichtung zur Aufnahme des Flachteils (10) aufweist, welches Überwachungssystem eine Lichtquelle (50) mit einem Lichtaustrittsfenster und einen Lichtempfänger (52) mit einem Lichteintrittsfenster enthält, wobei das Lichtaustrittsfenster und das Lichteintrittsfenster derart positioniert sind, dass ein vom Lichtaustrittsfenster zum Lichteintrittsfenster gerichtetes Lichtbündel (60) von dem Schlitten (28) während seiner Bewegung durch das Lichtbündel teilweise abgedeckt wird, und eine an den Lichtempfänger angeschlossene Auswerteeinrichtung, die ein aus seiner Bewegung des Schlittens längs einer Soll-Bahn hergeleitetes Sollsignal mit einem aus einer Ist-Bewegung des Schlittens hergeleiteten Istsignal vergleicht und eine Abweichung anzeigt.
PCT/EP2000/012103 1999-12-02 2000-12-01 Überwachungssystem für eine transportvorrichtung von flachteilen, insbesondere wafer-scheiben WO2001040884A2 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US10/149,046 US6681148B2 (en) 1999-12-02 2000-12-01 Monitoring system for a conveying device for flat articles, especially wafers
EP00993283A EP1234323A2 (de) 1999-12-02 2000-12-01 Überwachungssystem für eine transportvorrichtung von flachteilen, insbesondere wafer-scheiben

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19958082.0 1999-12-02
DE19958082A DE19958082A1 (de) 1999-12-02 1999-12-02 Überwachungssystem für eine Transportvorrichtung von Flachteilen, insbesondere Wafer-Scheiben

Publications (3)

Publication Number Publication Date
WO2001040884A2 WO2001040884A2 (de) 2001-06-07
WO2001040884A3 true WO2001040884A3 (de) 2002-02-14
WO2001040884A9 WO2001040884A9 (de) 2002-09-19

Family

ID=7931162

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2000/012103 WO2001040884A2 (de) 1999-12-02 2000-12-01 Überwachungssystem für eine transportvorrichtung von flachteilen, insbesondere wafer-scheiben

Country Status (4)

Country Link
US (1) US6681148B2 (de)
EP (1) EP1234323A2 (de)
DE (1) DE19958082A1 (de)
WO (1) WO2001040884A2 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7489779B2 (en) * 2001-03-22 2009-02-10 Qstholdings, Llc Hardware implementation of the secure hash standard
KR100568867B1 (ko) * 2004-03-18 2006-04-10 삼성전자주식회사 웨이퍼 좌표감지장치 및 그 웨이퍼 좌표감지 기능을 갖는반도체 제조설비

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4803373A (en) * 1986-01-29 1989-02-07 Nikon Corporation Conveyor arm apparatus with gap detection
JPH1041367A (ja) * 1996-07-24 1998-02-13 Ushio Inc 物体検出方法およびウエハ搬送アームの検出装置
JPH11150078A (ja) * 1997-11-17 1999-06-02 Ulvac Corp 縦型熱処理炉
JPH11179692A (ja) * 1997-12-16 1999-07-06 Shin Meiwa Ind Co Ltd 産業用ロボットのハンド異常検出装置及びハンド異常検出方法
JPH11254359A (ja) * 1998-03-12 1999-09-21 Toyota Autom Loom Works Ltd 部材搬送システム

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5605428A (en) * 1993-03-05 1997-02-25 Jenoptik Gmbh Device for indexing magazine compartments and wafer-shaped objects in the compartments
DE4310149C2 (de) * 1993-03-29 1996-05-02 Jenoptik Jena Gmbh Einrichtung zur Handhabung von scheibenförmigen Objekten in einer Handhabungsebene eines lokalen Reinraumes
DE4326309C1 (de) * 1993-08-05 1994-09-15 Jenoptik Jena Gmbh Vorrichtung zum Transport von Wafermagazinen
US5466945A (en) * 1994-03-23 1995-11-14 Eaton Corporation Apparatus for detecting proper positioning of objects in a holder
US5604443A (en) * 1994-05-23 1997-02-18 Tokyo Electron Limited Probe test apparatus
KR100315007B1 (ko) * 1995-11-22 2002-02-28 이시다 아키라 카세트내의 기판 검출 및 반송장치와 그 방법
US6516244B1 (en) * 2000-08-25 2003-02-04 Wafermasters, Inc. Wafer alignment system and method
US6430468B1 (en) * 2000-11-17 2002-08-06 Applied Materials, Inc. Method and apparatus for accurate placement of semiconductor wafers onto respective platforms within a single reaction chamber

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4803373A (en) * 1986-01-29 1989-02-07 Nikon Corporation Conveyor arm apparatus with gap detection
JPH1041367A (ja) * 1996-07-24 1998-02-13 Ushio Inc 物体検出方法およびウエハ搬送アームの検出装置
JPH11150078A (ja) * 1997-11-17 1999-06-02 Ulvac Corp 縦型熱処理炉
JPH11179692A (ja) * 1997-12-16 1999-07-06 Shin Meiwa Ind Co Ltd 産業用ロボットのハンド異常検出装置及びハンド異常検出方法
JPH11254359A (ja) * 1998-03-12 1999-09-21 Toyota Autom Loom Works Ltd 部材搬送システム

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 06 30 April 1998 (1998-04-30) *
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 11 30 September 1999 (1999-09-30) *
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 12 29 October 1999 (1999-10-29) *
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 14 22 December 1999 (1999-12-22) *

Also Published As

Publication number Publication date
DE19958082A1 (de) 2001-06-07
EP1234323A2 (de) 2002-08-28
WO2001040884A9 (de) 2002-09-19
WO2001040884A2 (de) 2001-06-07
US20020182052A1 (en) 2002-12-05
US6681148B2 (en) 2004-01-20

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