WO2001013692A1 - Passive thermal transfer of subsea electronics - Google Patents

Passive thermal transfer of subsea electronics Download PDF

Info

Publication number
WO2001013692A1
WO2001013692A1 PCT/NO1999/000255 NO9900255W WO0113692A1 WO 2001013692 A1 WO2001013692 A1 WO 2001013692A1 NO 9900255 W NO9900255 W NO 9900255W WO 0113692 A1 WO0113692 A1 WO 0113692A1
Authority
WO
WIPO (PCT)
Prior art keywords
vessel shell
heat conducting
conducting element
vessel
pressure vessel
Prior art date
Application number
PCT/NO1999/000255
Other languages
French (fr)
Inventor
Olav Bakka
Michael Hilditch
Geir Inge Olsen
Original Assignee
Kværner Oilfield Products As
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kværner Oilfield Products As filed Critical Kværner Oilfield Products As
Priority to PCT/NO1999/000255 priority Critical patent/WO2001013692A1/en
Priority to AU56587/99A priority patent/AU5658799A/en
Publication of WO2001013692A1 publication Critical patent/WO2001013692A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1434—Housings for electronics exposed to high gravitational force; Cylindrical housings

Definitions

  • the present invention relates to a pressure vessel for passive conduction of heat generated by current-carrying components inside the vessel shell.
  • Cooling of electronics is normally achieved by either radiation/natural convection from a heat source to the surrounding ambient air, by utilising a fan for creating forced convection to the air or by transferring the generated heat by forced convection to a liquid that is pumped in a closed loop and dissipated in a heat exchanger.
  • any components employed in addition to the primary components such as an auxiliary cooling system, will inherently cause failure at some point in time.
  • servicing will be required to maintain the reliability of operation.
  • the system will also require space and thus adding weight and cost to the subsea package.
  • the subsea environment provides a natural heat sink since the temperature is low at water depths relevant for oil and gas production.
  • the water will typically be about 4 degree Celsius and is constant.
  • a passive cooling system as an integrated part of a subsea power distribution system, thus avoiding the added complexity associated with a utility cooling system.
  • a pressure vessel according to the introductory passage above, which is distinguished in that the current-carrying components are mounted to at least one heat conducting element, which at least one heat conducting element is placed circumferentially against the inner wall of the vessel shell and each heat conducting element has an outwardly facing surface which is complementary to the internal surface of the vessel shell and the outwardly facing surface is in direct conducting engagement with the internal surface of the vessel shell, as passive conduction of heat only occur.
  • the at least one heat conducting element can be expanded to the internal surface of the vessel shell without further fixing means. It is kept in place by means of the expanding effect of the element or elements only.
  • the at least one heat conducting element arranged with a gap in the longitudinal direction thereof and expanding means are provided in the gap and the expanding means are expanding the at least one heat conducting element outwardly and thus against the internal surface of the vessel shell.
  • the at least one heat conducting element can be manufactured of any suitable thermal conductive material such as carbon-composite or aluminum.
  • the vessel shell can be manufactured of any suitable thermal conductive material like the following materials; carbon-composite, high-grade steel or titan.
  • a gel, paste or similar can preferably be provided at the interface between the outwardly facing surface of the at least one heat conducting element and the internal surface of the vessel shell.
  • the vessel shell can have a cylindrical central part and a hemispherical part in each end.
  • the vessel shell is, however, not limited to this external design, and can per se be oval, truncated cylindrical, parallelepipedic or of any suitable design.
  • the vessel shell can be bi divided and each part comprises a flange having means for securing the parts together.
  • the outer wall of the vessel shell can on at least portions of the surface thereof be provided with cooling promoting means, like cooling fins. Cooling fins will increase the manufacturing costs and will only be used when moore cooling is required.
  • Fig.l shows a pressure vessel according to the invention with the one half of the vessel shell lifted off
  • Fig.2 shows the assembly of the heat conducting elements and electronics/elctrical power components
  • Fig.3 shows a transversal cross section of the pressure vessel.
  • Fig.l shows one embodiment of the pressure vessel 1 including a vessel shell 3 and internal heat conducting elements 2 to which the electronics and/or power components 5 are mounted.
  • the illustrated vessel shell 3 has a design which comprises a cylindrical central section and a hemispherical section in each end.
  • the vessel shell 3 is bidivided and each section has a circumscribing end flange 9 in the end opposite to the hemispherical section.
  • the flanges 9 are brought together and kept in sealing relation with each other by means of sealing means and fixing means like bolts or clamps around the flanges 9.
  • the design of the vessel shell 3 is not material and all suitable designs are possible, like truncated cylindrical, oval, parallelepipedic, etc.
  • the outer surface of the vessel shell 3 may be provided with cooling promoting means, like cooling fins or similar means increasing the external surface area of the vessel 1.
  • This embodiment includes six heat conducting elements 2 extending in parallell in the longitudinal direction of the vessel shell 3.
  • the elements 2 are placed circumferentially against the internal wall 4 of the vessel shell 3 and are spaced apart with a small longitudinal gap 7 therebetween.
  • a number of springs 8 are mounted in the gap 7 between the heat conducting elements 2 thus expanding the heat conducting elements 2 outwardly against the internal wall 4 of the vessel shell 3. This expanding action is sufficient to keep the heat conducting elements 2 in place against the internal wall 4 of the vessel shell 3 without further fixing means. This makes installation and replacement of internal components 5 easy and convenient.
  • fixing means may be provided to securely fix the heat conducting elements 2 to the internal wall 4 of the vessel shell 3.
  • abutment means can be provided in the internal wall 4 of the vessel shell 3 to keep the heat conducting elements 2 in place in the longitudinal direction of the vessel 1.
  • the vessel 1 is designed to withstand the surrounding water pressure. High pressure penetration equipment allows for power supply and communication with the equipment within the vessel 1.
  • the internal environment of the vessel 1 consists of an inert atmosphere maintained at low pressure.
  • Fig. 2 shows the electric components 5 generating heat assembled to an array of six cylindrical elements 2 or segments 2 made of a suitable conductive material, e.g. carbon-fibre, aluminum, or any suitable material able to provide substantial thermal transfer.
  • a suitable conductive material e.g. carbon-fibre, aluminum, or any suitable material able to provide substantial thermal transfer.
  • the number of segments 2 can be from one and up. If only one is used, this need to have one longitudinal gap 7 in order to obtain the expanding action.
  • the one or more segments 2 may or may not be arranged to fully circumscribe the cylindrical part of the vessel shell 3.
  • Fig.3 shows the intimate contact between the outwardly facing surface 6 of the segments 2 and the internal wall 4 of the vessel shell 3.
  • the outer surface 6 of the segments 2 are arcuated to be coplementary to the curvature of the internal wall 4 of the vessel shell 3. It is material that the contact of the outer surface 6 of the segments 2 against the internal wall 4 of the vessel shell 3 is as extensive as possible.
  • a gel, paste or similar having high heat conductivity may be coated on the outer surface 6 of the segments 2 or the internal wall 4 surface of the vessel shell 3. This improves the heat conduction and eliminates possible void spaces.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Pressure Vessels And Lids Thereof (AREA)

Abstract

A pressure vessel (1) for passive conduction of heat generated by current-carrying components (5) inside the vessel shell (3) is disclosed. The current-carrying components (5) are mounted to at least one heat conducting element (2), which at least one heat conducting element (2) is placed circumferentially against the inner wall (4) of the vessel shell (3). Each heat conducting element (2) has an outwardly facing surface (6) which is complementary to the internal wall surface of the vessel shell (3) and the outwardly facing surface (6) is in direct conducting engagement with the internal wall surface of the vessel shell (3), as passive conduction of heat only occurs.

Description

PASSIVE THERMAL TRANSFER OF SUBSEAELECTRONICS
The present invention relates to a pressure vessel for passive conduction of heat generated by current-carrying components inside the vessel shell.
Electronics and electrical power components will always be associated with generation of heat. The heat generated will be detrimental to the performance and reliability of operation of the equipment if the heat is not dissipated by method of cooling either by natural or forced thermal transfer.
Cooling of electronics is normally achieved by either radiation/natural convection from a heat source to the surrounding ambient air, by utilising a fan for creating forced convection to the air or by transferring the generated heat by forced convection to a liquid that is pumped in a closed loop and dissipated in a heat exchanger.
Power distribution and control technology of oil and gas processing is currently in the process of being adapted to the subsea environment. This application requires the highest possible system reliability and availability due to the cost associated with retrieval, maintenance and production downtime.
Any components employed in addition to the primary components such as an auxiliary cooling system, will inherently cause failure at some point in time. To reduce the risk for failure, servicing will be required to maintain the reliability of operation. The system will also require space and thus adding weight and cost to the subsea package.
The subsea environment provides a natural heat sink since the temperature is low at water depths relevant for oil and gas production. The water will typically be about 4 degree Celsius and is constant.
Application of power distribution and control will require all the system components shielded from the seawater environment.
From US patent 4.184.539 is an electronic card mount and heat transfer assembly for underwater vehicles known. A plurality of electronic circuit cards are edge mounted in heat transfer relation to a pair of spaced parallel card mounting plates extending from a bulkhead of an underwater instrumentation vehicle hull having a tubular cover section adapted to be moved into and out of covering relation to the cards and mounting plates. Spring biased slip plates provide heat transfer paths from the mounting plates to the cover section for dissipation to ambient water.
According to the invention, it is found feasible to have a passive cooling system as an integrated part of a subsea power distribution system, thus avoiding the added complexity associated with a utility cooling system.
This is achieved with a pressure vessel according to the introductory passage above, which is distinguished in that the current-carrying components are mounted to at least one heat conducting element, which at least one heat conducting element is placed circumferentially against the inner wall of the vessel shell and each heat conducting element has an outwardly facing surface which is complementary to the internal surface of the vessel shell and the outwardly facing surface is in direct conducting engagement with the internal surface of the vessel shell, as passive conduction of heat only occur.
For easy removal and replacement, the at least one heat conducting element can be expanded to the internal surface of the vessel shell without further fixing means. It is kept in place by means of the expanding effect of the element or elements only.
In one preferred embodiment is the at least one heat conducting element arranged with a gap in the longitudinal direction thereof and expanding means are provided in the gap and the expanding means are expanding the at least one heat conducting element outwardly and thus against the internal surface of the vessel shell.
In order to achieve best possible heat conduction, the at least one heat conducting element can be manufactured of any suitable thermal conductive material such as carbon-composite or aluminum.
For best possible performance, also the vessel shell can be manufactured of any suitable thermal conductive material like the following materials; carbon-composite, high-grade steel or titan. To avoid possible air pockets or areas having little or absent contact, a gel, paste or similar can preferably be provided at the interface between the outwardly facing surface of the at least one heat conducting element and the internal surface of the vessel shell.
In one embodiment the vessel shell can have a cylindrical central part and a hemispherical part in each end. The vessel shell is, however, not limited to this external design, and can per se be oval, truncated cylindrical, parallelepipedic or of any suitable design.
The vessel shell can be bi divided and each part comprises a flange having means for securing the parts together.
In one embodiment the outer wall of the vessel shell can on at least portions of the surface thereof be provided with cooling promoting means, like cooling fins. Cooling fins will increase the manufacturing costs and will only be used when moore cooling is required.
Other and further objects, features and advantages with the present invention will appear from the following description of a preferred embodiment of the invention, which is given for the purpose of description, without thus being limiting, and given together with the appended drawings, where:
Fig.l shows a pressure vessel according to the invention with the one half of the vessel shell lifted off,
Fig.2 shows the assembly of the heat conducting elements and electronics/elctrical power components, and
Fig.3 shows a transversal cross section of the pressure vessel.
Fig.l shows one embodiment of the pressure vessel 1 including a vessel shell 3 and internal heat conducting elements 2 to which the electronics and/or power components 5 are mounted. The illustrated vessel shell 3 has a design which comprises a cylindrical central section and a hemispherical section in each end. The vessel shell 3 is bidivided and each section has a circumscribing end flange 9 in the end opposite to the hemispherical section. During assembly of the vessel 1, the flanges 9 are brought together and kept in sealing relation with each other by means of sealing means and fixing means like bolts or clamps around the flanges 9.
It is to be understood, however, that the design of the vessel shell 3 is not material and all suitable designs are possible, like truncated cylindrical, oval, parallelepipedic, etc. In addition, the outer surface of the vessel shell 3 may be provided with cooling promoting means, like cooling fins or similar means increasing the external surface area of the vessel 1.
This embodiment includes six heat conducting elements 2 extending in parallell in the longitudinal direction of the vessel shell 3. The elements 2 are placed circumferentially against the internal wall 4 of the vessel shell 3 and are spaced apart with a small longitudinal gap 7 therebetween. A number of springs 8 are mounted in the gap 7 between the heat conducting elements 2 thus expanding the heat conducting elements 2 outwardly against the internal wall 4 of the vessel shell 3. This expanding action is sufficient to keep the heat conducting elements 2 in place against the internal wall 4 of the vessel shell 3 without further fixing means. This makes installation and replacement of internal components 5 easy and convenient.
In another embodiment, fixing means may be provided to securely fix the heat conducting elements 2 to the internal wall 4 of the vessel shell 3. Also abutment means can be provided in the internal wall 4 of the vessel shell 3 to keep the heat conducting elements 2 in place in the longitudinal direction of the vessel 1.
The vessel 1 is designed to withstand the surrounding water pressure. High pressure penetration equipment allows for power supply and communication with the equipment within the vessel 1.
The internal environment of the vessel 1 consists of an inert atmosphere maintained at low pressure.
Fig. 2 shows the electric components 5 generating heat assembled to an array of six cylindrical elements 2 or segments 2 made of a suitable conductive material, e.g. carbon-fibre, aluminum, or any suitable material able to provide substantial thermal transfer.
The number of segments 2 can be from one and up. If only one is used, this need to have one longitudinal gap 7 in order to obtain the expanding action. The one or more segments 2 may or may not be arranged to fully circumscribe the cylindrical part of the vessel shell 3.
Fig.3 shows the intimate contact between the outwardly facing surface 6 of the segments 2 and the internal wall 4 of the vessel shell 3. The outer surface 6 of the segments 2 are arcuated to be coplementary to the curvature of the internal wall 4 of the vessel shell 3. It is material that the contact of the outer surface 6 of the segments 2 against the internal wall 4 of the vessel shell 3 is as extensive as possible.
In order to ensure this extensive contact, a gel, paste or similar having high heat conductivity may be coated on the outer surface 6 of the segments 2 or the internal wall 4 surface of the vessel shell 3. This improves the heat conduction and eliminates possible void spaces.

Claims

P a t e n t c l a i m s
1.
Pressure vessel (1) for passive conduction of heat generated by current-carrying components (5) inside the vessel shell (3), characterised in that the current-carrying components (5) are mounted to at least one heat conducting element (2), which at least one heat conducting element (2) is placed circumferentially against the inner wall (4) of the vessel shell (3) and each heat conducting element (2) has an outwardly facing surface (6) which is complementary to the internal wall surface of the vessel shell (3) and the outwardly facing surface (6) is in direct conducting engagement with the internal wall surface of the vessel shell (3), as passive conduction of heat only occur.
2.
Pressure vessel according to claim 1, characterised in that the at least one heat conducting element (2) is expanded to the internal wall (4) surface of the vessel shell (3) without further fixing means.
3.
Pressure vessel according to claim 1 or 2, characterised in that the at least one heat conducting element (2) is arranged with a gap (7) in the longitudinal direction thereof and that expanding means (8) are provided in the gap (7) and the expanding means (8) are expanding the at least one heat conducting element (2) outwardly and thus against the internal wall (4) surface of the vessel shell (3).
4.
Pressure vessel according to claim 1,2 or 3, characterised in that the at least one heat conducting element (2) is manufactured of carbon-composite or aluminum.
5.
Pressure vessel according to claim 1,2 or 3, characterised in that the vessel shell (3) is manufactured of one among the following materials; carbon-composite, high-grade steel or titan.
6.
Pressure vessel according to one of the claims 1-5, characterised in that a gel, paste or similar is provided in the interface between the outwardly facing surface (6) of the at least one heat conducting element (2) and the internal wall (4) surface of the vessel shell
(3).
7.
Pressure vessel according to one of the claims 1-6, characterised in that the vessel shell (3) comprises a cylindrical central part and a hemispherical part in each end.
8.
Pressure vessel according to one of the claims 1-7, characterised in that the vessel shell (3) is bidivided and each part comprises a flange (9) having means for securing the parts together.
9.
Pressure vessel according to one of the claims 1-8, characterised in that the outer wall of the vessel shell (3) on at least portions of the surface thereof is provided with cooling promoting means, like cooling fins.
PCT/NO1999/000255 1999-08-13 1999-08-13 Passive thermal transfer of subsea electronics WO2001013692A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/NO1999/000255 WO2001013692A1 (en) 1999-08-13 1999-08-13 Passive thermal transfer of subsea electronics
AU56587/99A AU5658799A (en) 1999-08-13 1999-08-13 Passive thermal transfer of subsea electronics

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/NO1999/000255 WO2001013692A1 (en) 1999-08-13 1999-08-13 Passive thermal transfer of subsea electronics

Publications (1)

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WO2001013692A1 true WO2001013692A1 (en) 2001-02-22

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WO (1) WO2001013692A1 (en)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2404282A (en) * 2003-07-10 2005-01-26 Visteon Global Tech Inc Microelectronic package within cylindrical housing
DE102006022497A1 (en) * 2006-05-05 2007-11-29 Danfoss Drives A/S Cylindrical assembly with at least one electronic component
WO2009074770A1 (en) * 2007-12-12 2009-06-18 Aker Subsea Limited Subsea containment vessel and heat sink assembly
EP2048928A3 (en) * 2007-10-09 2010-01-06 Vetco Gray Controls Limited Heat removal from electrical modules
FR2943488A1 (en) * 2009-03-23 2010-09-24 Converteam Technology Ltd ELECTRICAL MODULE FOR IMMERSION IN WATER
EP2467005A1 (en) 2010-12-20 2012-06-20 Vetco Gray Controls Limited Cooling component of an electronic unit
EP2824275A1 (en) * 2013-07-09 2015-01-14 ABB Technology Ltd Subsea unit with cooling of electronic devices
EP2853682A1 (en) * 2013-09-25 2015-04-01 Siemens Aktiengesellschaft Subsea enclosure system for disposal of generated heat
WO2015189093A1 (en) * 2014-06-11 2015-12-17 Fmc Kongsberg Subsea As Subsea cooling assembly
WO2016092043A1 (en) * 2014-12-12 2016-06-16 Ge Oil & Gas Uk Limited Locking mechanism
US9581358B2 (en) 2013-08-30 2017-02-28 Exxonmobil Upstream Research Company Multi-phase passive thermal transfer for subsea apparatus
WO2017102603A1 (en) * 2015-12-15 2017-06-22 Onesubsea Ip Uk Limited Gas filled subsea electronics housing with spring engaged heat sink
US9777966B2 (en) 2014-01-30 2017-10-03 General Electric Company System for cooling heat generating electrically active components for subsea applications
US10721831B2 (en) 2018-02-20 2020-07-21 Eagle Technology, Llc Electronics chassis compound cylinder pressure vessel
WO2020257899A1 (en) * 2019-06-24 2020-12-30 Petróleo Brasileiro S.A. - Petrobras Protective modules for embedded electronics and interconnection method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4184539A (en) * 1978-07-10 1980-01-22 The United States Of America As Represented By The Secretary Of The Navy Electronic card mount and heat transfer assembly for underwater vehicles
US4757157A (en) * 1986-11-14 1988-07-12 Alcatel Cit Housing for an undersea repeater
US4858068A (en) * 1986-03-21 1989-08-15 Alcatel Cit Electronic circuit housing

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4184539A (en) * 1978-07-10 1980-01-22 The United States Of America As Represented By The Secretary Of The Navy Electronic card mount and heat transfer assembly for underwater vehicles
US4858068A (en) * 1986-03-21 1989-08-15 Alcatel Cit Electronic circuit housing
US4757157A (en) * 1986-11-14 1988-07-12 Alcatel Cit Housing for an undersea repeater

Cited By (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2404282B (en) * 2003-07-10 2005-05-11 Visteon Global Tech Inc Microelectronic package within cylindrical housing
US7180736B2 (en) 2003-07-10 2007-02-20 Visteon Global Technologies, Inc. Microelectronic package within cylindrical housing
DE102004033400B4 (en) * 2003-07-10 2008-08-28 Visteon Global Technologies, Inc., Dearborn Electronic unit and its use
GB2404282A (en) * 2003-07-10 2005-01-26 Visteon Global Tech Inc Microelectronic package within cylindrical housing
DE102006022497A1 (en) * 2006-05-05 2007-11-29 Danfoss Drives A/S Cylindrical assembly with at least one electronic component
DE102006022497B4 (en) * 2006-05-05 2008-02-28 Danfoss Drives A/S Cylindrical assembly with at least one electronic component
EP2048928A3 (en) * 2007-10-09 2010-01-06 Vetco Gray Controls Limited Heat removal from electrical modules
WO2009074770A1 (en) * 2007-12-12 2009-06-18 Aker Subsea Limited Subsea containment vessel and heat sink assembly
FR2943488A1 (en) * 2009-03-23 2010-09-24 Converteam Technology Ltd ELECTRICAL MODULE FOR IMMERSION IN WATER
EP2234468A1 (en) * 2009-03-23 2010-09-29 Converteam Technology Ltd Electric module
US7983041B2 (en) 2009-03-23 2011-07-19 Converteam Technology Ltd. Electric module
EP2467005A1 (en) 2010-12-20 2012-06-20 Vetco Gray Controls Limited Cooling component of an electronic unit
EP2824275A1 (en) * 2013-07-09 2015-01-14 ABB Technology Ltd Subsea unit with cooling of electronic devices
WO2015003935A1 (en) * 2013-07-09 2015-01-15 Abb Technology Ltd Subsea unit with cooling of electronic devices
US9581358B2 (en) 2013-08-30 2017-02-28 Exxonmobil Upstream Research Company Multi-phase passive thermal transfer for subsea apparatus
EP2853682A1 (en) * 2013-09-25 2015-04-01 Siemens Aktiengesellschaft Subsea enclosure system for disposal of generated heat
WO2015044021A1 (en) * 2013-09-25 2015-04-02 Siemens Aktiengesellschaft Subsea enclosure system for disposal of generated heat
US9777966B2 (en) 2014-01-30 2017-10-03 General Electric Company System for cooling heat generating electrically active components for subsea applications
WO2015189093A1 (en) * 2014-06-11 2015-12-17 Fmc Kongsberg Subsea As Subsea cooling assembly
WO2016092043A1 (en) * 2014-12-12 2016-06-16 Ge Oil & Gas Uk Limited Locking mechanism
WO2017102603A1 (en) * 2015-12-15 2017-06-22 Onesubsea Ip Uk Limited Gas filled subsea electronics housing with spring engaged heat sink
US9806503B2 (en) 2015-12-15 2017-10-31 Onesubsea Ip Uk Limited Gas filled subsea electronics housing with spring engaged heat sink
US10411443B2 (en) 2015-12-15 2019-09-10 Onesubsea Ip Uk Limited Gas filled subsea electronics housing with spring engaged heat sink
US10721831B2 (en) 2018-02-20 2020-07-21 Eagle Technology, Llc Electronics chassis compound cylinder pressure vessel
WO2020257899A1 (en) * 2019-06-24 2020-12-30 Petróleo Brasileiro S.A. - Petrobras Protective modules for embedded electronics and interconnection method
GB2602729A (en) * 2019-06-24 2022-07-13 Petroleo Brasileiro Sa Petrobras Protective modules for embedded electronics and interconnection method
GB2602729B (en) * 2019-06-24 2023-08-02 Petroleo Brasileiro Sa Petrobras Protective modules for embedded electronics and interconnection method
US11988527B2 (en) 2019-06-24 2024-05-21 Petróleo Brasileiro S.A.—Petrobrás Protection modules for on-board electronics and interconnection method

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