CN218513860U

CN218513860U - Laser device

Info

Publication number: CN218513860U
Application number: CN202222596390.6U
Authority: CN
Inventors: 梁志远; 张观文; 吴仕忠
Original assignee: PR Lighting Ltd
Current assignee: PR Lighting Ltd
Priority date: 2022-09-29
Filing date: 2022-09-29
Publication date: 2023-02-21
Anticipated expiration: 2032-09-29

Abstract

The utility model discloses a laser device, which comprises a shell, a laser module, a heat dissipation assembly and a substrate; the substrate is arranged on the shell and forms an installation cavity with the shell in an enclosing mode; the laser module comprises a laser source arranged on the substrate; the heat dissipation assembly comprises a heat absorption plate, a heat conduction pipe and fins; the laser source and the heat absorption plate are both positioned in the mounting cavity, and the fins are mounted on the substrate and positioned outside the mounting cavity; the heat absorption plate is arranged on the laser source, one end of the heat conduction pipe is clamped between the heat absorption plate and the laser source, and the other end of the heat conduction pipe is connected with the fins. The utility model discloses can realize quick heat dissipation, avoid the condition of burning out to take place, improve life.

Description

Laser device

Technical Field

The utility model belongs to the field of laser technology, concretely relates to laser device.

Background

The laser lamp is laser device's one kind, and the laser lamp generally divide into industry laser lamp and amusement laser lamp, and the laser lamp generally adopts laser module to launch light, because laser module service environment temperature requires more rigorously, and the temperature should not be too high, and the high temperature can influence life-span or burn out, and consequently current laser lamp life-span is lower.

Disclosure of Invention

An object of the utility model is to provide a laser device, the utility model discloses can realize quick heat dissipation, avoid the condition of burning out to take place, improve life.

The laser device comprises a shell, a laser module, a heat dissipation assembly and a substrate; the substrate is arranged on the shell and forms an installation cavity with the shell in an enclosing mode;

the laser module comprises a laser source arranged on the substrate;

the heat dissipation assembly comprises a heat absorption plate, a heat conduction pipe and fins;

the laser source and the heat absorption plate are both positioned in the mounting cavity, and the fins are mounted on the substrate and positioned outside the mounting cavity;

the heat absorption plate is arranged on the laser source, one end of the heat conduction pipe is clamped between the heat absorption plate and the laser source, and the other end of the heat conduction pipe is connected with the fins.

Further, a pipe groove is formed in the heat absorption plate, the laser source is provided with a heat dissipation surface, the heat dissipation surface and the inner wall of the pipe groove jointly enclose to form a pipe clamping cavity, and one end of the heat conduction pipe is located in the pipe clamping cavity.

Further, the laser device further comprises a heat radiation fan arranged on the substrate; the heat radiation fan is positioned outside the installation cavity.

Furthermore, the number of the fins is multiple, and the fins are arranged on the substrate at intervals and are located between the heat radiation fan and the substrate.

Further, the laser device also comprises a bracket; the heat radiation fan is arranged on the substrate through the bracket.

Further, the number of the heat pipes is multiple, one end of each heat pipe is clamped between the heat absorbing plate and the laser source, and the other end of each heat pipe penetrates through the substrate and is connected with the fins.

Further, a pipe hole is formed in the substrate, and the heat conduction pipe penetrates through the pipe hole of the substrate.

Further, the shell is provided with a mounting groove, and the base plate covers a notch of the mounting groove and encloses with the inner wall of the mounting groove to form the mounting cavity.

Further, the laser device also comprises a sealing ring; the sealing ring is clamped between the base plate and the notch edge of the mounting groove.

Further, the notch edge of mounting groove is equipped with the draw-in groove, the sealing washer has the card strip, the card strip card is established in the draw-in groove.

The utility model provides a technical scheme has following advantage and effect:

the utility model discloses a radiator unit's heat pipe realizes the quick heat dissipation of laser module's light source with heat transfer, and the heat pipe centre gripping is at absorber plate and laser source, and the heat conduction is effectual for the radiating efficiency is higher, has avoided laser module because of the high temperature with burn out, has improved laser device life, has reduced laser device's maintenance and replacement cost.

Drawings

FIG. 1 is an exploded view of a laser device;

FIG. 2 is a schematic structural diagram of a heat dissipation assembly, a laser module, and a heat dissipation fan;

fig. 3 is a schematic structural view of the heat dissipation assembly and the laser module.

Description of reference numerals:

10. a housing; 11. mounting grooves;

20. a laser module; 21. a laser source; 211. a heat dissipating surface;

30. a heat dissipating component; 31. a heat absorbing plate; 32. a heat conducting pipe; 33. a fin;

40. a substrate;

50. a mounting cavity;

60. a heat radiation fan;

70. a support;

80. and (5) sealing rings.

Detailed Description

The following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings and examples. The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "communicating" are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Unless otherwise specified or defined, in the description of the present invention, it is to be understood that the terms "first", "second", and the like are used in the present invention to describe various information, but the information should not be limited to these terms, and these terms are only used to distinguish one type of information from another. For example, the "first" information may also be referred to as "second" information, and similarly, the "second" information may also be referred to as "first" information, without departing from the scope of the invention.

As used herein, unless otherwise specified or defined, the term "and/or" includes any and all combinations of one or more of the associated listed items.

For convenience of description, the up-down direction described below coincides with the up-down direction of fig. 1 itself, the left-right direction described below coincides with the left-right direction of fig. 2 itself, and the front-back direction described below coincides with the projection direction of fig. 2 itself.

As shown in fig. 1 to 3, a laser device includes a housing 10, a laser module 20, a heat sink 30, and a substrate 40. The substrate 40 is installed on the housing 10 and encloses with the housing 10 to form an installation cavity 50, and the substrate 40 plays a role in sealing and waterproofing.

The laser module 20 includes a laser source 21 mounted on the substrate 40. The laser module 20 is of a conventional structure, and further includes a color wheel, a motor and other components. The laser source 21 of the laser module 20 generates heat during operation, which may cause the laser module 20 to burn out.

The heat dissipation assembly 30 includes a heat absorption plate 31, a heat conduction pipe 32, and fins 33; the heat pipe 32 is a copper pipe and can conduct heat, the heat absorbing plate 31 is used for absorbing heat from the laser source 21 and then transferring the heat to the fins 33 through the heat pipe 32, the fins 33 are aluminum fins 33, and the fins 33 radiate the heat to the air outside the installation cavity 50.

The laser source 21 and the heat absorbing plate 31 are both located in the installation cavity 50, and the laser module 20 is installed in the installation cavity 50 and isolated by the substrate 40, so that the laser module 20 is protected. The fins 33 are mounted on the substrate 40 and located outside the mounting cavity 50. The substrate 40 has an upper surface and a lower surface. The laser module 20 is mounted on the upper surface and the fins 33 are mounted on the lower surface.

The heat absorbing plate 31 is mounted on the laser source 21, and the heat absorbing plate 31 is attached to the laser source 21 so as to be thermally transferred to the laser source 21, so that the heat absorbing plate 31 absorbs heat generated by the operation of the laser source 21. One end of the heat pipe 32 is clamped between the heat absorbing plate 31 and the laser source 21, and both the heat absorbing plate 31 and the laser source 21 are in contact with the heat pipe 32, so that the heat of the laser source 21 can be directly absorbed, and the cooling effect of the laser source 21 is obvious. The heat absorbing plate 31 and the heat conducting pipe 32 simultaneously absorb the heat of the laser source 21, and since the heat conducting pipe 32 has limited heat transfer, in order to rapidly cool down the laser source 21, a part of the heat is absorbed and stored by the heat absorbing plate 31, and then slowly transferred to the fins 33 through the heat conducting pipe 32. The other end of the heat pipe 32 is connected to the fins 33, and the heat of the laser source 21 and the heat absorbing plate 31 is transferred to the fins 33 outside the installation cavity 50 through the heat pipe 32, and finally the heat is dissipated to the air from the fins 33.

Specifically, in some embodiments, a pipe slot is formed in the heat absorbing plate 31, the laser source 21 has a heat dissipating surface 211, the heat dissipating surface 211 and an inner wall of the pipe slot together enclose to form a pipe clamping cavity, one end of the heat conducting pipe 32 is located in the pipe clamping cavity, and the heat conducting pipe 32 is located by the pipe clamping cavity, so that the heat conducting pipe 32 is ensured to be simultaneously in contact with the heat absorbing plate 31 and the heat dissipating surface 211 of the laser source 21, and the laser source 21 and the heat conducting pipe 32 are directly in contact with each other, so that the heat dissipating efficiency is higher, and the heat absorbing plate 31 can be ensured to be attached to the heat dissipating surface 211 of the laser source 21, so that the heat dissipating efficiency of the heat dissipating surface 211 of the laser source 21 is higher.

Specifically, in some embodiments, the laser device further includes a heat dissipation fan 60 mounted on the substrate 40; the heat dissipation fan 60 is located outside the installation cavity 50. The heat dissipation fan 60 can accelerate the heat dissipation of the fins 33, the heat dissipation fan 60 blows air against the fins 33, the cold air is conveyed to the fins 33 to achieve the rapid cooling of the fins 33, after the temperature of the fins 33 is reduced, the temperature difference between the fins 33 and the heat pipe 32 is increased, and the heat of the heat pipe 32 is transferred to the fins 33 more rapidly.

Specifically, in some embodiments, there are a plurality of fins 33, and each of the fins 33 is disposed at intervals on the substrate 40 and is located between the heat dissipation fan 60 and the substrate 40. The substrate 40, all the fins 33, and the heat dissipation fan 60 are sequentially arranged from top to bottom. The fins 33 are spaced from top to bottom to arrange the heat conduction pipes 32 which sequentially penetrate all the fins 33 from top to bottom. The fins 33 are annular, the heat dissipation fan 60 blows air to the fins 33 from bottom to top, and the air enters the fins 33 and then flows around the substrate 40 to take away heat on the fins 33.

Specifically, in some embodiments, the laser apparatus further comprises a bracket 70; the bracket 70 is installed on the housing 10 or the substrate 40, and the heat dissipation fan 60 is installed on the substrate 40 through the bracket 70, and the bracket 70 allows the heat dissipation fan 60 to be suspended below the fins 33 and to supply cool air upward.

Specifically, in some embodiments, the number of the heat conducting pipes 32 is multiple, so as to increase the heat dissipation efficiency. One end of each of the heat pipes 32 is clamped between the heat absorbing plate 31 and the laser source 21, and the other end of each of the heat pipes 32 passes through the substrate 40 and is connected to the fins 33.

Specifically, in some embodiments, the base plate 40 is provided with pipe holes, and the heat conduction pipes 32 pass through the pipe holes of the base plate 40. The size and shape of the pipe hole are matched with those of the heat conduction pipe 32.

Specifically, in some embodiments, the housing 10 has a mounting groove 11, the housing 10 is cylindrical, and the mounting groove 11 penetrates through the housing 10 from top to bottom. A light assembly adapted to the laser module 20 is disposed in the housing 10, and a laser source 21 of the laser module 20 is emitted from an upper notch of the mounting groove 11 through the light assembly. The base plate 40 covers the lower notch of the mounting groove 11 and encloses with the inner wall of the mounting groove 11 to form the mounting cavity 50.

Specifically, in some embodiments, the laser device further comprises a sealing ring 80; the sealing ring 80 increases the sealing performance of the installation cavity 50, and plays a role in water prevention. The sealing ring 80 is clamped between the base plate 40 and the notch edge of the mounting groove 11.

Specifically, in some embodiments, a clamping groove is formed in the edge of the notch of the mounting groove 11, the sealing ring 80 is provided with a clamping strip, and the clamping strip is clamped in the clamping groove, so that the sealing ring 80 is better in waterproof sealing performance.

The working principle of the embodiment is as follows: the heat absorption plate is tightly attached to the heat dissipation surface of the laser source, the heat absorption plate absorbs heat inside the laser source as much as possible during working and quickly transfers the heat to the aluminum fins through the heat conduction pipe, the heat dissipation fan is arranged at the center of the aluminum fins and blows air towards the fins, cold air flows through the fins through blowing air and takes away the heat of the fins, the temperature of the laser module is reduced, and efficient quick heat dissipation is formed, so that the temperature of the laser module is reduced.

The above embodiments are not intended to be exhaustive list of the present invention, and there may be many other embodiments not listed. Any replacement and improvement made on the basis of not violating the concept of the utility model belong to the protection scope of the utility model.

Claims

1. The laser device is characterized by comprising a shell, a laser module, a heat dissipation assembly and a substrate; the substrate is arranged on the shell and is enclosed with the shell to form an installation cavity;

the laser module comprises a laser source arranged on the substrate;

2. The laser device as claimed in claim 1, wherein the heat absorbing plate has a slot, the laser source has a heat dissipating surface, the heat dissipating surface and an inner wall of the slot together enclose a tube clamping cavity, and one end of the heat conducting tube is located in the tube clamping cavity.

3. The laser device of claim 1, further comprising a heat sink fan mounted on the substrate; the heat radiation fan is positioned outside the installation cavity.

4. The laser device of claim 3, wherein the plurality of fins are spaced apart from each other on the substrate and are located between the heat dissipation fan and the substrate.

5. The laser device of claim 4, further comprising a support; the heat radiation fan is arranged on the substrate through the bracket.

6. The laser device according to any one of claims 1 to 5, wherein the number of the heat pipes is plural, one end of each of the heat pipes is sandwiched between the heat absorbing plate and the laser source, and the other end of each of the heat pipes passes through the substrate and is connected to the fin.

7. The laser device according to any one of claims 1 to 5, wherein a tube hole is provided on the substrate, and the heat conducting tube passes through the tube hole of the substrate.

8. The laser device according to any one of claims 1 to 5, wherein the housing has a mounting groove, and the base plate covers a notch of the mounting groove and encloses with an inner wall of the mounting groove to form the mounting cavity.

9. The laser device of claim 8, further comprising a sealing ring; the seal ring is clamped between the base plate and the notch edge of the mounting groove.

10. The laser device as claimed in claim 9, wherein a slot is provided at the edge of the notch of the mounting slot, and the sealing ring has a clamping strip, and the clamping strip is clamped in the slot.