CN100388872C - Radiator and radiating method - Google Patents
Radiator and radiating method Download PDFInfo
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- CN100388872C CN100388872C CNB2004100804076A CN200410080407A CN100388872C CN 100388872 C CN100388872 C CN 100388872C CN B2004100804076 A CNB2004100804076 A CN B2004100804076A CN 200410080407 A CN200410080407 A CN 200410080407A CN 100388872 C CN100388872 C CN 100388872C
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- thermal source
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Abstract
The present invention relates to a heat radiating device and a heat radiating method which are used for radiating heat of a heat source. A heat conducting assembly is attached on the heat source; heat energy produced by the heat source is transferred to the heat conducting assembly; a vibrating source is arranged on the heat conducting component and accelerates the heat energy of the heat conducting assembly to be rapidly transferred to the edge of the heat conducting assembly so as to carry out heat exchange with external coal air for enhancing heat radiating efficiency.
Description
Technical field
The present invention is a kind of heat abstractor and heat dissipating method, is applied to the thermal source of electronic instrument, effectively thermal source is dispelled the heat, keeps the operate as normal of thermal source.
Background technology
Known, along with the arithmetic speed of computer CPU (CPU) increases day by day, the heat energy that CPU is produced when work is also more and more surprising, past is owing to the long-standing neglect to the CPU heat dissipation problem, make CPU often must under the environment of high temperature, carry out work because of the heat energy that self produces, not only reduce its operation efficiency, more shorten its useful life.
At present general solution be on motherboard, install additional one with the contacted radiator of CPU, by CPU with thermal energy conduction to radiator, again by the radiating fin on the radiator with the heat energy loss, to reach the purpose of heat radiation, because the mode of heat transferred has conduction, convection current and radiation, and aforementioned mode of the heat transferred that central processing unit was produced being gone out with radiator is conduction, just by the medium of solid as heat transferred, and heat transferred is gone out.The heat transferred mode of conduction is quicker than other heat transferred mode, this mainly is because the transmission of the intermolecular heat of adjacent media is for after absorbing enough heats when a medium molecule, the electronics of this medium molecule just skips to higher energy level, and electron collision with the adjacent media molecule, with the heat transferred that will absorb the just now electronics of adjacent media molecule so far, and the lower energy level of rebound so just can be gone out heat transferred.
Radiator generally can be divided into the radiator that the radiator that installs radiator fan additional is arranged and do not install radiator fan additional; The radiator that installs radiator fan additional is arranged owing to can export cooling blast to radiating fin by radiator fan, thereby quicken the radiating rate of convection current, just with the medium of fluid as heat transferred, and heat transferred is gone out, and generally think that all its radiating efficiency is for good than the radiator that does not install radiator fan additional.
In the radiating mode of above-mentioned CPU, radiator is a solid, air is a fluid, distance in the radiator between each medium molecule is near than the distance between each medium molecule in the air, and mostly be in the metal radiator, but more free electrons heating load transmission (because medium molecule is restricted in the lattice and can't moves) is arranged, again so the heat transferred mode of conduction is quicker than the heat transferred mode of convection current.
But generally promoted for the usefulness that makes radiator fan, all radiator fan is arranged near the radiator, be side or the top that radiator fan is arranged at radiator what is more, the weight that CPU is loaded increases, and causes the damage probability of CPU to improve.
Even the design of the radiating fin form of the radiator that changes, or change the mode of the material of radiating fin, and improve the radiating efficiency of radiator.
Summary of the invention
In view of above problem, main purpose of the present invention is to provide a kind of heat abstractor and heat dissipating method, to promote the efficient to the thermal source heat radiation effectively, keeps the operate as normal of thermal source.
Therefore, for achieving the above object, heat abstractor disclosed in this invention and heat dissipating method, be applied to the thermal source of electronic instrument, so that thermal source is dispelled the heat, wherein on thermal source, be covered with termal conductor module, the heat energy that thermal source produced will be transmitted on the termal conductor module, vibration source is arranged at the junction of a plurality of radiating fins of termal conductor module, parallel this termal conductor module of the direction of vibration of this vibration source pastes the direction of this thermal source, the heat energy that quickens termal conductor module by vibration source is passed to the edge of termal conductor module apace, carries out heat exchange with the cold air with the external world, and then promotes radiating efficiency.
Vibration source is a micro motor, and can include eccentric rotor, vibrates kinetic energy to produce, or can add fan, and promote radiating efficiency.
About feature of the present invention and embodiment, conjunction with figs. and most preferred embodiment are described in detail as follows.(for making purpose of the present invention, structure, feature and function thereof there are further understanding, cooperate embodiment to be described in detail as follows.)
Description of drawings
Fig. 1 uses illustration for first embodiment that the present invention is applied to CPU and radiator;
Fig. 2 is applied to the first embodiment exploded view of CPU and radiator for the present invention;
Fig. 3 uses illustration for second embodiment that the present invention is applied to CPU, radiator and fan;
Fig. 4 uses illustration for the 3rd embodiment that the present invention is applied to CPU and radiator;
Fig. 5 is applied to the 3rd embodiment exploded view of CPU and radiator for the present invention;
Fig. 6 uses illustration for the 4th embodiment that the present invention is applied to CPU and radiator;
Fig. 7 is applied to the 4th embodiment exploded view of CPU and radiator for the present invention;
Fig. 8 uses illustration for the 5th embodiment that the present invention is applied to CPU and radiator;
Fig. 9 uses illustration for the 6th embodiment that the present invention is applied to CPU and radiator; And
Figure 10 is applied to the 6th embodiment exploded view of CPU and radiator for the present invention.
Wherein, description of reference numerals:
Thermal source-11
Termal conductor module-12
Fan-20
Vibration source-30
Axle center-31
Weight-32
Embodiment
First embodiment that the present invention as shown in Figure 1 is applied to CPU and radiator uses illustration, and the present invention shown in Figure 2 is applied to the first embodiment exploded view of CPU and radiator, the present invention is a kind of heat abstractor, in order to thermal source 11 is dispelled the heat, this thermal source 11 can be the heat generating component of electronic instrument, certainly, what be easy to generate most at present heat in the computer system just belongs to central processing unit, therefore the thermal source shown in the figure 11 is represented with central processing unit, be covered with termal conductor module 12 on the thermal source 11, termal conductor module 12 shown in the figure is then represented with the radiator of radiating fin with radial arrangement, so the heat energy that thermal source 11 is produced will be transmitted on the termal conductor module 12 in the mode of conduction, therefore after a medium molecule of the termal conductor module 12 that contacts thermal source 11 absorbs enough heats, the electronics of this medium molecule just skips to higher energy level, and electron collision with adjacent media molecule in the termal conductor module 12, so that the heat transferred that this medium molecule will absorb the just now electronics of adjacent media molecule so far, and the lower energy level of rebound, heat transferred is gone out, until the edge of heat transferred to termal conductor module 12, heat abstractor disclosed in this invention includes vibration source 30, this vibration source 30 is arranged on the termal conductor module 12, and be positioned at the junction of each radiating fin, vibration source 30 is a micro motor, it has eccentric rotor, to produce vibration kinetic energy, make the heat of thermal source 11 be able to pass by vibration source 30 by the termal conductor module 12 of radiating fin with radial arrangement, and because radiating fin is radial arrangement, so the heat energy that can quicken termal conductor module 12 is passed to the edge of termal conductor module 12 apace, just after medium molecule obtains energy via mode of vibration, only need to absorb again a part of energy, just get so that its electronics skips to higher energy level, and at the electron collision of this electronics and adjacent media molecule, and the heat transferred that will absorb the just now electronics of adjacent media molecule so far, and during the lower energy level of rebound, just heat transferred can be gone out, until the edge of heat transferred to termal conductor module 12, carry out heat exchange with cold air with the external world, and then transmitting repeatedly under the situation of heat fast, promote radiating efficiency.
Because sentencing central processing unit, this represents thermal source 11, and the anti-vibration that is subjected to vertical himself direction of central processing unit is limited in one's ability, thereby the direction of vibration of vibration source 30 can be designed to the direction that parallel termal conductor module 12 pastes thermal source 11, so the vibration of vibration source 30 is with the unlikely thermal source 11 that damages the central processing unit form, certainly, if thermal source 11 is other form, then the direction of vibration of vibration source 30 can be other mode.
Second embodiment that is applied to CPU, radiator and fan as for as shown in Figure 3 the present invention uses illustration, then be to set up fan 20 in termal conductor module 12 next doors, the termal conductor module 12 so that extraneous cold air is flowed through apace, and make the edge of termal conductor module 12 and extraneous cold air carry out heat exchange, and then promote radiating efficiency.Certainly, the top that fan 20 is installed in termal conductor module 12 also is feasible mode.
The 3rd embodiment that the present invention as shown in Figure 4 is applied to CPU and radiator uses illustration, and the present invention shown in Figure 5 is applied to the 3rd embodiment exploded view of CPU and radiator, the present invention is a kind of heat abstractor, in order to thermal source 11 is dispelled the heat, this thermal source 11 can be the heat generating component of electronic instrument, certainly, what be easy to generate most at present heat in the computer system just belongs to central processing unit, therefore the thermal source shown in the figure 11 is represented with central processing unit, be covered with termal conductor module 12 on the thermal source 11, termal conductor module 12 shown in the figure is then represented with the radiator with radiating fin that the shape that is parallel to each other arranges, so the heat energy that thermal source 11 is produced will be transmitted on the termal conductor module 12 in the mode of conduction, therefore after a medium molecule of the termal conductor module 12 that contacts thermal source 11 absorbs enough heats, the electronics of this medium molecule just skips to higher energy level, and electron collision with adjacent media molecule in the termal conductor module 12, so that the heat transferred that this medium molecule will absorb the just now electronics of adjacent media molecule so far, and the lower energy level of rebound, heat transferred is gone out, until the edge of heat transferred to termal conductor module 12, heat abstractor disclosed in this invention includes vibration source 30, this vibration source 30 is arranged on the termal conductor module 12, vibration source 30 is a micro motor, it has eccentric rotor, to produce vibration kinetic energy, make the heat of thermal source 11 be able to pass by vibration source 30 by the termal conductor module 12 of radiating fin with the shape arrangement that is parallel to each other, and because vibration source 30 is positioned at the side end of each radiating fin, so the heat energy that can quicken termal conductor module 12 is passed to the edge of termal conductor module 12 apace, just after medium molecule obtains energy via mode of vibration, only need to absorb again a part of energy, just get so that its electronics skips to higher energy level, and at the electron collision of this electronics and adjacent media molecule, and the heat transferred that will absorb the just now electronics of adjacent media molecule so far, and during the lower energy level of rebound, just heat transferred can be gone out, until the edge of heat transferred to termal conductor module 12, carry out heat exchange with cold air with the external world, and then transmitting repeatedly under the situation of heat fast, promote radiating efficiency.
Because sentencing central processing unit, this represents thermal source 11, and the anti-vibration that is subjected to vertical himself direction of central processing unit is limited in one's ability, thereby the direction of vibration of vibration source 30 can be designed to the direction that parallel termal conductor module 12 pastes thermal source 11, so the vibration of vibration source 30 is with the unlikely thermal source 11 that damages the central processing unit form, certainly, if thermal source 11 is other form, then the direction of vibration of vibration source 30 can be other mode.Certainly, this embodiment fan of also can having arranged in pairs or groups is to promote radiating efficiency.
The 4th embodiment that the present invention as shown in Figure 6 is applied to CPU and radiator uses illustration, and the present invention shown in Figure 7 is applied to the 4th embodiment exploded view of CPU and radiator, the present invention is a kind of heat abstractor, in order to thermal source 11 is dispelled the heat, this thermal source 11 can be the heat generating component of electronic instrument, certainly, what be easy to generate most at present heat in the computer system just belongs to central processing unit, therefore the thermal source shown in the figure 11 is represented with central processing unit, be covered with termal conductor module 12 on the thermal source 11, termal conductor module 12 shown in the figure is then represented with the radiator with radiating fin that the shape that is parallel to each other arranges, so the heat energy that thermal source 11 is produced will be transmitted on the termal conductor module 12 in the mode of conduction, therefore after a medium molecule of the termal conductor module 12 that contacts thermal source 11 absorbs enough heats, the electronics of this medium molecule just skips to higher energy level, and electron collision with adjacent media molecule in the termal conductor module 12, so that the heat transferred that this medium molecule will absorb the just now electronics of adjacent media molecule so far, and the lower energy level of rebound, heat transferred is gone out, until the edge of heat transferred to termal conductor module 12, heat abstractor disclosed in this invention includes vibration source 30, this vibration source 30 is arranged on the termal conductor module 12, vibration source 30 is a micro motor, it has eccentric rotor, to produce vibration kinetic energy, make the heat of thermal source 11 be able to pass by vibration source 30 by the termal conductor module 12 of radiating fin with the shape arrangement that is parallel to each other, and the heat energy that quickens termal conductor module 12 is passed to the edge of termal conductor module 12 apace, just after medium molecule obtains energy via mode of vibration, only need to absorb again a part of energy, just get so that its electronics skips to higher energy level, and at the electron collision of this electronics and adjacent media molecule, and the heat transferred that will absorb the just now electronics of adjacent media molecule so far, and during the lower energy level of rebound, just heat transferred can be gone out, until the edge of heat transferred to termal conductor module 12, carry out heat exchange with cold air with the external world, and then transmitting repeatedly under the situation of heat fast, promote radiating efficiency.
Because sentencing central processing unit, this represents thermal source 11, and the anti-vibration that is subjected to vertical himself direction of central processing unit is limited in one's ability, thereby the direction of vibration of vibration source 30 can be designed to the direction that parallel termal conductor module 12 pastes thermal source 11, so the vibration of vibration source 30 is with the unlikely thermal source 11 that damages the central processing unit form, certainly, if thermal source 11 is other form, then the direction of vibration of vibration source 30 can be other mode.Certainly, this embodiment fan of also can having arranged in pairs or groups is to promote radiating efficiency.
The 5th embodiment that is applied to CPU and radiator as for as shown in Figure 8 the present invention uses illustration, then be as termal conductor module 12 with radiator with the radiating fin that is obliquely installed, so the area of dissipation of radiating fin just can be increased, and then the lifting radiating efficiency, and the vibration source 30 among this embodiment is arranged at a side of one radiating fin.
The 6th embodiment that the present invention as shown in Figure 9 is applied to CPU and radiator uses illustration, and the present invention shown in Figure 10 is applied to the 6th embodiment exploded view of CPU and radiator, the present invention is a kind of heat abstractor, in order to thermal source 11 is dispelled the heat, this thermal source 11 can be the heat generating component of electronic instrument, certainly, what be easy to generate most at present heat in the computer system just belongs to central processing unit, therefore the thermal source shown in the figure 11 is represented with central processing unit, and be covered with termal conductor module 12 on the thermal source 11, termal conductor module 12 shown in the figure is then represented with the radiator with radiating fin that the shape that is parallel to each other arranges, so the heat energy that thermal source 11 is produced will be transmitted on the termal conductor module 12 in the mode of conduction, therefore after a medium molecule of the termal conductor module 12 that contacts thermal source 11 absorbs enough heats, the electronics of this medium molecule just skips to higher energy level, and electron collision with adjacent media molecule in the termal conductor module 12, so that the heat transferred that this medium molecule will absorb the just now electronics of adjacent media molecule so far, and the lower energy level of rebound, heat transferred is gone out, until the edge of heat transferred to termal conductor module 12, heat abstractor disclosed in this invention includes vibration source 30, this vibration source 30 is arranged on the termal conductor module 12, vibration source 30 is a micro motor, it has eccentric rotor, rotor includes axle center 31 and is arranged at the weight 32 of axle center 31 1 ends, to produce vibration kinetic energy, make the heat of thermal source 11 be able to pass by vibration source 30 by the termal conductor module 12 of radiating fin with the shape arrangement that is parallel to each other, and because vibration source 30 is positioned at the side end of each radiating fin, so the heat energy that can quicken termal conductor module 12 is passed to the edge of termal conductor module 12 apace, just after medium molecule obtains energy via mode of vibration, only need to absorb again a part of energy, just get so that its electronics skips to higher energy level, and at the electron collision of this electronics and adjacent media molecule, and the heat transferred that will absorb the just now electronics of adjacent media molecule so far, and during the lower energy level of rebound, just heat transferred can be gone out, until the edge of heat transferred to termal conductor module 12, carry out heat exchange with cold air with the external world, and then transmitting repeatedly under the situation of heat fast, promote radiating efficiency.
Because sentencing central processing unit, this represents thermal source 11, and the anti-vibration that is subjected to vertical himself direction of central processing unit is limited in one's ability, thereby the direction of vibration of vibration source 30 can be designed to the direction that parallel termal conductor module 12 pastes thermal source 11, so the vibration of vibration source 30 is with the unlikely thermal source 11 that damages the central processing unit form, certainly, if thermal source 11 is other form, then the direction of vibration of vibration source 30 can be other mode.Certainly, this embodiment fan of also can having arranged in pairs or groups is to promote radiating efficiency.And the mode that makes vibration source 30 be arranged at a side of radiating fin also can be used as another embodiment.
By above-mentioned heat abstractor heat dissipating method of the present invention as can be known, dispel the heat in order to thermal source, wherein on thermal source, be covered with termal conductor module, the heat energy that thermal source produced will be transmitted on the termal conductor module, this heat dissipating method mainly is arranged at vibration source on the termal conductor module, the heat energy that quickens termal conductor module by vibration source is passed to the edge of termal conductor module apace, carries out heat exchange with the cold air with the external world, and then promotes radiating efficiency.
And by above-mentioned heat abstractor as can be known the direction of vibration of vibration source can be designed to the direction that parallel termal conductor module pastes thermal source, and vibration source is micro motor, it includes eccentric rotor, to produce vibration kinetic energy.And rotor can include the axle center and be arranged at the weight of axle center one end, or even adds fan by termal conductor module, to promote radiating efficiency.
Though the present invention with aforesaid preferred embodiment openly as above; right its is not in order to qualification the present invention, any those skilled in the art, without departing from the spirit and scope of the present invention; can do some changes and revise, therefore scope of patent protection of the present invention must be with being as the criterion that claim was defined.
Claims (12)
1. heat abstractor, in order to a thermal source is dispelled the heat, it is characterized in that, be covered with a termal conductor module on this thermal source, the heat energy that this thermal source produced will be transmitted on this termal conductor module, and a vibration source is arranged at the junction of a plurality of radiating fins of this termal conductor module, parallel this termal conductor module of the direction of vibration of this vibration source pastes the direction of this thermal source, the heat energy that quickens this termal conductor module by this vibration source is passed to the edge of this termal conductor module apace, carry out heat exchange with cold air, and then promote radiating efficiency with the external world.
2. heat abstractor as claimed in claim 1 is characterized in that, this vibration source is a micro motor.
3. heat abstractor as claimed in claim 2 is characterized in that this micro motor includes the rotor of an off-centre, to produce vibration kinetic energy.
4. heat abstractor as claimed in claim 3 is characterized in that, this rotor includes an axle center and is arranged at a weight of this axle center one end.
5. heat abstractor as claimed in claim 1 is characterized in that, also includes a fan.
6. heat abstractor as claimed in claim 1 is characterized in that, these a plurality of radiating fins are arranged radially.
7. heat dissipating method, in order to a thermal source is dispelled the heat, it is characterized in that, be covered with a termal conductor module on this thermal source, the heat energy that this thermal source produced will be transmitted on this termal conductor module, one vibration source is arranged at the junction of a plurality of radiating fins of this termal conductor module, and parallel this termal conductor module of the direction of vibration of this vibration source pastes the direction of this thermal source, the heat energy that quickens this termal conductor module by this vibration source is passed to the edge of this termal conductor module apace, carry out heat exchange with cold air, and then promote radiating efficiency with the external world.
8. heat dissipating method as claimed in claim 7 is characterized in that, this vibration source is a micro motor.
9. heat dissipating method as claimed in claim 8 is characterized in that this micro motor includes the rotor of an off-centre, to produce vibration kinetic energy.
10. heat dissipating method as claimed in claim 9 is characterized in that, this rotor includes an axle center and is arranged at a weight of this axle center one end.
11. heat dissipating method as claimed in claim 10 is characterized in that, also includes a fan.
12. heat dissipating method as claimed in claim 7 is characterized in that, these a plurality of radiating fins are arranged radially.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100804076A CN100388872C (en) | 2004-09-29 | 2004-09-29 | Radiator and radiating method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100804076A CN100388872C (en) | 2004-09-29 | 2004-09-29 | Radiator and radiating method |
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| Publication Number | Publication Date |
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| CN1756471A CN1756471A (en) | 2006-04-05 |
| CN100388872C true CN100388872C (en) | 2008-05-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB2004100804076A Active CN100388872C (en) | 2004-09-29 | 2004-09-29 | Radiator and radiating method |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101694552B (en) * | 2009-10-21 | 2011-04-13 | 友达光电股份有限公司 | Liquid crystal display device |
| CN102238851A (en) * | 2010-04-30 | 2011-11-09 | 骆俊光 | Active heat sink |
| CN111649894A (en) * | 2020-07-03 | 2020-09-11 | 中国飞机强度研究所 | Thermal vibration test device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04275491A (en) * | 1991-03-04 | 1992-10-01 | Matsushita Electric Ind Co Ltd | Radiator |
| JPH08247692A (en) * | 1995-03-14 | 1996-09-27 | Hitachi Ltd | Vibration control type heat transport pipe |
| CN1330859A (en) * | 1998-12-11 | 2002-01-09 | 艾利森电话股份有限公司 | Device for increasing heat transfer |
| US20040050536A1 (en) * | 2002-09-12 | 2004-03-18 | Michinori Watanabe | Heat-emitting element cooling apparatus |
-
2004
- 2004-09-29 CN CNB2004100804076A patent/CN100388872C/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04275491A (en) * | 1991-03-04 | 1992-10-01 | Matsushita Electric Ind Co Ltd | Radiator |
| JPH08247692A (en) * | 1995-03-14 | 1996-09-27 | Hitachi Ltd | Vibration control type heat transport pipe |
| CN1330859A (en) * | 1998-12-11 | 2002-01-09 | 艾利森电话股份有限公司 | Device for increasing heat transfer |
| US20040050536A1 (en) * | 2002-09-12 | 2004-03-18 | Michinori Watanabe | Heat-emitting element cooling apparatus |
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| CN1756471A (en) | 2006-04-05 |
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