WO2001008093A1 - Minicarte a circuit integre et procede pour son obtention - Google Patents
Minicarte a circuit integre et procede pour son obtention Download PDFInfo
- Publication number
- WO2001008093A1 WO2001008093A1 PCT/FR2000/002049 FR0002049W WO0108093A1 WO 2001008093 A1 WO2001008093 A1 WO 2001008093A1 FR 0002049 W FR0002049 W FR 0002049W WO 0108093 A1 WO0108093 A1 WO 0108093A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- integrated circuit
- mini
- support
- card
- sim
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/145—Organic substrates, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to the manufacture of memory devices with integrated circuits. It relates more particularly to an economical process for the production of integrated circuit devices of the plug-in printed circuit card type, such as so-called "SIM” or “mini-SIM” cards, here called mini-cards, as well as the new mini-cards thus obtained.
- SIM subscriber Identity
- mini-cards mini-cards
- SIM cards are used in a variety of applications, from mobile phones to set-top boxes for encrypted TV channels, Internet access devices and other applications.
- mini-smart cards are currently in the form of a storage and data processing medium comprising a card body, usually made of non-electrically conductive material, and an integrated circuit chip comprising connection pads. with flush contact areas. Said chip is conventionally incorporated by means of a module which is carried over into a card in the conventional format of credit cards, while the latter is subsequently cut out in the format of the targeted SIM card.
- integrated circuits is understood here to mean both simple integrated circuits and integrated circuits also comprising passive elements, such as for example capacitors, resistors, inductors, etc., as in the case of logic circuits with resistors. capacitors-transistors (RCTL, in English resistor-capacitor-transistor logic).
- the microcircuit occupies a relatively small proportion of the circumscribed space by the periphery of the contact pads and a fortiori a small part of the surface of the card.
- the main object of the present invention is to provide less expensive means for the manufacture of mini-cards similar to SIM or mmi-SIM cards.
- Another object of the invention is to provide means for the manufacture of such smart cards, making it possible to reduce the number of operating steps required.
- Another object of the invention is to provide an integrated circuit card of the SIM or mini-SIM type comprising a less fragile microcircuit, in particular less brittle, than those produced with thick silicon wafers.
- the invention provides a method for manufacturing a mini-card of the SIM or mini-SIM type, using an integrated circuit chip, connected to a communication interface, as well as possibly to conductive tracks, to integrate them on or in a card body, said method comprising the steps consisting in placing a thin and large integrated circuit on a support, said integrated circuit covering all or almost all of said support, and in forming the card body with said support.
- a wafer or integrated circuit board can be provided on a stiffening support. This is all the more true as the wafer is thinner and therefore needs this support all the more for its mechanical strength.
- a communication interface with antenna and / or with contact pads, as well as possible conductive tracks, are produced on the active face of said integrated circuit.
- said method according to the invention comprises the steps of: implementation of said integrated circuit on its original support, said integrated circuit comprising output pads on its active face, embodiment, in particular by printing or fixing, a communication interface with antenna and / or contact pads, and possibly conductive tracks, on the active face of said integrated circuits and in contact with output pads of the chip, use of the support d origin of the integrated circuit as material of the card body, and if necessary, cutting of individual circuits constituting a mini-card with integrated circuit on a support, advantageously in the format of the body of a mini-card of SIM or mini-SIM type.
- said integrated circuits are subjected to said printing or fixing while they are still grouped on a wafer of integrated circuits.
- preferably integrated circuit boards or integrated circuits having a thickness of around 3 to 20 ⁇ m are used.
- the plate is practically transparent at this thickness and flexible.
- the integrated circuit chips advantageously have a surface area greater than 0.5 cm 2 and preferably p of between 1 and 10 cm ⁇ .
- the active face of said plates can be treated in order to improve the wettability, the grip and / or the electrical conductivity.
- connections are made to the interface in line with the chip output pads and / or by means of routing.
- the wafer is provided with integrated circuits of pads or "bumps" by a known technique, and the contacts are printed so that they are opposite the said studs or conventional routings are carried out.
- the communication interface with an antenna or contact pads, and any conductive tracks, by a printing process such as for example screen printing, pad printing , inkjet printing, spraying or spraying through a mask or stencil, vacuum evaporation, and / or by a metallization process such as, for example, electrolytic deposition, non-electrolytic deposition, process with initiation of metallization or any other known method of metallization, implemented according to an appropriate metallization grid.
- the printing of contacts on the active face of the integrated circuits is carried out on a wafer or wafer of silicon or other semiconductor materials comprising the integrated circuits concerned, before cutting this wafer or wafer into individual chips, as indicated upper.
- the individual chips are obtained by cutting, in particular by sawing along appropriate lines, the semiconductor wafer.
- the operation is preferably carried out on a wafer of support material comprising a plurality of integrated circuits arranged in practice in a square matrix and the cutting of which into individual chips is then carried out according to cutting plans which follow lines and columns of this matrix.
- the step of printing the contact pads and / or antenna connection pads according to the invention can be carried out on a continuous strip carrying a succession, advantageously over several rows, of individual chips arranged on a support material appropriate.
- this further comprises at least one step of applying a varnish, a label and / or an opaque and / or printable film on the surfaces external to protect, outside of contact or connection areas.
- this can also include transferring such an integrated circuit chip onto its support onto a card body, but this variant is less advantageous because it requires adding a support card body, while the support on which said integrated circuit can be supplied has been found to be able to form an appropriate support for giving a SIM card after cutting.
- the integrated circuit chip which can itself constitute the card intended for plugging into an appropriate device, such as for example a cell phone or a multimedia device.
- an increase in the thickness of the support can be carried out by adding or removing a portion or a layer of said support.
- an adhesive may be present under the integrated circuit chip, on its support. It can be a thermoplastic adhesive, a two-phase thermosetting adhesive, a hot-reactivatable adhesive or activatable by light radiation, in particular under UV, or a pressure-activatable adhesive.
- the object of the invention is also a mini-card with an integrated circuit of SIM or mini-SIM type, comprising an integrated circuit chip comprising a connection to a communication interface with antenna and / or with contact pads, as well as possibly conductive tracks, said mini-card comprising a thin and large integrated circuit on a support, said integrated circuit covering all or almost all of said support and the latter forming the card body.
- the body of the minimap includes the original support of the integrated circuit (2) or a part of it.
- said mini-card comprises an integrated circuit of small thickness and large size on a support, while said support forms the card body and is cut to the dimensions of a mini-card of the SIM or mini-SIM type.
- Fig. 1 a top view of a portion of an integrated circuit board provided with contact pads
- Fig. 2 a top view of a portion of an integrated circuit board with the chips covered with conductive pads
- Fig. 3 a top view in perspective showing schematically a mini-card with integrated circuits according to the invention.
- the manufacture of the mini-card 9 includes the supply of integrated circuit chips 2 and a card body, as well as the production of connection pads 4 and contact pads 6, and possibly of conductive tracks 7, while the circuit integrated 2 is a thin and large integrated circuit on a support 8, said support forming the card body and being cut to the dimensions of a mini-card
- the integrated circuit 2 can extend over all or almost all of said support.
- said integrated circuit comes from an integrated circuit board 1 having a thickness of 3 to 20 ⁇ m, while the integrated circuit considered has an area greater than 0.5 cm 2 and preferably between 1 and 10 cm 2 .
- Such a wafer includes chips 2 intended to be separated along lines 3, 3 ′ and provided with studs 4 on their active face.
- the active face of the integrated circuit 2 is advantageously provided according to the invention with contact pads 6, and optionally conductive tracks 7, located inside the area of said active face.
- all the connections between the integrated circuit 2 and the contact pads 6 are located in line with the plane of said integrated circuit, inside the area of said active face.
- connection pads 4 are arranged in such a way that they completely or partially avoid the use of conductive routing tracks 7.
- the material of the support 8 is preferably chosen from glass and one or more plastics of the poly (methyl methacrylate) (PMMA), polycarbonate (PC), acrylonitrile-butadiene-styrene (ABS), polystyrene (PS) type. ), poly (ethylene terephthalate) (PET), polyethylene naphthalate (PEN), poly (vinyl chloride) (PVC), polyethylene (PE), polyamide (PA), polyimide (PI), polyether imide (PEI) and polypropylene (PP), or any other suitable material.
- PMMA poly (methyl methacrylate)
- PC polycarbonate
- ABS acrylonitrile-butadiene-styrene
- PS polystyrene
- PMMA poly (methyl methacrylate)
- PET polyethylene terephthalate
- PEN polyethylene naphthalate
- PVC poly (vinyl chloride)
- PE polyethylene
- PA polyamide
- PI polyimide
- the support material 8 is advantageously coated with an adhesive with high adhesiveness, such as for example an epoxy resin with high adhesion, on which is fixed the face opposite to the active face of said integrated circuit.
- an adhesive with high adhesiveness such as for example an epoxy resin with high adhesion
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU67059/00A AU6705900A (en) | 1999-07-23 | 2000-07-13 | Minicard with integrated circuit and method for obtaining same |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR99/09771 | 1999-07-23 | ||
FR9909771A FR2796759B1 (fr) | 1999-07-23 | 1999-07-23 | Minicarte a circuit integre et procede pour son obtention |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2001008093A1 true WO2001008093A1 (fr) | 2001-02-01 |
Family
ID=9548605
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/FR2000/002049 WO2001008093A1 (fr) | 1999-07-23 | 2000-07-13 | Minicarte a circuit integre et procede pour son obtention |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU6705900A (fr) |
FR (1) | FR2796759B1 (fr) |
WO (1) | WO2001008093A1 (fr) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7463199B2 (en) | 2002-11-07 | 2008-12-09 | Fractus, S.A. | Integrated circuit package including miniature antenna |
EP2260850A2 (fr) | 2002-01-28 | 2010-12-15 | Kyowa Hakko Kogyo Co., Ltd | Antagonistes des récepteurs A2A pour utilisation dans le traitement des troubles du mouvement |
US8207893B2 (en) | 2000-01-19 | 2012-06-26 | Fractus, S.A. | Space-filling miniature antennas |
US8330259B2 (en) | 2004-07-23 | 2012-12-11 | Fractus, S.A. | Antenna in package with reduced electromagnetic interaction with on chip elements |
US9099773B2 (en) | 2006-07-18 | 2015-08-04 | Fractus, S.A. | Multiple-body-configuration multimedia and smartphone multifunction wireless devices |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5155068A (en) * | 1989-08-31 | 1992-10-13 | Sharp Kabushiki Kaisha | Method for manufacturing an IC module for an IC card whereby an IC device and surrounding encapsulant are thinned by material removal |
US5308967A (en) * | 1990-10-26 | 1994-05-03 | Reinhard Jurisch | Data carrier for identification systems |
EP0810659A2 (fr) * | 1996-05-28 | 1997-12-03 | Harris Corporation | Appareil d'empaquetage pour semi-conducteur et procédé |
US5731222A (en) * | 1995-08-01 | 1998-03-24 | Hughes Aircraft Company | Externally connected thin electronic circuit having recessed bonding pads |
US5753901A (en) * | 1995-06-12 | 1998-05-19 | Solaic | Chip for an electronic card coated with a layer of insulating material, and an electronic card including such a chip |
EP0869452A1 (fr) * | 1997-04-02 | 1998-10-07 | ODS R. Oldenbourg Datensysteme GmbH & Co. KG | Mini carte à puce et méthode de production |
EP0908844A1 (fr) * | 1997-10-07 | 1999-04-14 | De La Rue Cartes Et Systemes | Carte à microcircuit combinant des plages de contact extérieur et une antenne,et procédé de fabrication d'une telle carte |
-
1999
- 1999-07-23 FR FR9909771A patent/FR2796759B1/fr not_active Expired - Fee Related
-
2000
- 2000-07-13 WO PCT/FR2000/002049 patent/WO2001008093A1/fr active Application Filing
- 2000-07-13 AU AU67059/00A patent/AU6705900A/en not_active Abandoned
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5155068A (en) * | 1989-08-31 | 1992-10-13 | Sharp Kabushiki Kaisha | Method for manufacturing an IC module for an IC card whereby an IC device and surrounding encapsulant are thinned by material removal |
US5308967A (en) * | 1990-10-26 | 1994-05-03 | Reinhard Jurisch | Data carrier for identification systems |
US5753901A (en) * | 1995-06-12 | 1998-05-19 | Solaic | Chip for an electronic card coated with a layer of insulating material, and an electronic card including such a chip |
US5731222A (en) * | 1995-08-01 | 1998-03-24 | Hughes Aircraft Company | Externally connected thin electronic circuit having recessed bonding pads |
EP0810659A2 (fr) * | 1996-05-28 | 1997-12-03 | Harris Corporation | Appareil d'empaquetage pour semi-conducteur et procédé |
EP0869452A1 (fr) * | 1997-04-02 | 1998-10-07 | ODS R. Oldenbourg Datensysteme GmbH & Co. KG | Mini carte à puce et méthode de production |
EP0908844A1 (fr) * | 1997-10-07 | 1999-04-14 | De La Rue Cartes Et Systemes | Carte à microcircuit combinant des plages de contact extérieur et une antenne,et procédé de fabrication d'une telle carte |
Cited By (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8558741B2 (en) | 2000-01-19 | 2013-10-15 | Fractus, S.A. | Space-filling miniature antennas |
US10355346B2 (en) | 2000-01-19 | 2019-07-16 | Fractus, S.A. | Space-filling miniature antennas |
US9331382B2 (en) | 2000-01-19 | 2016-05-03 | Fractus, S.A. | Space-filling miniature antennas |
US8207893B2 (en) | 2000-01-19 | 2012-06-26 | Fractus, S.A. | Space-filling miniature antennas |
US8212726B2 (en) | 2000-01-19 | 2012-07-03 | Fractus, Sa | Space-filling miniature antennas |
US8610627B2 (en) | 2000-01-19 | 2013-12-17 | Fractus, S.A. | Space-filling miniature antennas |
US8471772B2 (en) | 2000-01-19 | 2013-06-25 | Fractus, S.A. | Space-filling miniature antennas |
EP2260850A2 (fr) | 2002-01-28 | 2010-12-15 | Kyowa Hakko Kogyo Co., Ltd | Antagonistes des récepteurs A2A pour utilisation dans le traitement des troubles du mouvement |
US9077073B2 (en) | 2002-11-07 | 2015-07-07 | Fractus, S.A. | Integrated circuit package including miniature antenna |
US10056691B2 (en) | 2002-11-07 | 2018-08-21 | Fractus, S.A. | Integrated circuit package including miniature antenna |
US7463199B2 (en) | 2002-11-07 | 2008-12-09 | Fractus, S.A. | Integrated circuit package including miniature antenna |
US10644405B2 (en) | 2002-11-07 | 2020-05-05 | Fractus, S.A. | Integrated circuit package including miniature antenna |
US8203488B2 (en) | 2002-11-07 | 2012-06-19 | Fractus, S.A. | Integrated circuit package including miniature antenna |
US9761948B2 (en) | 2002-11-07 | 2017-09-12 | Fractus, S.A. | Integrated circuit package including miniature antenna |
US7791539B2 (en) | 2002-11-07 | 2010-09-07 | Fractus, S.A. | Radio-frequency system in package including antenna |
US10320079B2 (en) | 2002-11-07 | 2019-06-11 | Fractus, S.A. | Integrated circuit package including miniature antenna |
US8330259B2 (en) | 2004-07-23 | 2012-12-11 | Fractus, S.A. | Antenna in package with reduced electromagnetic interaction with on chip elements |
US9899727B2 (en) | 2006-07-18 | 2018-02-20 | Fractus, S.A. | Multiple-body-configuration multimedia and smartphone multifunction wireless devices |
US10644380B2 (en) | 2006-07-18 | 2020-05-05 | Fractus, S.A. | Multiple-body-configuration multimedia and smartphone multifunction wireless devices |
US9099773B2 (en) | 2006-07-18 | 2015-08-04 | Fractus, S.A. | Multiple-body-configuration multimedia and smartphone multifunction wireless devices |
US11031677B2 (en) | 2006-07-18 | 2021-06-08 | Fractus, S.A. | Multiple-body-configuration multimedia and smartphone multifunction wireless devices |
US11349200B2 (en) | 2006-07-18 | 2022-05-31 | Fractus, S.A. | Multiple-body-configuration multimedia and smartphone multifunction wireless devices |
US11735810B2 (en) | 2006-07-18 | 2023-08-22 | Fractus, S.A. | Multiple-body-configuration multimedia and smartphone multifunction wireless devices |
Also Published As
Publication number | Publication date |
---|---|
AU6705900A (en) | 2001-02-13 |
FR2796759A1 (fr) | 2001-01-26 |
FR2796759B1 (fr) | 2001-11-02 |
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