WO2001008092A1 - Procede de fabrication de carte a puce de format reduit - Google Patents
Procede de fabrication de carte a puce de format reduit Download PDFInfo
- Publication number
- WO2001008092A1 WO2001008092A1 PCT/FR2000/002047 FR0002047W WO0108092A1 WO 2001008092 A1 WO2001008092 A1 WO 2001008092A1 FR 0002047 W FR0002047 W FR 0002047W WO 0108092 A1 WO0108092 A1 WO 0108092A1
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- WIPO (PCT)
- Prior art keywords
- chip
- integrated circuit
- manufacturing
- contact pads
- face
- Prior art date
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
- G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/072—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising a plurality of integrated circuit chips
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
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- G—PHYSICS
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- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07737—Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts
- G06K19/07739—Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts comprising a first part capable of functioning as a record carrier on its own and a second part being only functional as a form factor changing part, e.g. SIM cards type ID 0001, removably attached to a regular smart card form factor
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- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5388—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates for flat cards, e.g. credit cards
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Definitions
- the invention relates to a method of manufacturing a portable integrated circuit device, of the smart card type with a reduced format compared to the standard format of smart cards. It also relates to the device obtained by such a method.
- This device comprises two parallel flat faces, one of which has contact pads.
- the device according to the invention comprises at least two integrated circuit chips connected to each other and to said contact pads.
- smart cards with flush contact allow for example secure transactions of electronic payment, identification or telecommunications type.
- the dimensions of the cards and the positioning of the contacts are defined by a standard corresponding to international standards ISO 7810, 7816-1 and 7816-2.
- This first standard defines a card with or without contact as a portable element of small thickness and dimensions: 85 mm in length, 54 mm in width and 0.76 mm in thickness.
- a second standard made it possible to define the format of smart cards dedicated to the mobile telephony market.
- Smart cards dedicated to mobile telephony have a reduced format compared to the ISO format which has just been called back. These are 25 mm long and 15 mm wide mini-cards, the thickness being identical to the thickness of the cards meeting the first standard.
- a contact smart card comprises a plastic support in the form of a plate according to the ISO standard format. This support carries at least one electronic microcircuit (also called electronic module or electronic micromodule in the literature) and a series of contact pads for the electrical connection of the microcircuit to an operating circuit.
- the support for the smart card is produced by plastic molding or by lammation, then the microcircuit is incorporated into the card support during an operation. called "inserting". In practice, the microcircuit is bonded into a cavity provided for this purpose in the support. It is also recalled that so far, a smart card with a reduced format contact (mmi-card) compared to the standard ISO format, is produced from the process of manufacturing a standard format card which is completed. by a partial pre-cutting operation of the card holder to delimit a region comprising the contact area.
- mmi-card reduced format contact
- a contour slot 20 is formed in this support 200 around an internal portion 160 comprising the microcircuit 10 and the contact pads 14.
- This internal portion 160 has a substantially rectangular profile defined according to the GSM 11.11 standard. It is surrounded by the slot 20 which delimits the card corresponding to the second format, which remains integral with the external portion 180 of the standard format card 200 by straps 22, 24, 26 which we have taken care to leave during forming the contour slot 20.
- the card can then be used as is in the ISO standard format for credit cards, but also in mini-card format by detaching the internal portion 160, which carries the micromodule 10, from the external portion 180.
- the mobile telephony market is constantly changing and is tending towards greater miniaturization of mobile terminals. Therefore, the miniaturization of the mini-card format seems a necessity in order not to penalize the miniaturization of the terminals.
- FIG. 2 Such a device is illustrated in FIG. 2. It comprises a card body 100 of rectangular shape 15 mm in length and 10 mm in width with a thickness less than or equal to 0.76 mm and a polarization 105 of 1mm by 1mm on the lower right corner of card 100.
- Such a device makes it possible to meet a need for a reduced card format by optimizing the place of the integrated circuit in this new format and by being compatible with new generations of mobile telephones.
- Such a card 100 has the advantage of providing rigidity to the product by the presence of the contact grid 14 over its entire front face 30.
- the invention also aims to offer a GSM mini-card comprising a high-performance chip with a large capacity for accepting new functions, and the design and manufacture of which are rapid and economical.
- the invention consists in using standard chips from the electronics field, that is to say chips which are not specially designed for GSM, and assembling them to fulfill the desired functions. It is thus possible, at lower cost, to offer a new mini-card without developing a specific GSM chip.
- the present invention provides a method of manufacturing such a smart card of reduced format compared to standard formats.
- the method according to the invention proposes to use a plurality of integrated circuit chips to constitute the microcircuit of such a device of reduced format in order to increase its capacities and its functions.
- the present invention relates more particularly to a method of manufacturing a portable electronic device with integrated circuits comprising contact pads on a first face of the device, said device being of smart card type of reduced format compared to the standard format of smart cards, characterized in that it comprises the following steps: - transfer of a first integrated circuit chip onto a support strip comprising the contact pads; transfer of a second integrated circuit chip onto the first chip; - interconnection of the chips with each other and with the contact pads so as to form a micromodule; protection of integrated circuit chips and their connections by an insulating material constituting the second face of the device; obtaining the device by cutting the micromodule at the periphery of the contact pads constituting the first face.
- At least a third integrated circuit chip is transferred to the first chip and / or the second chip of the micromodule.
- the transfer of integrated circuit chips is carried out by bonding using an electrically insulating adhesive.
- the interconnection of the integrated circuit chips is carried out by a jet of conductive material.
- the interconnection of the integrated circuit chips is carried out by wire wiring.
- the protection of the integrated circuits and their connections is carried out by transfer molding of a resin so as to directly obtain the second face of the device.
- the protection of the integrated circuits and their connections is carried out by dispensing a resin, the second face of the device being produced by overmolding of the assembly.
- the cutting is carried out so as to obtain a keying device.
- the present invention also relates to a portable electronic device with integrated circuits, of the chip card type with a reduced format compared to the standard format of chip cards, characterized in that it comprises at least two integrated circuit chips interconnected with each other and electrically. connected to contact pads forming a first face of the device.
- the first chip covers almost the entire surface of the device.
- the second chip is transferred to the first chip, the second chip having dimensions smaller than those of the first chip.
- the device comprises at least a third integrated circuit chip transferred to the first chip and / or to the second chip.
- the first chip constitutes a memory chip.
- the second chip constitutes a device security chip.
- the third chip constitutes an interface chip between the first chip and the second chip.
- FIG. 1 shows a smart card according to the prior art
- Figure 2 shows a smart card according to the invention
- Figures 3a to 3d illustrate the first steps of the manufacturing process according to the invention
- Figure 4 illustrates a first embodiment of the connection step of the method according to the invention
- FIG. 5 illustrates a second embodiment of the connection step of the method according to the invention
- FIG. 6 illustrates the protection step of the method according to the invention
- FIG. 7 illustrates the step of cutting out the method according to the invention.
- a contact grid 18 such as a metallic plate of nickel-plated and gilded copper for example, is etched in order to constitute contact pads 14 intended to become the front face 30 of the device 100 according to the 'invention.
- the method according to the invention consists, firstly (FIG. 3b), in placing a dielectric sheet 15 on the metal grid 18.
- this sheet consists of a hot-rolled thermoplastic material on the grid 18.
- the dielectric sheet 15 will have been previously drilled in order to create wells 16 passing through the sheet 15 opposite each contact pad 14 of the grid 18.
- a first integrated circuit chip 1 is then bonded to the dielectric sheet 15, active face with the contact pads 7 upwards (FIG. 3c). Bonding is carried out using an electrically insulating adhesive.
- This first chip 1 covers almost the entire surface of the device 100. According to one application, it can be constituted by a memory chip, for example. A second integrated circuit chip 2 is then bonded to the first chip 1, active face with the contact pads 7 upwards (FIG. 3d). Bonding is also carried out using an electrically insulating adhesive. This second chip 2 has dimensions smaller than those of the first chip 1. According to a application, it can be constituted by a security chip.
- At least a third integrated circuit chip 3 can also be bonded to the first chip 1 and / or the second chip 2, active face with the contact pads 7 upwards (FIG. 3d). Bonding is also carried out using an electrically insulating adhesive.
- This third chip 3 has dimensions smaller than those of the first chip 1. According to one application, it can constitute the interface between the first chip 1 and the second chip 2.
- connections 17 can be made by traditional wired wiring ( Figure 4), or by jet of conductive material ( Figure 5) or by any other suitable means.
- a micromodule 10 is thus obtained with at least two integrated circuit chips electrically connected to the contact pads 14 via the wells 16 of the dielectric 15.
- FIG. 6 illustrates the protection step which makes it possible to produce the second planar face 40 of the device 100, and which can be obtained by various methods.
- the chips and the connections are protected by a coating resin deposited using any known means such as a "glob top" in English terminology, which designates the coating of the chip from above in a protective resin.
- the assembly is then overmolded with an insulating material.
- a transfer molding is carried out in order to directly obtain protection 8 for the chips and connections 17 as well as the second face 40 of the device 100.
- the devices 100 are then obtained by cutting using a cutting tool having a broken edge to form the polarizing device 105 (FIG. 7).
- the device thus produced has a format compatible with smart cards dedicated to mobile phones.
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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AU65763/00A AU6576300A (en) | 1999-07-26 | 2000-07-13 | Method for making smart card with reduced format |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9909684A FR2797075B1 (fr) | 1999-07-26 | 1999-07-26 | Procede de fabrication de dispositif portable a circuits integres, de type carte a puce de format reduit par rapport au format standard |
FR99/09684 | 1999-07-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2001008092A1 true WO2001008092A1 (fr) | 2001-02-01 |
Family
ID=9548521
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/FR2000/002047 WO2001008092A1 (fr) | 1999-07-26 | 2000-07-13 | Procede de fabrication de carte a puce de format reduit |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU6576300A (fr) |
FR (1) | FR2797075B1 (fr) |
WO (1) | WO2001008092A1 (fr) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8695881B2 (en) | 2004-06-30 | 2014-04-15 | Nxp B.V. | Chip card for insertion into a holder |
US10395164B2 (en) | 2016-12-15 | 2019-08-27 | Fingerprint Cards Ab | Fingerprint sensing module and method for manufacturing the fingerprint sensing module |
US11023702B2 (en) | 2016-12-15 | 2021-06-01 | Fingerprint Cards Ab | Fingerprint sensing module and method for manufacturing the fingerprint sensing module |
US11610429B2 (en) | 2016-12-15 | 2023-03-21 | Fingerprint Cards Anacatum Ip Ab | Fingerprint sensing module and method for manufacturing the fingerprint sensing module |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE20110585U1 (de) * | 2001-06-11 | 2001-11-15 | Cubit Electronics Gmbh | Kontaktloser Transponder |
JP2004005678A (ja) | 2002-05-20 | 2004-01-08 | Quadnovation Inc | コンタクトレストランザクションカード及びそのアダプター |
EP1437684A1 (fr) * | 2003-01-08 | 2004-07-14 | SCHLUMBERGER Systèmes | Module pour carte hybride |
FR2914460B1 (fr) | 2007-03-30 | 2009-08-21 | Oberthur Card Syst Sa | Module electronique mince pour carte a microcircuit. |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0702325A2 (fr) * | 1994-09-19 | 1996-03-20 | Fabrica Nacional De Moneda Y Timbre | Carte intelligente utile en telephonie et similaire |
DE19511775C1 (de) * | 1995-03-30 | 1996-10-17 | Siemens Ag | Trägermodul, insb. zum Einbau in einen kartenförmigen Datenträger, mit Schutz gegen die Untersuchung geheimer Bestandteile |
DE19526672A1 (de) * | 1995-07-21 | 1997-01-23 | Giesecke & Devrient Gmbh | Datenträger mit integriertem Schaltkreis |
DE19541072A1 (de) * | 1995-11-03 | 1997-05-07 | Siemens Ag | Chipmodul |
DE19701165C1 (de) * | 1997-01-15 | 1998-04-09 | Siemens Ag | Chipkartenmodul |
DE19735170A1 (de) * | 1997-08-13 | 1998-09-10 | Siemens Ag | Chipmodul, insbesondere für kontaktbehaftete Chipkarten, mit nebeneinander angeordneten Chips |
FR2761498A1 (fr) * | 1997-03-27 | 1998-10-02 | Gemplus Card Int | Module electronique et son procede de fabrication et carte a puce comportant un tel module |
-
1999
- 1999-07-26 FR FR9909684A patent/FR2797075B1/fr not_active Expired - Fee Related
-
2000
- 2000-07-13 WO PCT/FR2000/002047 patent/WO2001008092A1/fr active Application Filing
- 2000-07-13 AU AU65763/00A patent/AU6576300A/en not_active Abandoned
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0702325A2 (fr) * | 1994-09-19 | 1996-03-20 | Fabrica Nacional De Moneda Y Timbre | Carte intelligente utile en telephonie et similaire |
DE19511775C1 (de) * | 1995-03-30 | 1996-10-17 | Siemens Ag | Trägermodul, insb. zum Einbau in einen kartenförmigen Datenträger, mit Schutz gegen die Untersuchung geheimer Bestandteile |
DE19526672A1 (de) * | 1995-07-21 | 1997-01-23 | Giesecke & Devrient Gmbh | Datenträger mit integriertem Schaltkreis |
DE19541072A1 (de) * | 1995-11-03 | 1997-05-07 | Siemens Ag | Chipmodul |
DE19701165C1 (de) * | 1997-01-15 | 1998-04-09 | Siemens Ag | Chipkartenmodul |
FR2761498A1 (fr) * | 1997-03-27 | 1998-10-02 | Gemplus Card Int | Module electronique et son procede de fabrication et carte a puce comportant un tel module |
DE19735170A1 (de) * | 1997-08-13 | 1998-09-10 | Siemens Ag | Chipmodul, insbesondere für kontaktbehaftete Chipkarten, mit nebeneinander angeordneten Chips |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8695881B2 (en) | 2004-06-30 | 2014-04-15 | Nxp B.V. | Chip card for insertion into a holder |
US10395164B2 (en) | 2016-12-15 | 2019-08-27 | Fingerprint Cards Ab | Fingerprint sensing module and method for manufacturing the fingerprint sensing module |
US11023702B2 (en) | 2016-12-15 | 2021-06-01 | Fingerprint Cards Ab | Fingerprint sensing module and method for manufacturing the fingerprint sensing module |
US11610429B2 (en) | 2016-12-15 | 2023-03-21 | Fingerprint Cards Anacatum Ip Ab | Fingerprint sensing module and method for manufacturing the fingerprint sensing module |
Also Published As
Publication number | Publication date |
---|---|
FR2797075A1 (fr) | 2001-02-02 |
AU6576300A (en) | 2001-02-13 |
FR2797075B1 (fr) | 2001-10-12 |
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