Classifications

• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
  • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
  • G01R1/02—General constructional details
  • G01R1/06—Measuring leads; Measuring probes
  • G01R1/067—Measuring probes
  • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
  • G01R1/06733—Geometry aspects
  • G01R1/06744—Microprobes, i.e. having dimensions as IC details
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
  • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
  • G01R1/02—General constructional details
  • G01R1/06—Measuring leads; Measuring probes
  • G01R1/067—Measuring probes
  • G01R1/073—Multiple probes
  • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
  • G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
  • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
  • G01R1/02—General constructional details
  • G01R1/06—Measuring leads; Measuring probes
  • G01R1/067—Measuring probes
  • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
  • G01R1/06733—Geometry aspects
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
  • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
  • G01R1/02—General constructional details
  • G01R1/06—Measuring leads; Measuring probes
  • G01R1/067—Measuring probes
  • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
  • G01R1/06755—Material aspects
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
  • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
  • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
  • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
  • G01R31/2851—Testing of integrated circuits [IC]

Definitions

• the present invention relates to probe assemblies of the type commonly used for testing integrated circuits (IC) and, m particular, the present invention relates to a membrane probing assembly having contacts which scrub, m a locally controlled manner, across the respective input/output conductors of each device so as to reliably wipe clear the surface oxides that are normally found on those conductors thereby ensuring good electrical connection between the probing assembly and each device.
• IC integrated circuits
• One typical procedure is to support the wafer on a flat stage or "chuck” and to move the wafer m X, Y and Z directions relative to the head of the probing assembly so that the contacts on the probing assembly move from die to die for consecutive engagement with each die. Respective signal, power and ground lines are run to the probing assembly from the test instrumentation thus enabling each circuit to be sequentially connected to the test instrumentation.
• One conventional type of probing assembly used for testing integrated circuits provides contacts that are configured as needle-like tips These tips are mounted about a central opening formed m a probe card so as to radially converge inwardly and downwardly through the opening. When the wafer is raised beyond that point where the pads on the wafer first come into contact with these tips, the tips flex upwardly so as to skate for- wardly across their respective pads thereby removing oxide buildup on the pads.
• a second type of probing assembly uses a flexible membrane structure for supporting the probing contacts.
• lead lines of well- defined geometry are formed on one or more plies of flexible msulative film, such as polyimide or MYLARTM If separate plies are used, these plies are bonded together to form, for example, a multilayered transmission line structure.
• each conductive line is terminated by a respective probing contact which is formed on, and projects outwardly from, an outer face of the membrane.
• These probing contacts are arranged m a predetermined pattern that matches the pattern of the device pads and typically are formed as upraised bumps for probing the flat surfaces conventionally defined by the pads.
• the inner face of the membrane is supported on a supporting structure.
• This structure can take the form, for example, of a truncated pyramid, m which case the inner face of the center portion of the membrane is supported on the truncated end of the support while the marginal portions of the membrane are drawn away from the center portion at an angle thereto so as to clear any upright components that may surround the pads on the device.
• 4,918,383 shows a closely related device wherein radially extending leaf springs permit vertical axis movement of the rigid support while preventing it from tilting so that there is no slippage or "misalignment” of the contact bumps on the pads and further so that the entire membrane will shift slightly in the horizontal plane to allow the contacts to "scrub" across their respective pads in order to clear surface oxides from these pads.
• certain of the contact bumps are likely to be m a recessed position relative to their neighbors and these recessed bumps will not have a satisfactory opportunity to engage their pads since they will be drawn away from their pads by the action of their neighbors on the rigid support.
• a second conventional form of membrane probing assembly is exemplified by the device shown m Barsotti
• European Patent Pub. No. 304,868A2 This device provides a flexible backing for the central or contact -carrying portion of the flexible membrane.
• the membrane In Barsotti, the membrane is directly backed by an elastome ⁇ c member and this member, m turn, is backed by a rigid support so that minor height variations between the contacts or pads can be accommodated.
• positive-pressure air, negative-pressure air, liquid or an unbacked elastomer to provide flexible backing for the membrane, as shown m Gangroth U.S. Patent No. 4,649,339, Ardezzone U.S. Patent No. 4,636,772, Reed, Jr. et al . U.S. Patent No. 3,596,228 and Okubo et al .
• Pad damage is likely to occur with this type of design, however, because a certain amount of tilt is typically present between the contacts and the device, and those contacts angled closest to the device will ordinarily develop much higher contact pressures than those which are angled away.
• Garretson device the characteristic of the elastome ⁇ c member is such as to urge the contacts into lateral movement when those contacts are placed into pressing engagement with their pads.
• Yet another related assembly is shown m Evans U.S. Patent No. 4,975,638 which uses a pivotably mounted support for backing the elastomeric member so as to accommodate tilt between the contacts and the device.
• the Evans device is subject to the friction clinging problem already described insofar as the pads of the device are likely to cling to the contacts as the support pivots and causes the contacts to shift laterally.
• Yet other forms of conventional membrane probing assemblies are shown m Crumly U.S. Patent No. 5,395,253, Barsotti et al .
• each contact constitutes a spring metal finger, and each finger is mounted so as to extend m a cantilevered manner away from the underlying membrane at a predetermined angle relative to the membrane.
• a similar configuration is shown m Higgms U.S. Patent No. 5,521,518. It is difficult, however, to originally position these fingers so that they all terminate m a common plane, particularly if a high density pattern is required. Moreover, these fingers are easily bent out of position during use and cannot easily be rebent back to their original position. Hence, certain ones of the fingers are likely to touch down before other ones of the fingers, and scrub pressures and distances are likely to be different for different fingers.
• Evans at least, is there an adequate mechanism for tolerating a minor degree of tilt between the fingers and pads.
• Evans suggests roughening the surface of each finger to improve the quality of electrical connection, this roughening can cause undue abrasion and damage to the pad surfaces.
• Yet a further disadvantage of the contact fingers shown in both Evans and Higgins is that such fingers are subject to fatigue and failure after a relatively low number of "touchdowns" or duty cycles due to repeated bending and stressing.
• Cascade Microtech, Inc. of Beaverton, Oregon has developed a probe head 40 for mounting a membrane probing assembly 42.
• the high-speed digital lines 48 and/or shielded transmission lines 50 of the probe head are connected to the input/output ports of the test instrumentation by a suitable cable assembly, and the chuck 51 which supports the wafer is moved m mutually perpendicular X,Y,Z directions in order to bring the pads of the die area into pressing engagement with the contacts included on the lower contacting portion of the membrane probing assembly.
• the probe head 40 includes a probe card 52 on which the data/signal lines 48 and 50 are arranged. Referring to FIGS.
• the membrane probing assembly 42 includes a support element 54 formed of incompressible material such as a hard polymer.
• This element is detach- ably connected to the upper side of the probe card by four Allen screws 56 and corresponding nuts 58 (each screw passes through a respective attachment arm 60 of the support element, and a separate backing element 62 evenly distributes the clamping pressure of the screws over the entire back side of the supporting element) .
• different probing assemblies having different contact arrangements can be quickly substituted for each other as needed for probing different devices.
• the support element 54 includes a rearward base portion 64 to which the attach- ment arms 60 are integrally joined. Also included on the support element 54 is a forward support or plunger 66 that projects outwardly from the flat base portion. This forward support has angled sides 68 that converge toward a flat support surface 70 so as to give the forward support the shape of a truncated pyramid.
• a flexible membrane assembly 72 is attached to the support after being aligned by means of alignment pins 74 included on the base portion.
• This flexible membrane assembly is formed by one or more plies of msu- lative sheeting such as KAPTONTM sold by E . I . Du Pont de Nemours or other polyimide film, and flexible conductive layers or strips are provided between or on these plies to form the data/signal lines 76.
• the forward support 66 protrudes through a central opening 78 in the probe card so as to present the contacts which are arranged on a central region 80 of the flexible membrane assembly m suitable position for pressing engagement with the pads of the device under test.
• the membrane assembly includes radially extending arm segments 82 that are separated by inwardly curving edges 84 that give the assembly the shape of a formee cross, and these segments extend m an inclined manner along the angled sides 68 thereby clearing any upright components surrounding the pads
• a series of contact pads 86 terminate the data/signal lines 76 so that when the support element is mounted, these pads electrically engage corresponding termination pads provided on the upper side of the probe card so that the data/signal lines 48 on the probe card are electrically connected to the contacts on the central region.
• a feature of the probing assembly 42 is its capability for probing a somewhat dense arrangement of contact pads over a large number of contact cycles in a manner that provides generally reliable electrical connection between the contacts and pads m each cycle despite oxide buildup on the pads.
• This capability is a function of the construction of the support element 54, the flexible membrane assembly 72 and their manner of interconnection.
• the membrane assembly is so constructed and connected to the support element that the contacts on the membrane assembly preferably wipe or scrub, m a locally controlled manner, laterally across the pads when brought into pressing engagement with these pads.
• the preferred mechanism for producing this scrub- bmg action is described m connection with the construction and interconnection of a preferred membrane assembly 72a as best depicted m FIGS. 6 and 7a-7b.
• FIG. 6 shows an enlarged view of the central region 80a of the membrane assembly 72a.
• the contacts 88 are arranged m a square-like pattern suitable for engagement with a square-like arrangement of pads.
• FIG. 7a which represents a sectional view taken along lines la- la m FIG. 6, each contact comprises a relatively thick rigid beam 90 at one end of which is formed a rigid contact bump 92.
• the contact bump includes thereon a contacting portion 93 which comprises a nub of rhodium fused to the contact bump.
• each beam is formed m an overlapping connection with the end of a flexible conductive trace 76a to form a joint therewith.
• This conductive trace m conjunction with a back-plane conductive layer 94 effectively provides a controlled impedance data/signal line to the contact because its dimensions are established using a photolithographic process.
• the backplane layer preferably includes openings therein to assist, for example, with gas venting during fabrication.
• the membrane assembly is interconnected to the flat support surface 70 by an interposed elastome ⁇ c layer 98, which layer is coextensive with the support surface and can be formed by a silicone rubber compound such as ELMER'S STICK-ALLTM made by the Borden Company or Sylgard 182 by Dow Corning Corporation. This compound can be conveniently applied in a paste-like phase which hardens as it sets.
• the flat support surface as previously mentioned, is made of incompressible material and is preferably a hard dielectric such as polysulfone or glass.
• FIG. 8 shows, m dashed line view, the relative positions of the contact 88 and pad 100 at the moment of initial engagement or touchdown and, m solid-line view, these same elements after "overtravel" of the pad by a distance 106 m a vertical direction directly toward the flat support surface 70.
• the distance 108 of lateral scrubbing movement is directly dependent on the vertical deflection of the contact 88 or, equiva- lently, on the overtravel distance 106 moved by the pad 100.
• the elastomeric layer 98 is backed by the incompressible support surface 70, the elastomeric layer exerts a recovery force on each tilting beam 90 and thus each contact 93 to maintain contact-to-pad pressure during scrubbing.
• the elastomeric layer accommodates some height variations between the respective contacts.
• FIG 9a when a relatively shorter contact 88a is situated between an immediately adjacent pair of relatively taller contacts 88b and these taller contacts are brought into engagement with their respective pads, then, as indicated m FIG. 9b, deformation by the elastomeric layer allows the smaller contact to be brought into engagement with its pad after some further overtravel by the pads.
• the tilting action of each contact is locally controlled, and the larger contacts are able, m particular, to tilt independently of the smaller contact so that the smaller contact is not urged into lateral movement until it has actually touched
• the electroplating process to construct such a beam struc- ture includes the incompressible material 68 defining the support surface 70 and the substrate material attached thereon, such as the elastomeric layer 98.
• the flexible conductive trace 76a is then patterned on a sacrificial substrate.
• a polyimide layer 77 is patterned to cover the entire surface of the sacrificial substrate and of the traces 76a, except for the desired location of the beams 90 on a portion of the traces 76a.
• the beams 90 are then electroplated withm the openings m the polyimide layer 77.
• a layer of photoresist 79 is patterned on both the surface of the polyimide 77 and beams 90 to leave openings for the desired location of the contact bumps 92.
• the contact bumps 92 are then electroplated withm the openings m the photoresist layer 79.
• the photoresist layer 79 is removed and a thicker photoresist layer 81 is patterned to cover the exposed surfaces, except for the desired locations for the contacting portions 93.
• the contacting portions 93 are then electroplated withm the openings in the photoresist layer 81.
• the photoresist layer 81 is then removed.
• the sacrificial substrate layer is removed and the remaining layers are attached to the elastomeric layer 98.
• the resulting beams 90, contact bumps 92, and contacting portions 93 provides the independent tilting and scrubbing functions of the device.
• the ability to decrease the pitch (spacing) between the devices is limited by the "mushrooming" effect of the electroplating process over the edges of the polyimide 77 and photoresist layers 79 and 81.
• the "mushrooming" effect is difficult to control and results m a variable width of the beams 90, contact bumps 92, and contacting portions 93. If the height of the beams 90, the contact bumps 92, or the contacting portions 93 are increased then the "mushrooming" effect generally increases, thus increasing the width of the respective portion. The increased width of one part generally results m a wider overall device which m turn increases the minimum spacing between contacting portions 93.
• decreasing the height of the beams 90, the contact bumps 92, or the contacting portions 93 generally decreases the width of the "mushrooming" effect which m turn decreases the minimum spacing between contacting portions 93.
• the height of the contacting portions 93 relative to the respective beam 90 is sufficiently reduced, then during use the rearward end of the beam 90 may sufficiently tilt and contact the test device m an acceptable location, i.e., off the contact pad.
• a second metal layer directly on top of a first metal layer such as contacting portions 93 on the contact bumps 92, especial - ly when using nickel .
• an interface seed layer such as copper or gold is used to make an improved interconnection.
• the interface seed layer reduces the lateral strength of the device due to the lower sheer strength of the interface layer .
• the photoresist layer 79 (and 81) over the raised portions of the beams 90 tends to be thicker than the photoresist layer 79 (and 81) over the lower portions of the polyimide 77.
• the thickness of the photoresist 79 (and 81) tends to vary depending on the density of the beams 90.
• the photoresist layer 79 (and 81) will be thicker on average than regions of the membrane probe that have a less dense spacing of devices .
• the duration of the process depends on the thickness of the photoresist 79 (or 81) . Witn variable photoresist thickness it is difficult to properly process the photoresist to provide uniform open- mgs .
• the thinner regions of photoresist layer 79 (or 81) will tend to be overexposed resulting m variably sized openings.
• the greater the photoresist layer thickness 79 (or 81) the greater the variability m its thickness. Accordingly, the use of photoresist presents many processing problems .
• the minimum size of the contacting portions 93 is defined primarily by the lateral strength requirements and the maximum allowable current density therein.
• the minimum size of the contacting portions 93 accounting for the tolerances alignment, turn defines the minimum size of the con- tact bumps 92 so that the contacting portions 93 are definitely constructed on the contact bumps 92.
• the minimum size of the contact bumps 92 in view of the contacting portions 93 and accounting for the tolerances in alignment, defines the minimum size of the beams 90 so that the contact bumps 92 are definitely constructed on the beams 90. Accordingly, the summation of the tolerances of the contact bumps 92 and the contacting portions 93, together with a minimum size of the contacting portions 93, defines the minimum device size, and thus defines the minimum pitch between contact pads.
• the present invention overcomes the aforementioned drawbacks of the prior art by providing a substrate, preferably constructed of a ductile material.
• a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought mto contact with the substrate.
• the tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein.
• a dielectric (msulative) layer, that is preferably patterned, is supported by the substrate.
• a conductive material is located within the depressions and then preferably planarized to remove excess from the top surface of the dielectric layer and to provide a flat overall surface.
• a trace is patterned on the dielectric layer and the conductive material.
• a polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.
• FIG. 1 is a perspective view of a membrane probing assembly bolted to a probe head and a wafer supported on a chuck in suitable position for probing by this assembly.
• FIG. 2 is a bottom elevational view showing various parts of the probing assembly of FIG. 1, including a support element and flexible membrane assembly, and a fragmentary view of a probe card having data/signal lines connected with corresponding lines on the membrane assembly.
• FIG. 3 is a side elevational view of the membrane probing assembly of FIG. 1 where a portion of the membrane assembly has been cut away to expose hidden portions of the support element.
• FIG. 4 is a top elevational view of an exemplary support element.
• FIGS. 5a-5b are schematic side elevational views illustrating how the support element and membrane assembly are capable of tilting to match the orientation of the device under test .
• FIG. 6 is an enlarged top elevational view of the central region of the construction of the membrane assembly of FIG. 2.
• FIGS. 7a-7b are sectional views taken along lines la- la m FIG. 6 first showing a contact before touchdown and then showing the same contact after touchdown and scrub movement across its respective pad.
• FIG. 8 is a schematic side view showing, m dashed-lme representation, the contact of FIGS. 7a-7b at the moment of initial touchdown and, in solid-line representation, the same contact after further vertical overtravel by the pad.
• FIGS. 9a and 9b illustrate the deformation of the elastomeric layer to bring the contacts mto contact
• FIG. 10 is a longitudinal sectional view of the device of FIG. 8.
• FIG. 11 is a cross sectional view of the device of FIG. 8.
• FIG. 12 is a more accurate pictorial view of the device shown FIGS. 10 and 11.
• FIG. 13 is a detailed view of the device shown m FIG. 11 illustrating the uneven layers that result during processing.
• FIG. 14 is a pictorial view of a substrate.
• FIG. 15 is a pictorial view of an exemplary embodiment of a tool, and m particular a dimpling tool, of the present invention.
• FIG. 16 is a pictorial view illustrating the tool of FIG. 15 coming into contact with the substrate of FIG. 14.
• FIG. 17 is a pictorial view of the substrate of FIG. 14 after the tool of FIG. 15 has come mto contact therewith.
• FIG. 18 is a sectional view of the substrate of FIG. 14 with a polyimide layer supported thereon.
• FIG. 19 is a pictorial view of the tool of FIG. 16 together with a z-axis stop.
• FIG. 20 is a sectional view of the substrate of
• FIG. 14 with a trace, conductive material in the depression, and additional polyimide layer thereon.
• FIG. 21 is a pictorial view of the device of FIG. 20, inverted, with the substrate removed.
• FIG. 22 is a breakaway sectional view of the contacting portion of FIG. 21.
• FIG. 23 is a schematic view illustrating one arrangement of the devices of the present invention.
• FIG. 24 is a schematic view illustrating the contact of a traditional contacting portion and the oxide layer of a solder bump.
• FIG. 25 is a plan view of an alternative device with an elongate probing portion.
• FIG. 26 is a side view of the device of FIG. 25 with an elongate probing portion.
• FIG. 27 is a pictorial view of a solder bump with a mark therein as a result of the device of FIGS. 25 and 26.
• FIG. 28 is a pictorial view of another alternative probing device.
• FIG. 29 is a pictorial view of a further alternative probing device suitable for solder bumps.
• FIG. 30 is a side view of a true Kelvin connection using the devices of the present invention.
• a substrate 200 is preferably constructed from a ductile material such as aluminum, copper, lead, indium, brass, gold, silver, platinum, or tantalum, with a thickness preferably between 10 mills and 1/8 inch.
• the top surface 202 of the substrate 200 is preferably planar and polished for optical clarity to improve viewing, as described later.
• a tool and in particular a "dimpling" tool 210 is constructed with a head 212 having the desired shape of the resulting device for contacting the contact pads on the test device.
• the dimpling tool 210 includes a projection 214 to connect to a dimpling machine (not shown) .
• the tool 210 is supported by the dimpling machine with the head 212 oriented to come mto contact with the top surface 202 of the substrate 200.
• the tool 210 is preferably constructed of a material that is harder than the substrate 200 so that a dimple can be readily made therein.
• Suitable material for the tool 210 is, for example, tool steel, carbide, chromium, and diamond.
• the preferred dimpling machine is a probe station which has accurate x, y, and z control . It s to be understood that any other suitable dimpling machine may likewise be used. Referring to FIG. 16, the tool 210 is pressed into contact with the top surface 202 of the substrate 200 resulting a depression 216 matching the shape of the tool 210 upon its removal from the substrate 200, as shown FIG. 17 The tool 210 is used to create a plurality of depressions 216 the substrate 200 matching the desired pattern, such as the pattern shown FIG. 6.
• the tool 210 can be held stationary and the substrate 200 can be moved the z-direction until the top surface 202 of the substrate is pressed mto contact with the tool 210 resulting the same depression 216 matching the shape of the tool 210 upon its removal from the substrate 200, as shown m FIG. 17.
• a polyimide layer 220 is patterned around the depressions 216. It is to be understood that any other suitable msulative layer or dielectric layer may likewise be used. In the process of patterning the polyimide layer 220, it is somewhat difficult to remove the polyimide from the depressions 216 during the exposing and etching process for the polyimide layer 220. This is especially true when the depressions 216 are relatively deep with steeply inclined sides.
• the polyimide layer 220 may be patterned on the top surface 202 of the substrate 200 with openings located therein where the depressions 216 are desired. Thereafter, the tool 210 is used to create the depressions 216 the substrate 200 through the openings provided in the polyimide layer 220.
• This alternative technique eliminates the difficult process of adequately removing the polyimide layer 220 from the depressions 216. It is expensive to manufacture masks for exposing the polyimide layer 220 that have tolerances sufficient to precisely align the openings for the depressions 216.
• the tool 210, m combination with the dimpling machine can be aligned to the actual location of one of the openings that results from exposing and etching the polyimide layer 220 with a relatively inexpensive, and somewhat inaccurate mask.
• the present inventors came to the realization that localized regions of the mask, and thus the openings resultmg therefrom, tend to be relatively well aligned for purposes of dimpling Likewise, regions of the mask distant from one another tend not to be relatively well aligned for purposes of dimpling.
• the dimpling machine may be realigned to the actual openings m the polyimide layer 220 at different remote locations, so that each localized region is relatively accurately aligned, while the overall alignment may be somewhat off. In this manner a relatively inexpensive mask may be used.
• the dimpling machine includes accurate z-axis movement so that the depth of each depression is identical, or substantially identical. Referring to FIG.
• an alternative dimpling tool 240 with a built in z-axis stop 242 may be used.
• the z-axis stop 242 is a projection extending outward from the head 244 that comes to rest on the top surface of the polyimide 220 or top surface 202 of the substrate 200.
• the z-axis stop 242 is positioned with respect to the head 244 such that the proper depth is obtained, taking into account whether or not the polyimide layer 220 is previously patterned before using the dimpling tool 240.
• a conductive material 250 is electroplated onto the polyimide 220 and substrate 200 thereby filling up the depressions 216 with the conductive material 250, such as nickel and rhodium. It is to be understood that any other suitable technique may be used to locate conductive material withm the depressions 216.
• the conductive material 250 is then preferably lapped to remove excess from the top surface of the polyimide layer 220 and to provide a flat overall surface.
• the preferred lapping process is a chemical - mechanical plana ⁇ zation process.
• a trace 252 is patterned on the polyimide layer 220 and the conductive material 250.
• the trace 252 is preferably a good conductor such as copper, aluminum, or gold.
• a polyimide layer 254 is then patterned over the entire surface.
• the substrate 200 is then removed by any suitable process, such as etching with hydrochloric acid (HCL 15%) or sulfuric acid (H 2 S0 4 ) .
• Hydrochloric acid and sulfu ⁇ c acid are not reactive with the polyimide layer 220 nor the conductive material 250, such as nickel or rhodium.
• the polyimide layer 254 may alternatively be any suitable insulator or dielectric layer.
• the contacting portion 260 of the resulting device is preferably selected to have a low contact resistance so that a good electrical connection may be made with the test device. While nick- el has a relatively low contact resistance, rhodium has an even lower contact resistance and is more resistant to wear than nickel. Accordingly, the depressions 216 are preferably coated with a layer of rhodium. Using normal processing techniques the thickness of rhodium is limited to approximately 5 microns.
• the resulting device includes an exterior layer of rhodium, and m particular the contacting portion 260, which is then filled with the remaining conductive material, such as nickel or a nonconductive fill. The conductive material need not fill the entire depression.
• top-down construction process provides numerous advantages over the traditional "bottom-up" processing technique of constructing layers upon a supporting substrate. These advantages also permit the capability of constructing devices with improved characteristics.
• the ability to construct devices having any suitable height also relieves the limitations imposed by attempting to electroplate mto a tall narrow openings m photoresist, which is difficult.
• the elevation of the contacting portions 260 of the devices is extremely uniform because it is defined solely by the tooling process, which is mechanical in nature. Different localized current densities of the electroplating bath, different densities of the ions withm the electroplating bath, and "random" variations m the electroplating bath are eliminated from impacting the overall shape and height of the resulting devices. With substantially uniform elevation of the devices, less force is required for the devices to make adequate contact with the test device which, m turn, decreases the likelihood of bending and breaking the probe station, the probe head, and/or the membrane probing assembly. Also, the substantially uniform elevation of the devices decreases the likelihood of damaging contact pads on the test device with excessive pressure.
• the contacting portion 260 of the devices are stronger because the device is constructed of a single homogenous material during one depositing process requiring no mterfacial layers, as previously required for the multiple processing steps. This permits reducing the size of the contacting portions to the limitation of the maximum current density allowable therein during testing and not the minimum sheer force of the mterfacial layers.
• the shape of the resulting devices are customizable to effectively probe different materials.
• the shape of the device may have steep sidewall angles, such as 85 degrees, while still providing mechanical strength, stability, and integrity.
• the steep sidewalls permit narrower devices to be constructed which allows for a greater density of devices for increasingly denser arrangements of contact pads on the test device.
• the angle of the sidewalls are not dependent (e.g. independent) on the crystalline structure of the substrate .
• the shape of the contacting portion is known precisely, and is uniform between devices, which permits uniform contact with the contact pads of the test device.
• the alignment of the different portions of the resultmg device are exactly uniform between devices because each device was constructed using the same tooling process. With exact alignment of the lower portions of each device (beam and contact bump) m relation to the contacting portion, there is no need to provide additional leeway to accommodate processing variations inherent in photoresist processes and in electroplating processes. Also, the "mushrooming" effect of the electroplating process is eliminated which also reduces the required size of the device.
• the alignment variability reduction, and virtual elimination, of different devices 300 allows a significantly decreased pitch to be obtained, suitable for contact pads on the test device that have increased density.
• the shape of the resulting devices may be tailor shaped to provide optimal mechanical performance.
• the device should have a beam and bump structure that tilts upon contact.
• the device 300 may include an inclined surface 304 between its tail 302 and the contacting portion 260.
• the inclined surface 304 provides for increased strength along portions of the length of the device 300 which permits the tail 302 to be thinner than its head 306.
• the torque forces applied to the device 300 during the tilting process of the device 300 tend to decrease over the length of the device 300 which has a correspondingly thinner material defined by the inclined surface 304.
• With a thinner tail 302 and material proximate the tail 302, the tail 302 of the device 300 has less likelihood of impacting the test device if excess tiling occurs.
• the improved shape of the device 300 also decreases the amount of metal material required.
• "look-up" cameras are used to obtain an image of the lower portion of the membrane probe to determine the precise location of the devices 300 relative to the contact pads on the test device. Using “look-up” cameras permits automatic alignment of the membrane devices relative to the contact pads so that automatic testing may be performed. In order to obtain an image of the devices 300 on the membrane probe the "look-up” cameras normally utilize light to illuminate the devices 300. Unfortunately, the traditional planar processing techniques result in relatively flat surfaces on the beams, contact bumps, and contacting portions, a perpendicular orientation to the "look up” cameras each of which reflects light back to the "look-up” camera. The light reflecting back to the "look up” camera from all the surfaces frequently results m some confusion regarding the exact location of the contacting portions 260.
• the inclined surface 304 of the devices 300 tends to reflect incident light away from lowerly disposed "look-up” cameras, while the contacting portions 306 tend to reflect incident light back to lowerly disposed “look-up” cameras. Light returning to the "look-up" camera primarily from the contacting portions 306 results m less potential confusion regarding the exact location of the contacting portions.
• the initial polishing of the top surface 202 of the substrate 200 results m a matching smooth lower surface for the polyimide layer 220 patterned thereon.
• the substrate 200 After etching away, or otherwise removing, the substrate 200 the lower surface of the polyimide layer 220 is smooth and the resulting polyimide layer 220 is generally optically clear.
• the spaces between the traces and the metallized devices 300 is relatively optically transmissive so that an operator positioning the device can readily see through the device between the traces and devices. This assists the operator in manually positioning the membrane probe on the devices which are otherwise obscured.
• the pyramidal shape of the devices 300 allows the operator to more easily determine the exact location of the contacting portions relative to the contact pads on the test device, which were previously obscured by the wide beam structures (relative to the contacting portions) .
• the contacting portions 260 of the device are preferably constructed with an exterior surface of rhodium 340, which typically can be effectively plated to only approximately a thickness of 5 microns.
• the plating process of rhodium is semi-conformal , so the resulting layer is approximately 5 microns thick a perpendicular direction to the exterior sides 352 and 354.
• the width of the top 350 of the contacting portion and the angle of the sides 352 and 354 of the tool 210 is selected so that the rhodium 340 plated on both sides 352 and 254 preferably join together forming a v-shape.
• the remainder of the device is preferably nickel.
• the thickness of the rhodium 340 is only 5 microns in a perpendicular direction, the thickness of the rhodium 340 a perpendicular direction from the top 350 of the device is greater than 5 microns. Accordingly, the contacting portion which wears during use m a generally perpendicular direction from the top 350 will last longer than if the top portion were merely plated to a thickness of 5 microns of rhodium.
• the texture of the contacting portion 260 may be selected to provide the described scrubbing effect on the contact pads of the test device.
• the tool may include a roughened surface pattern on the corresponding contacting portion to provide a uniform texture for all devices.
• the aforementioned construction technique also provides several advantages related to the shape of the devices which would be otherwise difficult, if not impossible, to construct.
• the tool may provide any desired shape, such as a simple bump, if no scrubbing action is desired.
• the inclined supporting sides of the test device up to the contacting portion 260 provides superior mechanical support for the contacting portion
• the contacting portion may be smaller without risk of it becoming detached from the device.
• the smaller contacting portion provides improved contact with the contact pad of the test device when the device tilts to penetrate the oxide buildup on the surface of the contact pad.
• the tail 302 of the device may be substantially thinner than the remainder of the device which decreases the likelihood of the tail 302 portion impacting the contact pad of the test device during testing when the device tilts.
• the pressure exerted by the contacting portions of the devices is variable by changing the center of rotation of the device.
• the center of rotation of the device can be selected by selecting the length of the device and the location/height of the contacting portion relative thereto. Accordingly, the pressures can be selected, as desired, to match characteristics of two different contact pads.
• a triangular shape of the footprint of the device allows for high lateral stability of the devices while permitting a decrease m the pitch between devices.
• the contacting portions 403 of the device are preferably aligned m a linear arrangement for many contact pads of test devices.
• the triangular portions of the device are aligned in alternatively opposing directions.
• the capability of constructing contacting portions that are raised high from the lower surface of the device, while still maintaining uniformity m the device height and structural strength, allows the device to provide scrubbing action while the lower surface of the device requires little movement.
• the small movement of the lower surface of the device to make good electrical contact during testing decreases the stress on the layers under the lower surface of the device. Accordingly, the likelihood of cracking the polyimide layers and the conductive traces is reduced.
• the oxide 285 tends to be pressed mto the solder bump 287 together with the contacting portion 289 resulting m a poor interconnection.
• the needles tend to skate on the solder bumps, bend under withm the solder bumps, collect debris on the needles, flake the debris onto the surface of the test device, and cleaning the needle probes is time consuming and tedious Moreover, needle probes leave non-uniform probe marks on the solder bumps When probing solder bumps used on flip-chips, the probe marks left the upper portion of the solder bump tends to trap flux therein, which when heated tends to explode, which degrades, or otherwise destroys, the interconnection.
• the upper portion of the device mcludes a pair of steeply inclined sides 291 and 293, such as 15 degrees off vertical, with preferably polished sides.
• the inclined sides 291 and 293 preferably form a sharp ridge 295 at the top thereof.
• the angle of the sides 291 and 293 is selected with regard to the coefficient of friction between the sides and the oxide on the solder bump, so that the oxide coated surface tends to primarily slide along the surfaces of the sides 291 and 293, or otherwise shear away, and not be significantly carried on the sides as the device penetrates a solder bump.
• the substantially sharp ridge also provides for a mark (detent) after contact that extends across the entire solder bump. Subsequent heating of the solder bumps, together with flux, result m the flux exiting from the sides of the solder bump thereby avoiding the possibility of explosion.
• the resulting mark left on the solder bumps is uniform m nature which allows manufacturers of the solder bumps to account for the resulting marks m their design. Also, less force is required to be applied to the device because it tends to slice through the solder bump rather than make pressing contact with the solder bump.
• the flatter surface 405 prevents slicing too deeply mto the solder ball (bump) .
• a waffle pattern may be used.
• an alternative device includes a pair of projections 311 and 313 that are preferably at the ends of an arch 315.
• the spacing between the projections 311 and 313 is preferably less than the diameter of the solder bump 317 to be tested. With such an arrangement the projections 311 and 313 will strike the sides of the solder bump 317 thereby not leaving a mark on the upper portion of the solder bump 317. With marks on the sides of the solder bump 317, the subsequent flux used will be less likely to become trapped with the mark and explode.
• the alignment of the device is not centered on the solder bump 317 then it is highly likely that one of the projections 311 and 313 will still strike the solder bump 317.
• Kelvin connections A more detailed analysis of Kelvin connections is described m Fink, D.G., ed., Electronics Engineers' Handbook, 1st ed., McGraw-Hill Book Co., 1975, Sec. 17-61, pp. 17-25, 17-26, "The Kelvin Double Bridge", and U.S. Patent Application Serial No. 08/864,287, both of which are incorporated by reference herein. It is to be noted that none to all of the aforementioned advantages may be present m devices constructed accordingly to the present mvention, depending on the technique used, desired use, and structure achieved.

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• Engineering & Computer Science (AREA)
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• Microelectronics & Electronic Packaging (AREA)
• General Engineering & Computer Science (AREA)
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• 1999
  • 1999-07-21 JP JP2001512067A patent/JP2003505871A/ja active Pending
  • 1999-07-21 CN CNB998168165A patent/CN1174836C/zh not_active Expired - Fee Related
  • 1999-07-21 KR KR1020027000301A patent/KR100724131B1/ko not_active IP Right Cessation
  • 1999-07-21 EP EP99937404A patent/EP1210208A4/en not_active Withdrawn
  • 1999-07-21 WO PCT/US1999/016653 patent/WO2001007207A1/en active IP Right Grant
  • 1999-07-21 AU AU52244/99A patent/AU5224499A/en not_active Abandoned

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