WO2000068739A1 - Photosensitive composition - Google Patents
Photosensitive composition Download PDFInfo
- Publication number
- WO2000068739A1 WO2000068739A1 PCT/EP2000/004009 EP0004009W WO0068739A1 WO 2000068739 A1 WO2000068739 A1 WO 2000068739A1 EP 0004009 W EP0004009 W EP 0004009W WO 0068739 A1 WO0068739 A1 WO 0068739A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- compound
- composition according
- formula
- coating
- oligomeric
- Prior art date
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- 239000000203 mixture Substances 0.000 title claims abstract description 88
- 150000001875 compounds Chemical class 0.000 claims abstract description 43
- 229910000679 solder Inorganic materials 0.000 claims abstract description 24
- 125000004122 cyclic group Chemical group 0.000 claims abstract description 10
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims abstract description 5
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 3
- 239000001257 hydrogen Substances 0.000 claims abstract description 3
- 230000007704 transition Effects 0.000 claims abstract description 3
- 238000000576 coating method Methods 0.000 claims description 34
- 239000011248 coating agent Substances 0.000 claims description 28
- 229920000642 polymer Polymers 0.000 claims description 27
- -1 phosphazene compound Chemical class 0.000 claims description 26
- 239000011230 binding agent Substances 0.000 claims description 19
- 239000000758 substrate Substances 0.000 claims description 13
- 238000004132 cross linking Methods 0.000 claims description 12
- 230000005855 radiation Effects 0.000 claims description 12
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 10
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- 239000002904 solvent Substances 0.000 claims description 9
- 230000008569 process Effects 0.000 claims description 8
- 239000000654 additive Substances 0.000 claims description 7
- 238000001723 curing Methods 0.000 claims description 6
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- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 6
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- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 2
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- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
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- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
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- DZKXDEWNLDOXQH-UHFFFAOYSA-N 1,3,5,2,4,6-triazatriphosphinine Chemical compound N1=PN=PN=P1 DZKXDEWNLDOXQH-UHFFFAOYSA-N 0.000 description 1
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- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 description 1
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- PIZHFBODNLEQBL-UHFFFAOYSA-N 2,2-diethoxy-1-phenylethanone Chemical compound CCOC(OCC)C(=O)C1=CC=CC=C1 PIZHFBODNLEQBL-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
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- 125000003580 L-valyl group Chemical group [H]N([H])[C@]([H])(C(=O)[*])C(C([H])([H])[H])(C([H])([H])[H])[H] 0.000 description 1
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- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 239000008240 homogeneous mixture Substances 0.000 description 1
- 150000001469 hydantoins Chemical class 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 150000007928 imidazolide derivatives Chemical class 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 150000003951 lactams Chemical class 0.000 description 1
- 229910001338 liquidmetal Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- 229920003145 methacrylic acid copolymer Polymers 0.000 description 1
- XJRBAMWJDBPFIM-UHFFFAOYSA-N methyl vinyl ether Chemical compound COC=C XJRBAMWJDBPFIM-UHFFFAOYSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 229960000907 methylthioninium chloride Drugs 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- GKTNLYAAZKKMTQ-UHFFFAOYSA-N n-[bis(dimethylamino)phosphinimyl]-n-methylmethanamine Chemical class CN(C)P(=N)(N(C)C)N(C)C GKTNLYAAZKKMTQ-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000002923 oximes Chemical class 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 150000003004 phosphinoxides Chemical class 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 150000008442 polyphenolic compounds Chemical class 0.000 description 1
- 235000013824 polyphenols Nutrition 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000007763 reverse roll coating Methods 0.000 description 1
- 238000009666 routine test Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- KXCAEQNNTZANTK-UHFFFAOYSA-N stannane Chemical compound [SnH4] KXCAEQNNTZANTK-UHFFFAOYSA-N 0.000 description 1
- 229910000080 stannane Inorganic materials 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 229960002317 succinimide Drugs 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 150000005326 tetrahydropyrimidines Chemical class 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 150000003852 triazoles Chemical class 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- 239000013638 trimer Substances 0.000 description 1
- 229940096522 trimethylolpropane triacrylate Drugs 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
Definitions
- the present invention relates to a photosensitive composition which is particularly suitable for use as photostructurable photoresist and which contains at least one selected phos- phazene compound.
- the novel composition can be used, for example, as photostructurable solder resist in the production of solder masks for printed circuit boards.
- Photosensitive compositions suitable for use as photostructurable photoresist are known per se. As a rule they contain at least (a) one film-forming crosslinkable polymeric compound, (b) one monomeric and/or oligomeric photopolymerisable compound and (c) one photoinitia- tor. These compositions can additionally contain numerous other components, for example a crosslinker, preferably a corresponding epoxy resin, fillers, and other additives.
- the photosensitive composition When using a photosensitive composition as photostructurable photoresist, the photosensitive composition is usually applied in a thin layer to the material to be coated and is then irradiated image-wise with a suitable radiation.
- the film-forming crosslinkable polymers and/or the photopolymerisable monomeric and/ or oligomeric compounds polymerise in this process. Owing to the photopolymerisation of the cited components, the solubility is reduced at the exposed sites of the resist coating compared to at the unexposed sites so that differentiation and structuration of the surface becomes possible. After irradiation, development is carried out. The action of a developer solution makes it possible to remove the unexposed sites of the coating.
- the remaining coating is preferably subjected to thermal aftertreatment or curing in the course of which any possibly present heat-curable component is cured, full curing being carried out, if required, with suitable irradiation prior to or after that aftertreatment.
- the film-forming polymeric compound imparts to the cured coating, e.g. a solder mask, a large part of the required mechanical solidity. Hardness and durability of the cured coating, however, are held to result from, inter alia, the presence of a cured epoxy resin.
- solder masks are very high. Therefore, to increase the surface hardness, hard fillers such as quartz powder or barium sulfate are incorporated into the coating or starting mixture.
- hard fillers such as quartz powder or barium sulfate are incorporated into the coating or starting mixture.
- the printed circuit boards thus coated are, however, highly sensitive in the nickel-gold process. In particular, moisture or solvent may penetrate under the solder mask, resulting in the paint flaking off.
- the solder mask applied as a paint becomes more brittle if hard fillers are added. The adhesive properties are also impaired.
- photosensitive compositions which are suitable, for example, for use as photostructurable photoresist, in particular as photostructurable solder resist in the production of solder masks, for printed circuit boards may be substantially increased by the addition of selected polymerisable phosphazene compounds.
- This invention relates in particular to a photosensitive polymerisable composition which is suitable for use as photostructurable photoresist, which composition comprises at least one cyclic and/or oligomeric compound composed of structural units of formula (I)
- R is identical or different radicals of formula
- R T is hydrogen or methyl
- composition preferably contains a 6-membered or 8-membered cyclic compound consisting of units of formula (I), wherein n is 3 or 4.
- composition particularly preferably contains a compound of formula (la):
- the novel photosensitive composition is particularly suitable for use as photostructurable solder resist for the production of solder masks for printed circuit boards.
- the invention relates in particular to a photosensitive photopolymerisable composition, which comprises at least (a) one film-forming crosslinkable polymeric compound (binder), (b) one monomeric and/or oligomeric photopolymerisable compound, (c) one photoinitiator and (d) at least one cyclic and/or oligomeric compound composed of units of the above formula (I), wherein the individual substituents have the meanings cited there, and, optionally, further additives, in particular those selected from the group consisting of the crosslinkers, preferably crosslinking epoxy resins, and fillers, dyes, pigments, defoamers, adhesion promoters, fungicides and thixotropic agents.
- a photosensitive photopolymerisable composition which comprises at least (a) one film-forming crosslinkable polymeric compound (binder), (b) one monomeric and/or oligomeric photopolymerisable compound, (c) one photoinitiator and (d) at least one cycl
- the compounds (a) and (b) can also be combined in a single compound or in different compounds, which lies within the scope of this invention.
- the monomeric or oligomeric photopolymerisable compound (b) can contain crosslinking groups, for example hydroxyl groups.
- the film-forming compound for example, may also be modified such that it contains hydroxyl groups and polymerises photochemically when suitably irradiated.
- this invention relates to solder masks which are obtainable from a composition of this invention.
- this invention relates to printed circuit boards which are coated with a solder mask of this invention.
- This invention also relates to the use of the novel compositions for the production of solder masks for printed circuit boards.
- the compounds of formula (I) are known per se and can be prepared in a manner known per se.
- Compounds of formula (la) can be prepared, for example, by reacting 1 ,1 ,3,3,5,5,- hexachlorocyclotriphosphazene with a compound of formula (II):
- the novel photosensitive composition contains the cyclic and/or oligomeric phosphazene compound, which is composed of units of formula (I), or a mixture of such compounds, preferably in a concentration of 0.2% to 10%, more preferably of 1.0% to 5.0% and, particularly preferably, of 1.5% to 3.7%, based on the dry weight of the components (a), (b), (c), (d) of the composition.
- a concentration of 0.2% to 10% more preferably of 1.0% to 5.0% and, particularly preferably, of 1.5% to 3.7%, based on the dry weight of the components (a), (b), (c), (d) of the composition.
- the film-forming crosslinkable polymeric compound of component (a) (also called “binder”) preferably comprises epoxy acrylates.
- Component (b) is preferably radically polymerisable monomers such as acrylates and/or methacrylates.
- a possibly present hardener is, for example, a hydroxyl group-containing compound with which the component (a) can be thermally crosslinked after irradiation and development.
- the radically polymerisable compound (b), or part of these compounds preferably also contains hydroxyl groups.
- compositions based on a binder, a photopolymerisable compound and a photoinitiator are described, inter alia, in EP-0 115 354.
- these compositions can be used, for example, for the further processing according to this invention, i.e. in admixture with at least one cyclic and/or oligomeric phosphazene compound composed of units of formula (I) as further component.
- Other photosensitive compositions are described, inter alia, in EP-0493317.
- compositions contain water-soluble or dispersible, solid, crosslinkable film-forming polymers as binders, water-soluble or dispersible photopolymerisable acrylate monomers and/or meth- acrylate monomers and/or corresponding oligomers as well as water-soluble and/or dispersible photoinitiators. If the binder is not self-crosslinking, then the cited composition comprises water-soluble and/or dispersible crosslinkers for the binder polymers as thermal hardeners, selected from the group consisting of the epoxy resins, melamine resins and blocked poly- isocyanates.
- compositions are those with carboxyl group-containing acrylate and methacrylate polymers or copolymers as binders, in which the carboxyl groups are in each case reacted with ammonia and/or specific amines so that the binder is water-soluble.
- Such compositions are also suitable for the further processing in admixture with at least one cyclic and/or oligomeric phosphazene compound composed of units of formula (I) as further component.
- compositions of this invention can contain as film-forming crosslinkable polymeric compound in general solid, crosslinkable, film-forming polymers.
- film-forming polymeric binders are, for example, polyvinyl alcohol/polyvinyl acetate polymers or copolymers, maleic anhydride/vinyl ether copolymers, maleic anhydride/styrene copolymers and acrylic acid and meth- acrylic acid polymers or copolymers as well as carboxyl group-containing acrylate and methacrylate polymers or copolymers.
- Suitable maleic anhydride/vinyl ether copolymers can contain e.g. vinyl methyl ether as ether component and are obtainable e.g. under the name Gantrex® AN (GAF CORP.). Suitable maleic anhydride/styrene copolymers are commercially available e.g. under the name Scripset® resins (MONSANTO).
- Polyvinyl alcohols can contain, for example, anhydrides of dicarboxylic acids, e.g. maleic anhydride, as copolymer. Copolymers of polyvinyl acetate e.g. with crotonic acid can also be used and have good film-forming properties.
- anhydrides of dicarboxylic acids e.g. maleic anhydride
- Copolymers of polyvinyl acetate e.g. with crotonic acid can also be used and have good film-forming properties.
- Acrylic acid and methacrylic acid polymers or copolymers as well as carboxyl group-containing acrylate and methacrylate polymers or copolymers are understood to mean both the homo- and copolymers of the pure acids and the copolymers of the acids with their esters, preferably the alkyl esters, and other comonomers such as maleic acid, itaconic acid, their esters, or styrene.
- Other suitable binder polymers of this type are disclosed in EP-0 115 354, some of which are commercially available.
- a commercially available acrylic resin is, for example, the Carboset® Type 531 (GOODRICH).
- Suitable self-crosslinking binder polymers are also reaction products of standard epoxy resins, for example based on (i) bisphenols, e.g. based on bisphenol A, or novolaks, with (ii) at least one aromatic di- or trihydroxy compound and (iii) triglycidyl isocyanurate in an amount of 1-30%, based on the entire composition.
- standard epoxy resins for example based on (i) bisphenols, e.g. based on bisphenol A, or novolaks, with (ii) at least one aromatic di- or trihydroxy compound and (iii) triglycidyl isocyanurate in an amount of 1-30%, based on the entire composition.
- Such compounds are described, inter alia, in EP 0 559 607.
- Suitable self-crosslinking binder polymers are also standard epoxy resins, for example based on bisphenols, e.g. based on bisphenol A, or novolaks, which have been reacted or modified to such a degree with acrylic acid and/or methacrylic acid that they are film-forming and, under suitable irradiation, polymerise photochemically and self-crosslink.
- the novel compositions contain as further component a crosslinker (hardener), preferably selected from the group consisting of the epoxy resins, melamine resins and blocked polyisocyanates.
- a crosslinker preferably selected from the group consisting of the epoxy resins, melamine resins and blocked polyisocyanates.
- Suitable crosslinkers are standard epoxy resins, for example based on bisphenols, such as bisphenol A, or based on novolaks, hydantoins, uracils and isocyanurates. They may be both monomers and prereacted adducts with polyamines, polycarboxylic acids, polyalcohols or polyphenols, etc.
- Suitable epoxy resins are commercially available in many forms.
- a particularly preferred composition comprises an epoxy resin, e.g. based on novolak, as sole thermal hardener.
- Compositions of this invention can also contain a melamine resin as thermal hardener, in particular as sole thermal hardener, preferred melamine resins being condensates of melamine and formaldehyde. These may effect three-dimensional crosslinking for example by reaction with hydroxyl groups at the binder polymer.
- melamine resins suitable for this invention are commercially available e.g. under the name Cymel®.
- Blocked polyisocyanates suitable for this invention may be derived e.g. from aliphatic, cyclo- aliphatic, aromatic or araliphatic compounds containing at least two isocyanate groups, including e.g. 2,4-diisocyanatotoluene and its technical mixtures with 2,6-diisocyanatotoluene, 2,6-diisocyanatotoluene, 4,4'-diisocyanatodiphenylmethane and also technical mixtures of different diisocyanatodiphenylmethanes (for example of the 4,4'- and 2,4'-isomers), N,N'-di- (4-methyl-3-isocyanatophenyl)urea, 1 ,6-diisocyanatohexane and the like.
- Suitable blocking components are, for example, ⁇ -dicarbonyl compounds, such as malonate, acetoacetate or 2,4-pentanedione, or hydroxamate, tri- azoles, imidazoles, imidazolides, tetrahydropyrimidines, lactams, oximes, hydroxyimides, such as N-succinimide, or phenols or thiophenols. It is also possible to use urethanised, carbodiimidised or di- or trimerised polyisocyanates, e.g.
- the deblocking temperature of the blocked polyisocyanates is preferably from 90°C to 160°C, more preferably from 110°C to 140°C.
- Polyisocyanates suitable according to this invention are also commercially available, e.g. under the name Desmodur® (BAYER). Novel compositions containing a blocked poly- isocyanate, in particular as sole thermal hardener, are also a preferred embodiment of this invention.
- compositions of this invention are those which contain as component (a) acrylic acid and/or methacrylic acid polymers and/or acrylic acid and/or methacrylic acid copolymers and/or carboxyl group-containing acrylate and/or methacrylate polymers and/or acrylate and/or methacrylate copolymers which are soluble or insoluble in water and/or which are copolymerised with glycidyl acrylate and or glycidyl methacrylates.
- Suitable photopolymerisable acrylate or methacrylate monomers and oligomers are known to the skilled person and are mentioned e.g. in the above-cited EP-A-0 115 354 which is referred to here.
- Suitable for use in this invention are, for example, diethylene glycol diacrylate, trimethylolpropanetriacrylate, pentaerythritoltriacrylate or epoxy acrylates, e.g. those derived from bisphenol A, phenol novolaks or cresol novolaks which may contain both epoxy groups and acrylate and/or methacrylate groups, urethane acrylates or polyester acrylates.
- the epoxy acrylates can usually also be modified with a carboxylic anhydride.
- the photoinitiators used may be customary initiators of radical photopolymerisation, if required together with coinitiators.
- the initiators are preferably present in an amount of 0.1 to 10% by weight of the composition and could per se also be present in amounts of more than 10 % by weight, but this usually does not give any better results.
- Suitable examples of photoinitiators or photoinitiator systems are aromatic carbonyi compounds, such as benzoin, benzoinalkyl ether, e.g.
- acetophenones in particular benzilketals, such as benzildimethylketal, or ⁇ -halogen-substituted acetophenones, such as trichloromethyl-p-tert-butylphenylketone or morpholinomethylphenyl- ketone, or dialkoxyacetophenones, such as diethoxyacetophenone, or ⁇ -hydroxyacetophe- nones, such as 1-hydroxycyclohexylphenylketone; or benzophenones, such as benzophe- none or bis(4-dimethylamino)benzophenone; or metalocene initiators, e.g.
- titanocene initiators such as bis( ⁇ -methylcyclopentadienyl)-bis( ⁇ -pentafluorophenyl)-titanium-IV; or a stan- nane in combination with a photoreducable dye, for example trimethylbenzylstannane in combination with methylene blue or bengal pink; or a quinone or a thioxanthone in combination with an amine which contains at an ⁇ -C-atom at least one hydrogen atom, such as anthraquinone, benzoquinone or thioxanthone in combination with bis(4-dimethylamino)- benzophenone or triethanolamine; or a thioxanthone, for example an alkyl- or halogen-substituted thioxantone, e.g. 2-isopropylthioxanthone or 2-chlorothioxanthone; or acylphos- phides.
- the novel compositions can comprise fillers, the novel addition of the compound or compounds of formula (I) being able to reduce the amount of filler.
- Suitable fillers are, for example, talcum, barium sulfate or quartz, with which e.g. the properties of a coating, such as its surface hardness, heat resistance or isolation capacity against electric currents, may be improved or with which the tackiness may be reduced.
- the novel compositions can contain fillers in amounts from 10 % by weight to 50, preferably to 35 % by weight, based on the entire weight of the composition.
- the novel compositions can contain additional additives.
- additives are, for example, dyes and/or pigments, preferably in an amount from 0J to 1 % by weight, or customary additives, such as defoamers, adhesion promoters, fungicides or thixotropic agents, preferably each in amounts from 0.5 % by weight to 5 % by weight, based on the entire weight of the composition.
- the per se known components (a), (b) and (c) and any other components and additives which may be present are mixed in a manner known per se, if required with heating and melting, and a compound of formula (I) or a mixture of such compounds is added before, during or after the mixing of the individual components of the mixture.
- a compound of formula (I) or a mixture of such compounds is added before, during or after the mixing of the individual components of the mixture.
- the skilled person is familiar with how to do this.
- the novel photosensitive composition is suitable in particular for the preparation of coatings.
- This invention therefore also relates to a process for the preparation of a coating, in particular of solder masks, which comprises applying a novel composition to a substrate, removing any solvent possibly present, irradiating the coating obtained with actinic radiation in a desired pattern, removing the unexposed sites of the coating by means of a suitable solvent with exposure of the substrate, and then thermally curing the coating remaining on the substrate and, if required, curing it before or after the thermal curing by means of UV radiation.
- the solvent which may be present in the composition e.g. organic solvent or water
- An amorphous resist film is obtained on the substrate, the thickness of which after drying is preferably from 5 ⁇ m to 150 ⁇ m.
- the temperatures during drying are normally below the temperature at which the thermal crosslinking of the binder in the coating takes place, preferably below 100°C, more preferably at about 70°C - 80°C. Drying can also be carried out under vacuum, optionally without heating.
- the photosensitive coating is then exposed to radiation in a manner known per se in particular in order to polymerise the photochemically polymerisable monomeric and/or oligomeric compounds, for example the acrylate and/or methacrylate monomers and/or the corresponding oligomers. This is usually carried out image-wise. Owing to the photopolymerisation of the cited components, the solubility is reduced at the exposed sites compared to at the unexposed sites so that a differentiation of the surface due to a different solubility in suitable solvents is obtained.
- the irradiation of the novel compositions is preferably carried out with actinic radiation.
- actinic radiation This is usually UV- and/or VIS-radiation, preferably of the wavelength from about 220nm to 550 nm, in particular from 220nm to 450 nm.
- Any of the radiation sources known per se may be used for irradiation, for example mercury high pressure lamps or UV- ⁇ /IS-laser.
- the process parameters, such as irradiation time and distance from the source of radiation and from the photosensitive coating generally depend on the kind of photosensitive composition used and on the desired properties of the coating, and the skilled person can determine them with a few routine tests.
- the image-wise irradiation can be carried out, for example, through a photomask or through the direct writing of a laser beam on the photosensitive coating.
- Development is carried out after the irradiation.
- a developer solution the unexposed sites of the photoresist can be removed in a manner known per se with suitable aqueous or organic solvents.
- the coating is subjected to a thermal aftertreatment or cure. This is done by heating to a temperature at which preferably a total crosslinking of the binder polymer and of the compound of formula (I) takes place.
- the temperature required therefor is usually above 100°C, e.g. in the range from 120°C - 180°C, preferably from 120°C - 150°C. It may be of advantage to also carry out a further cure with UV radiation which may result in a more complete polymerisation in particular of the component (b) and of the compound of formula (I). This can take place, for example, at the same time as the thermal curing.
- the preparation of the coated substrates can be carried out using coating processes known per se by means of which a coating may be uniformly applied.
- coating processes are spin-coating, brush application, spray application, e.g. electrostatic spraying, reverse roll coating, immersion coating and knife coating and the curtain coating process.
- the curtain coating and screen printing processes are preferred.
- the amount applied (coating thickness) and the kind of substrate (coating substrate) depend on the desired field of application.
- the novel compositions can be applied in relatively thin layers and provide good resolution.
- the use of the corresponding radiation source and photosensitive component makes them, in particular, suitable for all customary fields of application where the generation of structured images is desired.
- novel compositions are particularly suitable for the preparation of coatings on any kind of substrate, for example wood, textiles, paper, ceramics, glass, plastics, such as polyester, polyolefins, cellulose acetate or epoxy resins, in particular glass fibre reinforced epoxy resins, and metals, such as aluminium, copper, nickel, iron, zinc, magnesium or cobalt, and semi-conductor materials, such as silicium, GaAs or germanium, and isolator materials, such as Si 3 N 4 or SiO 2 , where an image or, in particular, a protective layer, is to be applied through irradiation.
- substrate for example wood, textiles, paper, ceramics, glass, plastics, such as polyester, polyolefins, cellulose acetate or epoxy resins, in particular glass fibre reinforced epoxy resins, and metals, such as aluminium, copper, nickel, iron, zinc, magnesium or cobalt, and semi-conductor materials, such as silicium, GaAs or germanium, and isolator materials, such
- Coatings of this invention also have excellent thermal resistance if they are brought into contact with hot liquid metals and/or alloys, for example in a solder bath which usually has a temperature in the range of about 270°C.
- this use of coatings prepared according to this invention is also an object of this invention, as is also the use of the described compositions as photostructurable solder stopping resist in the production of printed circuit boards, which is very particularly preferred.
- Example A comparison example, without phosphazene compound
- the resin paste prepared according to the above instructions of a) and b) and the accelerator mixture are mixed in the indicated ratios.
- 100 g each of resin paste are mixed with the corresponding amount of accelerator mixture so that the paint mixtures listed in Table 1 are obtained, i.e. to yield the compositions according to the mixtures A (comparison mixture) and B and C (mixtures of this invention).
- (1 ) binder reaction product of 467 g of diglycidyl ether of bisphenol A (epoxy value:5.26- 5.38 val/kg), 333g of tetrabromobisphenol A. 200 g of triglycidyl isocyanurate and 0.05 g of 2-phenylimidazole, heated to 160°C over c. 3 hours. After cooling to c. 150°C, charged with 125g of methyl ethyl ketone. Prepared according to EP 0 559 607, Example 1.
- phosphazene compound 1 ,1 ,3,3,5,5-hexa(methacryloyloxyethoxy)cyclotriphos- phazene
- the copper laminate newly coated with the paint mixture is left standing for 20 minutes in the air and is then dried for 30 minutes at 80°C.
- the copper laminate is exposed with UV light energy of 1500 mJ/cm 2 , developed in a developing process with gamma-butyrolactone and then fully cured at 150°C in a circulating air oven for one hour.
- Examination of the paint film (formulations A, B and C):
- the phosphazene compound (5) at the same time acts as adhesion promoter on copper and also as flow control agent, i.e. in the tests B and C it is possible to forego the use of the flow control agent or to reduce its amount.
- the flow control agent is used in all three formulations.
- the formulation A (without phosphazene compound) has a very bad flow and very bad adhesion on the substrate compared to the formulations B and C.
- the addition of the phosphazene compound according to the formulations B and C increases the surface hardness by 2 grades to 7H. Surprisingly, these two formulations have a very good cross-hatch adhesion image of 0 (zero) according to DIN 53 151.
- the addition of the phosphazene compound not only increases the surface hardness (pencil hardness) by two grades but additionally increases both the adhesion of the coating on the substrate and the toughness of the coating. This is remarkable, for as a rule the harder the surface the worse the cross-hatch image.
- the pencils have a 5-6 mm long undamaged, exposed lead cylinder.
- the tip of the lead cylinder is held at a 90° angle to the sandpaper and abraded so that a flat round cross-section is obtained.
- the cross-section must be free from any irregu larity, in particular at the edge.
- the test sample is fixed to the measuring device.
- the pencil of the highest hardness is clamped at a 45° angle and placed on the test sample.
- the test sample is moved by means of the mechanical device designated therefor (crank) at least 6.5 mm towards the tip of the pencil. This procedure is repeated with the pencils of lower hardness.
- the test may not be carried out more than once at the same site of the test sample.
- the pencil hardness is that hardness value at which the surface is not yet hollowed out or dented. This value is not to be confused with the scratch hardness which is that hardness value at which the surface is not yet scratched.
Abstract
Description
Claims
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020017012695A KR20020006698A (en) | 1999-05-11 | 2000-05-04 | Photosensitive composition |
AU49168/00A AU4916800A (en) | 1999-05-11 | 2000-05-04 | Photosensitive composition |
JP2000616465A JP2002544542A (en) | 1999-05-11 | 2000-05-04 | Photosensitive composition |
EP00931115A EP1177478A1 (en) | 1999-05-11 | 2000-05-04 | Photosensitive composition |
CA002369025A CA2369025A1 (en) | 1999-05-11 | 2000-05-04 | Photosensitive composition |
HK02105574.1A HK1044048A1 (en) | 1999-05-11 | 2002-07-29 | Photosensitive composition |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH89999 | 1999-05-11 | ||
CH899/99 | 1999-05-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2000068739A1 true WO2000068739A1 (en) | 2000-11-16 |
Family
ID=4197776
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2000/004009 WO2000068739A1 (en) | 1999-05-11 | 2000-05-04 | Photosensitive composition |
Country Status (8)
Country | Link |
---|---|
EP (1) | EP1177478A1 (en) |
JP (1) | JP2002544542A (en) |
KR (1) | KR20020006698A (en) |
CN (1) | CN1350660A (en) |
AU (1) | AU4916800A (en) |
CA (1) | CA2369025A1 (en) |
HK (1) | HK1044048A1 (en) |
WO (1) | WO2000068739A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004049069A1 (en) * | 2002-11-28 | 2004-06-10 | Kodak Polychrome Graphics Gmbh | Photopolymer composition suitable for lithographic printing plates |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI486708B (en) * | 2013-06-20 | 2015-06-01 | Chi Mei Corp | Photosensitive resin composition, black matrix, color filter and liquid crystal display device |
JP6759323B2 (en) * | 2018-03-28 | 2020-09-23 | 太陽インキ製造株式会社 | Photosensitive resin composition, two-component photosensitive resin composition, dry film and printed wiring board |
CN111909381B (en) * | 2020-09-11 | 2021-06-15 | 东部超导科技(苏州)有限公司 | Ultraviolet crosslinking polyphosphazene, preparation method thereof, composite coating low-temperature measurement optical fiber and preparation method thereof |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0453237A2 (en) * | 1990-04-16 | 1991-10-23 | Fujitsu Limited | Photosensitive, heat-resistant resin composition and pattern formation process |
EP0464749A1 (en) * | 1990-07-02 | 1992-01-08 | Canon Kabushiki Kaisha | Image holding member |
JPH06228253A (en) * | 1993-02-08 | 1994-08-16 | Nippon Kayaku Co Ltd | Resin composition, solder resist resin composition and their hardened product |
-
2000
- 2000-05-04 AU AU49168/00A patent/AU4916800A/en not_active Abandoned
- 2000-05-04 CN CN00807369A patent/CN1350660A/en active Pending
- 2000-05-04 JP JP2000616465A patent/JP2002544542A/en active Pending
- 2000-05-04 EP EP00931115A patent/EP1177478A1/en not_active Withdrawn
- 2000-05-04 CA CA002369025A patent/CA2369025A1/en not_active Abandoned
- 2000-05-04 KR KR1020017012695A patent/KR20020006698A/en not_active Application Discontinuation
- 2000-05-04 WO PCT/EP2000/004009 patent/WO2000068739A1/en not_active Application Discontinuation
-
2002
- 2002-07-29 HK HK02105574.1A patent/HK1044048A1/en unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0453237A2 (en) * | 1990-04-16 | 1991-10-23 | Fujitsu Limited | Photosensitive, heat-resistant resin composition and pattern formation process |
EP0464749A1 (en) * | 1990-07-02 | 1992-01-08 | Canon Kabushiki Kaisha | Image holding member |
JPH06228253A (en) * | 1993-02-08 | 1994-08-16 | Nippon Kayaku Co Ltd | Resin composition, solder resist resin composition and their hardened product |
Non-Patent Citations (1)
Title |
---|
DATABASE WPI Section Ch Week 199437, Derwent World Patents Index; Class A21, AN 1994-299840, XP002146127 * |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004049069A1 (en) * | 2002-11-28 | 2004-06-10 | Kodak Polychrome Graphics Gmbh | Photopolymer composition suitable for lithographic printing plates |
DE10255664B4 (en) * | 2002-11-28 | 2006-05-04 | Kodak Polychrome Graphics Gmbh | For photolithographic printing plates suitable photopolymer composition |
US7169534B2 (en) * | 2002-11-28 | 2007-01-30 | Kodak Polychrome Graphics Gmbh | Photopolymer composition suitable for lithographic printing plates |
Also Published As
Publication number | Publication date |
---|---|
HK1044048A1 (en) | 2002-10-04 |
AU4916800A (en) | 2000-11-21 |
CA2369025A1 (en) | 2000-11-16 |
KR20020006698A (en) | 2002-01-24 |
EP1177478A1 (en) | 2002-02-06 |
JP2002544542A (en) | 2002-12-24 |
CN1350660A (en) | 2002-05-22 |
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