HK1044048A1 - Photosensitive composition - Google Patents
Photosensitive compositionInfo
- Publication number
- HK1044048A1 HK1044048A1 HK02105574.1A HK02105574A HK1044048A1 HK 1044048 A1 HK1044048 A1 HK 1044048A1 HK 02105574 A HK02105574 A HK 02105574A HK 1044048 A1 HK1044048 A1 HK 1044048A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- photosensitive composition
- photosensitive
- composition
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Paints Or Removers (AREA)
- Materials For Photolithography (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH89999 | 1999-05-11 | ||
PCT/EP2000/004009 WO2000068739A1 (en) | 1999-05-11 | 2000-05-04 | Photosensitive composition |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1044048A1 true HK1044048A1 (en) | 2002-10-04 |
Family
ID=4197776
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK02105574.1A HK1044048A1 (en) | 1999-05-11 | 2002-07-29 | Photosensitive composition |
Country Status (8)
Country | Link |
---|---|
EP (1) | EP1177478A1 (en) |
JP (1) | JP2002544542A (en) |
KR (1) | KR20020006698A (en) |
CN (1) | CN1350660A (en) |
AU (1) | AU4916800A (en) |
CA (1) | CA2369025A1 (en) |
HK (1) | HK1044048A1 (en) |
WO (1) | WO2000068739A1 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10255664B4 (en) * | 2002-11-28 | 2006-05-04 | Kodak Polychrome Graphics Gmbh | For photolithographic printing plates suitable photopolymer composition |
TWI486708B (en) * | 2013-06-20 | 2015-06-01 | Chi Mei Corp | Photosensitive resin composition, black matrix, color filter and liquid crystal display device |
JP6759323B2 (en) * | 2018-03-28 | 2020-09-23 | 太陽インキ製造株式会社 | Photosensitive resin composition, two-component photosensitive resin composition, dry film and printed wiring board |
CN111909381B (en) * | 2020-09-11 | 2021-06-15 | 东部超导科技(苏州)有限公司 | Ultraviolet crosslinking polyphosphazene, preparation method thereof, composite coating low-temperature measurement optical fiber and preparation method thereof |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2980359B2 (en) * | 1990-04-16 | 1999-11-22 | 富士通株式会社 | Photosensitive heat-resistant resin composition and pattern forming method using the same |
EP0464749B1 (en) * | 1990-07-02 | 1995-10-04 | Canon Kabushiki Kaisha | Image holding member |
JPH06228253A (en) * | 1993-02-08 | 1994-08-16 | Nippon Kayaku Co Ltd | Resin composition, solder resist resin composition and their hardened product |
-
2000
- 2000-05-04 WO PCT/EP2000/004009 patent/WO2000068739A1/en not_active Application Discontinuation
- 2000-05-04 CN CN00807369A patent/CN1350660A/en active Pending
- 2000-05-04 AU AU49168/00A patent/AU4916800A/en not_active Abandoned
- 2000-05-04 KR KR1020017012695A patent/KR20020006698A/en not_active Application Discontinuation
- 2000-05-04 EP EP00931115A patent/EP1177478A1/en not_active Withdrawn
- 2000-05-04 CA CA002369025A patent/CA2369025A1/en not_active Abandoned
- 2000-05-04 JP JP2000616465A patent/JP2002544542A/en active Pending
-
2002
- 2002-07-29 HK HK02105574.1A patent/HK1044048A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP2002544542A (en) | 2002-12-24 |
AU4916800A (en) | 2000-11-21 |
EP1177478A1 (en) | 2002-02-06 |
CA2369025A1 (en) | 2000-11-16 |
CN1350660A (en) | 2002-05-22 |
WO2000068739A1 (en) | 2000-11-16 |
KR20020006698A (en) | 2002-01-24 |
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