WO2000063757A1 - Dispositif de commande modulaire de debit massique et de pression monte en surface - Google Patents

Dispositif de commande modulaire de debit massique et de pression monte en surface Download PDF

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Publication number
WO2000063757A1
WO2000063757A1 PCT/US2000/010041 US0010041W WO0063757A1 WO 2000063757 A1 WO2000063757 A1 WO 2000063757A1 US 0010041 W US0010041 W US 0010041W WO 0063757 A1 WO0063757 A1 WO 0063757A1
Authority
WO
WIPO (PCT)
Prior art keywords
modular
gas
flow
flow sensor
control valve
Prior art date
Application number
PCT/US2000/010041
Other languages
English (en)
Inventor
Anthony C. Diprizio
Kevin T. Mahan
Jon M. Sutton
Maura I. Toth
Original Assignee
Millipore Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Millipore Corporation filed Critical Millipore Corporation
Priority to AU44597/00A priority Critical patent/AU4459700A/en
Publication of WO2000063757A1 publication Critical patent/WO2000063757A1/fr

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Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D16/00—Control of fluid pressure
    • G05D16/20—Control of fluid pressure characterised by the use of electric means
    • G05D16/2006—Control of fluid pressure characterised by the use of electric means with direct action of electric energy on controlling means
    • G05D16/2013—Control of fluid pressure characterised by the use of electric means with direct action of electric energy on controlling means using throttling means as controlling means
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D7/00—Control of flow
    • G05D7/06—Control of flow characterised by the use of electric means
    • G05D7/0617—Control of flow characterised by the use of electric means specially adapted for fluid materials
    • G05D7/0629—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means
    • G05D7/0635—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on throttling means

Definitions

  • the present invention relates generally to gas transport systems and measuring devices, and more particularly to a system and method for integrating various components m a modular gas transport system, and even more particularly to the integration of gas flow components m a modular gas stick for use m semiconductor manufacturing.
  • gas flow path having a number of components used to regulate, filter, and monitor the gas flowing through the path.
  • current semiconductor manufacturing processes such as chemical vapor deposition, require the delivery of ultra-pure gases at proper flow rates and amounts to process chambers within a tool.
  • gas components are typically incorporated into the gas path (commonly referred to for semiconductor manufacturing processes as the gas stick) , including mass flow controllers, flow monitors, moisture monitors, valves, regulators, gas filters, gas purifiers, pressure sensors, diffusers, capacitance diaphragm gauges, displays, pressure transducers, and other commercially available components .
  • FIGURE 1 An exemplary prior art gas path 10, or gas stick, is shown m FIGURE 1.
  • the gas will flow from a source through gas path 10 that can include, as an example, an isolation valve 12, a regulator 14, a pressure transducer or sensor 16, a filter 18, an isolation valve 20, a mass flow controller 22, and a downstream isolation air operated valve 26 to the process chamber (not shown) .
  • Each individual gas component is a stand alone unit and is connected to the next using a series of m-line connectors 24.
  • This is an exemplary manuf cturing system and any number of additional and alternative components could comprise the gas path from the source to the process chamber.
  • adding gas components to an in- line gas stick 10 increases the overall length of the gas stick 10 by both the component length and the connector length.
  • mass flow controller 22 is typically built only to operate within a limited range of flow and pressure conditions for a specific gas. To operate outside the original parameters, the sensor portion of the mass flow controller 22 may be recalibrated or re-ranged, but the attached control valve may no longer be capable of acceptable performance under the new conditions (pressure, flow, or gas type) . Thus the permutations of calibrated mass flow controllers needed can be costly. As many as fifty to two hundred different mass flow controllers may be needed to cover every different permutation m a typical semiconductor manufacturer scenario.
  • Mass flow controllers within current gas sticks are typically either thermal-based instruments or pressure- based instruments. The whole mass flow controller unit must be replaced to convert the current gas sticks from a thermal-based to pressure-based flow control. This too can be very costly.
  • the standard footprint for the modular gas stick is approximately 1.5 X 1.5 inches, according to SEMI Draft
  • Certain gas components may not fit the 1.5 X 1.5 inch modular footprint of the modular gas stick.
  • the present invention provides an improved gas component integration system and method that substantially eliminates or reduces disadvantages and problems associated with previously developed gas flow path systems and methods used for flowing a gas from a source, through a number of components, to a destination.
  • the modular surface mount flow sensor and control valve of the present invention provides a way integrating the mass flow controller 22, such as the one shown m FIGURE 1 into a modular gas stick.
  • the gas components stack m a direction perpendicular to the original gas flow axis.
  • the gas components can be individually manufactured components that are connected together using standard VCR connections or SEMI Draft Doc. 2787 specification connections.
  • a specific embodiment of the present invention is the modular surface mount mass flow and pressure controller.
  • the modular surface mount mass flow and pressure controller of the present invention includes a modular flow sensor and a modular control valve.
  • the modular flow sensor measures the amount of gas flowing through a modular gas stick and the modular control valve adjusts and controls the flow rate of gas through the modular gas stick.
  • Both the modular flow sensor and the modular control valve are mounted on a surface (e.g., the top) of a modular base.
  • the present invention provides an important technical advantage by providing a way to incorporate the functionality of a mass flow controller m a modular gas stick design.
  • the present invention provides another technical advantage by providing easy repair and replacement of the modular gas components which make up the mass flow controller, thus reducing associated costs.
  • the present invention provides another technical advantage by reducing the number of permutations of current mass flow controllers required to handle all the different ranges of different types of gases used in the semiconductor manufacturing process .
  • the present invention provides another technical advantage by providing more flexibility in placing gas components in a gas stick design.
  • the present invention provides another technical advantage by providing a way to easily convert from a thermal -based gas stick design to a pressure-based gas stick design and visa versa.
  • the present invention provides another technical advantage by providing a gas stick design where the electronics can either be remote or local .
  • FIGURE 1 shows a prior art gas flow path having a series of individual, single function gas components, including a mass flow controller, connected together inline along the axis of gas flow;
  • FIGURE 2 shows the base dimensions of a prior art mass flow controller
  • FIGURE 3 shows one embodiment of the present invention where the mass flow controller has been broken down into a modular flow sensor and a modular control valve
  • FIGURE 4 shows the base dimensions of the modular flow sensor and modular control valve
  • FIGURE 5 shows the modular gas stick m a thermal - based flow configuration
  • FIGURE 6 shows the modular gas stick m a pressure- based flow configuration.
  • the modular surface mount mass flow and pressure controller of the present invention includes a modular flow sensor and a modular control valve .
  • the modular flow sensor measures the amount of gas flowing through a modular gas stick and the modular control valve adjusts and controls the flow rate of gas through the modular gas stick. Both the modular flow sensor and the modular control valve are mounted on a modular base.
  • the connections used to mount the modular flow sensor, modular control valve, and other gas components on the modular base can include connectors that meet the draft SEMI 2787 specification (described m SEMI Draft Doc. 2787, incorporated herein by reference) such as B-seal, C-seal, CS-seal, W-seal and Z-seal connectors.
  • Examples of the modular gas components that can be mounted on a modular base include gas filters, gas purifiers, pressure transducers, mass flow controllers, displays, moisture monitors, gauges, valves, diffusers, capacitance diaphragm gauges, and pressure regulators.
  • the present invention includes separating the flow sensor and control valve of a standard mass flow controller and mounting them on a modular base.
  • FIGURE 3 shows one embodiment of a modular gas stick 10 as opposed to the conventional in-line gas stick 10 of FIGURE 1.
  • the modular gas stick 10 fits onto a modular base 38 that meets SEMI 2787 specifications for modular gas sticks (including height, length, and width requirement) .
  • the m-line gas stick 10 was configured such that the gas components required a connector 24 before and after each gas component .
  • the base block of the standard mass flow controller 22 shown m FIGURE 1 is typically more than twice as long as other gas components m the gas stick 10.
  • the base block dimensions of a typical prior art flow controller are 4 X 1.5 inches, as shown in FIGURE 2. This is much larger than the modular footprint dimensions of 1.5 X 1.5 (shown m FIGURE 4) inches required to fit on the modular base 38.
  • the prior art mass flow controller 22 of FIGURE 1 simply cannot be mounted onto a modular base
  • the present invention provides a separate flow sensor 25 and control valve 30 which make up the prior art features of mass flow controller 22 and mounts them on modular base 38. This results m a reduction m horizontal space along the axis of gas flow
  • the flow sensor 25 and control valve 30 of the present invention each fits the 1.5 X 1.5 inch modular foot print shown m FIGURE 4 (dimension C equals approximately 1.5 inches) .
  • Seating a modular flow sensor 25 and modular control valve 30 allows the use of a modular base block 38.
  • the length of the gas stick 10 has been reduced because the standard mass flow controller 22 base block requires 4 inches, while the combined length of the flow sensor 25 and control valve 30 base blocks is only 3 inches. This will save horizontal space along the gas flow path 28 as well as provide a number of other advantages .
  • the standard mass flow controller 22 of FIGURE 1 is built only to operate within a limited range of flow and pressure conditions for a specific gas. To operate outside the original parameters, the sensor portion of the mass flow controller 22 would have to be recalibrated or re-ranged, but the attached control valve may no longer be capable of acceptable performance under the new conditions (pressure, flow, or gas type) . Thus the permutations of calibrated mass flow controllers needed can be costly.
  • the present invention eliminates the need to recalibrate, re-range, or completely replace the standard mass flow controller 22 in many instances.
  • the separated flow sensor 25 may work over a range of 5 to 6 different gas types having different densities or different thermal conductivities.
  • the separated control valve 30 may work over a range of 5 to 6 different ranges.
  • the flow sensor 25 and control valve 30 may be able to cover the 50 to 200 other permutations that a standard mass flow controller 22 has to be built to.
  • either the flow sensor 25 or control valve 30 breaks down either part can be replaced at a lower cost than having to replace the whole standard mass flow controller 22.
  • the present invention provides another major advantage by providing more flexibility in placing individual gas components at different locations along the gas stick.
  • gasses which present problems to standard mass flow controllers 22 which are calibrated for thermal-based flow measurements.
  • Other gasses present problems to standard mass flow controllers 22 which are calibrated for pressure-based flow measurements.
  • the entire standard mass flow controller 22 must be replaced. The need to replace the entire mass flow controller 22 is eliminated m the present invention due to the use of separate, modular flow sensors 25 and control valves 30.
  • a thermal flow sensor can be mounted on the modular gas stick 10. If the gas flowing through the modular gas stick 10, or the process requires a pressure-based measurement, a pressure- based flow sensor can be mounted on the gas stick 10.
  • the control valve 30 need not be replaced to convert the modular gas stick from a thermal -based measurement gas stick to a pressure-based measurement gas stick. As with existing mass flow controllers, the electronics controlling the flow sensor 25 and the control valve 30 can be either remote or local .
  • FIGURE 5 shows one embodiment of the modular gas stick 10 m a thermal-based measurement configuration.
  • the flow sensor 25 is a thermal-based flow sensor and is preferably placed immediately before the control valve 30 along the gas flow path 28.
  • the electronics controlling modular flow sensor 25 and modular control valve 30 can be remote or local.
  • To convert the modular gas stick 10 from a thermal-based measurement configuration to a pressure- based configuration first remove the thermal flow sensor 25 and the control valve 30. Next, place the control valve 25 m the position where the thermal flow sensor 25 used to be. Finally, place a pressure-based flow sensor 25 m the position where the control valve 30 used to be.
  • the pressure-based configuration of the modular gas stick 10 can be seen m FIGURE 6.
  • control valve 30 is preferably placed before the pressure-based flow sensor 25 along the gas flow path 28. Since only the flow sensor 25 needs to be replaced when converting the modular gas stick 10 from a thermal -based measurement configuration to a pressure-based configuration, the replacement part cost is reduced.
  • the modular surface mount mass flow and pressure controller of the present invention includes a modular flow sensor and a modular control valve.
  • the modular flow sensor measures the amount of gas flowing through a modular gas stick and the modular control valve adjusts and controls the flow rate of gas through the modular gas stick.
  • Both the modular flow sensor and the modular control valve are mounted on a modular base.

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  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Flow Control (AREA)

Abstract

Le dispositif de commande modulaire de débit massique et de pression selon la présente invention comprend un capteur de débit modulaire et une soupape de régulation modulaire. Le capteur de débit modulaire mesure la quantité de gaz qui s'écoule dans un ensemble modulaire à gaz et la soupape de régulation modulaire ajuste et commande le débit du gaz dans l'ensemble modulaire à gaz. Le capteur de débit modulaire et la soupape de régulation modulaire sont tous les deux montés sur une surface d'une base modulaire.
PCT/US2000/010041 1999-04-19 2000-04-13 Dispositif de commande modulaire de debit massique et de pression monte en surface WO2000063757A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU44597/00A AU4459700A (en) 1999-04-19 2000-04-13 Modular surface mount mass flow and pressure controller

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29425799A 1999-04-19 1999-04-19
US09/294,257 1999-04-19

Publications (1)

Publication Number Publication Date
WO2000063757A1 true WO2000063757A1 (fr) 2000-10-26

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Family Applications (1)

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PCT/US2000/010041 WO2000063757A1 (fr) 1999-04-19 2000-04-13 Dispositif de commande modulaire de debit massique et de pression monte en surface

Country Status (3)

Country Link
AU (1) AU4459700A (fr)
TW (1) TW434379B (fr)
WO (1) WO2000063757A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001059343A1 (fr) * 2000-02-10 2001-08-16 Pall Corporation Ensemble de dispositifs fluidiques
WO2003032095A2 (fr) * 2001-10-09 2003-04-17 Millipore Corporation Systeme de programmation de machines de traitement chimique
EP1624355A3 (fr) * 2004-07-01 2006-02-22 The Boc Group, Inc. Dispositif de régulation de débit
CN100378397C (zh) * 2003-01-17 2008-04-02 应用材料有限公司 对压力不敏感的质量流量控制器
CN106163499A (zh) * 2014-03-14 2016-11-23 欧皮安特制药有限公司 鼻用药物产品及其使用方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0392072A1 (fr) * 1989-04-13 1990-10-17 Unit Instruments, Inc. Système de commande de débit d'une masse fluidique
WO1994009344A1 (fr) * 1992-10-16 1994-04-28 Unit Instruments, Inc. Regulateur de debit massique thermique dote d'un capteur thermique de debit massique orthogonal
US5605179A (en) * 1995-03-17 1997-02-25 Insync Systems, Inc. Integrated gas panel
WO1998057090A1 (fr) * 1997-06-13 1998-12-17 Swagelok Company Joint a portee plane pour ensemble de bloc modulaire reliant des composants mecaniques d'un systeme fluidique
WO1999035422A1 (fr) * 1998-01-09 1999-07-15 Swagelok Company Joint pour dispositif a ecoulement modulaire

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0392072A1 (fr) * 1989-04-13 1990-10-17 Unit Instruments, Inc. Système de commande de débit d'une masse fluidique
WO1994009344A1 (fr) * 1992-10-16 1994-04-28 Unit Instruments, Inc. Regulateur de debit massique thermique dote d'un capteur thermique de debit massique orthogonal
US5605179A (en) * 1995-03-17 1997-02-25 Insync Systems, Inc. Integrated gas panel
WO1998057090A1 (fr) * 1997-06-13 1998-12-17 Swagelok Company Joint a portee plane pour ensemble de bloc modulaire reliant des composants mecaniques d'un systeme fluidique
WO1999035422A1 (fr) * 1998-01-09 1999-07-15 Swagelok Company Joint pour dispositif a ecoulement modulaire

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001059343A1 (fr) * 2000-02-10 2001-08-16 Pall Corporation Ensemble de dispositifs fluidiques
WO2003032095A2 (fr) * 2001-10-09 2003-04-17 Millipore Corporation Systeme de programmation de machines de traitement chimique
WO2003032095A3 (fr) * 2001-10-09 2004-04-22 Millipore Corp Systeme de programmation de machines de traitement chimique
US6944522B2 (en) 2001-10-09 2005-09-13 Millipore Corporation Chemical process machine programming system
CN100378397C (zh) * 2003-01-17 2008-04-02 应用材料有限公司 对压力不敏感的质量流量控制器
US8127783B2 (en) 2003-01-17 2012-03-06 Applied Materials, Inc. Pressure-insensitive mass flow controller
US8656953B2 (en) 2003-01-17 2014-02-25 Applied Materials, Inc. Combination manual/pneumatic shut-off valve
EP1624355A3 (fr) * 2004-07-01 2006-02-22 The Boc Group, Inc. Dispositif de régulation de débit
CN106163499A (zh) * 2014-03-14 2016-11-23 欧皮安特制药有限公司 鼻用药物产品及其使用方法

Also Published As

Publication number Publication date
AU4459700A (en) 2000-11-02
TW434379B (en) 2001-05-16

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