WO2000059282A1

WO2000059282A1 - Method and apparatus for mounting electronic part

Info

Publication number: WO2000059282A1
Application number: PCT/JP2000/001983
Authority: WO
Inventors: Koichi Yabuki; Yoshiyuki Nagai; Keiji Hanada
Original assignee: Matsushita Electric Industrial Co., Ltd.
Priority date: 1999-03-30
Filing date: 2000-03-29
Publication date: 2000-10-05
Also published as: EP1175137B1; EP1175137A4; KR100614349B1; JP2000286600A; US6705004B1; CN1205849C; EP1175137A1; KR20010108421A; CN1345529A; DE60027886T2; JP3295655B2; DE60027886D1

Abstract

The deviation of an electronic part (18) with respect to a suction nozzle (7) is measured in the course of transportation of the electronic part (18) held on the suction nozzle (7) from a feeder (1) to a circuit board (10). Based on the deviation, it is decided whether the electronic part (18) on the suction nozzle (7) is expected to be properly mountable on the circuit board (10). If the decision is affirmative, the electronic part (18) is mounted on the circuit board (10).

Description

Description Electronic component mounting method and mounting device

The present invention relates to a method and an apparatus for mounting electronic components, in which various electronic components such as chip components and semiconductor elements are sucked by a suction nozzle and automatically mounted on a predetermined component mounting portion of a circuit board. Background art

Conventionally, in electronic component mounting apparatuses, as electronic components to be mounted on a circuit board have increased and electronic components have been mounted at a high density, there has been a demand for faster mounting operations. In order to cope with this, mounting operations have been speeded up by increasing the operating speed of each drive unit. For example, in the electronic component mounting apparatus shown in a schematic plan view in FIG. 6, when supplying electronic components (not shown), a component supply table 2 in which a plurality of component supply units 1 are arranged and mounted is mounted on the component supply unit 1. Move in the arrangement direction, and position the component outlet 3 of the required component supply unit 1 at the first station ST1 for component suction. The component supply unit 1 is generally called a parts cassette. Briefly, electronic components are stored in storage recesses arranged at regular intervals in a length direction of a holding tape (not shown). In addition, using a carrier tape (not shown) that prevents the electronic components from falling off with a cover tape (not shown) attached to the upper surface of the holding tape, the regularly arranged electronic components are continuously supplied to the component outlet 3. Is what you do.

When mounting electronic components supplied from the carrier tape on a circuit board while holding them by suction, a plurality of nozzle units (in the figure, 10 are shown) each having a suction nozzle 7 at the lower end thereof are provided. (Not shown) are mounted on a concentric circle around the rotating drum 8 at equal intervals by using a mounting head 9 of the low-resilience type. It is set to 0. That is, the rotary drum 8 is intermittently rotated in a direction indicated by an arrow at a fixed angle corresponding to the interval between the suction nozzles 7 of the nozzle unit, and the suction nozzles 7 are in the first to tenth stations ST1 to ST10. Are sequentially stopped. The suction nozzle 7 located in the first station ST1 for picking up components picks up and holds the electronic component in the component outlet 3 of the component supply unit 1 by moving the nozzle unit up and down. The suctioned and held electronic components are transferred with the intermittent rotation of the rotary drum 8 and the positioning of the suction nozzle 7 to the third station ST 3 for component recognition is stopped by the component recognition device 11. Based on the image data obtained by imaging with a camera (not shown), the amount of displacement and the attitude of the suction nozzle 7 with respect to the central part are recognized. Subsequently, when the electronic component reaches the fifth station ST5 for correction, the electronic component is rotated by the nozzle unit by the positional shift amount to correct the positional shift amount calculated in the above-described image recognition processing. .

Further, when the electronic component is positioned and stopped at the sixth station ST6 at the component mounting position, the board holding table 12 on which the circuit board 10 is positioned and fixed on the upper surface is moved a predetermined distance in the X and Y directions. And the required component mounting portion of the circuit board 10 is positioned directly below the electronic component sucked and held by the suction nozzle 7. Thereafter, the electronic component held by the suction nozzle 7 is mounted on a required component mounting portion of the circuit board 10 by vertically moving the nozzle unit. In the seventh to tenth stations ST7 to ST10, various preparations for mounting electronic components, such as switching of the suction nozzle 7, are performed.

By the way, in recent years, as typified by mobile phones, the weight and thickness of electronic devices have been promoted, and in order to realize such electronic devices, a circuit board 10 incorporated therein is required. It is necessary to reduce the size and to mount smaller electronic components on a circuit board at a high density at a narrow interval. On the other hand, when mounting electronic components on the circuit board 10, the distance between adjacent electronic components is limited to be narrow due to the mechanical configuration of the electronic component mounting apparatus. The mounting accuracy of the electronic component mounting device is based on the correction values calculated from the image data in the third station ST3 for component recognition. Then, the electronic component is mounted on the circuit board 10 after correcting the position of the electronic component in the fifth stage ST5 for correction, so that there is almost no factor that restricts the mounting interval of the electronic component. For example, FIG. 7 schematically shows a recognition screen 13 captured by the recognition camera of the component recognition device 11 in the third station ST3. Based on the recognition screen 13, the central part 17 of the image 17 of the electronic component held by the suction nozzle 7 with respect to the position coordinates (X, y) of the central part 14 of the image 14 of the suction nozzle 7 based on the recognition nozzle 13 The shift amount (Δ ,, A y) of the position coordinates ( _{X l} , y,) of a and the inclination of the electronic component with respect to the suction nozzle 7 are calculated. Based on the data, a correction value for mounting the electronic component on the circuit board 10 is calculated, and after correcting the position of the electronic component based on the correction value, the electronic component is mounted on the circuit board 10. In recent years, the resolution of the component recognition device has been significantly improved, and as described above, the mounting accuracy is corrected as described above. Absent.

However, regarding the mechanism configuration of the electronic component mounting apparatus, as shown in FIG. 8, the electronic component 18 held by the suction nozzle 7 in a state of being displaced is recognized by the recognition correction and the predetermined position of the circuit board 10 is determined. When the nozzle unit 19 descends after being positioned so as to face the component mounting part, the suction nozzle 7 comes into contact with the electronic component 18 already mounted in the adjacent location as shown in part A. However, there is a disadvantage that the mounted electronic component 18 is damaged and the quality of the produced circuit board 10 is impaired.

Therefore, in order to avoid the above-described inconvenience, it is conceivable to make the suction nozzle 7 as small as possible so as not to contact the mounted electronic component 18. However, in such a case, since the suction nozzle 7 has a smaller suction port diameter, the suction force on the electronic component 18 decreases, and the occurrence rate of the suction error of the electronic component 18 increases. However, the electronic components 18 to be discarded increase due to the suction error, resulting in an economic loss. In addition, the strength of the suction nozzle 7 also decreases as the outer wall of the suction nozzle 7 becomes thinner, and the maintenance frequency of the suction nozzle 7 increases, resulting in an increase in cost.

Accordingly, the present invention has been made in view of the above-described conventional problems, and uses an existing suction nozzle V to mount electronic components on a circuit board at a high density, while preventing the circuit board from being damaged by the electronic components. It is an object of the present invention to provide an electronic component mounting method and a mounting device capable of preventing deterioration in the quality of a board. Disclosure of the invention

In order to achieve the above object, a method for mounting an electronic component according to the present invention provides a method of mounting an electronic component in a process of sucking an electronic component supplied from a component supply unit with a suction nozzle, taking out the electronic component, and transferring the electronic component onto a circuit board. And calculating whether or not it is possible to mount the electronic component being sucked to the suction nozzle on the circuit board without any trouble, based on the shift amount. An electronic component whose determination result is possible is mounted on a circuit board.

In this electronic component mounting method, the electronic component that is being sucked by the suction nozzle is only moved when the amount of displacement of the electronic component with respect to the suction nozzle is such that the suction nozzle can closely face the circuit board during mounting operation. Since it is mounted on a circuit board, high quality can be ensured on the produced circuit board.

In the above invention, a range of the circuit board in which the suction nozzle is in close proximity to the electronic component when the electronic component being sucked by the suction nozzle is mounted on the circuit board is determined based on a shift amount of the electronic component with respect to the suction nozzle. The electronic component being sucked onto the circuit board based on whether or not the area of the electronic component mounted on the circuit board does not overlap with the electronic component already mounted on the position adjacent to the position where the electronic component being sucked on the suction nozzle is mounted on the circuit board. It is preferable to determine whether or not it is possible to mount the electronic components without any trouble, and to perform a control process to mount the electronic components determined to be non-overlapping on the circuit board.

In this way, if it is determined that the suction nozzle comes into contact with the mounted electronic component when the electronic component sucked and held by the suction nozzle is mounted as it is in a greatly displaced state, the mounting of the electronic component is stopped. Since this is not performed, it is possible to reliably prevent the suction nozzle from contacting and damaging the mounted electronic components, and to produce a high-quality circuit board.

Further, in the above control processing means, the electronic component being sucked by the suction nozzle is attached to a circuit board. When it is determined that the area of the circuit board on which the suction nozzle is close to and opposes when mounted on the circuit board overlaps with an electronic component already mounted at a position adjacent to the mounting position of the circuit board, the suction nozzle is sucking on the suction nozzle. If the electronic component has no polarity, the electronic component that is being sucked by the suction nozzle is placed on the circuit board based on the shift amount of the electronic component with respect to the suction nozzle assuming that the electronic component has been rotated by 180 °. When mounting, a range of the circuit board on which the suction nozzles are close to and opposed to each other is obtained, and the obtained range is already mounted at a position adjacent to a position on the circuit board at which the electronic component being suctioned to the suction nozzle is mounted. It is determined whether or not the electronic component being sucked by the suction nozzle can be mounted on the circuit board without any trouble based on whether the electronic component does not overlap with the electronic component. It is preferred to mount the circuit board after the electronic component is rotated 1 8 0 °.

This not only prevents the suction nozzle from contacting and damaging the mounted electronic components during the mounting operation, but also allows the non-polarized electronic components to be flipped and mounted by inverting them. If the nozzle does not contact the adjacent mounted electronic components, the electronic components are rotated and then mounted by 180 degrees, so the number of electronic components to be discarded can be reduced as much as possible to reduce costs. .

Further, in the above invention, it is determined whether or not the electronic component being sucked can be mounted on the circuit board without any trouble based on whether or not the shift amount of the electronic component with respect to the suction nozzle is smaller than a preset regulation value. The electronic component whose determination result is possible can be mounted on the circuit board.

As a result, it is possible to reliably prevent the suction nozzle from contacting and damaging the mounted electronic components during the mounting operation, and to ensure high quality on the produced circuit board. There is an advantage that the control processing can be simplified.

Also, the electronic component mounting apparatus of the present invention includes a mounting head for picking up and taking out an electronic component supplied from a component supply unit by a suction nozzle, and then transferring the electronic component to a circuit board for mounting. In the process of transferring the electronic component held by suction onto the circuit board, the electronic component is image-recognized and a shift amount of the electronic component with respect to the suction nozzle is calculated. During the suction by the suction nozzle Mounting presence / absence determining means for determining whether or not the child component can be mounted on the circuit board without any trouble, and mounting the electronic component on the circuit board determined by the mounting presence / absence determining means to have no trouble. It is configured as follows.

In this electronic component mounting apparatus, mounting presence / absence determining means for determining whether or not it is possible to mount the electronic component being sucked on the suction nozzle on the circuit board without any trouble based on the amount of displacement of the electronic component with respect to the suction nozzle. With this arrangement, the electronic component mounting method of the present invention can be faithfully embodied, and the effect of the mounting method can be reliably obtained. In addition, since the shift amount of the electronic component with respect to the suction nozzle calculated by the component recognition device included in the existing electronic component mounting device is used, the configuration can be made at low cost. BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 is a block diagram showing a main configuration of an electronic component mounting apparatus for embodying the electronic component mounting method of the present invention.

FIG. 2 is a flow chart illustrating a control process of the electronic component mounting method according to the first embodiment of the present invention.

Fig. 3 is an explanatory diagram of the mounting method described above.

FIG. 4 is a flow chart showing a control process of the electronic component mounting method according to the second embodiment of the present invention.

FIG. 5 is a flowchart illustrating a control process of an electronic component mounting method according to a third embodiment of the present invention, and FIG. 6 is an electronic component mounting apparatus including a low-profile mounting head. FIG. 4 is a schematic plan view showing

FIG. 7 is an explanatory diagram schematically showing a recognition image obtained by the component recognition device in the electronic component mounting apparatus,

FIG. 8 is a side view showing a state of occurrence of inconvenience caused by a conventional electronic component mounting method. BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the drawings. FIG. 1 shows a simplified configuration of a main part of an electronic component mounting apparatus for realizing a method of mounting an electronic component of the present invention. FIG. The electronic component mounting apparatus includes an electronic component mounting mechanism 20 and a controller 21. The electronic component mounting mechanism 20 includes a plurality of (1) having suction nozzles 7 at the lower end. The nozzle unit 19 is mounted on a concentric circle around the rotating drum 8 at equal intervals. The mounting head 9 is mounted via a gear mechanism 22 and a mounting head 9 is mounted. It is configured to include a control mode 23 of a drive source for controlling rotation.

On the other hand, in the third step ST3 of FIG. 6, the control unit 21 determines the center of the electronic component 18 with respect to the center of the suction nozzle 7 based on the image data captured by the recognition camera of the component recognition device 11. A shift amount calculating means 24 for calculating the shift amount of the part, and an electronic component 18 which is held by the suction nozzle 7 based on the shift amount calculated by the shift amount calculating means 24 are mounted on the circuit board 10. Mounting presence / absence determining means 27 for determining whether or not the mounting is possible. The displacement amount calculating means 24 can be used inexpensively because it can also serve as the component recognition device 11 provided in the existing electronic component mounting apparatus.

Next, a flow chart of FIG. 2 showing a control process of a mounting method of an electronic component according to the first embodiment will be described with reference to an explanatory diagram of FIG. When the suction nozzle 7 sucks and holds the electronic component 18 at the first station ST 1 in FIG. 6 and then transfers the electronic component 18 to the third station ST 3, the shift amount calculating means 24 uses the component recognition device 1. (1) Recognition The camera performs image recognition of the electronic component 18 based on the image data obtained by capturing the electronic component 18 (step S 1). Subsequently, based on the recognition result described above, the shift amount calculating means 24 calculates the central part 17 a of the image 1 中央 of the electronic component 18 held by the suction nozzle 7 as shown in FIG. The position coordinates (X !, y,) are calculated (step S2). The position coordinates (x, y) of the central portion of the suction nozzle 7 are recognized in advance for each suction nozzle 7 and registered in the shift amount calculating means 24. Further, the shift amount calculating means 24 calculates (X-X,) and (y-) to obtain the image 1 of the suction nozzle 7 as shown in FIG. The shift amount (Δ （, Ay) of the position coordinates (X,, y,) of the center part 17 a of the image 17 of the electronic component 18 with respect to the position coordinates (X, y) of the center part 14 a of step 4 is calculated (step S 3) o

Next, the mounting presence / absence determining means 27 determines the shift amount (Δχ, Ay) calculated by the shift amount calculating means 24 and the mounting position 28 on the circuit board 10 shown in FIG. 3 where the next electronic component is to be mounted. From the coordinates (X _ls Y,) at the center and the area of the suction port at the tip of the suction nozzle 7, the area 29 of the circuit board 10 to which the suction nozzle 7 closely faces when mounting the electronic component 18 being suctioned is determined. (Step S4). Further, the mounting presence / absence determining means 27 determines the mounting range 30 of the electronic component 18 already mounted at a position adjacent to the mounting position 28 of the electronic component 18 being suctioned by the suction nozzle 7 by the position coordinates (Χ ₂ , Y ₂ ) (Step S5).

Subsequently, the mounting presence / absence determining means 27 compares and contrasts the range 29 of the circuit board 10 where the suction nozzle 7 is close to and opposes with the mounting range 30 of the mounted electronic component 18 (step S6). It is determined whether or not some of the 30 overlap, that is, whether or not the suction nozzle 7 contacts the mounted electronic component 18 during the mounting operation (step S7). If it is determined that they do not contact, when the suction nozzle 7 moves to the sixth station S-6 in FIG. 6, the electronic component 18 held by the suction nozzle 7 is mounted on the circuit board 10. (Step S8). On the other hand, if the suction nozzle 7 is determined to be in contact, when the suction nozzle 7 moves to the sixth station ST 6, the vertical movement of the nozzle unit 19 is stopped, and the suction nozzle 7 holds the electronic component 18 by suction and thereafter. It is transferred to the stations ST7 to ST10, and the suction nozzle 7 releases the suction to the electronic component 18 at a predetermined position, and the electronic component 18 is discarded. Thereby, it is possible to reliably prevent the suction nozzle 7 from contacting and damaging the mounted electronic component 18 during the mounting operation, and to ensure high quality of the produced circuit board 10.

FIG. 4 is a flowchart illustrating a control process of a mounting method of an electronic component according to the second embodiment of the present invention, and the mounting method will be described. When the suction nozzle 7 holding the electronic component 18 by suction is transferred to the third station ST3, a method for calculating a deviation amount is performed. The stage 24 recognizes the image of the electronic component 18 based on the image data of the component recognition device 11 (step S11). Subsequently, the shift amount calculating means 24 calculates the position coordinates ( _Xl , y,) of the center of the electronic component 18 sucked and held by the suction nozzle 7 based on the above-described recognition result (step _S12 ). . Further, the shift amount calculating means 24 calculates (X—X,) and (y—) to calculate the position coordinates of the center of the electronic component 18 with respect to the position coordinates (X, y) of the center of the suction nozzle 7. The shift amount (Δχ, Δy) of ( _Xl ,) is calculated (step S13).

Next, the mounting presence / absence determining means 27 calculates the displacement (mm x, Ay) calculated by the above-described displacement calculating means 24 and the coordinates of the center of the mounting position 28 on the circuit board 10 where the next electronic component is to be mounted. From (X,, Y,) and the area of the suction port at the tip of the suction nozzle 7, a range 29 of the circuit board 10 where the suction nozzle 7 is in close proximity when mounting the electronic component 18 being sucked is obtained ( Step S14). Further, the mounting presence / absence determining means 27 determines the mounting range 30 of the electronic component 18 already mounted at a location adjacent to the mounting position 28 of the electronic component 18 being sucked by the suction nozzle 7 by using the position coordinates ( X ₂ , Y ₂ ) (step S15).

Subsequently, the mounting presence / absence determining means 27 compares and contrasts the area 29 where the suction nozzle 7 is in close proximity to the circuit board 10 with the mounting area 30 of the mounted electronic component 18 (step S16). It is determined whether or not some of the 30 overlap, that is, whether or not the suction nozzle 7 contacts the mounted electronic component 18 during the mounting operation (step S17). If it is determined that there is no contact, when the suction nozzle 7 moves to the sixth station ST6, processing is performed so that the electronic component 18 suction-held by the suction nozzle 7 is mounted on the circuit board 10 (step S18). ). The above control processing is the same as in the first embodiment.

On the other hand, if it is determined that the electronic component 18 comes into contact (step S17), it is determined whether the electronic component 18 being sucked by the suction nozzle 7 is of a type having polarity (step S19). If it is determined that the electronic component 18 has no polarity, it is possible to mount the electronic component 18 in a state where the direction is reversed. The calculated deviation (Δ χ, A y) is assumed to have been rotated 180 °, and the deviation (量, Δγ) should be mounted next to the electronic component on the circuit board 10. Based on the coordinates (XΥ,) at the center of the mounting position 28 and the area of the suction port at the tip of the suction nozzle 7, a circuit in which the suction nozzle 7 is closely opposed when mounting the electronic component 18 being suctioned The range of the substrate 10 is obtained again (step S20).

Next, the mounting presence / absence determining means 27 compares and compares the range of the circuit board 10 on which the suction nozzle 7 obtained as described above is opposed to and the mounting range 30 of the mounted electronic component 18. Then (step S21), it is determined whether or not the suction nozzle 7 contacts the mounted electronic component 18 during the mounting operation based on whether or not a part of the two ranges overlap (step S22). If it is determined that no contact occurs, the position of the electronic component 18 is inverted by rotating the suction nozzle 7 by 180 ° (step S23), and then the suction nozzle 7 is moved to the sixth station ST6. When the electronic component 18 is moved, the electronic component 18 held by the suction nozzle 7 is processed to be mounted on the circuit board 10 (step S 18). On the other hand, if it is determined that the electronic component has a polarity, or if it is determined in step S 19 that the electronic component 18 has polarity, when the suction nozzle 7 moves to the sixth station SΤ6, the nozzle unit 19 The suction nozzle 7 holds the electronic component 18 while sucking and holding it, and then transfers it to the subsequent stations ST 7 to ST 10 so that the suction nozzle 7 sucks the electronic component 18 at a predetermined location. The electronic component 18 is released and disposed so as to be discarded (step S24).

By controlling the mounting of the electronic components as described above, it is possible to prevent the suction nozzle 7 from contacting and damaging the mounted electronic components 18 during the mounting operation, as in the first embodiment. In addition to the reliable prevention, if the suction nozzle 7 does not contact the adjacent mounted electronic component 18 when it is assumed that the non-polar electronic component 18 is mounted upside down, Electronic components 18 to 180. Since the components are mounted after being rotated, the number of electronic components 18 to be discarded can be reduced as much as possible to reduce costs.

FIG. 5 is a flowchart showing a control process of a mounting method of an electronic component according to the third embodiment of the present invention. This mounting method will be described. Suction nozzle 7 is the first stage When the electronic component 18 was sucked and held by the station ST1, and then transferred to the third station ST3, the shift amount calculating means 24 used the component recognition device 11 to take an image of the electronic component 18 with the recognition camera. The electronic component 18 is image-recognized based on the image data (step S31). Subsequently, the shift amount calculating means 24 calculates the position coordinates (χ ,, y,) of the central part of the electronic component 18 sucked and held by the suction nozzle 7 based on the above recognition result (Step S). 32). Further, the shift amount calculating means 24 calculates (X−X,) and (y−y,), and calculates the position of the center of the electronic component 18 with respect to the position coordinates (X, y) of the center of the suction nozzle 7. The deviation amount (Δχ, Ay) of the position coordinates (x, y,) is calculated (step S33).

Subsequently, the mounting presence / absence determining means 27 compares the deviation amount (Δχ, Ay) calculated by the above-mentioned deviation amount calculating means 24 with a pre-registered regulation value (step S34), and calculates the deviation amount (Δχ , Ay) is smaller than the regulation value (step S35). If the suction nozzle 7 is determined to be smaller than the regulation value, when the suction nozzle 7 moves to the sixth station ST 6, processing is performed so that the electronic component 18 suction-held by the suction nozzle 7 is mounted on the circuit board 10. (Step S36). On the other hand, if the suction nozzle 7 is determined to be larger than the regulation value, the vertical movement of the nozzle unit 19 is stopped when the suction nozzle 7 moves to the sixth station ST6, and the suction nozzle 7 holds the electronic component 18 by suction. The suction nozzle 7 releases the suction to the electronic component 18 at a predetermined location at a predetermined position, and discards the electronic component 18 (step S37). As a result, it is possible to reliably prevent the suction nozzle 7 from contacting and damaging the mounted electronic components 18 during the mounting operation, and in addition to ensuring high quality of the produced circuit board 10, There is an advantage that control processing of the mounting method can be simplified. Industrial applicability

As described above, according to the electronic component mounting method of the present invention, when the amount of displacement of the electronic component with respect to the suction nozzle is such that the suction nozzle can approach the circuit board without any trouble during the mounting operation, the suction nozzle The electronic components that are being picked up are mounted on the circuit board. Thus, high quality can be ensured for a circuit board on which electronic components are mounted at high density. Further, according to the electronic component mounting apparatus of the present invention, it is determined whether or not it is possible to mount the electronic component being sucked to the suction nozzle on the circuit board without any trouble based on the amount of displacement of the electronic component with respect to the suction nozzle. Is provided, the mounting method of the electronic component of the present invention can be faithfully embodied, and the effect of the mounting method can be reliably obtained. Therefore, the present invention is useful for achieving both high-density mounting of electronic components and prevention of deterioration in circuit board quality due to damage to the electronic components.

Claims

The scope of the claims

1. In the process of picking up the electronic component (18) supplied from the component supply section (1) by the suction nozzle (7), taking out the component, and transferring it to the circuit board (10), the electronic component (18) Calculating the amount of deviation from the suction nozzle (7),

Whether the electronic component (18) being suctioned to the suction nozzle (7) can be mounted on the circuit board (10) without any trouble is determined based on the displacement amount. A method of mounting an electronic component, comprising mounting an electronic component (18) whose determination result is acceptable on a circuit board (10).

2. Based on the amount of displacement of the electronic component (18) with respect to the suction nozzle (7), when mounting the electronic component (18) being suctioned by the suction nozzle (7) on the circuit board (10), the suction nozzle ( 7) determine the range (29) of the circuit board (10) in which

The determined range (29) Force does not overlap with the electronic component (18) mounted on the circuit board (10) adjacent to the position where the electronic component (18) being sucked by the suction nozzle (7) is mounted. Based on whether or not it is possible, it is determined whether or not the electronic component (18) being sucked can be mounted on the circuit board (10) without any trouble.

The electronic component mounting method according to claim 1, wherein the electronic component (18) determined not to overlap is mounted on the circuit board (10).

3. When mounting the electronic component (18) on the circuit board (10), which is being sucked by the suction nozzle (7), the area (29) of the circuit board (10) where the suction nozzle (7) is in close proximity is set. When it is determined that the electronic component (18) already mounted on the position adjacent to the mounting position of the circuit board (10) overlaps with the electronic component (18), the electronic component (18) being suctioned by the suction nozzle (7) has a polarity. If it is determined that the electronic component (18) has been rotated by 180 °, the electronic component (18) that is being suctioned by the suction nozzle (7) is determined based on the amount of deviation of the electronic component (18) from the suction nozzle (7). ) Is mounted on the circuit board (10), and the area of the circuit board (10) where the suction nozzle (7) is in close proximity to the circuit board (10) is determined. Whether the obtained range does not overlap with the electronic component (18) mounted on the circuit board (10) adjacent to the position where the electronic component (18) being sucked by the suction nozzle (7) is mounted. It is determined whether or not it is possible to mount the electronic component (18) being sucked on the suction nozzle (7) on the circuit board (10) without any trouble based on the above, and the determination result is possible. 3. The electronic component mounting method according to claim 2, wherein the electronic component (18) is rotated by 180 ° and then mounted on the circuit board (10).

4. Mount the electronic component (18) being sucked on the circuit board (10) without any trouble, based on whether the deviation of the electronic component (18) from the suction nozzle (7) is smaller than a preset regulation value. Determine whether it is possible to

The electronic component mounting method according to claim 1, wherein an electronic component (18) whose determination result is possible is mounted on the circuit board (10).

5. A mounting head that picks up the electronic component (18) supplied from the component supply section (1) by the suction nozzle (7), removes it, and then transfers it to the circuit board (10) for mounting.

(9) and

In the process of transferring the electronic component (18) sucked and held by the suction nozzle (7) onto the circuit board (10), the electronic component (18) is image-recognized and the suction nozzle (7) of the electronic component (18) is recognized. And an electronic component (18) being sucked by the suction nozzle (7) on the circuit board (10) without any trouble based on the calculated shift amount. Mounting presence / absence determining means (27) for determining whether or not mounting is possible;

An electronic component mounting apparatus characterized in that the electronic component (18) determined by the mounting presence / absence determining means (27) to be non-overlapping is mounted on the circuit board (10).