WO2000057490A1 - Lamp - Google Patents

Lamp Download PDF

Info

Publication number
WO2000057490A1
WO2000057490A1 PCT/IB2000/000232 IB0000232W WO0057490A1 WO 2000057490 A1 WO2000057490 A1 WO 2000057490A1 IB 0000232 W IB0000232 W IB 0000232W WO 0057490 A1 WO0057490 A1 WO 0057490A1
Authority
WO
WIPO (PCT)
Prior art keywords
light
characterized
according
lamp
lens
Prior art date
Application number
PCT/IB2000/000232
Other languages
German (de)
French (fr)
Inventor
Adrian WOHLER
Original Assignee
Eurolight Illumination Technologies Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to CH52699 priority Critical
Priority to CH526/99 priority
Application filed by Eurolight Illumination Technologies Gmbh filed Critical Eurolight Illumination Technologies Gmbh
Publication of WO2000057490A1 publication Critical patent/WO2000057490A1/en

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/233Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/501Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502Wavelength conversion materials
    • H01L33/504Elements with two or more wavelength conversion materials
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/507Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/508Wavelength conversion elements having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material

Abstract

The lamp has a part embodied as a contact socket (2), a reflector (24) having a hole closed by a lens (25) and a support (26), on one side of which four light-emitting diodes (6, 7, 8, 9) powered by a constant current source (11) are disposed in such a way that a light having a desired shading is irradiated by the optical system (25). A light-emitting diode together with two photoluminescent phosphor layers can be embedded in a translucent material.

Description

lamp

The invention relates to a luminaire according to the preamble of claim 1.

Miniaturized bulbs are nowadays already overall commercially available in many forms. Among them, the so-called halogen lamps have found a permanent place with greatly reduced quartz or hard glass bulb. Such incandescent lamps, which are provided for example with a tungsten wire, and include a bromine compound, characterized by high luminous efficiency, long life and very small dimensions. They are used not only in the photographic and cinematographic technique, but also for general lighting object.

It is an object of the invention to provide a new light, further advantages can be achieved with the still.

This object is according to the invention advantageously achieved by a lamp according to claim. 1

The inventive light brings an excellent combination of advantages. In addition to a significant energy saving and a very long service life, it has a high impact resistance, and they are practically no self-heating and does not radiate in the ultraviolet range.

Other advantageous embodiments of the invention emerge from the dependent claims.

The invention is explained in more detail below, for example, with reference to drawings. Show it:

Fig. 1 and 2 are schematic configurations of a first and a second embodiment of a lamp according to the invention,

ERSATZBLÄIT (RULE 26) Fig. 3 is a plan view of the support side shown in Fig. 1,

FIGS. 4 and 5 are schematic representations of a first and a second light emitting element according to the invention,

Fig. 6 is a block diagram for explaining the differences between a single light and a special light according to the invention,

Fig. 7 is a block diagram for explaining the operation of the two preferred embodiments according to the invention,

Fig. 8, the radiation characteristic of a light-emitting diode with two

Phosphor layers of three colors on the left and a light emitting diode for an orange light, right, and

FIGS. 9 to 11 different color charts for explaining the operation of a combination of these LEDs.

The lamp according to Fig. 1 comprises a contact base 1, a preferably conical housing socket 2 and a reflector 3, for example made of a light material with a reflective inner layer, which is formed preferably funnel-shaped and has a completed by an optical system 4 opening. The wider end of the socket 2 is mounted on one side of a flat support 5 and the base side of the reflector 3 on the other side of this support. 5 In the carrier 5 are a plurality of luminous elements 6, 7, 8, 9 disposed such that they can radiate symmetrically through the optical system 4 preferably light. The inner peripheral region of the wearer and two circuits 10, 11 are housed. In the figure, the contact base 1 with two connectors or contact pins 12 shown. 13 but it is also more contact pins be present.

The lamp of FIG. 2 includes a contact socket 20 formed as a module with a sub-miniature switching power supply 21 and two connections or contact pins 22, 23 and a reflector 24, for example made of a light material with a reflective home nenschicht, which is preferably formed in a funnel shape and a by having an optical system 25 closed opening. The other end of the module 20 is attached to the

ERSÄΪZBLATT (CON 6) mounted one side of a flat support 26 and the base side of the reflector 24 on the other side of this carrier 26th In the carrier 26 are also luminous elements 6, 7, 8, 9 and circuits 10, 11 are arranged in FIG. 1.

Fig. 3 shows the relative arrangement of the elements 6 to 11 on the supports 5 (Fig. 1) and 26 (Fig. 2). The light-emitting elements 6 to 9 are preferably high power light-emitting diodes. The light-emitting elements 7 and 8 closer to the center of the carrier 5 or 26 disc-shaped 6 and 9, for example, AlInGaP light-emitting diodes, or vice versa, for example, InGaN light-emitting diodes and the two slightly light-emitting elements further outwardly. On the carrier 5 or 26 and a NTC-circuit 14 is mounted, which serves as a temperature regulator. The circuits 10 and 11 constitute a check or control a constant current source.

The lamp according to Fig. 1 and 2 can be modular. As shown in FIG. 1, for example, forms the carrier 5 with the different elements 6 to 11, a first module 15 and the optical system 4 may also be a second module 4. Also, the contact socket 20 (Fig. 2) may comprise a support 27 on which the sub-miniature switching power supply 21 is mounted, which is formed together with the carrier 27 as an additional or third module 27. The contact socket 20 can for example have an outer cylindrical wall 28th Preferably, the reflectors 3 and / or 24 made of plastic, such as polycarbonate, having an inner vapor-deposited aluminum layer as a reflector surface, the housing socket or wall 2 and the reflector 3 (Fig. 1) or the corresponding parts are 28 and 24 formed integrally may be, and wherein an annular shoulder formed as seat for the respective carrier 5 and 26 may be provided between the parts 2 and 3 or 28 and 24th If she

Lamps according to Fig. 1 and 2 have a modular or not, they preferably include a constant current source 11 and a temperature control 14 (Fig. 3), the special light according to Fig. 2, in addition a drive 10 (Fig. 3), and optionally in the having contact socket 20 housed subminiature switching power supply 21st In FIG. 1 are also connecting wires 16, 17 shown for the current supply.

Fig. 4 shows an example of an inventive light-emitting element having an InGaN light-emitting diode 41, mounted on so-called gull-wing terminals 42, 43 and connected, and the whole being housed in a translucent housing 40, which is preferably as transparent -Füllmasse, may be formed, for example made of colorless epoxy material or silicone. The outer region of the housing from which the light is emitted, is formed in the form of a lens 44, symmetrically with respect to the light radiated by the light source 41 light beam. Inside the housing, a first photo luminescent phosphor layer 45 is embedded, which is thus directly and slightly arched above the light source 41st The phosphor layer 45 may be optionally located also at least partially in the lower portion of the lens 44, as Fig. 5 shows. integrated in the region of the lens, for example, in the filler according to the invention is a second phosphor layer 46, preferably in the outer region, as shown in Figs. 4 and 5. The substrate of the light emitting diode can be as usual from Al2O3. The bottom portion of the light emitting diode is formed as a cooling surface 47 off.

The block diagram of FIG. 6 shows the modules 4, 15 and 20, and an operating member 61. However, a simple embodiment of the luminaire comprises only the module 4 and a module 15 with the circuits 11 and 14. The block diagram of FIG. 7 illustrates that the constant current source 11 is provided to energize the light-emitting elements 6 and 9 and / or 7 and 8 with a constant current, and that the temperature control 14 is connected to the constant current source 11. In the particular embodiment of FIG. 2, the drive 10 can include a circuit 71, to adjust the color temperature of the lamp, and / or a dimmer 72, to regulate the brightness of the light in flie- sequent transitions, the circuit 71 by a operating element 73 and the dimmers 72 by an actuator 74, for example, each with an open reflector (reflector with remote lens) or by means of additional wires or other means, can be actuated.

Fig. 8 on the left shows the radiation characteristics of an InGaN light-emitting diode with two phosphor layers which radiates, accordingly, in three colors, namely blue, green and yellow, and the right, the radiation pattern of a commercially available AHnGaP light-emitting diode for an orange light of 590 nm wavelength , The basic color of light emitted from the InGaN light-emitting diode is blue; excited by this light, the first phosphor layer and the green light, the second phosphor layer emits yellow light from. In FIG. 8, the corresponding wavelengths 460 nm, 505 nm and 550 nm of the light mixture are given, which is emitted from the InGaN light-emitting diode.

In the color chart of Fig. 9, the color components are 91, 92 and 93 according to the invention for the colors blue, green and yellow, an InGaN light-emitting diode with the two phosphorus

ERSATZBLÄTT RULE specified layers 26th For these colors, a mixing point 94. results For the coordinates following values ​​apply:

Blue: x = 0.12 to 0.20 or 0.14 to 0.17 and y = 0.03 to 0.06 or 0.04 to 0.05

Yellow: x = 0.20 to 0.40 or 0.25 to 0.33, and y = 0.50 to 0.70 or 0.62 to .67 green: x = 0.08 to 0.12, or 0 , from 09 to 0.10 and y = 0.40 to 0.70 or 0.50 to 0.60

In the color chart of Fig. 10 the color components of the mixing point 94 of FIG. 8 and the color portion 95 are indicated for the orange of the AlInGaP LED. From these two color components, a mixing point 96, which exceeds approximately coincides with the reference white point is obtained. In the illustrated axis any color temperature can be achieved. Orange:: for the coordinates of the color portion 95 following values ​​apply x = 0.5 to 0.7 or from 0.52 to 0.62 and y = 0.3 to 0.5 or 0.4 to 0.5

Fig. 11 shows a color chart for a mixture of four color components. With the aid of the constant current source, the currents can be calibrated or regulated in order to obtain a desired mixed color. Preferably, both light emitting diodes are controlled together by the dimmer 72, wherein the orange component is controlled to control the color only.

To be able to improve the cooling of the support 5 and 26, for example, aluminum plates of about 1 to 2 mm thickness to be that are occupied on the front side with a thin copper plate, film or layer to the brazing of the components 6 to 10 ( to facilitate Fig. 1). The inventive lamp provides not only an adjustable color temperature and high color rendering index, but also a great freedom in the choice of design; so a value of only 10 to 30 mm, for example, for the conditions shown in the figures, distance D between the light emitting diodes and the lens can be selected, but preferably 12 to 14 mm, and the diameter of the lens, a value of 40 to 80 mm, preferably However, 45 to 55 mm. The lens may be on the inside as a Fresnel lens, optionally of acrylic glass, and the outer side as a diffusing lens, preferably formed from polycarbonate. A starting material for the layers 45, 46 may be, for example, yellow phosphorus.

Claims

P atentanspr ü che
1. Lamp with a reflector (3, 24) having a through an optical system (4, 25) closed opening, and a support (5, 26), characterized in that on one side of the carrier (5, 26) at least one luminous element (6, 7, 8, 9) is arranged such that light through the optical system (4, 25) is emitted.
2. Lamp according to claim 1, characterized in that the luminous element (6, 7, 8, 9) from a constant current source (11) is fed semi-conductor light emitting element.
3. Lamp according to claim 2, characterized in that it comprises a to the constant current source (11) connected to temperature control (14).
4. (20, 27, 28) Luminaire according to one of claims 1 to 3, characterized in that it comprises a contact base having a subminiature switch mode power supply (21) and two connections (22, 23).
5. Light according to one of claims 2 to 4, characterized in that it additionally comprises a circuit (71) for adjusting the color temperature of the lamp and / or a dimmer switch (72) for regulating the brightness of the light.
6. Light according to one of claims 1 to 5,
ERSATZBUffT (RULE 26) characterized, in that
light-emitting elements are available, which have color components in a color chart, which provide a desired color mixing.
7. Light according to one of claims 1 to 6, characterized in that the light elements (6, 7, 8, 9) InGaN light-emitting diodes and / or AlInGaP light-emitting diodes.
8. Light according to one of claims 1 to 7, characterized in that
light-emitting elements are present, the color components in a color chart (91, 92, 93, 94) for the colors blue, green, yellow and orange which are subject to coordinate the following values:
Blue: x = 0.12 to 0.20 or 0.14 to 0.17 and y = 0.03 to 0.06 or 0.04 to 0.05
Yellow: x = 0.20 to 0.40 or 0.25 to 0.33, and y = 0.50 to 0.70 or 0.62 to .67
Green: x = 0.08 to 0.12 or 0.09 to 0.10 and y = 0.40 to 0.70 or 0.50 to 0.60 Orange: x = 0.5 to 0.7 or 0 52 to 0.62, and y = 0.30 to 0.50 or 0.40 to 0.50
9. Light according to one of claims 1 to 8, characterized in that at least one light emitting diode (41) in a light-transmitting material (40) is housed, whose outer portion is formed preferably in the form of a lens (44).
10. Light according to one of claims 1 to 9, characterized in that in the interior of a light transmissive material (40) one, two or more photoluminescent layers, preferably photoluminescent phosphor layers (45, 46) are embedded.
11. Lamp according to claim 9 or 10, characterized in that a photoluminescent phosphor layer (46) located in the outer region (44) of light transmitting material (40) or the lens (44) is integrated.
12. Light according to one of claims 1 to 11, characterized in that a value of 10 to 30 mm is selected for the distance D between the light emitting elements and designed as a lens optical system, but preferably 12 to 14 mm, and / or that for the diameter of the lens, a value of 40 to 80 mm but preferably 45 to 55 mm is selected.
ERSATZBLAΠ (RULE 26)
PCT/IB2000/000232 1999-03-19 2000-03-07 Lamp WO2000057490A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CH52699 1999-03-19
CH526/99 1999-03-19

Publications (1)

Publication Number Publication Date
WO2000057490A1 true WO2000057490A1 (en) 2000-09-28

Family

ID=4189030

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2000/000232 WO2000057490A1 (en) 1999-03-19 2000-03-07 Lamp

Country Status (1)

Country Link
WO (1) WO2000057490A1 (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001093342A1 (en) * 2000-05-29 2001-12-06 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Led-based white-light emitting lighting unit
WO2001093341A1 (en) * 2000-05-29 2001-12-06 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Led-based white-light emitting lighting unit
WO2003010830A2 (en) * 2001-07-26 2003-02-06 Koninklijke Philips Electronics N.V. Multichip led package with in-package quantitative and spectral sensing capability and digital signal output
WO2003036159A1 (en) * 2001-10-25 2003-05-01 Tir Systems Ltd. Solid state continuous sealed clean room light fixture
US6809475B2 (en) 2000-06-15 2004-10-26 Lednium Pty Limited Led lamp with light-emitting junctions arranged in a three-dimensional array
EP1795797A1 (en) * 2004-09-27 2007-06-13 Sze Keun Chan Led lamp
DE10230105B4 (en) * 2001-07-05 2007-07-26 Tridonic Optoelectronics Gmbh White LED light source
EP1930959A1 (en) * 2002-08-30 2008-06-11 Gelcore LLC Phosphor-coated led with improved efficiency
US7479662B2 (en) 2002-08-30 2009-01-20 Lumination Llc Coated LED with improved efficiency
WO2009104136A1 (en) * 2008-02-21 2009-08-27 Philips Intellectual Property & Standards Gmbh Gls-alike led light source
CN104456358A (en) * 2014-11-27 2015-03-25 龙桂山 Automotive interior LED lamp
US9841175B2 (en) 2012-05-04 2017-12-12 GE Lighting Solutions, LLC Optics system for solid state lighting apparatus
US9951938B2 (en) 2009-10-02 2018-04-24 GE Lighting Solutions, LLC LED lamp

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5173810A (en) * 1991-08-21 1992-12-22 Aisens Co., Ltd. Light transmitting lens for use with a photoelectric sensor
DE19651140A1 (en) * 1995-12-13 1997-06-19 Loptique Ges Fuer Lichtsysteme Light with low power consumption
US5803579A (en) * 1996-06-13 1998-09-08 Gentex Corporation Illuminator assembly incorporating light emitting diodes

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5173810A (en) * 1991-08-21 1992-12-22 Aisens Co., Ltd. Light transmitting lens for use with a photoelectric sensor
DE19651140A1 (en) * 1995-12-13 1997-06-19 Loptique Ges Fuer Lichtsysteme Light with low power consumption
US5803579A (en) * 1996-06-13 1998-09-08 Gentex Corporation Illuminator assembly incorporating light emitting diodes

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
None

Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7002291B2 (en) 2000-05-29 2006-02-21 Patent-Treuhand-Gesellschaft Fur Elektrische Gluhlampen Mbh LED-based white-emitting illumination unit
WO2001093341A1 (en) * 2000-05-29 2001-12-06 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Led-based white-light emitting lighting unit
US6504179B1 (en) 2000-05-29 2003-01-07 Patent-Treuhand-Gesellschaft Fur Elektrische Gluhlampen Mbh Led-based white-emitting illumination unit
JP4695819B2 (en) * 2000-05-29 2011-06-08 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH White light emitting lighting unit that the Led-based
US7183706B2 (en) 2000-05-29 2007-02-27 Patent-Treuhand-Gesellschaft Fur Elektrische Gluhlampen Mbh Led-based illumination unit
JP2003535478A (en) * 2000-05-29 2003-11-25 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング White light emitting lighting unit that the Led-based
WO2001093342A1 (en) * 2000-05-29 2001-12-06 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Led-based white-light emitting lighting unit
US6809475B2 (en) 2000-06-15 2004-10-26 Lednium Pty Limited Led lamp with light-emitting junctions arranged in a three-dimensional array
DE10230105B4 (en) * 2001-07-05 2007-07-26 Tridonic Optoelectronics Gmbh White LED light source
WO2003010830A3 (en) * 2001-07-26 2003-06-05 Koninkl Philips Electronics Nv Multichip led package with in-package quantitative and spectral sensing capability and digital signal output
WO2003010830A2 (en) * 2001-07-26 2003-02-06 Koninklijke Philips Electronics N.V. Multichip led package with in-package quantitative and spectral sensing capability and digital signal output
US6871983B2 (en) 2001-10-25 2005-03-29 Tir Systems Ltd. Solid state continuous sealed clean room light fixture
GB2398116B (en) * 2001-10-25 2005-05-25 Tir Systems Ltd Solid state continuous sealed clean room light fixture
GB2398116A (en) * 2001-10-25 2004-08-11 Tir Systems Ltd Solid state continuous sealed clean room light fixture
WO2003036159A1 (en) * 2001-10-25 2003-05-01 Tir Systems Ltd. Solid state continuous sealed clean room light fixture
DE10297364B4 (en) * 2001-10-25 2009-07-23 Tir Technology LP, Burnaby Continuously sealed solid-cleanroom lighting device
EP1930959A1 (en) * 2002-08-30 2008-06-11 Gelcore LLC Phosphor-coated led with improved efficiency
US7479662B2 (en) 2002-08-30 2009-01-20 Lumination Llc Coated LED with improved efficiency
EP1795797A4 (en) * 2004-09-27 2007-10-31 Sze Keun Chan Led lamp
EP1795797A1 (en) * 2004-09-27 2007-06-13 Sze Keun Chan Led lamp
WO2009104136A1 (en) * 2008-02-21 2009-08-27 Philips Intellectual Property & Standards Gmbh Gls-alike led light source
US8651723B2 (en) 2008-02-21 2014-02-18 Koninklijke Philips N.V. LED light source with a luminescent layer
US9951938B2 (en) 2009-10-02 2018-04-24 GE Lighting Solutions, LLC LED lamp
US9841175B2 (en) 2012-05-04 2017-12-12 GE Lighting Solutions, LLC Optics system for solid state lighting apparatus
US10139095B2 (en) 2012-05-04 2018-11-27 GE Lighting Solutions, LLC Reflector and lamp comprised thereof
CN104456358A (en) * 2014-11-27 2015-03-25 龙桂山 Automotive interior LED lamp

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DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
122 Ep: pct application non-entry in european phase