WO2000028381A1 - Procede pour produire des microcomposants possedant des canaux d'ecoulement - Google Patents

Procede pour produire des microcomposants possedant des canaux d'ecoulement Download PDF

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Publication number
WO2000028381A1
WO2000028381A1 PCT/DE1999/003286 DE9903286W WO0028381A1 WO 2000028381 A1 WO2000028381 A1 WO 2000028381A1 DE 9903286 W DE9903286 W DE 9903286W WO 0028381 A1 WO0028381 A1 WO 0028381A1
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WO
WIPO (PCT)
Prior art keywords
layer
metal
metal layer
screen printing
channels
Prior art date
Application number
PCT/DE1999/003286
Other languages
German (de)
English (en)
Inventor
Andreas Thies
Konrad CRÄMER
Heinrich Meyer
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19920161A external-priority patent/DE19920161A1/de
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Priority to AU16476/00A priority Critical patent/AU1647600A/en
Publication of WO2000028381A1 publication Critical patent/WO2000028381A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F25/00—Flow mixers; Mixers for falling materials, e.g. solid particles
    • B01F25/40—Static mixers
    • B01F25/42—Static mixers in which the mixing is affected by moving the components jointly in changing directions, e.g. in tubes provided with baffles or obstructions
    • B01F25/43—Mixing tubes, e.g. wherein the material is moved in a radial or partly reversed direction
    • B01F25/432—Mixing tubes, e.g. wherein the material is moved in a radial or partly reversed direction with means for dividing the material flow into separate sub-flows and for repositioning and recombining these sub-flows; Cross-mixing, e.g. conducting the outer layer of the material nearer to the axis of the tube or vice-versa
    • B01F25/4323—Mixing tubes, e.g. wherein the material is moved in a radial or partly reversed direction with means for dividing the material flow into separate sub-flows and for repositioning and recombining these sub-flows; Cross-mixing, e.g. conducting the outer layer of the material nearer to the axis of the tube or vice-versa using elements provided with a plurality of channels or using a plurality of tubes which can either be placed between common spaces or collectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F33/00—Other mixers; Mixing plants; Combinations of mixers
    • B01F33/30—Micromixers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J19/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J19/0093—Microreactors, e.g. miniaturised or microfabricated reactors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2310/00—Treatment by energy or chemical effects
    • B32B2310/08—Treatment by energy or chemical effects by wave energy or particle radiation
    • B32B2310/0806—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation
    • B32B2310/0843—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation using laser
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to a method for producing microcomponents with
  • Flow channels in at least one level in particular chemical microreactors, which can be used in the chemical industry, inter alia, for synthesis reactions and in other fields, for example as hydrogen sources for energy conversion (fuel cells), and also of heat exchangers, mixers and evaporators.
  • chemical microreactors which can be used in the chemical industry, inter alia, for synthesis reactions and in other fields, for example as hydrogen sources for energy conversion (fuel cells), and also of heat exchangers, mixers and evaporators.
  • reaction cells whose dimensions range from a few micrometers to a few millimeters and are therefore much smaller than those of conventional reactors. These reaction cells are designed so that physical, chemical or electrochemical reactions can take place in them. In contrast to a conventional porous system (heterogeneous catalysis), the dimensions of these cells are defined by the design, i.e. they can be produced according to plan using a technical process. The arrangement of individual reaction lines in the ensemble of the reactor is also ordered, in particular periodically in one, two or three dimensions.
  • chemical microreactors also include the necessary supply and discharge structures for the fluids (liquids, gases) as well as sensors and actuators, for example valves that control the flow of material through the individual cells, and heating elements.
  • a chemical microreactor can be produced by stacking a plurality of copper foils into which grooves are carved using a diamond tool to form flow channels.
  • Such a production process is described by D.Hönicke and G.Wiesmeier in "Heterogeneous Catalyzed Reactions in a Microreactor” in DECHEMA Monographs. Volume 132, Papers of the Workshop on Microsystem Technology, Mainz, 20 to 21 February 1995, pages 93 to 107.
  • the inner walls of the reaction channels were partially oxidized to copper (l) oxide.
  • the LIGA process (lithography, electroforming, molding) exposes a plastic layer, usually polymethyl methacrylate (PMMA), using synchrotron radiation and then develops it.
  • PMMA polymethyl methacrylate
  • the structure produced in this way is filled with metal using an electrolytic process.
  • the metal structure can then be reproduced in further process steps by means of a plastic impression (plastic injection molding process). This method was developed by W. Ehrfeld and H. Lehr in Radial Phys. Chem. Volume 45. Pages 349 to 365.
  • a technique related to the LIGA process that does not require the very complex synchrotron radiation is the so-called laser LIGA process.
  • the PMMA plastic layer is structured with a powerful UV laser and then galvanically molded as in the LIGA process (W. Ehrfeld et al., "Potentials and Reaction of Microreactors" in DECHEMA Monographs, Volume 132, pages 1 to 29).
  • EP 0 212878 A1 describes a method for producing a heat exchanger in which the flow channels of the heat medium are formed in steel plates by chemical etching. The steel plates are then welded to one another by diffusion bonds.
  • WO 9215408 A1 describes a method for producing microsieves, in which holes and other depressions are etched with a specific pattern by plasma technology in a flat carrier covered with an etch-resistant layer. Several of these perforated beams are then connected together.
  • DE 197 08 472 A1 describes a production process for chemical microreactors in which fluid channels are formed in individual planes by structuring substrates provided with metal surfaces by means of photolithographic techniques or screen printing processes and the resulting channel structures being formed by metal removal or application processes. The individually produced levels are then combined into a stack and firmly connected. For example, the channels can be produced by partially etching away the metal layer on the substrate.
  • the previously known methods for producing chemical microreactors and heat exchangers have many disadvantages. For example, complicated and / or expensive techniques for making the channels are required. In some cases, the manufacture of the reactors is limited only to silicon as the material.
  • the functional surface layers are used, for example, to catalyze chemical reactions.
  • a subsequent coating of the flow channels in the levels is often not possible, since in this case the functional layers themselves cannot be applied electronically due to the fresh shielding by the reactor or heat exchanger itself.
  • electroless metallization it has been found that a safe coating is not possible.
  • the metallization baths usually used react very sensitively to different flow rates of the metallization liquid on the surfaces to be coated. Under these conditions, surface areas, among other things, are electrolessly metallized, which the metallizing liquid slowly flows past, during surface areas. past which the liquid flows at high speed, are not coated with metals.
  • the present invention is therefore based on the problem of microcomponents with flow channels in at least one plane, in particular chemical microreactors.
  • Manufacture heat exchangers, mixers and evaporators that are suitable for a large number of different applications in chemical reaction technology, for heat exchange, for mixing substances or for evaporating liquids.
  • the manufacturing process should be as inexpensive and quick to carry out without high failure rates in the manufacture of the microcomponents.
  • Such microreactors, heat exchangers, mixers and evaporators should be easy and inexpensive to produce even in large numbers.
  • the method according to the invention is used to manufacture microcomponents with flow channels in at least one level, in particular chemical microreactors. Heat exchangers. Mixers and evaporators.
  • the flow channels preferably have dimensions from a few micrometers to a few millimeters.
  • the chemical microreactors are preferably used in the chemical industry, inter alia, for synthesis reactions and in other fields, used for example as hydrogen sources for energy conversion (fuel cells).
  • Chemical microreactors are understood to be devices with flow channels in at least one reactor position which, in addition to the actual reaction zones, may also have auxiliary zones which are used for mixing, metering, heating, cooling or analyzing the starting materials, intermediate products or end products.
  • Each zone is characterized by a structure that is adapted to the respective requirements. While heating and cooling zones are designed either as heat exchangers or as reactor abbeys equipped with electrical resistance heaters or electrical cooling elements, analysis zones have adapted sensors.
  • Dosing zones contain, for example, microvalves and mixing zones, for example channels with suitably shaped internals for swirling the combined fluids.
  • Flow channels are contained in at least one level in the microreactors, heat exchangers, mixers and evaporators.
  • the flow channels in the individual levels can also be partially connected to one another.
  • FIGS. 1 and 2. Show it:
  • a first metal layer 1 is first produced to produce the multilayer microcomponents (method step A).
  • This metal layer can be formed using a galvanotechnical or physical metal deposition process either on a carrier 2, for example on an artificial peat plate or a metal plate, or a self-supporting foil can be produced.
  • a carrier 2 for example on an artificial peat plate or a metal plate, or a self-supporting foil can be produced.
  • films are known from printed circuit board technology. All conventional vacuum processes can be used for coating with a physical metal deposition process, namely the CVD (chemical vapor deposition), PECVD (chemical enhanced vapor deposition), vapor deposition and sputtering processes.
  • This metal layer is preferably formed by electrolytic metal deposition.
  • the metal layer 1 is preferably at least 0.1 ⁇ m in order to ensure sufficient electrical conductivity for subsequent manufacturing steps. A thickness of 5 ⁇ m to 1 mm is common.
  • the first metal layer or metal foil is then coated in a first process variant on at least one of the two surfaces with a photosensitive layer 3 (process step B).
  • the thickness of this layer is determined by the height of the flow channels to be formed later.
  • Negative photoresists used. After drying, the photosensitive layer formed is exposed to the pattern of the channels, for example through a mask 4 (light rays 5; method step B1) and the underlying metal layer or metal foil 1 is subsequently exposed in the development process at all locations 6 which do not correspond to the channels to be formed (Process step B2).
  • at least one surface of the first metal layer or metal foil 1 is coated with a screen printing lacquer layer at the locations on the surface which correspond to the channels to be formed.
  • a foil preferably a plastic foil, is laminated onto at least one surface of the first metal layer or metal foil 1, the foil being provided with perforations at all points 6 of the surface which do not correspond to the channels to be formed.
  • the use of such a film is advantageous when particularly high
  • Flow channels are to be formed so that the resist structure must be very thick. Therefore, foils with a thickness of 50 ⁇ m and more are used.
  • a second metal layer 7 is then deposited at the exposed or exposed locations 6 of the first metal layer or metal foil 1 (method step C1).
  • an electroplating process is used for this, preferably an electrolytic metal deposition process in which an external power source is used for metal deposition.
  • the second metal layer can also be produced by electroless metallization.
  • the second metal layer 7 only on the first metal layer or the metal foil is formed, for example by applying a negative electrical potential to the first metal layer or the metal foil during the deposition of the second metal. If, on the other hand, an electrostatic metal deposition process is selected, this metal is automatically and selectively deposited only on the exposed areas of the first metal layer or metal foil.
  • the metal of the second metal layer can be identical to the metal of the first metal layer or metal foil. Another metal can also be applied to form the second metal layer.
  • the second metal layer forms the walls of the flow channels.
  • This metal layer must therefore have a thickness which corresponds to the height of the flow channels.
  • the second metal layer should preferably be as thick as the screen printing lacquer layer, the photosensitive layer or the perforated film.
  • the first channel level formed can - if necessary - be leveled by a mechanical or other surface treatment, for example by micro milling or polishing.
  • the process sequence A to C described above is carried out several times in succession to form the second and further channel levels.
  • a further first metal layer 1' is then applied to the surface of the photoresist layer.
  • Screen printing resist layer or on the perforated film 3 and on the second metal layer 7 is applied.
  • This further first metal layer V like the corresponding metal layer or metal foil 1 in the first level, represents a base layer on which the individual flow channels of the next channel level are formed.
  • a thin conductive starting layer made of metal is first deposited in the first channel level if this first metal layer is deposited electrolytically.
  • a catalytic layer for electroless metal deposition must first be removed. be divorced.
  • Palladium colloids for example, are suitable for this. These are used to prepare the electrically non-conductive surfaces for the deposition of the thin conductive starting layer, which can form the basis for an electrolytically deposited metal layer.
  • the second base layer can also be formed using a physical metal deposition process, for example by sputtering.
  • this second base layer 1 ' After the formation of this second base layer 1 ', a photosensitive layer, a structured screen printing lacquer layer or perforated film is again applied. The photosensitive layer, screen printing lacquer layer or perforated film is then dried. The photosensitive layer is then exposed to the image of the flow channels and developed. The screen printing lacquer or foil structure also has the image of the flow channels. The second metal is then again formed on the exposed metal surfaces. Then further levels are applied in the manner described.
  • the top reactor or heat exchanger level is covered by a last metal layer to close the top channel level.
  • This metal layer is also called the end segment.
  • front plates can optionally be provided on the two end faces of the reactor, heat exchanger, mixer or evaporator, which are screwed together, for example, in order to absorb the forces occurring during the flow.
  • method step A is carried out to form an end segment for the flow channels.
  • the metal layer 1 'applied after the formation of the first channel level represents the end segment.
  • the individual micro component levels are thus produced in a sequential manner with the method according to the invention.
  • no leaks can occur in the finished micro-component due to an inadequate joining process.
  • metals that can be deposited by means of electroplating processes can be used as materials.
  • copper, nickel, cobalt, zinc, tin, chromium and iron and their alloys can be used to manufacture the flow channel walls.
  • Precious metals such as platinum, gold, silver, ruthenium and palladium are particularly suitable for the functional layers.
  • the individual layers initially produced separately are subsequently connected to one another by diffusion welding or soldering.
  • Such a disadvantageous effect can usually not be avoided when joining the conventional microcomponents due to the large amount of heat.
  • Another advantage of the method according to the invention is that no special measures have to be taken to ensure good adhesion between the second and further base layers V (or 1 ", V", ...) and the photoresist layer, screen printing resist layer or the perforated foil.
  • a third metal layer 8 is produced by electrolytic or electroless metal deposition or by a physical metal deposition method, for example a sputtering, vapor deposition, CVD or PECVD method , educated.
  • molecular layers which have specific catalytic properties can also be chemisorbed or adsorbed, or plastic or ceramic layers can also be formed.
  • the ceramic layers are particularly advantageous when a large surface is to be created on the flow channel walls. Porous ceramic layers are formed for this purpose, for example oxide layers by sputtering.
  • a vapor-deposited aluminum layer is also particularly suitable and can subsequently be converted into an aluminum oxide layer by anodizing or treatment, for example with nitric acid. Such a layer can serve as a support for catalysts with which this layer can be impregnated.
  • Layer 8 in turn can also be made up of different layers. These layers can also serve as supported catalysts.
  • the surfaces of the screen printing lacquer layer, the photosensitive layer or the perforated film and the second metal layer are first cleaned. The cleaned surfaces can then be brought into contact with an activation solution, for example a palladium koiloid solution, which has a catalytic effect for the subsequent electroless metal deposition in order to be able to electrolessly deposit metal on the non-catalytic surfaces of the screen printing lacquer layer, photosensitive layer or the perforated film.
  • Layer 8 can also be selectively applied exclusively to the screen printing Layer, the photosensitive layer or the perforated film are applied by suitable mask processes, in order to prevent layers 8 deposited on the metal layer 7 from impairing the adhesive strength of metal layers subsequently applied to the layer 7.
  • Activation solutions of this type are known per se. These are usually formed by mixing palladium chloride, tin (II) chloride and hydrochloric acid or palladium sulfate, an aminopyridine and lye or palladium sulfate, an organic protective colloid such as polyvinylpyrrolidone and sodium hypophosphite.
  • the activated surfaces are then brought into contact with a metallization solution, for example an acidic solution containing palladium ions.
  • a palladium plating solution which can be used well for this purpose additionally contains an oxidizing agent, for example sodium peroxodisulfate.
  • a corrosion protection layer made of a nickel / phosphorus alloy can also be deposited.
  • Commercial baths are available for this purpose which contain a nickel salt as well as carboxylic acids as complexing agents for nickel ions and sodium hypophosphite as reducing agent.
  • the second metal layer 7 is modified in a modification of the previously described method in a reactor, heat exchanger, mixer or evaporator level in accordance with method step C and the first metal layer V in the subsequent level or as the final segment serving first metal layer V according to process step A 'in a single combined process step. This eliminates a separate process step.
  • the metals of the first and second metal layers are preferably identical.
  • the metal layer V serves as an end segment, the formation of which is not followed by any further process steps if only one flow channel level is to be formed.
  • Functional layers 8 are also deposited in the production of microcomponents according to this process scheme. These are applied to the resist surfaces (process section B3 in FIG. 2). For this purpose, the same process techniques are used as in the process variant according to FIG. 1 described first.
  • metal layers can be deposited, provided that specific requirements of the respective application require it.
  • wear-resistant layers against corrosion and abrasion for example made of chromium, a nickel / phosphorus alloy or palladium
  • surfaces made of catalytically active metal platinum, palladium
  • Magnetic rails for example made of a ferromagnetic nickel / cobalt alloy, may also be necessary for certain applications, such as for example the use of solenoid valves as actuators.
  • the surface structure can also be roughened or smoothed by chemical or electrolytic etching techniques
  • the screen printing lacquer layer After the desired number of channel levels has been formed, the screen printing lacquer layer.
  • Photosensitive layer or perforated film removed in a further process step D the structure produced can, for example, be brought into contact with a solvent for the screen printing lacquer layer, the photosensitive layer or the perforated film with the simultaneous action of ultrasound and heat low surface tension
  • solvent depends on the type of plastic material to be dissolved (screen printing varnish, photosensitive layer, perforated film).
  • Acetone, chloroform, butanone, 1, 4-dioxane and N, N-dimethylformamide and their mixtures and for photoresists N-methylpyrrolidone, trichloroethane, dimethyl sulfoxide and methylene chloride and their mixtures are, for example, suitable for polymethyimethacrylate as plastic material.
  • aqueous alkaline systems with suitable cosolvents can be used.
  • the screen printing lacquer layer, photosensitive layer or perforated film can also be removed by pyrolysis.
  • the plastic can also be removed using a plasma process.
  • the finished micro component structure is brought into a glow discharge zone of a plasma reactor.
  • the screen printing lacquer layer, photosensitive layer or perforated film can be removed in accordance with process step D using supercritical liquids.
  • the micro-component structure is brought into contact with carbon dioxide, ethylene, propane, ammonia, nitrous oxide, water, toluene, nitrogen heterocycles or other substances which are in a supercritical state under suitable pressure and temperature conditions, for example in an autoclave.
  • Supercritical fluids that can be converted into the supercritical state at room temperature are particularly suitable.
  • a well suited supercritical fluid is carbon dioxide.
  • micro component levels are shown as examples. Show it:
  • FIG. 3 shows a schematic illustration of a cross section through a heat exchanger
  • Fig. 4 a schematic representation of a cross section of several channel levels in a multiple use for six continuous reactors.
  • FIG. 3 shows a channel layer 10 in a heat exchanger. This single layer consists of two superimposed metallic layers
  • channels 11 through which a fluid (liquid or gas) is passed during the operation of the heat exchanger.
  • the channels are produced by a photolithographic process. These channels extend in the upper of the two layers and have a width of approximately 400 ⁇ m and a height of approximately 100 ⁇ m.
  • the channels 11 end in connection spaces ⁇ 12 ', 12 "', which are used to connect the chemical micro-reactor to corresponding feed and discharge lines for the fluid to be passed through.
  • the fluid flowing through the heat exchanger can be operated, for example, via the connection space shown in FIG. 3 above 12 'are passed into the channels 11 and, after passing through the channels, leave the microreactor again through the connection space 12'"shown in FIG. 3 below.
  • connection spaces 12 'and 12'"of the layers with the designation A lie one above the other and on the other hand the connection spaces 12" and 12 "" of the layers with the designation B one above the other.
  • the channels in the layers with the designation A are connected to one another via the respective connection spaces. The same applies to the
  • Screw connections are provided, for example, for the gas and liquid-tight connection of the connection spaces 12 ⁇ 12 ", 12" ', 12 “” with corresponding supply and discharge lines. That limit the connection spaces
  • Channel plane areas 13 serve as sockets for the screw connections and are processed so that circular projections with external threads are formed from the respective end face of the reactor, so that supply and discharge pipes can be connected to these sockets, for example with union nuts, in a gas-tight and liquid-tight manner.
  • the supply and discharge lines are connected to the connection spaces 12 ', 12 ", 12" ⁇ 12 "" which are open to the outside.
  • the connections to the supply and discharge pipes can also be made by welded or soldered connections. In this case, however, it must again be taken into account that, when joining, heat-sensitive functional layers in the heat exchanger channels could be damaged or even destroyed. Therefore, a mechanical method of making the connections is preferable.
  • a micro component according to the invention typically has outer side lengths which are in the range from one to a few centimeters.
  • the connection spaces 12 ', 12 ", 12"', 12 “" of the layer 10 shown in FIG. 3 in the present case have side lengths of 1 cm each.
  • the layers can also have channels with a different shape, for example for systems based on the countercurrent principle, as well as openings to neighboring layers. Breakthroughs can be formed by appropriately depositing metal when forming the first and second metal layers. The openings can also be produced by chemical or electrochemical etching of the first and second metal layers formed.
  • actuators and sensors can be integrated into a microreactor.
  • the actuators are switching elements that can be controlled externally or automatically by means of measurement signals, for example valves, but also electrical resistance heaters or cooling elements that function according to the Peltier effect.
  • Microreactors, in which actuators and sensors are provided can be locally optimized if the actuators and sensors are linked appropriately in terms of control technology.
  • the sensor outputs can be used for external monitoring of the reactor condition (such as aging, poisoning of catalysts and similar parameters).
  • electrical connection lines for controlling or for recording measurement signals on the substrates may also have to be provided. Suitable structuring elements for these elements must be taken into account in the photo process.
  • Microchips for controlling actuators and sensors can also be integrated into the interior of microreactors, for example, by electrically isolating the microchips from the metallic layers. For this, the Chips are placed, for example, on the screen printing lacquer layer, photosensitive layer or perforated film.
  • the electrical connections to corresponding control and signal lines can be made by bonded wires or other known connection techniques, such as by soldering or gluing.
  • peripheral reactor components such as feed lines, mixing zones, heating or cooling circuits can also be formed at the same time as the structures are being formed, so that the production outlay is reduced. Therefore, these elements must already be provided when structuring the photo. In addition, the usual sealing problems are minimized.
  • the layers shown here differ from the channel position in FIG. 3 in that only recesses for connection spaces 12 , > 12 '"are provided on two mutually opposite sides of the layers, while in the case of the position of FIG. 3 it is also rotated by 90 ° arranged recesses are available.
  • the individual elements of the reactors are in this case produced in a multiple use at the same time.
  • the individual reactors are then separated from one another along the dashed lines 14.

Abstract

L'invention concerne un procédé pour produire des microcomposants possédant des canaux d'écoulement dans au moins un plan, notamment des microréacteurs chimiques, des échangeurs thermiques, des mélangeurs et des évaporateurs. Ce procédé consiste à: A. produire une première couche métallique ou un film métallique (1); B. revêtir au moins une surface de la première couche métallique ou du film métallique (1) avec une couche de résist (3) structurée, la première couche métallique ou le film métallique (1) étant mis à nu tous les endroits (6) ne correspondant pas aux canaux à réaliser; C. déposer une deuxième couche métallique (7) sur les endroits (6) mis à nu de la première couche métallique ou du film métallique (1); la séquence des étapes A à C étant effectuée plusieurs fois de suite pour former plusieurs plans et/ou la séquence des étapes A à C étant suivie de l'étape A pour former un segment de fermeture destiné aux canaux d'écoulement; et D. éliminer la couche de résist (3) après la formation des plans. La couche de résist (3) peut être une couche de vernis appliquée par sérigraphie, une couche photosensible ou un film perforé.
PCT/DE1999/003286 1998-11-06 1999-10-07 Procede pour produire des microcomposants possedant des canaux d'ecoulement WO2000028381A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU16476/00A AU1647600A (en) 1998-11-06 1999-10-07 Method for producing microcomponents having flow channels

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE19852523.0 1998-11-06
DE19852523 1998-11-06
DE19920161A DE19920161A1 (de) 1998-11-06 1999-04-28 Verfahren zum Herstellen von Mikrobauteilen mit Strömungskanälen
DE19920161.7 1999-04-28

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WO2000028381A1 true WO2000028381A1 (fr) 2000-05-18

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7981241B2 (en) 2006-11-22 2011-07-19 Airbus Operations Limited Method for forming a feature in a piece of composite material

Citations (4)

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DE3129626C1 (de) * 1981-07-28 1982-12-16 Messerschmitt-Bölkow-Blohm GmbH, 8000 München "Verfahren zum galvanoplastischen Herstellen von bedeckten Kanälen und Metallgegenstand mit derartigen Kanälen"
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