WO2000010763A1

WO2000010763A1 - Method and device for distributing solder balls

Info

Publication number: WO2000010763A1
Application number: PCT/JP1999/004414
Authority: WO
Inventors: Kouji Ukai
Original assignee: Ibiden Co., Ltd.
Priority date: 1998-08-18
Filing date: 1999-08-13
Publication date: 2000-03-02
Also published as: JP2000061632A

Abstract

Purpose: a method and a device for distributing solder balls which completely prevent missing or duplicated solder balls. Constitution: a storing hole (11) sized for allowing only one solder ball (4) to be stored therein is provided in an aligning plate (10) at a position to which the solder ball (4) is to be distributed on a printed wiring board (5). Solder balls are supplied to the aligning plate (10) to allow each storing hole (11) to receive one each solder ball (4) and then the plate (10) is inclined to remove surplus solder balls (4). Next, a suction head (20) having suction ports (21) at the same positions as those of the storing holes (11) and having no missing nor duplicated solder balls (4) sucks the solder balls (4), which are then transported to immediately above the printed wiring board (5) and released from the suction, whereby the solder balls (4) are distributed to the board (5).

Description

0/10763

Description Solder ball distribution method and solder ball distribution device

Technical field

The present invention relates to a technique for distributing solder balls for mounting components on a printed wiring board. More specifically, the present invention relates to a method and an apparatus for distributing solder balls, which eliminate the occurrence of blanks and duplication of solder balls in a suction head moving to a feeding position by sucking the delivered solder balls.

Background art

Conventionally, the distribution of solder balls to a printed rooster Bil board has been performed as follows. That is, as shown in Fig. 14, a large number of solder balls 101 are stored in the tray 102, and the suction balls 101 are sucked from above by the suction heads 103. Here, the suction head 103 is a hollow box provided with a large number of suction ports 104 on the lower surface, and the inside is evacuated. Each suction port 104 is provided corresponding to a position where the solder ball 101 is to be placed on the printed wiring board. The size of the suction port 104 is slightly smaller than the solder ball 101. As a result, the solder balls 101 are sucked one by one into the suction holes 104 of the suction head 103, and the suction head 103 in that state is conveyed to the printed wiring board and there. When the suction of the solder ball 101 is released, the solder ball 101 is delivered to a predetermined position on the printed wiring board.

Here, when the suction head 103 is sucked by the suction head 103, if the suction head 103 or the tray 102 or both of them are continuously vibrated, the solder ball 10 1 is easy to pinch to each suction port 104. As shown in Fig. 15, solder not only sucks the part of the suction head 103 but also blows air from below the tray 102 so that the solder balls 101 float. The suction of the ball 101 to each suction port 104 is assisted.

However, the conventional solder ball distribution technology described above has the following problems. That is, in the above manner, the encounter between the solder ball 101 and the suction port 104 is eventually It's just a coincidence. For this reason, as shown in Fig. 16, it is inevitable to generate a blank area X where the solder ball 101 is not adsorbed. If there is a blank spot X, components cannot be mounted at that spot on the printed wiring board. Therefore, the suction of the solder ball 101 by the suction head 103 must be complete without any blank area X.

Of course, in principle, by monitoring the internal pressure or exhaust flow rate of the suction head 103, it is necessary to check whether all the suction ports 104 are closed with solder balls. Is possible. However, the blockage of the suction port 104 by the solder ball 101 is not necessarily a hermetic seal, and there is considerable leakage. Also, because of the large number of suction ports 104 in practice, it is actually impossible to check with practical accuracy using this method.

A double ball Y as shown in Fig. 16 can also occur. When the solder head 101 is sucked by the suction head 103, a large number of solder balls 101 may be present near the suction port 104, and the action of static electricity or the like may occur. Because they may be stuck together. Also, as shown in Fig. 17, when the solder ball 101 is larger than the pitch P of the suction port 104, the solder ball 101 is inserted between the solder balls 101. Double ball Z may occur. If double balls ボール and Z are present, excess solder will be generated when components are mounted on the printed wiring board, causing problems such as short circuits between patterns. Therefore, double-balls ダブル and Ζ also need to be completely eliminated as well as blank space X. The double balls Υ and Ζ are different from the blank part X and cannot be detected by pressure or exhaust flow rate.

For this reason, optical inspection is performed between the tray 102 and the printed wiring board that is the distribution destination for optically blank spots X ゃ double balls Υ and ，. Must be returned to tray 102 to retry suction. This retry must be repeated as many times as possible until complete adsorption is achieved. For this reason, the actual takt time of distribution is extremely long, and the production efficiency is greatly reduced.

These problems do not provide a fundamental solution even if supplementary measures such as vibration or air blow from below are taken. In addition, if the solder balls 101 are continuously vibrated by applying vibration, friction and collision between the solder balls 101 occur frequently, and as a result, deformation of the solder balls 101, surface oxidation, and the like occur. However, there is also a problem that the failure is promoted in a later process. In addition, since the solder balls 101 in the tray 102 gradually decrease due to the distribution, the upper surface of the balls is detected by a sensor and the suction head is used in order to perform appropriate suction. It is necessary to control the height of the ball 3 or to replenish the solder balls 101 by the amount consumed and maintain the ball top surface at a constant height. was there.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems of the conventional technology. That is, an object of the present invention is to provide a method and an apparatus for distributing solder balls that completely eliminate the occurrence of blanks and duplication of solder balls.

Disclosure of the invention

In the solder ball distribution method according to the present invention, which has been made to solve this problem, an alignment plate having a storage hole for storing only one solder ball is used. First, solder balls are supplied on this alignment plate (Step 1). As a result, the solder balls are stored in the storage holes in the alignment plate. Subsequently, the excess solder balls on the alignment plate, that is, the solder poles that are not stored in the storage holes and are flushed are removed (Step 2). Next, the suction balls are used to suck the solder balls stored in the storage holes (Step 3). This suction head has suction holes at positions corresponding to the storage holes. Then, the suction head holding the solder ball in the suction hole is transported to the delivery position, where the suction of the solder ball is released. Thus, the solder balls are distributed to the distribution positions.

In this solder ball distribution method, when the solder balls are supplied on the alignment plate in Step 1, a part of the supplied solder balls is stored in the storage holes. At this time, if the number of solder balls supplied on the alignment plate is more than the extent that the upper surface of the alignment plate is completely covered by the solder balls, the solder poles will be stored in all the storage holes. Become. Also, no two or more solder balls are stored in one storage hole. At this time, there are a considerable number of solder balls on the alignment plate that are not stored in the storage holes and are flushed. These surplus solder balls are removed in step 2. When the excess solder balls have been removed, one solder ball is stored in each storage hole. The suction of the solder balls (Step 3) is performed in this state. Therefore, when performing suction, there is always only one solder ball near one suction hole. For this reason, in the sucked state, only one solder ball is always sucked in one suction hole, and no empty or overlapping solder balls occur.

In this method of distributing solder balls, the removal of excess solder balls in step 2 can be easily performed by tilting the alignment plate. When the alignment plate is tilted, the solder balls stored in the storage holes remain in the storage holes as they are, but the remaining solder balls are gravity CT

This is because it rolls down at 4. In addition, other methods for removing excess solder balls include sweeping with a brush, blowing off with an air jet, or a combination of these.

In this method of distributing solder balls, it is advisable to provide a ventilation hole at the bottom of the storage hole in the alignment plate to communicate between the front and back. In this way, in step 1, the suction of the solder balls into the storage holes can be promoted by drawing air from the back side of the alignment plate through the ventilation holes. Furthermore, when the alignment plate is tilted, it can be used to prevent solder balls from jumping out of the storage holes due to excessive tilt angles or the impact of the tilting operation. In addition, in step 3, the suction of the solder balls to the suction head can be assisted by exhausting air from the rear side of the alignment plate through the ventilation holes.

In this method of distributing solder balls, the solder balls to be supplied to the alignment plate in step 1 are stored in a ball hopper, and the solder balls removed from the alignment plate in step 2 are returned to the ball hopper. It is good to do. A considerable number of the solder balls supplied on the alignment plate in step 1 are to be removed from the alignment plate in step 2 as surplus balls. Because it can be supplied to In addition, the solder ball distributing device according to the present invention includes: an alignment plate having a storage hole for storing only one solder ball; a supply unit for supplying a solder pole on the alignment plate; Removing means for removing excess solder balls, suction heads provided with suction holes at positions corresponding to the storage holes, and transport means for transporting the suction heads to a delivery position. With these, the solder balls are distributed to the distribution position.

That is, in this solder ball distribution apparatus, first, the supply means supplies the solder balls onto the alignment plate. This corresponds to step 1 described above. Therefore, at this time, all the holes in the alignment plate contain one solder ball, and there is an extra solder ball on the alignment plate. Then, the surplus solder balls are removed by the removing means. This corresponds to step 2 described above. Therefore, at this time, all the storage holes in the alignment plate store one solder ball, and there is no excess solder ball on the alignment plate. Next, the solder ball stored in the storage hole is suctioned by the suction head. This corresponds to step 3 described above. Therefore, in this state, only one solder ball is adsorbed to each suction hole, and there is no gap or overlap of solder balls. Then, the suction head is transferred to the delivery position by the transfer means. When the suction of the solder ball is released at that position, the solder ball is delivered to the delivery position. P

5 In this solder ball distribution device, a tilting means for tilting the alignment plate can be used as the removing means. If the alignment plate is tilted by the tilting means, the solder balls stored in the storage holes will remain in the storage holes as they are, but the other excess solder balls will roll down due to gravity. In addition, other removal means include a means for sweeping with a brush and a means for blowing off with an air jet.

In this solder ball distribution device, a vent hole is provided at the bottom of the storage hole in the alignment plate to communicate between the front and back, and further, there is an intake / exhaust means for inhaling or exhaling air from the rear surface of the alignment plate through the vent hole. Is desirable. In this way, when step 1 is performed, the suction of the solder balls into the storage holes can be promoted by suctioning the air from the rear surface side of the alignment plate through the ventilation holes by the suction / exhaust means. In addition, when performing Step 3, the suction of the solder balls to the suction head can be assisted by discharging the air from the back side of the alignment plate through the ventilation holes by the suction and discharge means.

In addition, it is desirable that the solder ball distributing device has a ball hopper for storing the solder balls to be supplied onto the alignment plate and a transfer means for returning the solder balls removed from the alignment plate to the ball hopper. A considerable number of the solder balls supplied to the alignment plate in step 1 are to be removed from the alignment plate in step 2 as surplus balls. This is because it can be returned and supplied on the alignment plate again.

BRIEF DESCRIPTION OF THE FIGURES

Fig. 1 is an overall plan view of a solder ball distribution device according to an embodiment, Fig. 2 is a cross-sectional view of an alignment plate according to the embodiment (in a housed state), and Fig. 3 transfers solder balls from a suction head to a printed wiring board. FIG. 4 is a sectional view of an alignment plate, FIG. 5 is a diagram showing a ball tray and a ball hopper according to the embodiment, FIG. 6 is a diagram showing a state in which the alignment plate is inclined, and FIG. Fig. 8 illustrates the movement of the head, Fig. 8 shows the situation where the solder balls are supplied from the ball hob to the alignment plate, and Fig. 9 shows the state where the solder balls aligned on the alignment plate are sucked by the suction head. Figure, Figure 10 shows a blank of solder balls in the suction head, Figure 11 shows a surplus of solder balls in the suction head, and Figure 12 shows solder on the printed wiring board. Shows a state in which delivered the Lumpur, FIG 3 is a residue of the solder balls in the head to the suction FIG.

FIG. 14 is a diagram showing suction of a solder ball to a suction head according to the prior art (Part 1), and FIG. 15 is a diagram showing suction of a solder ball to a suction head according to the prior art (Part 2). Fig. 6 is a diagram showing the condition of the blank and hanging of the solder ball, and Fig. 17 is a diagram showing the condition of the pinching of the solder ball.

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The present embodiment is a solder ball distributing apparatus for executing a method of distributing solder balls to a component mounting position on a printed wiring board.

As shown in the plan view of FIG. 1, the solder ball distribution device 1 according to the present embodiment has two rotary tables, an index table 2 for ball alignment and an index table 3 for board transfer. The upper ball alignment index table 2 in FIG. 1 is a rotary table for aligning the solder balls 4 on the alignment plate 10 as shown in the side sectional view of FIG. The board transfer index table 3 in the lower part of Fig. 1 is a rotary table for receiving the aligned solder balls 4 on the printed wiring board 5 (see Fig. 3) and performing subsequent processing. And between the rotary tables 2 and 3, cameras 6 and 6 and disposal boxes 7 and 7 are provided. The cameras 6 and 6 observe the condition of the suction head 20 that moves between the ball alignment index table 2 and the substrate transport index table 3. The waste boxes 7, 7 are waste baskets for discarding the solder balls 4 in which some abnormality has been found.

The index table 2 for ball alignment will be described. The indexing table 2 for ball alignment is a rotatable circular table, and work booths 8 and 8 are provided at two locations. Further, each work booth 8 is provided with two alignment plates 10 and 10. That is, the ball alignment index table 2 has a total of four alignment plates 10. When the ball aligning index table 2 rotates, it goes without saying that each work booth 8 and each aligning plate 10 also rotate.

The alignment plate 10 is a rectangular dish-shaped member, and has a large number of storage holes 11 for storing the solder balls 4 as shown in a side sectional view of FIG. The storage hole 11 is a size that can store only one solder ball 4. In other words, the diameter of the storage hole 11 is at least one time and less than twice the diameter of the solder ball 4 (usually about 0.3 to 1.0 mm), and the depth is smaller than the diameter of the solder ball 4. 0, 5 times or more and less than 1.5 times. The storage holes 11 are provided in the printed wiring board 5 at locations where the solder balls 4 are to be placed. Therefore, the number of the storage holes 11 is the same as the number of the solder balls 4 to be placed on the printed board 1. From this, it can be seen that different alignment plates 10 are used depending on the specifications of the printed wiring board 5. At the bottom of each storage hole 11, a ventilation hole 12 communicating with the back side is formed, through which the pump is connected. This makes it possible to inhale and exhale from the back of the storage hole 11. In the alignment plate 10, the outer edge 13 of the ball alignment index table 2 has no edge. Therefore, when the solder balls 4 are present on the upper surface 14 of the alignment plate 10, the excess solder balls 4 that are not stored in the storage holes 11 may roll forward from the side 13 (to the right in Fig. 4). it can.

A ball tray 14 is provided at an upper position in FIG. 1 of the indexing table 2 for ball alignment. As shown in the side view of FIG. 5, the ball tray 14 is located outside and below the ball alignment index table 2. The ball tray 14 is a tray for accommodating the solder balls 4 rolled off the side 13 of the alignment plate 10. At the position shown in FIG. 5, a tilt plate 15 for tilting the alignment plate 10 and a ball hopper 17 for storing solder balls 4 to be supplied on the alignment plate 10 are provided.

The inclined plate 15 has a slope 16, and as shown in FIG. 6, the alignment plate 10 is inclined by the slope 16 by moving rightward in the figure. The lower end of the ball hopper 17 is open, but is closed by a shutter 18 that can be opened and closed. The ball hopper 17 is movable up and down in case the alignment plate 10 is moved by ^ #. The ball hopper 17 is connected to the ball tray 14 by a tube 19. As a result, the surplus solder balls 4 stored in the ball tray 14 can be returned to the ball hopper 17 through the tube 19 by means of an air jet. In other words, the position of the work booth 8 in the ball alignment index table 2 in FIG. 1 is the position where the work for storing the solder poles 4 in the storage holes 11 of the alignment plate 10 is performed.

On the other hand, at the lower position in FIG. 1 of the indexing table 2 for ball alignment, as shown in the side view of FIG. 7, the suction for absorbing the solder balls 4 aligned on the alignment plate 10 is performed. A head 20 is provided. The suction head 20 is a hollow box having a large number of suction ports 21 provided on the lower surface, and is connected to a pump so that a portion 內 is evacuated. Each suction port 21 is provided corresponding to a position on the printed wiring board 5 where the solder ball 4 is to be placed. ing. The size of the suction port 21 is slightly smaller than the solder ball 4. As a result, the solder balls 4 can be sucked one by one into the suction holes 21 of the suction head 20.

The suction head 20 can move up and down. Furthermore, the lower position in FIG. 1 of the indexing table 2 for ball alignment (indicated by X in FIG. 7) and the upper position in FIG. 1 of the indexing table 3 for substrate transfer (indicated by Y in FIG. 7) It can be moved between and. As a result, the solder balls 4 aligned on the alignment plate 10 can be transferred to the printed wiring board 5. In other words, the position of the work booth 8 in the lower part of FIG. 1 in the ball alignment index table 2 is determined by the operation of sucking the solder balls 4 stored in the storage holes 11 of the alignment plate 10 by the suction head 20. This is the position to perform. When the suction head 20 moves back and forth between the position X and the position Y, it passes over the camera 6 on the way.

The substrate transport index table 3 is a rotatable circular table, and park booths 22 are provided at four locations. Each work booth 22 can hold two printed boards 5,5. The position of the work booth 22 in FIG. 1 on the transfer index table 3 (Y in FIG. 7) is, as described above, the printed wiring board of the solder balls 4 sucked and conveyed by the suction head 20 as described above. 5 This is the position where the work to receive the distribution is performed. The positions of the other work booths 22 on the board conveying index table 3 are respectively for receiving the printed wiring board 5 that has not yet received the distribution of the solder balls 4 and for the printed wiring board 5 that has received the distribution of the solder balls 4. This is the position where components are mounted on the printed circuit board, and the printed wiring board 5 on which the components are mounted is paid out.

Next, a method of distributing the solder balls 4 performed by the solder ball distribution device 1 will be described. First, the situation of each part of the solder ball distribution device 1 when the distribution of the solder balls 4 is started will be described. In this state, many solder balls 4 are stored in the ball hopper 17. The number is more than enough to cover the upper surface of the alignment plate 10 with two or more layers of solder balls 4. The shirt 18 is closed. The ball alignment index table 2 is stopped when the two peak booths 8 and 8 are located at the top and bottom in FIG. Each alignment plate 10 of the ball alignment index table 2 is in a horizontal state. That is, the inclined plate 15 is retracted. The suction head 20 extends upward in FIG. 7 at the lower position (X in FIG. 7) of the ball aligning index table 2 in FIG. One printed booth 22 of the board transfer index table 3 receives two printed wiring boards 5 to which the solder balls 4 have not been distributed yet. P

9 The work booth 22 is located at the upper part in FIG. 1 (Y in FIG. 7) and stops.

In this state, first, the solder balls 4 are supplied to the alignment plate 10. That is, the shirt 18 of the ball hopper 17 is opened, and the solder balls 4 are supplied to the upper surface of the alignment plate 10 from the ball hopper 17 內 (FIG. 8). At this time, the alignment plate 10 receiving the supply of the solder balls 4 is the alignment plate 10 of the work booth 8 in FIG. The number of solder balls 4 supplied at this time is sufficient to cover the upper surface of the alignment plate 10 with two or more layers of solder balls 4. When the supply is finished, the shutter 18 is closed again. At this time, the pump is sucked from the rear side of the alignment plate 10 by the pump, and is sucked in through the ventilation holes 12.

As a result, a part of the solder balls 4 supplied to the upper surface of the alignment plate 10 is stored in each storage hole 11 of the alignment plate 10. As described above, a very large number of solder balls 4 are supplied to the upper surface of the alignment plate 10 and are covered with the solder balls 4 in two or more layers. 4 is stored. However, each storage hole 11 can store only one solder ball 4 in size, and no two or more solder balls 4 are stored in one storage hole. Here, the suction from the rear side of the alignment plate 10 also assists the smooth storage of the solder balls 4 in the storage holes 11.

In this state, all the storage holes 11 of the alignment plate 10 are occupied by one solder ball 4. On the upper surface of the alignment plate 10, there are a large number of solder balls 4 that are not stored in the storage holes 11 and are splashed. Then, as shown in Fig. 6, when the inclined plate 15 is advanced, the rear end of the alignment plate 10 (inside of the indexing table 2 for ball alignment) is lifted by the inclined surface 16 of the ffi plate 15 and the inclined plate 15 is lifted. 15 is tilted. As a result, any excess solder balls 4 that are splashing on the upper surface of the alignment plate 10 roll off the side 13 due to gravity. The rolled solder balls 4 are stored in a ball tray 14 shown in FIG. At this time, the angle of the f # toon of the alignment plate 10 should be about 30 °. When the alignment plate 10 is tilted, the ball hopper 17 moves upward to β.

Then, when the inclined plate 15 is retracted again and the alignment plate 10 is returned to a horizontal state, a state in which the solder balls 4 are aligned on the alignment plate 10 is obtained as shown in FIG. That is, in this state, all the storage holes 11 of the alignment plate 10 are occupied by one solder ball 4. In addition, the excess solder balls 4 have been removed from the alignment plate 10. The surplus solder balls 4 stored in the ball tray 14 are returned to the ball hopper 17 through a tube 19 by air jet.

Here, the ball alignment index table 2 is rotated by 180 ° and stopped there. Then, the alignment plate 10 in which the solder balls 4 are aligned comes to the lower position in FIG. 1 (X in FIG. 7). On the other hand, the alignment plate 10 where the solder balls 4 are not aligned comes to the upper position in FIG.

Then, the suction head 20 is lowered with respect to the alignment plate 10 at the position X in FIG. Then, the inside of the suction head 20 is sucked by the pump. As a result, the solder balls 4 stored in the storage holes 11 of the alignment plate 10 are sucked out, and as shown in FIG. It is in a state of being adsorbed. At this time, the air is discharged from the rear side of the alignment plate 10 through the vent hole 12 by the pump. This is for assisting the suction of the solder ball 4 to the suction port 21. As a result, all the suction ports 21 of the suction head 20 are occupied by one solder ball 4 and no excess solder ball 4 exists there.

In parallel with the suction operation by the suction head 20, the work of aligning the solder balls 4 with the other set of alignment plates 10 may be performed at the upper position in FIG. it can. Also, as each solder pole 4 is attracted to the suction head 20, the alignment plate 10 at the lower position in FIG. 1 in the ball alignment index table 2 becomes empty without the solder ball 4. . If the alignment plate 10 is moved to the upper position in FIG. 1 in the ball alignment index table 2, the solder balls 4 can be received again.

When the solder balls 4 are sucked by the suction head 20, the suction head 20 is raised and moved from the X position to the Y position in FIG. That is, the suction head 20 is moved to a position above the substrate transport index table 3. On the way, the suction head 20 passes above the camera 6. Therefore, at this time, it is possible to check whether there is any empty space (see Fig. 10) or excess (see Fig. 11) of the solder ball 4 in the suction head 20. During this movement, the inside of the suction head 20 is continuously sucked by the pump.

Below the suction head 20 that has moved to the Y position in FIG. 7, a printed wiring board 5 receiving the distribution of the solder balls 4 is placed. Therefore, the suction head 20 is placed at a height just above the printed wiring board 5. Can be lowered. This means that the solder ball 4 has been transported to the transported position. Here, the suction by the pump inside the suction head 20 is released. Therefore, each solder ball 4 sucked by the suction head 20 is placed on the printed wiring board 5. This position is where solder balls 4 are required for mounting components, and there is no shortage or excess at each position. Thus, as shown in FIG. 12, a state in which the solder balls 4 are distributed on the printed wiring board 5 is obtained.

Then, the board conveying index table 3 is rotated 90 °, and the work booth 22 on which the printed wiring board 5 to which the solder balls 4 have been distributed is placed is moved to another position. Then, after post-processing such as mounting of parts, it is paid out from the ¾g transport index table 3. If the printed wiring board 5 is received in the other work booth 22 of the board transfer index table 3 in advance, the solder balls 4 are distributed to the subsequent printed board 5 in parallel with this post-processing. be able to.

The suction head 20 that has transferred the solder ball 4 to the printed wiring board 5 is empty without the solder ball 4. Then, it goes up and returns to the ball alignment index table 2 (position X in FIG. 7), and the solder balls 4 are sucked from the subsequent alignment plate 10. In the middle of the movement, the suction head 20 passes above the camera 6. Therefore, at this time, it is possible to check whether any residual solder balls 4 (see Fig. 13) occur in the suction head 20.

As described in detail above, according to the present embodiment, the solder balls 4 to be distributed to the printed wiring board 5 are first supplied onto the alignment plate 10. The alignment plate 4 is provided with a storage hole 11 of a size that can accommodate only one solder ball 4 corresponding to the position where the solder ball 4 is to be distributed on the printed wiring board 5. As a result, the solder balls 4 are stored one by one in each of the storage holes 11, so that an arrangement of the solder balls 4 can be obtained in which the distribution to the printed wiring board 5 is sufficient and sufficient. In particular, a ventilation hole 12 is formed at the bottom of each storage hole 11, so that suction of the solder ball 4 into the storage hole 11 can be assisted by drawing air from the back side. In addition, since the alignment plate 10 is inclined by the inclined plate 15, the solder balls 4 that are not stored in the storage holes 11 and are flushed can be easily removed from the alignment plate 10. Here, since no edge is provided on the front side 13 of the alignment plate 10, the surplus solder balls 4 easily roll forward from the side 13 when the alignment plate 10 is inclined. Is what you can do. Then, after arranging the solder balls 4 on the alignment plate 10 as described above without any excess or shortage, the suction head 20 having the suction port 21 corresponding to the position where the solder ball 4 is to be delivered is provided. The set solder balls 4 are sucked. For this reason, a state in which the solder balls 4 are adsorbed to the adsorbing head 20 without excess or deficiency can be reliably obtained without retrying. Here, since the ventilation hole 12 is formed at the bottom of each storage hole 11, it is possible to assist the movement of the solder ball 4 from the storage hole 11 to the suction port 21 1 by discharging air from the back side. You can do it. Furthermore, the solder balls 4 to be supplied to the alignment plate 10 are stored in the ball hopper 17. Then, the solder balls 4 removed from the alignment plate 10 are returned from the ball tray 14 to the ball hopper 17 via the tubes 19, so that the solder balls 4 can be circulated and used conveniently.

In the present embodiment, a rotatable alignment index table 2 is also provided. The alignment of the solder balls 4 on the alignment plate 10 and the transfer of the solder balls 4 from the alignment plate 10 to the suction head 20 are performed at positions opposite to each other by 180 ° in the alignment index table 2. We are going to do it. As a result, these two tasks can be performed in parallel, contributing to a reduction in tact time.

In addition to the alignment index table 2, a rotatable substrate transport index table 3 is provided. The printed wiring board 5 is prepared for the board transfer index table 3, and the suction heads 20 are transferred here to distribute the solder balls 4, so that the alignment index table 2 is provided. The alignment of the solder balls 4 on the alignment plate 10 and the reception of the solder balls 4 on the printed wiring board 5 in the substrate transport index table 3 can be performed in parallel. Also, since it can be rotated like the board transfer index table 3, a new printed wiring board 5 is received and the solder balls 4 are distributed at another place in the board transfer index table 3. Attachment of components to the printed wiring board 5 and other other operations can be performed in parallel with the above-mentioned reception of the solder balls 4. This can also contribute to shortening the tact time.

Thus, a method of distributing solder balls and a device for executing the method are realized, in which the possibility of blanks or duplication of the solder balls 4 is almost eliminated. The above embodiment is merely an example, and does not limit the present invention. Therefore, naturally, the present invention can be variously improved and modified without departing from the scope of the invention. Industrial applicability

As is clear from the above description, according to the present invention, by holding the solder ball in each of the storage holes of the alignment plate and holding the solder ball on the suction head, the solder ball can be used for blanking or overlapping. A method and apparatus for distributing solder balls that completely eliminates occurrence thereof are provided. This eliminates the need for retries and contributes to improved production efficiency.

Claims

Claims: In a solder ball distribution method for distributing solder balls to a distribution position,

A solder ball is supplied on an alignment plate having a storage hole in which only one solder ball can be stored, and the solder ball is stored in the storage hole (step 1).

Removing excess solder balls on the alignment plate (step 2),

Using a suction head provided with a suction hole at a position corresponding to the storage hole, the solder ball stored in the storage hole is suctioned (Step 3),

A method of distributing solder balls, wherein the suction head is transported to a delivery position and the suction of the solder balls is released there.

In the method for distributing solder balls according to claim 1,

In the step (2), a surplus solder ball is removed by inclining the alignment plate to provide a solder ball distribution method.

In the method for distributing solder balls according to claim 1 or 2,

At the bottom of the storage hole in the alignment plate, a ventilation hole communicating between the front and back is provided.

In the step (1), air is sucked from the rear side of the alignment plate through the ventilation hole, and the solder ball is stored in the storage hole.

In the step 3, a method of distributing solder balls, characterized in that air is blown out from the back side of the alignment plate through the ventilation hole to assist the suction of the solder ball to the suction head.

In the method for distributing solder balls described in any one of claims 1 to 3,

A solder ball to be supplied on the alignment plate in the step 1 is stored in a ball hob,

A method of distributing solder balls, wherein the solder balls removed from the alignment plate in the step 2 are returned to the lift ball hob.

. In a solder ball distribution device that distributes a solder ball to a distribution position,

An alignment plate with a storage hole for storing only one solder ball,

Supply means for supplying a solder ball on the alignment plate;

Removing means for removing excess solder balls on the alignment plate; A suction head provided with a suction hole at a position corresponding to the storage hole;

And a conveying means for conveying the suction head to a distribution position.

In the solder ball distribution device according to claim 5,

2. The solder ball distributing device according to claim 1, wherein said removing means is a # means for inclining said alignment plate.

In the solder ball distribution device according to claim 5 or 6,

A solder ball distributing device, comprising: an intake / exhaust means for inhaling or exhaling air from the rear surface side of the alignment plate through the ventilation hole.

In the solder ball distribution apparatus according to any one of claims 5 to 7,

A solder ball distributing device, comprising: a ball hopper for storing solder balls to be supplied on the alignment plate; and a transfer means for returning the solder balls removed from the alignment plate to the ball hopper.