WO2000003417A1 - Device and method for providing a complete wafer stack - Google Patents

Device and method for providing a complete wafer stack

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Publication number
WO2000003417A1
WO2000003417A1 PCT/CH1999/000297 CH9900297W WO0003417A1 WO 2000003417 A1 WO2000003417 A1 WO 2000003417A1 CH 9900297 W CH9900297 W CH 9900297W WO 0003417 A1 WO0003417 A1 WO 0003417A1
Authority
WO
Grant status
Application
Patent type
Prior art keywords
wafer
stack
gripper
device
wafers
Prior art date
Application number
PCT/CH1999/000297
Other languages
German (de)
French (fr)
Inventor
Jakob Blattner
Bernhard Strasser
Christian Balg
Original Assignee
Tec-Sem Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

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Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of waers
    • H01L21/67781Batch transfer of wafers

Abstract

The aim of the invention is to avoid, during the batch handling of wafers, the negative effects caused by missing wafers in a wafer stack. To this end a device for handling a wafer stack and making said stack available to a treatment process is provided for which comprises a receiving device fitted with retaining elements for the simultaneous arrangement of several wafers positioned at defined distances from and vertically in relation to each other. Said device also comprises a detection device which is able to detect whether at least one wafer is missing in a wafer stack (4), as well as a handling device (20) which can be displaced in relation to the receiving device. Said device serves to remove at least one substantially vertically oriented fill-in wafer (26) from a storage means in which several fill-in wafers (26) can be positioned and to insert the fill-in wafer (26) into the wafer stack (4) in a defined position in said stack.

Description

Apparatus and method for providing a complete wafer stack

The invention relates to a device for handling and providing a wafer stack for a Behandlungspro- process comprising a receiving means with holding elements for simultaneous assembly and handling of a plurality of mutually at predetermined intervals arranged wafers (a multiple wafer gripper which simultaneously with retaining elements for handling arranged several at predetermined spacing, wafer) is provided. The invention also be ¬ meets a method of providing a complete wafer stack.

So-called wafers (semiconductor wafers, in particular silicon wafers) are starting materials for electronic components. To achieve the desired properties of the wafer, these various treatment processes, such as wet processes in which, among other things abgetra- layers gen are run. For economic reasons, it is this common practice to combine several wafers to a so-called "batch", so that the wafers of a batch through all processes simultaneously.

For various reasons it is possible that during processing of the batches individual wafers have to be taken out of the batch. Especially in automatic or fully automatic production of wafer single wafer can therefore be missing because they have been sorted out.

The processes which pass through the wafers, are often tuned to a certain number and a certain distance from adjacent wafers. It has been shown that a lack of wafer can have on the process results a negative impact. Thus, for example, due to an incorrect spacing of two successive wafers, result in changes in the flow rate of process liquid of the wet process, which for example in turn leads to a deviation of the thickness of a layer to be applied.

In order to supply a process a certain target number of wafers, it is known to assemble a batch of individual wafers. The wafers are hereby individually removed from a wafer holder disposed in a pile and inserted into a receptacle with which the batch is supplied to the process. As already may be absent in the support wafer, a sensor means may be present is detected with in each handling a wafer, whether neuter was also detected in tat a wafer and inserted into the receptacle.

Since this handling of individual wafers, the so-called "single-wafer handling," relatively time consuming and therefore un- ter economic aspects is questionable in the industrial production of wafers for quite some time plants are known in which the handling of the wafers just still takes place in the form of batches. in order to supply wafers of a process plant, the wafers are provided so here no longer the handling and delivery of individual wafers.

To replace even in a wafer stack lack wafer by a single füllwafer, so has become loading known a plant in which in which empty spaces of a wafer stack filled at a time with Füllwafern by a handling device to which the wafer still in a transport container are located. The dedicated Füllwafer also be from a transport container corresponds no men and are - positioned horizontally - as well as the wafer of the wafer stack. However, this has the disadvantage that particles can settle on the surface of the wafer.

The invention is therefore based on the object to provide a forward direction and a method with which it is possible to prevent even with the stack-wise handling wafers ( "batch Handling") adverse influences due to missing in a wafer stack wafers. in other words, to be created with the invention is a possibility even with the stack-wise handling wafers to provide for a machining process, a wafer stack with the intended number of wafers.

This object is achieved According to a first aspect of the invention, in the above-mentioned device is that it comprises a detection device, with the absence of at least one wafer can be detected in an existing wafer stack and lose with a relatively with respect to the receiving means movable manipulation device for unlocking is provided by at least one Einfüllwafer from a memory means in which a plurality Einfüllwafer can be arranged, and inserting the Einfullwafers in the wafer stack to a specified position in the wafer stack.

A second aspect of the invention relates to a method for providing a wafer stack for a Behandlungspro- process at the same time wafers of a wafer stack taken with a receiving device from a transport container, these wafers are arranged outside of the transport container in a substantially vertical orientation in a holder to the supplying wafer stack below of a process plant, is detected due to the spacing of successive wafers of the wafer stack with a detection device, the wafer stack to be exhaustive, is sent an appropriate signal in the absence of wafers of a controller, the controller being responsive a handling device for handling of substantially vertically arranged Füllwa- fer , which then removes a least minde ¬ Einfüllwafer from a memory means and a ¬ inserts in a holder in which the wafer stack is arranged.

In the inventive apparatus and methods detek- in a type of "scan" is thus by means of a sensor advantage if the wafer stack is complete. If it is determined that one or more wafers are missing, the wafer stack at the voids with one or is completes more so-called "Füllwafern". It has been shown that this is a very efficient and inexpensive solution as it can be avoided thereby to change the process parameters itself to adjust the treatment process to an un- full wafer stack. Since only takes place in the inventive devices of the filling operation with Füllwafern when the wafers of the wafer stack was transferred into a vertical position, the risk of contamination of the surface of the wafers with particles is far were less than is the case with prior art devices. For this purpose, also contributes, that the Füllwafer are arranged in a substantially vertical position and both the wafer stack and the Füllwafer be located in a clean room in which usually a vertical airflows mung is present which largely prevents particles settle the wafer surface.

Füllwafer may be wafers to be treated, which are later used for the production of electronic components actually. It is preferred, however, that the Einfüllwafer exclusively serve finally for filling wafer stacking and reused after treatment processes in another wafer stack as Einfüllwafer. For this, the Einfüllwafer be taken after completion of a treatment process again from the wafer stack and inserted into the storage means, which conveniently happens through the inventiveness according handler. The Einfüllwafer should in its dimensions - meet the wafers substantially to as closely as possible simulate the actual to be treated wafer - and possibly also in their surface texture.

A gripper of a manipulator according to the invention entimmt from a memory means a Einfüllwafer and transports it to the wafer stack. Since the control Due to the detection process known to be inserted at what point or position at which the Einfüllwafer, preferably adds of the same gripper the Einfüllwafer at the space in the wafer stack one in which it is deposited it at the corresponding position of the receiving device ,

EADERSHIP form at appropriate Off, the erfindungsge- Permitted handling device to a two-arm gripper, which is movable along at least two translational axes, removes already vertically oriented Einfüllwafer from a memory means and used in the receiving device, wherein the storage means may be part of the handling device. Since this handling device preferably performs all of the functions for Einfüllwafer required for filling a wafer stack, this is particularly easy to integrate into an existing plant for the provision of wafer stacks. To further facilitate this, therefore, it is also preferred that the handling device as a separate handling module, namely a so-called "stand-alone solution", is formed.

Further preferred embodiments of the invention emerge from the dependent claims. The invention is illustrated by the schematically shown in the figures embodiments; show it:

Fig. 1 is a perspective view of a

Loading and unloading for transport containers and of a partially shown multiple wafer gripper;

2 is a side view of the embodiment shown in Fig. 1

Investment;

Fig. 3 is a front view of the embodiment shown in Fig. 1

Investment;

4 is a plan view of the embodiment shown in Fig. 1

Investment;

Fig. 5 is a perspective view of a handling module and a portion of a

Multiple wafer grippers which both form part of an inventive handling apparatus;

Fig. 6 is a front view of the two invention components shown in Fig. 5.

In Figs. 1, 2, 3 and 4, a loading and unloading station for wafer transport container 2 is shown having means disposed in a lock wall closable lock opening 3 through which an in-a magazine of a transport container 2 wafer stack 4 in a clean room is einschleusbar. Such stations are known per se, so station must not be discussed on the structure and functions of loading and unloading. In Figs. 1 - 4 also partially a multiple wafer ¬ claw 5 is shown, with a complete stack of wafers 4 can be removed from the transport container and SämT ¬ Liche 25 wafers of the stack at the same time from a horizonta- len alignment in a substantially vertical alignment can be pivoted. The wafer gripper 5 is provided for ¬ with two rows of gripper fingers 6 here, at their free ends a slotted retaining member is attached. For ease of presentation only the first and last gripper fingers 6 of a gripper row of fingers are shown in the figures. The respective opposing gripper fingers in the two rows 6 are provided for removing a wafer from the transport container 2, wherein all the wafers of a wafer stack 4 are simultaneously taken out from the transport container. 2 Thus, the wafers are fixed during removal as well as during subsequent handling to prevent damage, the gripping device is also provided with a two-part holding rake 7, the two gripper fingers are arranged rows between its two halves.

For detecting the wafer in each case two gripper fingers 6 are arranged under a wafer, that the holding elements engage behind the wafer. By suitable movement of the wafer in each of the holding elements is to close check (not shown) in the two slots is inserted and arranged on the opposite side thereof into a slot of Halterechens. 7 To remove the wafer from the magazine, the multiple wafer gripper 5 moves out with the fingers of the gripper 6 supported wafer in a horizontal movement along a Y-axis from the transport container. 2 Subsequently, the wafer gripper 5 performs a pivoting movement about an axis of rotation, the rotary shaft is designated. 8 Due to the rotational movement, the wafer from its hori- zontal position are transferred into a vertical position. The design and functions of a possible derarti- gen wafer gripper are described in International Patent Application PCT / CH97 / 00383 of the applicant. The contents of this patent application is hereby fully incorporated by reference.

In Figs. 1 to 4 In addition, two claws on multiple wafer 5 mounted parallel arms 10, 10 'are shown. The arms are vertically aligned with the gripper fingers. 6 The Arne 10, 10 'are therefore arranged horizontally when the gripper fingers 6, as shown in Figs. 1 - 4, are in their vertical position. At a free end of one arm 10 is arranged a light source, a light detector and at the free end of the other arm 10 ', both of which belong to a non-illustrated light barrier sensor. The length and the distance between the two arms 10, 10 'is matched to the opening width of a front side of the transport container 2 and the diameter of the wafer. This vote provides that the photoelectric sensor can be positioned so that a wafer is having a portion of its peripheral edge between the light detector and light source. Finally, the multiple wafer gripper and thus the photoelectric sensor along a Z-axis is vertically movable, said traversing at least equal to the height of a magazine of a transport container. 2

In FIGS. 5 and 6, a handling device 20 can be seen which serves for handling Einfüllwafern. The handling device 20 has a housing 21, at its front face 22, two substantially mutually parallel gripping arms 23 are disposed 23 '. The spacing of the gripper arms 23, 23 'to one another is greater than the diameter of a wafer. '24 is in each case a prism-shaped slotted gripping element 24' is arranged at the free ends of the gripper arms 23, 23rd The two gripping elements 24, 24 'together form a single wafer gripper 25. The gripper 25 is single wafer füllwafern for handling individual inputs 26 are formed and this detects a vertically aligned in ¬ we sentlichen Einfüllwafer at its peripheral edge. The gripping elements 24, 24 'for this purpose are spaced apart from one another which is less than the diameter of a wafer.

The single-wafer gripper 25 is preferably in each gripping member 24, 24 'each provided with a photoelectric sensor, not shown, with which the presence of a wafer in the gripper can be detected. The photoelectric sensors are designed for this purpose as a reflection sensors, the light beam of the respective light transmitter is reflected by the peripheral edge of a wafer to the light receiver.

The gripper arms 23, 23 'of the single-wafer gripper 25 are movable along two translational axes Y and Z. The provided for this purpose servo motors are not further shown in the figures. Both axes can be equipped with two inductive proximity sensors to define the two end positions of each axis. Each axis may further comprise a third proximity sensor, which is used to define a reference position. By this measure, it is possible that each axis can recognize their reference position again, even if they do - should have lost - beispielswei- se due to power failure. The third sensor is preferably arranged in the Y-axis in the vicinity of a rear end stop and in the Z-axis in the region of an upper end stop.

The Y-axis of the exemplary embodiment of the handling module 20 shown is designed so that it can move to other than the reference position further 85 positions. Of these, the positions 1 to 60 for receiving and settling of Einfüllwafern in a storage means for Einfüllwa- fer 26 are provided. The positions 61-85 are used for filing Einfüllwafern 26 in the multiple wafer gripper 5 or in any other suitable receptacle for a wafer stack. 4

Approximately below the single-wafer gripper storage means for Einfüllwafer 26 is between the two gripping arms on the housing is provided in which a total of 60 Einfüllwafer in a vertical orientation can be arranged (see. Fig. 5 and 6). The storage means includes two parallel to the gripper arms 23, 23 'aligned support arms 27, 27'. The support arms each have an inclined support surface which are provided with slots for receiving the wafers. The two retaining arms 27, 27 'are movable along the Y-axis. The distances from each adjacent wafer shots of the retaining arms 27, 27 'are always identical and wear loading of the distance H, the wafer having the magazine of the transport container (so-called. "Pitch spacing").

The two retaining arms 27, 27 'are simultaneously moved from a parked position into a filling position - in a direction parallel to the gripper arms 23, 23' and from the housing 21 away - movable. For this purpose, the retaining arms 27, 27 'is driven by a drive in the form of an AC motor. In the filling position of the single-wafer gripper removes 25 Einfüllwafer 26 from the storage means and puts it back. By the mobility of the storage means the space can also be used for purposes other than the filling Einfüllwafern front of the housing 21, for example for moving the multiple wafer gripper 5. This makes it possible, the floor space required by an inventive handling device reduced advantageously. Since the handling device is usually arranged in a clean room, and any reduction means a substantial reduction of the effort for the production of electronic chips of required floor space, this advantage for the design of chip factories has great importance. Finally, the storage means may be provided with a not shown light barrier, with which the presence of Einfüllwafern 26 between the retaining arms 27, 27 'is detected. The light barrier is preferably arranged at Speichermit- tel before the first and after the last A ¬ füllwafer.

In the process carried out with the system according to the invention method it is provided that the 'arranged on the two arms 10, 10 photoelectric sensor scans arranged in the magazine of the transport container 2 wafer (see. Fig. 1- 4). For this purpose, the multiple wafer gripper 5 is placed opposite the transport container 2 in a position at first, as shown in Fig. 2, in which the two arms 10, 10 'below a lowermost receiving slot (not shown) of the magazine are located. Subsequently, the multiple wafer gripper 5 travels along the Z-axis vertically upward until the arms 10, 10 are 'above the uppermost slot of the magazine. On this path of the light beam of the light barrier sensor is interrupted by the JE existing in the magazine wafer. Since the arms moved at a constant speed and the control of the distances of successive slotted receptacles of the magazine are known can be determined in which slotted receptacles are empty.

also to be able to determine if a wafer is obliquely arranged in the magazine, a second photoelectric sensor could be provided on the arms, which is located in the traversing direction behind the first photoelectric sensor. The distance in the direction of travel of the two light barriers sensors should be smaller than the distance between two wafers, which are arranged in successive slit images. The distance between the two sensors is preferably at most half the distance of two such wafer. In the shown embodiment, instead of the two ¬ th photoelectric sensor is provided to measure the time in which the light beam of a photoelectric sensor un ¬ is interrupted. Since the control of the thickness of a wafer is known, can also determine whether a particular interruption of the light beam is due to one or more wafers of this additional measured variable. Indeed, it is possible that more than one wafer is in a slot recording. Finally, the controller counts the number of beam interruptions to determine, together with the previously discussed detection sizes the number of existing wafer whose positions and the positions of any vacancies in the magazine.

After the scanning process is completed, the multiple drives gripper 5 with the arms 10, 10 'back out of the magazine. By a pivoting movement of approximately 90 ° the gripper fingers 6 can be converted into a horizontal position approximately. Then take the gripper fingers 6, the wafers in the already described manner from the magazine. After the multiple wafer gripper 5 has been swung back by 90 ° retraced, it is in a refill position, in which all the wafers of the wafer stack 4 arranged vertically.

Once in the meantime, the storage means has been moved from its parking position to its filling position, now the fill in which the single-wafer gripper 25 fills the empty positions in multiple wafer gripper 5 with Einfüllwafern starts. 25 For this purpose, moves the single-wafer gripper below the Einfüllwafer below a certain, which is arranged in the retaining arms, Einfüllwafer 26. This is preferably the front and thus of the the multi-fold wafer gripper 5 closest positioned Einfüllwafer 26. After the gripping elements 24, 24 'of the single-wafer gripper have been positioned 25 vertically below the male Einfüllwafer 26 in a position of the single wafer gripper 25 along the Z-axis is moved vertically upward so that the gripping elements below the - viewed in the vertical direction - widest part of the record this on its peripheral edge with its two slots corresponding to Einfullwafers 26th Subsequently, the gripping members 24, 24 'in the vertical direction (Z-axis) can be moved further upwards. Thereby, the Einfüllwafer 26 is lifted out of the stack of Einfüllwafer. Once the Einfüllwafer 26 is located over the stack of Einfüllwafer, the gripping elements are moved along the Y-axis and positioned above the blank to be replenished position of the multiple wafer gripper. 5 Subsequently, the gripping members are lowered by operating the Z-axis and the Einfüllwafer inserted into the empty position of the wafer stack 4 26th Thus, the gripping members release the Einfüllwafer, they are also moved over the position vertically downward, in which the Einfüllwafer is already absorbed by the multiple wafer gripper 5 26th After the gripping elements 24, 24 without collision can be moved 'back along the Y-axis, the gripper moves along the wafer stack 25 4 back to the stack Einfüllwafer. Herewith the refill process is completed for an initially empty position in the wafer stack. 4 If more empty positions have been detected in the wafer stack, even these positions by the handling module 20 are filled with Einfüllwafern subsequently in an analogous manner. Here, each of the multiple wafer gripper 5 next Einfüllwafer is preferably taken from the stack of Einfüllwafer. Once all empty positions are filled with Einfüllwafern 26, the wafer stack for the next machining process is ready. The wafer stack may be arranged for this purpose in a known per se into another magazine or other receptacle for wafers, which is then transferred into a processing plant. Upon completion of the machining process of the above-described process takes place in reverse order. The wafer ¬ stack is thus placed back into the multiple wafer gripper whose gripper fingers are this vertically oriented substantially comparable. the Einfüllwafer are then individually removed again from the arranged in the multiple wafer gripper wafer stack and inserted into the stack of Einfüllwafer held by the holding arms to the single-wafer gripper. The single-wafer gripper this supply initially positioned along the Y-axis by the corresponding Einfüllwafer to then take along the Z-axis in the lower half of this Einfullwafers with the slots in the gripping means by a movement. As with the removal of the Einfüllwafer from the stack of Einfüllwafer the single-wafer gripper then moves without movement to interrupt along the Z-axis further vertically upward. After the Einfüllwafer is removed in this way from the wafer stack, it will be positioned by the single-wafer gripper along the Y-axis over a receptacle of the holding arms and lowered in the latter and used. Once the gripping means have been lowered so far that they are again freely movable in the Y-axis, the handling device for manipulating the next Einfullwafers is ready.

Finally, it should be noted that the stack of Einfüllwafer preferably in that this gets into the storage means - is first removed with the multiple wafer gripper 5 from a transport container - in fact, as well as wafers to be treated. Subsequently, the Einfüllwafer be pivoted with the multiple wafer gripper 5 from its previously horizontal orientation to a vertical position, to be subsequently used with the single-wafer gripper 25 separately in the storage means.

Claims

Patentanspr├╝che
1. A device for handling and providing a Wa ferstapels f├╝r a treatment process comprising a
having receiving means, which is provided with retaining elements for the simultaneous arrangement of a plurality of mutually vertically arranged at predetermined Abständen wafers, characterized by a Detektionseinrich- tung, with the absence of at least one wafer in an existing wafer stack (4) is detectable and gegenüber the receiving device relatively movable handling device (20) for removal of at least one, substantially vertically aligned, Einfüllwafer (26) from a storage means in which a plurality Einfüllwafer (26) can be arranged, and introduction ügen of Einfullwafers (26) in the wafer stack (4) to a specific position in the wafer stack.
2. Device according to claim 1, characterized in that the receiving device has a drive and is movable along at least two axes, and the holding members of the receiving means for Einf├╝gen a Einfullwafers (26) are so positionable that the wafers aligned substantially vertically are.
3. A device according to one or more of the preceding Anspr├╝che, characterized in that the handling device (20) comprises a two-arm grippers (25).
, Device according to one or more of the preceding Anspr├╝che, characterized in that the gripper (25) is only provided with two mutually perpendicular axes of motion.
5. The device according to one or more of the preceding Anspr├╝che, characterized in that the gripper is designed as a single-wafer gripper (25) which is provided with gripping elements (24, 24 ') for detecting a single wafer.
6. The device according to one or both of the preceding Anspr├╝che, characterized in that the storage means comprises receptacles in which the Einf├╝llwafer are vertically positionable substantially.
7. Device according to one or more of the preceding Ansprüche, characterized in (5) is that the receiving device a provided with holding elements for receiving wafers multiple wafer gripper which for simultaneous handling of several, preferably sämtlicher, a wafer is provided wafer stack (4).
8. The device according to one or more of the preceding Anspr├╝che, characterized in that the detection device is arranged on the receiving device.
characterized 9. The device according to one or more of the preceding Ansprüche that the detection means comprises a photoelectric sensor, or a reflection sensor and a light emitter is movable together with a Lichtempfänger of the sensor.
10. The device according to claim 9, featured in that the detection means comprises means by which the light transmitter and the Lichtempfänger so gegenüber a arranged in a Transportbehälter wafer stack (4) can be arranged and moved in that a beam path of the light transmitter is interrupted by wafer.
11. The device according to one or more of the preceding Ansprüche to 10, characterized by the storage means, which is between the two arms (10, 10 ') arranged in the gripper that sämtliche Einfüllwafer (26) the storage means can be arranged in a position in which gripper arms (23, 23 ') of the gripper (25) are oriented orthogonal to the Oberflächen Einfüllwafer (26).
12. Handling device for handling a single wafer, for example, individual Einf├╝llwafer, in particular according to one of the preceding Anspr├╝che, characterized by a gripper (25) for detecting a single vertically oriented wafer in a first position, and a displacement device for transporting the gripper together with a single wafer in a second position in which the wafer is deductible from the gripper in a vertical orientation.
13. Handling device according to claim 12, characterized in that the traversing means comprises translational only two toric movable axes.
14. Handling device according to one or both of the preceding Anspr├╝che 13 and 14, characterized by an integrated in the handler storage means for receiving a plurality of wafers, in particular Einf├╝llwafern.
15. A method for providing a wafer stack für a treatment process in the same wafer of a wafer stack taken with a receiving device of a Transportbehälter, and outside the transport portbehälters in a vertical orientation in a holder are arranged around the wafer stack zuzuführen below of a process plant, characterized characterized marked that this is detected on Vollständigkeit with a detection device due to the Abstände successive wafer of the wafer stack, in the absence of wafers of a controller a corresponding signal is sandt Ge, the control a handling device for handling of substantially vertically arranged Einfüllwafer responsive, the handling device then extracts at least one Einfüllwafer from a memory means and einfügt in a holder, in which the wafer stack is arranged.
16. The method according to claim 15, characterized in that the handling device in the absence of more than one wafer each of the aufzuf├╝llenden Einf├╝llwafer individually extracts from the storage means and continues into the holder once.
17. The method according to one or more of the preceding Anspr├╝che 15 and 16, characterized in that the handling device has at least removes a Einf├╝llwafer from a wafer stack, and the zur├╝cksetzt Einf├╝llwafer in the storage means with a vertical orientation ,
PCT/CH1999/000297 1998-07-09 1999-07-06 Device and method for providing a complete wafer stack WO2000003417A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CH146798 1998-07-09
CH1467/98 1998-07-09

Applications Claiming Priority (1)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002005320A1 (en) * 2000-07-09 2002-01-17 Brooks-Pri Automation (Switzerland) Gmbh Storage device, especially for the intermediate storage of test wafers
US8002511B2 (en) * 2005-10-28 2011-08-23 Tokyo Electron Limited Batch forming apparatus, substrate processing system, batch forming method, and storage medium
US9257319B2 (en) 2011-06-03 2016-02-09 Tel Nexx, Inc. Parallel single substrate processing system with alignment features on a process section frame

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5797622A (en) * 1980-12-11 1982-06-17 Toshiba Corp Diffusion heat treating jig of semiconductor substrate
US4513430A (en) * 1982-05-24 1985-04-23 Varian Associates, Inc. Missing or broken wafer sensor
JPS6273631A (en) * 1985-09-27 1987-04-04 Oki Electric Ind Co Ltd Semiconductor manufacturing equipment
JPS62132321A (en) * 1985-12-04 1987-06-15 Anelva Corp Dry etching apparatus
US4776744A (en) * 1985-09-09 1988-10-11 Applied Materials, Inc. Systems and methods for wafer handling in semiconductor process equipment
JPH1098088A (en) * 1996-09-20 1998-04-14 Tokyo Electron Ltd Vertical thermal processing device
US5829969A (en) * 1996-04-19 1998-11-03 Tokyo Electron Ltd. Vertical heat treating apparatus

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5797622A (en) * 1980-12-11 1982-06-17 Toshiba Corp Diffusion heat treating jig of semiconductor substrate
US4513430A (en) * 1982-05-24 1985-04-23 Varian Associates, Inc. Missing or broken wafer sensor
US4776744A (en) * 1985-09-09 1988-10-11 Applied Materials, Inc. Systems and methods for wafer handling in semiconductor process equipment
JPS6273631A (en) * 1985-09-27 1987-04-04 Oki Electric Ind Co Ltd Semiconductor manufacturing equipment
JPS62132321A (en) * 1985-12-04 1987-06-15 Anelva Corp Dry etching apparatus
US5829969A (en) * 1996-04-19 1998-11-03 Tokyo Electron Ltd. Vertical heat treating apparatus
JPH1098088A (en) * 1996-09-20 1998-04-14 Tokyo Electron Ltd Vertical thermal processing device

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 11, no. 275 5 September 1987 (1987-09-05) *
PATENT ABSTRACTS OF JAPAN vol. 11, no. 355 19 November 1987 (1987-11-19) *
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 09 31 July 1998 (1998-07-31) *
PATENT ABSTRACTS OF JAPAN vol. 6, no. 182 18 September 1982 (1982-09-18) *

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002005320A1 (en) * 2000-07-09 2002-01-17 Brooks-Pri Automation (Switzerland) Gmbh Storage device, especially for the intermediate storage of test wafers
US8002511B2 (en) * 2005-10-28 2011-08-23 Tokyo Electron Limited Batch forming apparatus, substrate processing system, batch forming method, and storage medium
US9257319B2 (en) 2011-06-03 2016-02-09 Tel Nexx, Inc. Parallel single substrate processing system with alignment features on a process section frame
US9293356B2 (en) 2011-06-03 2016-03-22 Tel Nexx, Inc. Parallel single substrate processing system
US9449862B2 (en) 2011-06-03 2016-09-20 Tel Nexx, Inc. Parallel single substrate processing system
US9508582B2 (en) 2011-06-03 2016-11-29 Tel Nexx, Inc. Parallel single substrate marangoni module

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