WO1999054845A1 - Method for producing a decorative item on an integrated circuit card - Google Patents

Method for producing a decorative item on an integrated circuit card Download PDF

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Publication number
WO1999054845A1
WO1999054845A1 PCT/FR1999/000705 FR9900705W WO9954845A1 WO 1999054845 A1 WO1999054845 A1 WO 1999054845A1 FR 9900705 W FR9900705 W FR 9900705W WO 9954845 A1 WO9954845 A1 WO 9954845A1
Authority
WO
WIPO (PCT)
Prior art keywords
support film
module
contact pads
card
entity
Prior art date
Application number
PCT/FR1999/000705
Other languages
French (fr)
Inventor
Stéphane AYALA
Didier Elbaz
Laurent Garcia
Original Assignee
Gemplus
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemplus filed Critical Gemplus
Priority to AU30390/99A priority Critical patent/AU3039099A/en
Priority to EP99911849A priority patent/EP1073997A1/en
Publication of WO1999054845A1 publication Critical patent/WO1999054845A1/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C5/00—Processes for producing special ornamental bodies
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item

Definitions

  • the invention relates to a method of producing a decorative entity on a module card, a card comprising a decorative entity produced according to such a method and its associated module.
  • the invention relates more particularly to a method of producing a decorative entity on a card of the type comprising a card body provided with at least one cavity and a module disposed in said cavity, said module comprising at least one series of contact pads on a support film.
  • the integrated circuit cards are most of the time provided with a decoration.
  • This decor can have a simple aesthetic function intended to personalize the card and make it more attractive.
  • This decoration can also have the function of transmitting an advertising message recalling for example the logo of a company.
  • the space occupied by the module on the card represents only a small proportion of the area of the card body or in other words support body.
  • printing techniques are generally used to decorate the card by which an ink deposit is made on the card body.
  • the design of the module, and in particular that of the contact pads, is also linked to criteria of reliability in the face of mechanical and electrical stresses which it must undergo repeatedly during the life of the card.
  • the object of the invention is therefore to propose a new method for producing a decorative entity on an integrated circuit card which is both simple and economical, and which in particular does not add any additional step compared to the normal manufacturing method. a poor decoration card.
  • the invention proposes a method for producing a card, characterized in that one realizes at at least one pattern of said entity using said module, by arrangement and contrast of the shape of said contact pads with the contour of said support film.
  • the contour of the support film corresponds at least partially to the contour of said entity.
  • the synthetic material of the support film (16) is at least partly translucent.
  • At least one functional element is placed under the support film, at least a part of which is made transparent through the support film.
  • the functional element is chosen from adhesive material fixing the module in said cavity, a microcircuit connected to the contact pads, a coating material surrounding a microcircuit, a colored ring around the chip to delimit the coating material .
  • the invention also relates to an integrated circuit card comprising a decorative entity produced according to a method having any one of the characteristics listed above.
  • the invention also relates to a module of the type comprising at least one series of contact pads on a support film and at least part of a decorative entity, characterized in that at least one pattern of said entity is produced by arrangement and contrast of the shape of said contact pads with the contour of said support film.
  • the invention has the advantage of retaining the traditional chip card production technology while respecting the standardized contact areas. In particular, 4 the rules for supplying current are observed, the rules for assembling a microcircuit whatever its size, the rules for inserting the module into the cavity.
  • FIG. 1 is a plan view of an integrated circuit card according to the state of the technique comprising on the one hand a module and on the other hand a decorative entity printed on the support body;
  • FIG. 2 is a sectional view through a plane perpendicular to the plane of the card schematically illustrating the structure of an embodiment of a module
  • FIG. 3 is a plan view illustrating a ribbon intended for the production of a module according to the structure of Figure 2, the module being in accordance with the state of the art illustrated in Figure 1;
  • Figure 4 is a view similar to that of Figure 1 illustrating a card produced according to the method of the invention and having a decorative entity which is drawn by the outline for the module;
  • FIG. 5 is a view similar to that of Figure 3 illustrating a ribbon intended for the production of modules in accordance with the teachings of the invention, before the modules are cut;
  • FIG. 6 is a view similar to that of FIG. 5 illustrating in dotted lines the cutting line of a module in the ribbon of FIG. 5.
  • FIG. 1 Illustrated in FIG. 1 is an integrated circuit card 10, also called a smart card, produced according to the state of the art using a known method.
  • the card 10 essentially comprises a support body 12 in particular of rectangular shape and for example in the format of a credit card.
  • the body 12 carries a module 14 and it is moreover decorated by a decorative entity 15 which is for example printed on the upper face of the support body 12.
  • FIG. 2 illustrates more precisely a known embodiment of a module 14.
  • the module 14 firstly comprises a support film 16 which is made of insulating material, for example epoxy or polyimide or polyethylene terephthalate (PET).
  • a support film 16 which is made of insulating material, for example epoxy or polyimide or polyethylene terephthalate (PET).
  • An upper face 18 of the support film 16 is covered with a conductive layer which is generally made of metallic material and which is intended to form contact pads 20 visible in FIG. 1.
  • the contact pads 20 are produced by etching the metal layer so as to define between each pad gaps which allow the pads to be electrically isolated from one another.
  • the metal layer can first be engraved or perforated mechanically so as to form the contact pads 20, then be then affixed to the upper face 18 of the film 16.
  • the etching can then be carried out for example by an electrochemical process.
  • an electronic microcircuit 24 also called an integrated circuit or electronic chip is arranged on an underside 22 of the support film 16 .
  • the microcircuit 24 is intended to be electrically connected to the contact pads 20 by connection wires 26 which extend through holes 28 arranged in the support film 16 so that the wires 26 can be connected to a lower face of the metal layer forming the contact pads 20.
  • the lower face 22 of the support film is covered, at least at the level of the microcircuit 24 and the wires 26, by a synthetic protective resin 30.
  • the module 14 is therefore for the essential consisting of the support film 16, the contact pads 20, the microcircuit 24, the connecting wires 26 and the protective resin 30.
  • This module 14 is intended to be received in a cavity 32 arranged in an upper face 34 of the support body 12 of the card 10.
  • the cavity 32 is for example a stepped cavity comprising a central compartment 36 of significant depth in which is received the protective resin 30 of the microcircuit or electronic chip 14.
  • the cavity 32 has a depth substantially equal to the cumulative thickness of the support film 16 and of the metal layer forming the contact pads 20.
  • the fixing of the module 14 in the cavity 32 is generally carried out by bonding the support film 16 to the bottom of the peripheral portion 38 of the cavity 32 with a adhesive material (45), that is to say that the module 14 is fixed in the cavity 32 by its peripheral contour. 7
  • the contact pads 20 are exposed substantially at the same level as the upper face 34 of the card.
  • the metallic layer is generally produced in the form of a continuous ribbon which, at least for certain manufacturing processes, is carried by a continuous ribbon of support film 16.
  • the metallic ribbon is etched so as to form, at regular intervals along the strip, groups of contact pads which are intended to form a module.
  • the metallic ribbon comprises two modules over the width of the ribbon.
  • the metal strip also has two lateral rails 40 which extend over the entire length of the strip, on either side of the groups of contact pads.
  • the contact pads 20 are all connected to the lateral rails 40 by current supply arms 42 which allow, for example, to carry out electrochemical deposits on the entire metal strip.
  • the current supply arms 42 also serve for the mechanical connection of each of the pads with the rails 40.
  • FIG. 4 illustrates a card 10 which, in accordance with the teachings of the invention, comprises a module 14 whose contact pads 20 and the support film 16 are adapted in such a way that, while respecting the standardized contact zones , the outline of the module 14 and its external appearance once inserted draw a decorative entity, in this case the same as that which was produced by printing on the card of FIG. 1. 8
  • the module 14 includes contact pads 44 in addition to the 6 pads which are intended to be actually connected to the microcircuit.
  • These pads 44 which therefore have no functional utility, nevertheless have the same characteristics as those which are effectively connected to the microcircuit 24, owing to the fact that the two types 20, 44 of contact pads are produced simultaneously according to the same manufacturing process.
  • the pads 44 which are not functional can of course adopt any contour, on the sole condition of respecting the limits due to manufacturing constraints, and in particular those relating to the engraving of the metal strip.
  • the module according to the invention is distinguished by the fact that the external contour of the support film 16, which is shown in dotted lines in FIG. 6, differs from that of the contact pads so that that when the module is inserted into the cavity of the card, the support film 16 is not only visible at the level of the interstices which separate the contact pads, but also around the external contour of the contact pads.
  • the material constituting the support film can be colored, for example black but also in other colors, so that the module once inserted has a color contrast, compared to the contact areas but also compared to the material of the card body, which increases the aesthetic character of the decorative entity.
  • the film material 16 can also be partially translucent so as to obtain a composition of colors for example with the material of the support body 12 or with the protective resin 30 which are located below it.
  • the contact pads can be covered with a material which, while having electrical and mechanical characteristics compatible with the function of these pads, can be of a particular color or appearance.
  • the modification of the shape of the contact pads of the module means that the path and the size of the current supply arms 42 have to be modified. Indeed, the size of each arm d
  • the current supply is linked, for example, to the unit surface of the contact pad 20 to which it is connected.
  • the paths of the current supply arms 42 must not overlap, and it is preferable that they do not cross an area of the support film strip which will later be cut to form the support film 16 of the module.
  • some of the current supply arms 42 connect contact pads belonging to different groups, that is to say intended to belong to different modules.
  • the invention proposes a new method of producing a decorative entity which brings almost no additional cost compared to a conventional method of producing an integrated circuit card comprising no decoration.
  • the inventive unit which is drawn by the module illustrated in FIG. 4 is not limiting, the method according to the invention making it possible to produce modules having various contours, and various patterns inside this contour.
  • the synthetic material of the support film (16) is at least partly translucent.
  • at least part of a functional element can be made transparent through the support film under the support film.
  • the functional element visible through transparency through the support film is preferably any element necessary for the manufacturing process of the module and of the card, for example, the chip or microcircuit, the protective coating, an adhesive material, a colored ring. around the chip to delimit the coating material etc.
  • the element can also be added only to participate in the definition of the pattern.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

The invention concerns a method for producing a decorative item on a card comprising a card body (12) provided with at least one cavity and one module (14) arranged in said cavity, said module comprising at least a series of contact pads (20) on a support film (16). The invention is characterised in that it consists in producing at least one pattern of said item using said module, by arranging and contrasting the shape of said contact pads with said support film outline.

Description

Procédé de réalisation d'une entité décorative sur une carte du type à circuit intégré. Method for producing a decorative entity on an integrated circuit type card.
L'invention concerne un procédé de réalisation d'une entité décorative sur une carte à module, une carte comportant une entité décorative réalisée selon un tel procédé et son module associé.The invention relates to a method of producing a decorative entity on a module card, a card comprising a decorative entity produced according to such a method and its associated module.
L'invention se rapporte plus particulièrement à un procédé de réalisation d'une entité décorative sur une carte du type comportant un corps de carte muni d'au moins une cavité et un module disposé dans ladite cavité, ledit module comportant au moins une série de plages de contact sur un film support.The invention relates more particularly to a method of producing a decorative entity on a card of the type comprising a card body provided with at least one cavity and a module disposed in said cavity, said module comprising at least one series of contact pads on a support film.
Les cartes à circuit intégré sont la plupart du temps munies d'un décor. Ce décor peut avoir une simple fonction esthétique destinée à personnaliser la carte et à la rendre plus attrayante. Ce décor peut aussi avoir comme fonction de transmettre un message publicitaire rappelant par exemple le logo d'une société.The integrated circuit cards are most of the time provided with a decoration. This decor can have a simple aesthetic function intended to personalize the card and make it more attractive. This decoration can also have the function of transmitting an advertising message recalling for example the logo of a company.
Dans le cas des cartes à circuit intégré au format d'une carte de crédit, la place occupée par le module sur la carte ne représente qu'une faible proportion de la superficie du corps de carte ou autrement dit corps support.In the case of integrated circuit cards in the format of a credit card, the space occupied by the module on the card represents only a small proportion of the area of the card body or in other words support body.
Aussi, on utilise généralement, pour décorer la carte, des techniques d'impression par lesquelles un dépôt d'encre est effectué sur le corps de carte.Also, printing techniques are generally used to decorate the card by which an ink deposit is made on the card body.
Jusqu'à présent, la plupart des modules sont dessinés de manière à présenter un contour externe rectangulaire, voire légèrement ovalisé, dans lequel les zones correspondant à chacune des plages de contact sont délimitées par des interstices dont la couleur correspond à la couleur du matériau diélectrique qui isole les plages l'une de l'autre. En effet, le dessin de ce module est presque entièrement dicté d'une part par les contraintes liées à la disposition normalisée des plages de contact, et d'autre part par la nécessité de pouvoir réaliser, à des coûts économiquement rentables, la fabrication du module et son implantation dans la carte.Until now, most of the modules have been designed so as to have a rectangular, even slightly ovalized, external contour, in which the zones corresponding to each of the contact pads are delimited by interstices whose color corresponds to the color of the dielectric material. which isolates the beaches from each other. Indeed, the design of this module is almost entirely dictated on the one hand by the constraints linked to the standardized arrangement of the contact pads, and on the other hand by the need to be able to carry out, at economically profitable costs, the manufacture of the module and its location in the card.
Le dessin du module, et notamment celui des plages de contact, est aussi lié à des critères de fiabilité face aux agressions mécaniques et électriques qu'il doit subir de manière répétée au cours de la vie de la carte.The design of the module, and in particular that of the contact pads, is also linked to criteria of reliability in the face of mechanical and electrical stresses which it must undergo repeatedly during the life of the card.
Ces contraintes ont donc fortement limité les tentatives proposées jusqu'à présent pour modifier la conception et la forme du module.These constraints have therefore greatly limited the attempts proposed so far to modify the design and form of the module.
Il est toutefois connu de graver, sur le module diverses inscriptions telles que par exemple le nom du fabricant de la carte à circuit intégré.However, it is known to engrave on the module various inscriptions such as for example the name of the manufacturer of the integrated circuit card.
Il est également connu du document WO-A-97/01823 un procédé de réalisation d'une carte à circuit intégré dans lequel les plages de contact présentent différents états de surface qui créent des contrastes entre des plages adjacentes.It is also known from document WO-A-97/01823 a method for producing an integrated circuit card in which the contact pads have different surface states which create contrasts between adjacent pads.
Dans tous les cas, les procédés connus jusqu'à présent permettant de décorer ou de personnaliser les cartes à circuit intégré nécessitent tous une étape supplémentaire de décoration. L'invention a donc pour but de proposer un nouveau procédé de réalisation d'une entité décorative sur une carte à circuit intégré qui soit à la fois simple et économique, et qui notamment n'ajoute aucune étape supplémentaire par rapport au procédé normal de fabrication d'une carte démunie de décoration.In all cases, the hitherto known methods for decorating or personalizing integrated circuit cards all require an additional decoration step. The object of the invention is therefore to propose a new method for producing a decorative entity on an integrated circuit card which is both simple and economical, and which in particular does not add any additional step compared to the normal manufacturing method. a poor decoration card.
Dans ce but, l'invention propose un procédé de réalisation d'une carte caractérisé en ce qu'on réalise au moins un motif de ladite entité à l'aide dudit module, par agencement et contraste de la forme desdites plages de contact avec le contour dudit film support.To this end, the invention proposes a method for producing a card, characterized in that one realizes at at least one pattern of said entity using said module, by arrangement and contrast of the shape of said contact pads with the contour of said support film.
Selon d'autres caractéristiques de l'invention : - le contour du film support correspond au moins partiellement au contour de ladite entité.According to other characteristics of the invention: - the contour of the support film corresponds at least partially to the contour of said entity.
- la matière synthétique du film support (16) est au moins en partie translucide.- The synthetic material of the support film (16) is at least partly translucent.
- on dispose au moins un élément fonctionnel sous le film support dont on fait apparaître au moins une partie par transparence à travers le film support.- At least one functional element is placed under the support film, at least a part of which is made transparent through the support film.
- l'élément fonctionnel est choisi parmi de la matière adhésive fixant le module dans ladite cavité, un microcircuit relié aux plages de contact, une matière d'enrobage entourant un microcircuit, un anneau coloré autour de la puce pour délimiter la matière d'enrobage.the functional element is chosen from adhesive material fixing the module in said cavity, a microcircuit connected to the contact pads, a coating material surrounding a microcircuit, a colored ring around the chip to delimit the coating material .
- on réalise un complément de motif de ladite entité par impression sur le corps de carte.- Complement of the pattern of said entity is produced by printing on the card body.
- le film support s'étend au-delà des plages de contact. L'invention concerne aussi une carte à circuit intégré comportant une entité décorative réalisée selon un procédé présentant l'une quelconque des caractéristiques énumérées ci-dessus.the support film extends beyond the contact pads. The invention also relates to an integrated circuit card comprising a decorative entity produced according to a method having any one of the characteristics listed above.
L'invention concerne aussi un module du type comportant au moins une série de plages de contact sur un film support et au moins une partie d'une entité décorative, caractérisé en ce qu'au moins un motif de ladite entité est réalisée par agencement et contraste de la forme desdites plages de contact avec le contour dudit film support. L'invention a comme avantage de conserver la technologie de réalisation de carte à puce traditionnelle tout en respectant les zones de contact normalisées. En particulier, 4 on respecte les règles d'amenées de courant, les règles d'assemblage d'un microcircuit quel que soit sa dimension, les règles d'encartage du module dans la cavité.The invention also relates to a module of the type comprising at least one series of contact pads on a support film and at least part of a decorative entity, characterized in that at least one pattern of said entity is produced by arrangement and contrast of the shape of said contact pads with the contour of said support film. The invention has the advantage of retaining the traditional chip card production technology while respecting the standardized contact areas. In particular, 4 the rules for supplying current are observed, the rules for assembling a microcircuit whatever its size, the rules for inserting the module into the cavity.
En outre, énormément de contrastes peuvent être obtenus à l'aide des différents éléments fonctionnels disposés sous un film support translucide et qui sont disponibles sous des couleurs variées ci-après:In addition, a great deal of contrast can be obtained using the various functional elements arranged under a translucent support film and which are available in various colors below:
- film support diélectrique : marron, noir, jaune, blanc...- dielectric support film: brown, black, yellow, white ...
- métallisations :or, argent, . - matières adhésives : toutes les couleurs- metallizations: gold, silver,. - adhesive materials: all colors
- matière d'enrobage : noir- coating material: black
D'autres caractéristiques et avantages de l'invention apparaîtront à la lecture de la description détaillée qui suit en référence aux dessins annexés dans lesquels : - la figure 1 est une vue en plan d'une carte à circuit intégré selon l'état de la technique comportant d'une part un module et d'autre part une entité décorative imprimée sur le corps support ;Other characteristics and advantages of the invention will appear on reading the detailed description which follows with reference to the appended drawings in which: - Figure 1 is a plan view of an integrated circuit card according to the state of the technique comprising on the one hand a module and on the other hand a decorative entity printed on the support body;
- la figure 2 est une vue en coupe par un plan perpendiculaire au plan de la carte illustrant de manière schématique la structure d'un mode de réalisation d'un module;- Figure 2 is a sectional view through a plane perpendicular to the plane of the card schematically illustrating the structure of an embodiment of a module;
- la figure 3 est une vue en plan illustrant un ruban destiné à la réalisation de module selon la structure de la figure 2, le module étant conforme à l'état de la technique illustré à la figure 1 ;- Figure 3 is a plan view illustrating a ribbon intended for the production of a module according to the structure of Figure 2, the module being in accordance with the state of the art illustrated in Figure 1;
- la figure 4 est une vue similaire à celle de la figure 1 illustrant une carte réalisée selon le procédé de l'invention et présentant une entité décorative qui est dessinée par le contour en vue du module;- Figure 4 is a view similar to that of Figure 1 illustrating a card produced according to the method of the invention and having a decorative entity which is drawn by the outline for the module;
- la figure 5 est une vue similaire à celle de la figure 3 illustrant un ruban destiné à la réalisation de modules conformes aux enseignements de l'invention, avant la découpe des modules ; et- Figure 5 is a view similar to that of Figure 3 illustrating a ribbon intended for the production of modules in accordance with the teachings of the invention, before the modules are cut; and
- la figure 6 est une vue similaire à celle de la figure 5 illustrant en pointillés la ligne de découpe d'un module dans le ruban de la figure 5.FIG. 6 is a view similar to that of FIG. 5 illustrating in dotted lines the cutting line of a module in the ribbon of FIG. 5.
On a illustré sur la figure 1 une carte à circuit intégré 1 0, également appelée carte à puce, réalisée selon l'état de la technique à l'aide d'un procédé connu.Illustrated in FIG. 1 is an integrated circuit card 10, also called a smart card, produced according to the state of the art using a known method.
La carte 10 comporte essentiellement un corps support 12 notamment de forme rectangulaire et par exemple au format d'une carte de crédit.The card 10 essentially comprises a support body 12 in particular of rectangular shape and for example in the format of a credit card.
Le corps 12 porte un module 14 et il est par ailleurs décoré par une entité décorative 15 qui est par exemple imprimée sur la face supérieure du corps support 12. On a illustré sur la figure 2 de manière plus précise un mode connu de réalisation d'un module 14.The body 12 carries a module 14 and it is moreover decorated by a decorative entity 15 which is for example printed on the upper face of the support body 12. FIG. 2 illustrates more precisely a known embodiment of a module 14.
Le module 14 comporte tout d'abord un film support 16 qui est réalisé en matière isolante, par exemple en époxy ou en polyimide ou en polyéthylène téréphtalate (PET). Une face supérieure 18 du film support 16 est recouverte d'une couche conductrice qui est réalisée généralement en matériau métallique et qui est destinée à former des plages de contact 20 visibles sur la figure 1 .The module 14 firstly comprises a support film 16 which is made of insulating material, for example epoxy or polyimide or polyethylene terephthalate (PET). An upper face 18 of the support film 16 is covered with a conductive layer which is generally made of metallic material and which is intended to form contact pads 20 visible in FIG. 1.
Les plages de contact 20 sont réalisées en gravant la couche métallique de manière à délimiter entre chaque plage des interstices qui permettent d'isoler électriquement les plages l'une de l'autre. Suivant les techniques de fabrication, la couche métallique peut d'abord être gravée ou perforée mécaniquement de manière à former les plages de contact 20, puis être ensuite apposée sur la face supérieure 18 du film 16. Au contraire, on peut prévoir que le gravage des plages de contact 20 ne soit réalisé qu'après le dépôt de la couche métallique sur le film support 16, le gravage pouvant alors être effectué par exemple par un procédé électrochimique.The contact pads 20 are produced by etching the metal layer so as to define between each pad gaps which allow the pads to be electrically isolated from one another. According to the manufacturing techniques, the metal layer can first be engraved or perforated mechanically so as to form the contact pads 20, then be then affixed to the upper face 18 of the film 16. On the contrary, it can be provided that the engraving contact pads 20 is only realized after the deposition of the layer metal on the support film 16, the etching can then be carried out for example by an electrochemical process.
Sur une face inférieure 22 du film support 16 on agence un microcircuit électronique 24 également appelé circuit intégré ou puce électronique. Le microcircuit 24 est destiné à être relié électriquement aux plages de contact 20 par des fils de liaison 26 qui s'étendent au travers de trous 28 aménagés dans le film support 16 de manière à ce que les fils 26 puissent être raccordés à une face inférieure de la couche métallique formant les plages de contact 20.On an underside 22 of the support film 16 an electronic microcircuit 24 also called an integrated circuit or electronic chip is arranged. The microcircuit 24 is intended to be electrically connected to the contact pads 20 by connection wires 26 which extend through holes 28 arranged in the support film 16 so that the wires 26 can be connected to a lower face of the metal layer forming the contact pads 20.
Afin de protéger le microcircuit 24 et les fils de liaison 26, la face inférieure 22 du film support est recouverte, au moins au niveau du microcircuit 24 et des fils 26, par une résine synthétique de protection 30. Le module 14 est donc pour l'essentiel constitué par le film support 16, les plages de contact 20, le microcircuit 24, les fils de liaison 26 et la résine de protection 30.In order to protect the microcircuit 24 and the connecting wires 26, the lower face 22 of the support film is covered, at least at the level of the microcircuit 24 and the wires 26, by a synthetic protective resin 30. The module 14 is therefore for the essential consisting of the support film 16, the contact pads 20, the microcircuit 24, the connecting wires 26 and the protective resin 30.
Ce module 14 est destiné à être reçu dans une cavité 32 aménagée dans une face supérieure 34 du corps support 12 de la carte 10.This module 14 is intended to be received in a cavity 32 arranged in an upper face 34 of the support body 12 of the card 10.
La cavité 32 est par exemple une cavité étagée comportant un compartiment central 36 de profondeur importante dans lequel est reçue la résine de protection 30 du microcircuit ou puce électronique 14. Dans une portion périphérique 38, la cavité 32 présente une profondeur sensiblement égale à l'épaisseur cumulée du film support 16 et de la couche métallique formant les plages de contact 20. La fixation du module 14 dans la cavité 32 est généralement effectuée par collage du film support 16 sur le fond de la portion périphérique 38 de la cavité 32 avec une matière adhésive (45), c'est-à-dire que le module 14 est fixé dans la cavité 32 par son contour périphérique. 7The cavity 32 is for example a stepped cavity comprising a central compartment 36 of significant depth in which is received the protective resin 30 of the microcircuit or electronic chip 14. In a peripheral portion 38, the cavity 32 has a depth substantially equal to the cumulative thickness of the support film 16 and of the metal layer forming the contact pads 20. The fixing of the module 14 in the cavity 32 is generally carried out by bonding the support film 16 to the bottom of the peripheral portion 38 of the cavity 32 with a adhesive material (45), that is to say that the module 14 is fixed in the cavity 32 by its peripheral contour. 7
Grâce à cette disposition, on peut voir que les plages de contact 20 affleurent sensiblement au même niveau que la face supérieure 34 de la carte.Thanks to this arrangement, it can be seen that the contact pads 20 are exposed substantially at the same level as the upper face 34 of the card.
Comme on peut le voir sur la figure 3, la couche métallique est généralement produite sous la forme d'un ruban continu qui, au moins pour certains procédés de fabrication, est portée par un ruban continu de film support 16. Le ruban métallique est gravé de manière à former, à intervalles réguliers le long du ruban, des groupes de plages de contact qui ont vocation à former un module. Dans l'exemple de réalisation de la figure 3, qui illustre un ruban pour la production de modules selon l'état de la technique, le ruban métallique comporte deux modules sur la largeur du ruban.As can be seen in FIG. 3, the metallic layer is generally produced in the form of a continuous ribbon which, at least for certain manufacturing processes, is carried by a continuous ribbon of support film 16. The metallic ribbon is etched so as to form, at regular intervals along the strip, groups of contact pads which are intended to form a module. In the exemplary embodiment of FIG. 3, which illustrates a ribbon for the production of modules according to the prior art, the metallic ribbon comprises two modules over the width of the ribbon.
Le ruban métallique comporte aussi deux rails latéraux 40 qui s'étendent sur toute la longueur du ruban, de part et d'autre transversalement des groupes de plages de contact.The metal strip also has two lateral rails 40 which extend over the entire length of the strip, on either side of the groups of contact pads.
Les plages de contact 20 sont toutes reliées aux rails latéraux 40 par des bras d'amené de courant 42 qui permettent par exemple d'effectuer des dépôts électrochimiques sur l'ensemble du ruban métallique. Lorsque le gravage du ruban est effectué avant son apposition sur le film support, les bras d'amené de courant 42 servent aussi à la liaison mécanique de chacune des plages avec les rails 40.The contact pads 20 are all connected to the lateral rails 40 by current supply arms 42 which allow, for example, to carry out electrochemical deposits on the entire metal strip. When the ribbon is etched before it is affixed to the support film, the current supply arms 42 also serve for the mechanical connection of each of the pads with the rails 40.
On a illustré sur la figure 4 une carte 10 qui, conformément aux enseignements de l'invention, comporte un module 14 dont les plages de contact 20 et le film support 16 sont adaptés de telle manière que, tout en respectant les zones normalisées de contact, le contour du module 14 et son aspect extérieur une fois encarté dessinent une entité décorative, en l'occurrence la même que celle qui était réalisée par impression sur la carte de la figure 1 . 8FIG. 4 illustrates a card 10 which, in accordance with the teachings of the invention, comprises a module 14 whose contact pads 20 and the support film 16 are adapted in such a way that, while respecting the standardized contact zones , the outline of the module 14 and its external appearance once inserted draw a decorative entity, in this case the same as that which was produced by printing on the card of FIG. 1. 8
Comme on peut le voir sur la figure 5, sur laquelle on a représenté en pointillés les zones de contact normalisées pour un module à 6 contacts, on peut voir que les plages de contact présentent une forme qui a été adaptée à celle de l'entité décorative.As can be seen in FIG. 5, in which the standardized contact areas have been shown in dotted lines for a 6-contact module, it can be seen that the contact pads have a shape which has been adapted to that of the entity decorative.
Dans l'exemple de réalisation qui est illustré sur les figures 4 à 6, on peut voir que le module 14 comporte des plages de contact 44 en plus des 6 plages qui sont destinées à être réellement reliées au microcircuit. Ces plages 44, qui n'ont donc pas d'utilité fonctionnelle, présentent malgré tout les mêmes caractéristiques que celles qui sont effectivement reliées au microcircuit 24, du fait que les deux types 20, 44 de plages de contact sont réalisés simultanément selon le même procédé de fabrication. Les plages 44 qui ne sont pas fonctionnelles pourront bien entendu adopter un contour quelconque, à la seule condition de respecter les limites dues aux contraintes de fabrication, et notamment celles concernant le gravage du ruban métallique.In the embodiment which is illustrated in FIGS. 4 to 6, it can be seen that the module 14 includes contact pads 44 in addition to the 6 pads which are intended to be actually connected to the microcircuit. These pads 44, which therefore have no functional utility, nevertheless have the same characteristics as those which are effectively connected to the microcircuit 24, owing to the fact that the two types 20, 44 of contact pads are produced simultaneously according to the same manufacturing process. The pads 44 which are not functional can of course adopt any contour, on the sole condition of respecting the limits due to manufacturing constraints, and in particular those relating to the engraving of the metal strip.
Comme on peut le voir sur la figure 6, le module selon l'invention se distingue par le fait que le contour externe du film support 16, qui est représenté en pointillés sur la figure 6, diffère de celui des plages de contact de telle sorte que lorsque le module est introduit dans la cavité de la carte, le film support 16 n'est pas seulement visible au niveau des interstices qui séparent les plages de contact, mais aussi autour du contour externe des plages de contact.As can be seen in FIG. 6, the module according to the invention is distinguished by the fact that the external contour of the support film 16, which is shown in dotted lines in FIG. 6, differs from that of the contact pads so that that when the module is inserted into the cavity of the card, the support film 16 is not only visible at the level of the interstices which separate the contact pads, but also around the external contour of the contact pads.
Or, le matériau constituant le film support peut être coloré, par exemple en noir mais aussi en d'autres couleurs, de telle sorte que le module une fois encarté présente un contraste de couleurs, par rapport aux plages de contact mais aussi par rapport au matériau du corps de carte, ce qui augmente le caractère esthétique de l'entité décorative. Le matériau du film 16 peut aussi être partiellement translucide de manière à obtenir une composition de couleurs par exemple avec le matériau du corps support 12 ou avec la résine de protection 30 qui se trouvent en dessous de lui. De même, les plages de contact peuvent être recouvertes d'un matériau qui, tout en ayant des caractéristiques électriques et mécaniques compatibles avec la fonction de ces plages, peut être d'une couleur ou d'un aspect particulier. Ainsi, en choisissant des contours adaptés pour le film support 16 et pour les plages de contact 20, 44, on peut dessiner sur la surface apparente du module 14, tout en respectant les zones de contact normalisées, un motif décoratif qui peut être figuratif ou abstrait. Bien entendu, la forme de la cavité 32 aménagée dans le corps support de carte 12 doit être adaptée, notamment pour sa partie périphérique 38, en fonction du contour du film support 16 du module 14.However, the material constituting the support film can be colored, for example black but also in other colors, so that the module once inserted has a color contrast, compared to the contact areas but also compared to the material of the card body, which increases the aesthetic character of the decorative entity. The film material 16 can also be partially translucent so as to obtain a composition of colors for example with the material of the support body 12 or with the protective resin 30 which are located below it. Likewise, the contact pads can be covered with a material which, while having electrical and mechanical characteristics compatible with the function of these pads, can be of a particular color or appearance. Thus, by choosing suitable contours for the support film 16 and for the contact pads 20, 44, it is possible to draw on the apparent surface of the module 14, while respecting the standardized contact areas, a decorative pattern which can be figurative or abstract. Of course, the shape of the cavity 32 arranged in the card support body 12 must be adapted, in particular for its peripheral part 38, as a function of the contour of the support film 16 of the module 14.
Comme on peut le voir en comparant les figures 3 et 5, la modification de la forme des plages de contact du module oblige à modifier le cheminement et la taille des bras d'amené de courant 42. En effet, la taille de chaque bras d'amené de courant est liée par exemple à la surface unitaire de la plage de contact 20 à laquelle il est relié. De même, les cheminements des bras d'amené de courant 42 ne doivent pas se recouper, et il est préférable qu'ils ne traversent pas une zone du ruban de film support qui sera ultérieurement découpée pour former le film support 16 du module. Dans cet exemple de réalisation de l'invention qui est illustré sur les figures 5 et 6, certains des bras d'amené de courant 42 relient des plages de contact appartenant à des groupes différents, c'est-à-dire destinées à appartenir à des modules différents. Ainsi, l'invention propose un nouveau procédé de réalisation d'une entité décorative qui n'apporte quasiment aucun surcoût par rapport à un procédé classique de réalisation d'une carte à circuit intégré ne comportant aucune décoration. L'entité inventive qui est dessinée par le module illustré à la figure 4 n'est pas limitative, le procédé selon l'invention permettant de réaliser des modules présentant divers contours, et divers motifs à l'intérieur de ce contour.As can be seen by comparing FIGS. 3 and 5, the modification of the shape of the contact pads of the module means that the path and the size of the current supply arms 42 have to be modified. Indeed, the size of each arm d The current supply is linked, for example, to the unit surface of the contact pad 20 to which it is connected. Likewise, the paths of the current supply arms 42 must not overlap, and it is preferable that they do not cross an area of the support film strip which will later be cut to form the support film 16 of the module. In this exemplary embodiment of the invention which is illustrated in FIGS. 5 and 6, some of the current supply arms 42 connect contact pads belonging to different groups, that is to say intended to belong to different modules. Thus, the invention proposes a new method of producing a decorative entity which brings almost no additional cost compared to a conventional method of producing an integrated circuit card comprising no decoration. The inventive unit which is drawn by the module illustrated in FIG. 4 is not limiting, the method according to the invention making it possible to produce modules having various contours, and various patterns inside this contour.
En variante, la matière synthétique du film support (16) est au moins en partie translucide. Ainsi on peut faire apparaître par transparence à travers le film support au moins une partie d'un élément fonctionnel sous le film support.As a variant, the synthetic material of the support film (16) is at least partly translucent. Thus, at least part of a functional element can be made transparent through the support film under the support film.
L'élément fonctionnel visible par transparence à travers le film support est de préférence tout élément nécessaire au procédé de fabrication du module et de la carte, par exemple, la puce ou microcircuit, l'enrobage de protection, une matière adhésive, un anneau coloré autour de la puce pour délimiter la matière d'enrobage etc.The functional element visible through transparency through the support film is preferably any element necessary for the manufacturing process of the module and of the card, for example, the chip or microcircuit, the protective coating, an adhesive material, a colored ring. around the chip to delimit the coating material etc.
L'élément peut également être ajouté uniquement pour participer à la définition du motif. The element can also be added only to participate in the definition of the pattern.

Claims

REVEND ICATIONS RESELL ICATIONS
1 . Procédé de réalisation d'une entité décorative sur une carte du type comportant un corps de carte (12) muni d'au moins une cavité et un module (14) disposé dans ladite cavité (14), ledit module comportant au moins une série de plages de contact (20) sur un film support (16), caractérisé en ce qu'on réalise au moins un motif de ladite entité à l'aide dudit module, par agencement et contraste de la forme desdites plages de contact avec le contour dudit film support.1. Method for producing a decorative entity on a card of the type comprising a card body (12) provided with at least one cavity and a module (14) disposed in said cavity (14), said module comprising at least one series of contact pads (20) on a support film (16), characterized in that at least one pattern of said entity is produced using said module, by arrangement and contrast of the shape of said contact pads with the outline of said support film.
2. Procédé selon la revendication 1 ou 2, caractérisé en ce que le contour du film support correspond au moins partiellement au contour de ladite entité.2. Method according to claim 1 or 2, characterized in that the contour of the support film corresponds at least partially to the contour of said entity.
3. Procédé selon l'une des revendications 1 à 3, caractérisé en ce que la matière synthétique du film support3. Method according to one of claims 1 to 3, characterized in that the synthetic material of the support film
(16) est au moins en partie translucide.(16) is at least partly translucent.
4. Procédé selon la revendication 3, caractérisé en ce que l'on dispose au moins un élément fonctionnel sous le film support dont on fait apparaître au moins une partie par transparence à travers le film support.4. Method according to claim 3, characterized in that there is at least one functional element under the support film of which at least a part is made to appear by transparency through the support film.
5. Procédé selon la revendication 4, caractérisé en ce que l'élément fonctionnel est choisi parmi de la matière adhésive fixant le module dans ladite cavité, un microcircuit relié aux plages de contact, une matière d'enrobage entourant un microcircuit, un anneau coloré autour de la puce pour délimiter la matière d'enrobage.5. Method according to claim 4, characterized in that the functional element is chosen from adhesive material fixing the module in said cavity, a microcircuit connected to the contact pads, a coating material surrounding a microcircuit, a colored ring around the chip to delimit the coating material.
6. Procédé selon l'une des revendications précédentes caractérisé en ce que l'on réalise un complément de motif de ladite entité par impression sur le corps de carte. 6. Method according to one of the preceding claims characterized in that a complementary pattern is made of said entity by printing on the card body.
7. Procédé selon l'une des revendications précédentes caractérisé en ce que le film support s'étend au-delà des plages de contact. 7. Method according to one of the preceding claims characterized in that the support film extends beyond the contact pads.
8. Carte à circuit intégré, caractérisée en ce qu'elle comporte une entité décorative réalisée selon un procédé conforme à l'une quelconque des revendications précédentes.8. Integrated circuit card, characterized in that it comprises a decorative entity produced according to a process according to any one of the preceding claims.
9. Module pour carte du type comportant un corps de carte (12) muni d'au moins une cavité, ledit module étant du type comportant au moins une série de plages de contact (20) normalisées sur un film support (16) et au moins une partie d'une entité décorative, caractérisé en ce qu'au moins un motif de ladite entité est réalisé par agencement et contraste de la forme desdites plages de contact avec le contour dudit film support. 9. Module for a card of the type comprising a card body (12) provided with at least one cavity, said module being of the type comprising at least one series of contact pads (20) standardized on a support film (16) and at at least part of a decorative entity, characterized in that at least one pattern of said entity is produced by arrangement and contrast of the shape of said areas of contact with the contour of said support film.
PCT/FR1999/000705 1998-04-17 1999-03-26 Method for producing a decorative item on an integrated circuit card WO1999054845A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
AU30390/99A AU3039099A (en) 1998-04-17 1999-03-26 Method for producing a decorative item on an integrated circuit card
EP99911849A EP1073997A1 (en) 1998-04-17 1999-03-26 Method for producing a decorative item on an integrated circuit card

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9805267A FR2777506B1 (en) 1998-04-17 1998-04-17 METHOD FOR PRODUCING A DECORATIVE ENTITY ON AN INTEGRATED CIRCUIT TYPE CARD
FR98/05267 1998-04-17

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AU (1) AU3039099A (en)
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Publication number Priority date Publication date Assignee Title
EP2720175A1 (en) * 2012-10-09 2014-04-16 Gemalto SA Electronic module, device with electronic module and manufacturing method.
FR3040516B1 (en) 2015-08-27 2017-09-15 Linxens Holding METHOD FOR MANUFACTURING AN ELECTRIC CIRCUIT, ELECTRIC CIRCUIT OBTAINED BY THIS METHOD AND CHIP CARD COMPRISING SUCH AN ELECTRICAL CIRCUIT
EP3889839A1 (en) 2020-03-31 2021-10-06 Thales Dis France Sa Method for optimised graphic customisation of smart card modules and module obtained
FR3110734B1 (en) * 2020-05-20 2022-07-29 Smart Packaging Solutions Electronic module for smart card with security patterns

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US5552574A (en) * 1992-08-26 1996-09-03 Gemplus Card International Method for the marking of a connector of a chip card with a laser beam
US5708545A (en) * 1992-07-23 1998-01-13 Deutsche Thomson-Brandt Gmbh Recording device with electrical contacts
DE19630049A1 (en) * 1996-07-25 1998-01-29 Siemens Ag Chip card with a contact zone and method for producing such a contact zone

Patent Citations (3)

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Publication number Priority date Publication date Assignee Title
US5708545A (en) * 1992-07-23 1998-01-13 Deutsche Thomson-Brandt Gmbh Recording device with electrical contacts
US5552574A (en) * 1992-08-26 1996-09-03 Gemplus Card International Method for the marking of a connector of a chip card with a laser beam
DE19630049A1 (en) * 1996-07-25 1998-01-29 Siemens Ag Chip card with a contact zone and method for producing such a contact zone

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EP1073997A1 (en) 2001-02-07
AU3039099A (en) 1999-11-08
FR2777506A1 (en) 1999-10-22
FR2777506B1 (en) 2000-06-30

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