WO1999025783A1 - Procede permettant d'assembler des pieces microstructurees en matiere plastique et composant obtenu selon ce procede - Google Patents

Procede permettant d'assembler des pieces microstructurees en matiere plastique et composant obtenu selon ce procede Download PDF

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Publication number
WO1999025783A1
WO1999025783A1 PCT/EP1998/007178 EP9807178W WO9925783A1 WO 1999025783 A1 WO1999025783 A1 WO 1999025783A1 EP 9807178 W EP9807178 W EP 9807178W WO 9925783 A1 WO9925783 A1 WO 9925783A1
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WO
WIPO (PCT)
Prior art keywords
microstructures
workpiece
plastic
workpieces
cavities
Prior art date
Application number
PCT/EP1998/007178
Other languages
German (de)
English (en)
Inventor
Raoul Bader
Petra Jacob
Peter Volk
Holger Moritz
Original Assignee
INSTITUT FüR MIKROTECHNIK MAINZ GMBH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by INSTITUT FüR MIKROTECHNIK MAINZ GMBH filed Critical INSTITUT FüR MIKROTECHNIK MAINZ GMBH
Priority to EP98955563A priority Critical patent/EP1030896A1/fr
Publication of WO1999025783A1 publication Critical patent/WO1999025783A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/32—Measures for keeping the burr form under control; Avoiding burr formation; Shaping the burr
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4895—Solvent bonding, i.e. the surfaces of the parts to be joined being treated with solvents, swelling or softening agents, without adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
    • B29C66/54—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
    • B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
    • B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/737—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the state of the material of the parts to be joined
    • B29C66/7379—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the state of the material of the parts to be joined degradable
    • B29C66/73793—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the state of the material of the parts to be joined degradable soluble, e.g. water-soluble
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/756—Microarticles, nanoarticles

Definitions

  • the invention relates to a method for connecting two workpieces, of which at least the first workpiece has microstructures made of plastic with the smallest structural dimensions ⁇ 1 mm on the surface to be connected. Furthermore, the invention relates to a component comprising at least two interconnected bodies, of which at least one body has microstructures made of plastic with the smallest structural dimensions ⁇ 1 mm on the surface connected to the other body.
  • Methods for connecting workpieces made of plastic are used in all areas of technology. Particularly in the field of biotechnology, for example for reaction and analysis systems, as well as hydraulics and pneumatics, miniaturized fluidic systems made of plastic are increasingly required. For this purpose, micro structures that are open to one side are molded in plastic. To form closed fluidic systems, the surface of these plastic bodies, such as webs, grooves or channel-like recesses, is covered with a thin plastic film or connected to other structured plastic bodies.
  • M.A. Roberts et. al. (Anal. 69, 1997, 2035-2042) describe the production of miniaturized analysis systems with channels for liquids. For this purpose, a film with an upper layer made of polyethylene terephthalate and a lower thin layer made of polyethylene is laminated onto a microstructured plastic body at 125 ° C.
  • R. M. McCormick et. al. (Anal. Chem. 69, 1997, 2626-2630) describe the production of injection molded plastic chips with microchannels for the electrophoresis of DNA. The microchannels are formed by laminating a plastic cover film onto the grooved plastic body. When laminating, a temperature of 105 ° C is applied over 5 minutes.
  • the object of the invention is to provide a method for connecting two workpieces, of which at least the first workpiece has microstructures made of plastic with the smallest structural dimensions ⁇ 1 mm on the surface to be connected, in which the workpiece does not have any have to be exposed to elevated temperatures, and this allows cost-effective mass production. Furthermore, it is an object of the invention to provide at least two components comprising components, of which at least one component has plastic microstructures with the smallest structural dimensions ⁇ 1 on the surface connected to the other component mm
  • an organic solvent or a mixture of organic solvents is applied between the workpieces to be joined, at least one of the solvents being able to dissolve the plastic of the surface to be joined at least one workpiece.
  • the two workpieces are brought into connection with one another in such a way that the majority of the between the Structural cavities are in connection with the environment. It is entirely sufficient if cavities are not open to the environment, but via other cavities, for example channels. This avoids the formation of cavities that are closed off from the environment Structures of the first workpiece are not completely covered by the second workpiece, and / or that one or both of the workpieces have holes or breakthroughs connecting the structures with the environment.
  • the solvent remaining between the microstructures can be quickly removed by applying a negative pressure diffuses the solvent or solvents from areas between the contact surfaces not only through the Outside edges of the components, but also into the environment via the cavities formed by the structures.
  • the vacuum is applied in such a way that the pressure in the vicinity of the two workpieces is reduced.
  • the workpieces brought into contact with one another are transferred to a vacuum chamber and the pressure in the chamber is reduced after a short dwell time.
  • the time within which the solvent is sufficiently removed with a view to sufficient strength to maintain the microstructures can be influenced by the choice of the level of the pressure and the solvent or the solvent mixture.
  • the negative pressure is applied to cavities located between the microstructures and connected to the environment in such a way that the pressure in these cavities is reduced compared to the pressure in the environment of the two workpieces.
  • an opening of the two workpieces connected to the cavities is connected in a pressure-tight manner with a vacuum device. If necessary, further openings connected to the cavities are to be closed in a pressure-tight manner or likewise to be connected to the vacuum device.
  • the pressure within the cavities can thus be reduced in a targeted manner and the solvent can thus be removed. Due to the difference between the ambient pressure and the pressure within the cavities, both workpieces are pressed closer together. This can help to compensate for deviations from a uniform structural height of the first workpiece, for example when using a plastic film as the second workpiece.
  • this joining process can easily be automated, which means that microstructured plastic bodies can be joined together in large quantities.
  • the pressure is advantageously reduced below the vapor pressure of the lowest-boiling solvent, particularly advantageously below the vapor pressure of the highest-boiling solvent.
  • the negative pressure is applied to cavities located between the microstructures, which are connected to the environment via at least two openings, in such a way that air is sucked through these cavities.
  • at least one opening of the two workpieces connected to the cavities is connected to a vacuum device.
  • the two workpieces have at least one second opening which communicates with the same cavities.
  • this opening is not closed pressure-tight or connected to the vacuum device, but remains open to the environment.
  • This embodiment also ensures rapid removal of the solvent, the workpieces having as few cavities as possible in which the solvent is not suctioned off, so-called dead zones.
  • the two workpieces are pressed closer together, as in the second embodiment.
  • the method according to the invention is particularly advantageously suitable for workpieces which have microstructures made of plastic with the smallest structural dimensions ⁇ 500 ⁇ m on the surface to be connected.
  • the method is also suitable for structures in the lower micrometer range and submicrometer range.
  • At least one workpiece has a plastic on the surface to be joined, which can be dissolved with one or more organic solvents.
  • This method is particularly suitable for joining thermoplastics of sufficient solubility, such as polymethyl methacrylate (PMMA), polycarbonates (PC), polystyrene (PS), polyoxymethylene (POM), polyether ether ketone (PEEK), polysulfone (PSU), polybutylene terephthalate (PBT), Polyethylene terephthalate (PET), polyvinylidene fluoride (PVDF), cycloolefin polymers (COP), copolymers based on cycloolefins and ethylene (COC) or copolymers based on acrylonitrile, butadiene and styrene (ABS).
  • PMMA polymethyl methacrylate
  • PC polycarbonates
  • PS polystyrene
  • POM polyoxymethylene
  • PEEK polyether ether ketone
  • PSU poly
  • the second workpiece which can also have microstructures, advantageously also consists of a plastic, for example a plastic film.
  • a plastic for example a plastic film.
  • glass or quartz glass for example, is also suitable as the material of the second workpiece.
  • the second workpiece can also have one or more other materials on the surface to be connected.
  • Suitable solvents are able to dissolve the plastic of the surface to be joined on at least one workpiece.
  • polar solvents are more suitable for dissolving polar plastics, and solvents of low polarity are more suitable for dissolving non-polar plastics. Therefore, depending on the plastic used, one or more solvents from the group of the low molecular weight (C1-C-10) saturated or unsaturated linear, branched or cyclic, optionally substituted alkanes, alcohols, ethers, esters, aldehydes, ketones, N, N-dialkylamides, aromatic compounds or mixtures thereof.
  • Suitable substituents are, for example, halogens, such as fluorine or chlorine.
  • solvents from the above group are dichloromethane, trichloromethane, trichlorethylene, hexane, heptane, octane, nonane, decane, decahydronaphthalene, methanol, ethanol, propanol, hexafluoropropanol, butanol, pentanol, hexanol, di-n-butyl ether, tert-butyl methyl ether, Tetrahydrofuran, methyl, ethyl, propyl, butyl or pentyl acetate, acetone, hexafluoroacetone hydrates, methyl ethyl ketone, methyl isobutyl ketone, cyclopentanone, cyclohexanone, N, N-dimethylformamide, N, N-dimethylacetamide, toluene or xylene.
  • Mixtures of at least two solvents are advantageous, the first of which dissolves the plastic in question well and the second solvent has less good dissolving properties.
  • the second solvent particularly advantageously has a higher vapor pressure than the first solvent.
  • a suitable mixing ratio of the solvents for the plastic in question is characterized in that good connection results are obtained while maintaining sensitive structures, i. H. without the microstructures being damaged in the specified dwell time. Therefore, the choice of solvents and the optimization of the mixing ratio have to be made not only with regard to the plastics, but also to the respective microstructures.
  • the workpieces can be brought into contact by placing them on top of one another or pressing them together. This is advantageously done at temperatures between 10 ° C and 40 ° C.
  • residence times of different lengths are required before the application of a vacuum to remove the solvents. Residence times of ⁇ 1 hour, in particular ⁇ 10 minutes, have proven to be advantageous. Long dwell times can damage sensitive structures. After the dwell time has elapsed, the vacuum is applied to remove the solvents. Because the majority of the voids between the microstructures are connected to the environment, solvent in the microstructures is quickly removed by lowering the pressure. Since no additives, such as polymers, are added to the solvent, no solids remain in the structures.
  • the solvents get from the area of the contact surfaces into the environment.
  • the contact time of the workpieces connected to one another when the vacuum is applied should at least be such that the solvents are removed to such an extent that an adequate quality of the connection is ensured.
  • plastic bodies can be connected to one another quickly and thus inexpensively while maintaining microstructured surfaces. Since elevated temperatures are not necessarily used, this method can also be used for structures with biologically active material, depending on the choice of solvent.
  • the invention also relates to components which comprise at least two bodies connected to one another, of which at least one body has microstructures made of plastic with the smallest structural dimensions ⁇ 1 mm on the surface connected to the other body.
  • the bodies are connected with the method according to the invention, the majority of the cavities lying between the structures being connected to the environment.
  • Such components particularly advantageously have microstructures for storing, passing through, dosing, mixing, separating, exchanging heat, chemical conversion and / or detection of at least one substance.
  • Passive structures are, for example, channel-like recesses with mixing and / or reaction spaces connected to inlets and outlets for fluid supply and discharge.
  • Active structures can be sensors, for example for measuring conductivity, or micro valves.
  • the substance is advantageously a gas or a liquid or the substance, in particular biomolecules, is dissolved in a liquid.
  • An example of such a component is a plastic plate which has grooves running parallel to one another, the grooves each having an electrode at their end regions. With the method according to the invention, a thin plastic film is applied to the plastic plate, which covers the grooves except for openings in the electrode area.
  • Such a component is used in capillary electrophoresis for the separation of DNA or protein fragments.
  • a large number of miniaturized cavities can be provided for storing substances, for example substance libraries in combinatorial chemistry.
  • substances for example substance libraries in combinatorial chemistry.
  • such a component can have openings connected to channels.
  • Surfaces of the microstructures can be functionalized for the separation or / and detection of biomolecules.
  • the component or areas thereof can consist of an optically transparent plastic.
  • surfaces or cavities can have catalytically active material.
  • Suitable solvents were pure butyl acetate, mixtures of butyl acetate and 1-propanol in ratios of up to 3: 5, butyl acetate and 1-hexanol in a ratio of 1: 1, and pentyl acetate and 1-hexanol in a ratio of 2: 1.
  • the respective solvent mixture was introduced with a pipette and the two parts were brought into contact for about 1 to 3 minutes.
  • the ambient pressure for approximately 10 of the compound of plates is for connecting circuit boards with foils min lowered mbar to 10 "4. In the case of one another, longer contact times have to proved to several hours at reduced ambient pressure to be advantageous.
  • the second and third embodiment according to which the negative pressure is applied specifically to the cavities, without lowering the ambient pressure, for the connection.
  • a PMMA plate with 4 ⁇ m wide grooves spaced a few ⁇ m apart was connected with a 125 ⁇ m thick PMMA film.
  • a mixture of butyl acetate and 1-propanol in a ratio of 1: 2 was used under the same test conditions as in Example 1.
  • a PMMA plate which had a 27 cm long, meandering groove with a width of 80 to 200 ⁇ m and a depth of 80 ⁇ m, the grooves being separated from one another by webs with a width of 80 to 200 ⁇ m, was used with a 125 ⁇ m thick PMMA film with the same solvent mixture and under the same test conditions as in Example 2.
  • the second and the third embodiment of the method according to the invention prove to be very advantageous here due to the long channel.
  • Polycarbonate Lithane HF110R from General Electric Plastics
  • Mixtures of butyl acetate and methanol and butyl acetate and 1-propanol each in a ratio of 1 1 and cyclopentanone and 1-propanol in a ratio of 2 3 were suitable for this purpose under the conditions described for Example 1
  • microstructured plates (20 x 20 x 2 mm) made of polysulfone (Ultrason brand, type S1010 from BASF) were joined using acetone as solvent and adhering to the test conditions of Example 1. Mixtures of cyclohexanone and n-butyl ether were also successfully used
  • the second film was positioned on the first film so that the two ends of the channel were open to the environment.
  • the solvent was removed by vacuum suction.
  • the interconnected plates and foils were examined in an optical microscope in the empty state and filled with an aqueous dye solution. In all of the experiments, the interconnected areas proved to be homogeneous. Cracks and enclosed bubbles could not be observed.
  • the microstructures were preserved and the intermediate webs lying between the grooves were completely connected to the applied plate or film, so that the channels filled with the dye solution were completely separated from one another by the intact intermediate webs.
  • the workpieces connected to one another according to Examples 1 to 3 and 6 to 8 could only be separated from one another by destroying the structures.
  • the plates bonded according to Examples 4, 5, 9 and 10 adhered less strongly, in which the structures were retained after separation, but the connecting surfaces of which showed significant damage.
  • Figure 1 shows the recording of a component according to the invention, which comprises a grooved plastic chip made of PMMA with a size of about 2 cm x 2 cm, on the surface of which a PMMA film with a thickness of 125 ⁇ m was applied by the method according to the invention.
  • Butyl acetate and 1-propanol in a ratio of 1: 1 were used as the solvent mixture used and the test conditions for Example 1 were met.
  • channels were formed on the microstructured surface of the plastic chip, which channels were connected to the surroundings from the edge area.
  • the channels were filled with an aqueous dye solution, which can be seen here as darker areas.
  • the unfilled areas that is to say the webs delimiting the channels, which were connected to the film above, can be seen as light lines.
  • connection points (light lines) between the plastic chip and the film are completely formed and homogeneous. No cracks or bubbles can be seen at the connection points.
  • the method according to the invention is therefore particularly suitable for realizing miniaturized fluidic systems, for example for biotechnological applications.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

L'invention concerne un procédé permettant d'assembler deux pièces dont la première au moins présente, sur sa face d'assemblage, des microstructures en matière plastique dont les plus petites sont < 1 mm. Selon cette invention, les microstructures ne sont pas exposées à des températures élevées. La première étape consiste à appliquer entre les pièces à assembler au moins un solvant organique apte à dissoudre la matière plastique des surfaces à assembler. La deuxième étape consiste à mettre en contact les pièces de telle façon que le plus grand nombre des zones situées entre les structures soient reliées à l'environnement, c'est-à-dire qu'aucune cavité fermée de l'environnement ne se forme. Après un court temps de fixation, la troisième étape consiste à appliquer une pression négative afin d'enlever rapidement le solvant. Ce procédé convient particulièrement à la réalisation de systèmes fluidiques miniaturisés destinés aux applications biotechnologiques. En outre, l'invention concerne des composants obtenus selon ce procédé.
PCT/EP1998/007178 1997-11-14 1998-11-10 Procede permettant d'assembler des pieces microstructurees en matiere plastique et composant obtenu selon ce procede WO1999025783A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP98955563A EP1030896A1 (fr) 1997-11-14 1998-11-10 Procede permettant d'assembler des pieces microstructurees en matiere plastique et composant obtenu selon ce procede

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19750374.8 1997-11-14
DE19750374 1997-11-14

Publications (1)

Publication Number Publication Date
WO1999025783A1 true WO1999025783A1 (fr) 1999-05-27

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Country Link
EP (1) EP1030896A1 (fr)
DE (1) DE19851644B4 (fr)
WO (1) WO1999025783A1 (fr)

Cited By (1)

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EP1697745A1 (fr) * 2003-12-18 2006-09-06 DIGITAL BIO TECHNOLOGY Seoul National University Institute of Advance Procede de metallisation d'une microplaquette en plastique

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DE19945604A1 (de) 1999-09-23 2003-08-07 Aclara Biosciences Inc Verfahren zur Verbindung von Werkstücken aus Kunststoff und seine Verwendung in der Mikro- und Nanostrukturtechnik
DE10130428B4 (de) 2001-06-23 2005-12-22 Boehringer Ingelheim Microparts Gmbh Verfahren zum flächenartigen Verbinden von Körpern
DE10134040B4 (de) * 2001-07-12 2006-07-13 Forschungszentrum Karlsruhe Gmbh Verfahren zur Herstellung von mikrofluidischen Hohlstrukturen aus Kunststoff
EP1886792B1 (fr) * 2004-03-22 2013-05-22 ibidi GmbH Dispositif pour examens microscopiques
KR101249431B1 (ko) * 2008-04-22 2013-04-03 알프스 덴키 가부시키가이샤 접합부재 및 그 제조방법
DE102012112306A1 (de) * 2012-12-14 2014-06-18 Thinxxs Microtechnology Ag Verfahren zur Verbindung von Komponenten einer mikrofluidischen Flusszelle

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EP1697745A1 (fr) * 2003-12-18 2006-09-06 DIGITAL BIO TECHNOLOGY Seoul National University Institute of Advance Procede de metallisation d'une microplaquette en plastique
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