EP1833607A1 - Structure fluidique et procede de realisation d'une structure fluidique - Google Patents

Structure fluidique et procede de realisation d'une structure fluidique

Info

Publication number
EP1833607A1
EP1833607A1 EP05846530A EP05846530A EP1833607A1 EP 1833607 A1 EP1833607 A1 EP 1833607A1 EP 05846530 A EP05846530 A EP 05846530A EP 05846530 A EP05846530 A EP 05846530A EP 1833607 A1 EP1833607 A1 EP 1833607A1
Authority
EP
European Patent Office
Prior art keywords
fluidic
conductor
fluid
opening
sealing material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP05846530A
Other languages
German (de)
English (en)
Inventor
Gregor Ocvirk
Gernot Hochmuth
Wolfgang Fiedler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
F Hoffmann La Roche AG
Roche Diagnostics GmbH
Original Assignee
F Hoffmann La Roche AG
Roche Diagnostics GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by F Hoffmann La Roche AG, Roche Diagnostics GmbH filed Critical F Hoffmann La Roche AG
Publication of EP1833607A1 publication Critical patent/EP1833607A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/52—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive
    • B29C65/54—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive between pre-assembled parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
    • B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
    • B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
    • B01L3/502707—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by the manufacture of the container or its components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
    • B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
    • B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
    • B01L3/502715—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by interfacing components, e.g. fluidic, electrical, optical or mechanical interfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
    • B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B29C66/1122—Single lap to lap joints, i.e. overlap joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/12—Joint cross-sections combining only two joint-segments; Tongue and groove joints; Tenon and mortise joints; Stepped joint cross-sections
    • B29C66/122—Joint cross-sections combining only two joint-segments, i.e. one of the parts to be joined comprising only two joint-segments in the joint cross-section
    • B29C66/1222—Joint cross-sections combining only two joint-segments, i.e. one of the parts to be joined comprising only two joint-segments in the joint cross-section comprising at least a lapped joint-segment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/12—Joint cross-sections combining only two joint-segments; Tongue and groove joints; Tenon and mortise joints; Stepped joint cross-sections
    • B29C66/122—Joint cross-sections combining only two joint-segments, i.e. one of the parts to be joined comprising only two joint-segments in the joint cross-section
    • B29C66/1224—Joint cross-sections combining only two joint-segments, i.e. one of the parts to be joined comprising only two joint-segments in the joint cross-section comprising at least a butt joint-segment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
    • B29C66/52—Joining tubular articles, bars or profiled elements
    • B29C66/522—Joining tubular articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
    • B29C66/53—Joining single elements to tubular articles, hollow articles or bars
    • B29C66/534—Joining single elements to open ends of tubular or hollow articles or to the ends of bars
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16L—PIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
    • F16L37/00—Couplings of the quick-acting type
    • F16L37/02—Couplings of the quick-acting type in which the connection is maintained only by friction of the parts being joined
    • F16L37/025—Couplings of the quick-acting type in which the connection is maintained only by friction of the parts being joined with an inner elastic part pressed against an outer part by reason of its elasticity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2200/00—Solutions for specific problems relating to chemical or physical laboratory apparatus
    • B01L2200/02—Adapting objects or devices to another
    • B01L2200/026—Fluid interfacing between devices or objects, e.g. connectors, inlet details
    • B01L2200/027—Fluid interfacing between devices or objects, e.g. connectors, inlet details for microfluidic devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2200/00—Solutions for specific problems relating to chemical or physical laboratory apparatus
    • B01L2200/06—Fluid handling related problems
    • B01L2200/0689—Sealing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2200/00—Solutions for specific problems relating to chemical or physical laboratory apparatus
    • B01L2200/12—Specific details about manufacturing devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/08—Geometry, shape and general structure
    • B01L2300/0809—Geometry, shape and general structure rectangular shaped
    • B01L2300/0816—Cards, e.g. flat sample carriers usually with flow in two horizontal directions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/08—Geometry, shape and general structure
    • B01L2300/0832—Geometry, shape and general structure cylindrical, tube shaped
    • B01L2300/0838—Capillaries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/08—Geometry, shape and general structure
    • B01L2300/0887—Laminated structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
    • B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
    • B29C65/4845—Radiation curing adhesives, e.g. UV light curing adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/756—Microarticles, nanoarticles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1002—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina
    • Y10T156/1043—Subsequent to assembly

Definitions

  • the invention relates to a method for coupling a fluidic conductor to a fluidic system and to an arrangement which has a fluidic system and a fluidic conductor coupled to this system according to the described method.
  • Such arrangements and fluidic systems are used in particular in chemical analysis, medical diagnostics and other biological and medical applications.
  • Such arrangements and systems can also be used in chemical synthesis and reactor technology.
  • such arrangements and systems can be used in the form of microfluidic systems.
  • fluidic conductors in particular hose systems to fluidic systems, such as microfluidic chips
  • the purpose of such systems can be very different, but in particular the above-mentioned applications of analysis and diagnostics in biological and medical applications, for example, for the purpose of microdialysis and the chemical reactor in the foreground.
  • WO 03/072251 A2 describes a microfluid system with at least one volume which can be flowed through and at least one connecting device connected to the volume, which is designed in the form of a tapered depression or a tapered elevation. Furthermore, WO 03/072251 A2 describes a plug device for use in such a microfluid system, which is designed such that it can be brought into engagement with the described connection device.
  • the microfluidic system described in WO 03/072251 A2 has some disadvantages in practical use. In particular, the production of such microfluidic systems is complicated because the production of the tapered depressions or the tapered elevations in the connection device is technically difficult realize and also the corresponding [plug device makes a complex manufacturing process required.
  • microfluidic system described in WO 03/072251 A2 has an undefined dead volume, since during the mating of the described connection device and the plug device corresponding cavities can form, which first have to be filled with fluid.
  • the described arrangement is only applicable to tubes or tubes with relatively high mechanical strength.
  • connection between a microfluidic system and a hose in which in the microfluidic system, a connecting piece is formed, on which a flexible hose can be attached.
  • the connecting piece does not protrude beyond the substrate surface of the microfluidic system, but is sunk in a hole in the substrate.
  • the system described in US 2004/0017078 A1 similar to the system described in WO 03/072251 A2, has the disadvantage that the connection can only be used for flexible hoses with a relatively high mechanical load capacity.
  • connection recesses produced by reactive ion etching are again proposed, which are in communication with fluidic channels integrated in the silicon chip and into which correspondingly fluidic tubes can be inserted.
  • These openings or recesses can also be provided again with recessed connecting pieces, similar to the method described in US 2004/0017078 A1.
  • the disadvantages of the described methods are similar to the disadvantages already described above and consist in particular in the fact that the method is limited to etchable substrates, in particular silicon, and makes expensive apparatus techniques, such as, for example, reactive ion etching, necessary.
  • DE 202 16 216 U1 discloses a microfluidic system, in particular a micro-flow sensor, which has an inlet / outlet opening in a wafer and a connection element for the inlet / outlet opening.
  • the connection element covers the surface of the wafer in the area of the input / output opening and has a jacket with a projection. Between the projection of the shell and the wafer, an adhesive connection is made.
  • the solution described in DE 202 16 216 U1 also binding of the connecting element with the microfluidic system has numerous disadvantages for practical use, in particular for the purposes mentioned above. Thus, in particular when establishing the connection between the connection element and the wafer, large dead volumes occur, which are disadvantageously noticeable especially in microfluidic systems and are difficult to calculate.
  • connection method described leads to microfluidic systems with a comparatively low packing density of the connection elements, which is in particular due to the fact that the connection elements are sealed from the outside by the adhesive connection.
  • a high packing density is an indispensable prerequisite for many applications in the field of microfluidics.
  • connection elements by means of which corresponding tubes can be connected to a microfluidic system embedded in a silicon wafer, whereby silicon wafers are structured such that they are on one side
  • the connection elements described here are manufactured directly from silicon (bulk coupler or post coupler) or molded from a silicon mold into a polymer (molded coupler).
  • the polymeric coupler may be attached to the wafer or substrate by adhesion, in particular by melt-bonding
  • adhesion in particular by melt-bonding
  • the compounds described have the disadvantage that the manufacturing process of the coupler is extremely complicated and involves several semiconductor manufacturing steps.
  • complex apparatus such as devices for reactive ion etching, required.
  • the method described is applicable in one of its embodiments only for tubes with relatively high mechanical strength.
  • microfluidic connections are described which are suitable for serial and parallel connection techniques with low dead volume and low pressure drop (about 1000 Pa), whereby the end of a hose to be connected is surrounded by an additional flange hose has inside a flange cavity into which a part of the flange hose can penetrate during insertion of the described double hose end, so as a solid connection to form with the substrate.
  • the method described is comparatively complicated, since in particular the production of the connection piece requires high temperatures (above 300 ° C.) and high pressure.
  • the method described is not suitable for polymer substrates.
  • the described compound is applicable only for tubes with relatively high mechanical strength, because the hose to be connected must be pressed under high force into the substrate.
  • US Pat. No. 6,290,791 B1 and EP 0 944 794 B1 disclose an arrangement with a micromechanically produced structure and a capillary or tube and a method for connecting the capillaries or tubes to the structure.
  • the micromechanically produced structure has a substrate into which fluidic flow channels are embedded, which are connected to an opening into which the tube can be inserted.
  • a sealing substance is introduced into the opening around the tube and cured to seal the tube within the opening.
  • One problem in particular is to prevent the sealing substance from penetrating into the tube or the tube and closing it. To solve this problem, various alternatives are proposed.
  • a light-curing adhesive as a sealing substance, wherein the inserted end of the tube or the tube is irradiated with a suitable light source, so that the light-curing adhesive is cured before reaching the end of the tube or tube and thereby stopped, especially if the inserted length of a hose, that is the length, on which a hose in the Opening is inserted, is only very short (especially shorter than 1 mm), stopping a light-curing adhesive is very difficult because in particular the light sources used themselves have a certain extent and edge blurring and are hardly positioned with the required precision.
  • a thread is inserted into the tube or the tube which is not connectable to the sealing substance, so that the fluidic connection between the capillary opening and the adjoining channel is kept free by the thread. The thread must be removed later.
  • a fluctuation of the light intensity of the light source used can lead to different running distances of the light-curing adhesive in the opening and thus close or narrow the end of the tube or hose in many cases of mass production or even penetrate into the fluidic channels of the micromechanically produced structure.
  • the proposed method relies on the tube or the tube can be inserted into one of the openings described. This is not readily possible, especially with thin-walled and easily deformable hoses, since they can be damaged during this process.
  • the production of the proposed openings in particular requires a complex micromechanical drilling or milling, since the conductor channel of the tube must be positioned exactly to the corresponding conductor channel of the microfluidic structure, which in turn requires a complex positioning relative to the embedded in the substrate fluidic flow channels.
  • No. 6,605,472 B1 describes a method by means of which a capillary tube can be connected to a microchip, the microchip having a capillary channel opening at an edge surface.
  • a hole aligned with the capillary opening is drilled into the edge of the microchip, into which the end of the capillary tube can be inserted, so that the capillary tube is pressed against the capillary channel of the microchip. rochips is connected.
  • the method described is in turn technically extremely complex, since - similar to US 6,290,791 Bl and EP 0 944 794 Bl - a precision bore and precision positioning is required.
  • the bore must be located axially of the capillary channel so that fluid from the capillary tube can flow directly into the capillary channel of the microchip. Furthermore, especially in order to avoid dead volumes, the bore bottom must be subsequently leveled before the insertion of the capillary tube.
  • a hot melt adhesive is used to fix the capillary tube in the bore. To fix the compound, high temperatures of up to 800 ° C must be applied, which precludes the use of this method, especially for polymeric structures.
  • the object of the present invention is therefore to disclose a method for coupling a fluidic conductor to a fluidic system, which avoids the disadvantages of the prior art.
  • the described method or an arrangement produced by this method should be inexpensive, in particular also be suitable for microfluidic systems and have a high degree of flexibility with regard to the choice of material.
  • a method for producing a fluidic structure for example a microfluidic structure, which can be used for one of the abovementioned purposes.
  • the fluidic structure can be used in particular for processing or handling fluid media, such as liquids or gases.
  • applications in the field of medical diagnostics, analytics or chemical reactor engineering, in particular microreactorics are in the foreground.
  • the method should have the following steps:
  • the at least one base substrate may be, for example, inorganic substrates, for example silicon substrates or glass, or also organic substrates, in particular various polymers, for. Silicone, po lycarbonate or cyclic olefin copolymers (COC). Also composed of different materials basic substrates are conceivable.
  • the at least one opening can be, for example, a bore introduced into the at least one base substrate, in particular a blind hole bore with, for example, a round, oval or polygonal cross section.
  • the at least one opening may also be a groove arranged on a surface of the at least one base substrate, which is accessible from the outside.
  • this groove may be accessible along its long side from a surface of the at least one base substrate, the groove being accessible from an end face of the at least one base substrate.
  • the groove may for example have a rectangular, round, U-shaped or V-shaped cross-section.
  • the groove can also have a cross-section in the form of a trapezoid, wherein advantageously the longer of the two parallel edges of the trapezoid lies on a surface of the at least one base substrate. This embodiment facilitates the insertion of a fluidic conductor.
  • a fluidic conductor in particular a tube or hose, having at least one backflow and at least one conductor wall is partially introduced into the at least one opening.
  • This fluidic conductor can be, for example, a flexible or rigid tube or a corresponding tube of inorganic or organic material, for example metals, silicone, Teflon, glass or PVC.
  • a lumen is to be understood as meaning a fluidic cavity in the interior of the fluidic conductor, through which a fluid medium can flow.
  • the at least one section of the at least one fluidic conductor can be the end of a tube or hose, in particular an open end, which is introduced into the at least one opening.
  • This introduction advantageously takes place in such a way that a cavity remains between the outer wall of the at least one fluidic conductor and the wall of the at least one opening.
  • the introduction of the at least one section of the at least one fluidic conductor into the at least one opening can take place such that a hose or tube or one end of such a tube or tube is inserted into one of the above-described grooves or into one of the above-described holes is inserted.
  • At least one curable fluid sealing material is introduced into the at least one opening.
  • This introduction of the fluid sealing material can for example be done directly in the externally accessible opening, for example by means of a pipette or microdosing.
  • a dispensing needle or a similar apparatus can be used with which, for example, fluid sealing material is introduced directly into one of the grooves described above or into one of the holes.
  • the introduction of the curable fluid sealing material into the at least one opening can also take place in that at least one Einfiillkanal associated with the at least one opening in the fluidic structure is provided. This filling channel can be accessible, for example, from the outside.
  • This filling channel can be simple or branched and communicate with one of the openings or simultaneously with a plurality of openings. Through this filling channel, fluid sealing material can flow into the at least one opening. It is particularly advantageous if the fluid sealing material completely or advantageously completely fills one or more intermediate spaces, which completely or advantageously completely fills the remaining space after inserting the at least one section of the at least one fluidic conductor into the at least one opening between this at least one fluidic conductor and the at least one opening.
  • This filling channel can be embedded, for example, in the at least one base substrate. Furthermore, this at least one filling channel can also penetrate further substrates, for example at least one intermediate substrate and / or a cover substrate.
  • the at least one section of the introduced at least one fluidic conductor has at least one open end, for example a tube or tube end, which has been introduced into the at least one opening, then it has proven to be particularly advantageous if the at least one curable one fluid sealing material when inserted into the opening closes this at least one open end.
  • the at least one curable fluid sealing material may partially penetrate into this tube or tube end and thus close this open end.
  • Closure means, in particular, for example a tight closure with respect to the fluidic media which flow through the at least one inner lumen of the at least one fluidic conductor.
  • the curable fluid sealing material closes the above-described intermediate space between the at least one fluidic conductor and the surrounding wall of the at least one opening tightly for the fluidic media in the inner lumen of the at least one fluidic conductor.
  • This curable fluid sealing material should be in a liquid state during filling.
  • the at least one fluid sealing material is completely or partially cured. Curing is to be understood as meaning a transition (for example a liquid / solid phase transition or also a transition due to a chemical reaction) in which the hardness and / or viscosity of the curable fluid-tight sealing material is greatly increased.
  • the curable fluid sealing material does not have to be completely solid, but it can, for example also present in a slightly plastic or elastic state.
  • a firm connection between the at least one base substrate of the fluidic structure and the at least one fluidic conductor is produced.
  • the connection between the at least one fluidic conductor and the at least one base substrate is thus mechanically stabilized and thus secured against undesired removal of the fluidic conductor.
  • the at least one section of the at least one fluidic conductor, which is introduced into the at least one opening of the at least one base substrate has a length of at least 0.2 mm, advantageously more than 0.5 mm, and especially advantageously in the range between 0.5 and 1.5 mm.
  • the optimum length of this at least one section also depends strongly on the outer dimensions of the at least one fluidic conductor, for example its diameter.
  • the at least one curable fluid sealing material may be various materials.
  • it may be a curable fluid sealing material, which is initially in the liquid state and is then curable under the action of electromagnetic radiation.
  • it may be a liquid of a photopolymerizable monomer.
  • the curing can then take place, for example, by a large-area light source, advantageously a UV light source, or else by an areal limited light source.
  • the curing can also take place only locally (eg by means of an exposure mask) or also at different points of the fluidic structure at different times.
  • a laser can also be used for the curing, in particular a laser whose wavelength is optimally adapted to the curable fluid sealing material.
  • the electromagnetic radiation used for the curing can penetrate all or part of the fluidic structure, for example the at least one base substrate or even further substrates, for example intermediate substrates or cover substrates, before acting on the at least one curable fluid sealing material.
  • the at least one substrate penetrated by the electromagnetic radiation has a low absorption for the electromagnetic radiation used.
  • transparent substrates can be used, for example, for light.
  • curable fluid sealing materials whose hardening takes place by thermal action.
  • This thermal action can be, for example, an increase in temperature, for example when monomeric fluids are used which carry out a polymerization in the case of a short-term increase in temperature (thermally initiated polymerization) and harden during this process.
  • a temperature reduction can also be used. This is particularly advantageous when fluid sealing materials are used which are liquid at elevated temperature and solidify in a subsequent decrease in temperature, for example to room temperature (liquid / solid phase transition).
  • increased pressure can also be used when introducing the at least one curable fluid sealing material.
  • curable fluid sealing materials materials which are flowable at this elevated pressure to penetrate into the at least one opening.
  • it may be at least one viscoelastic or pseudoplastic sealing material. Under the action of an increased pressure, such materials become correspondingly flowable, with complete or partial curing following reduction of the pressure.
  • curable fluid sealant materials are not limited to the materials mentioned.
  • curable fluid seal materials can also be employed which will self-cure (i.e., not by external action) over time, for example by a corresponding polymerization reaction.
  • monomer liquids with corresponding initiators which have flowable properties for a certain time and then cure.
  • the introduction of these materials into the at least one opening must then occur over time while these materials are fluid.
  • these materials may be, for example, epoxides or silicones.
  • inorganic materials are used, such as self-curing cements.
  • At least one connecting channel is subsequently produced between at least one inner lumen of the at least one fluidic conductor, in particular in the at least one section introduced into the at least one opening and at least one fluid channel of the fluidic structure.
  • This at least one connecting channel establishes a connection between the at least one fluidic conductor and the remaining region of the fluidic structure which can be flowed through for the fluidic media.
  • the remaining fluidic structure has one or more such fluid channels.
  • a fluid channel can be introduced, for example, into the at least one base substrate of the fluidic structure.
  • this at least one fluid channel but also in additional substrates, For example, in one or more deck substrates, be introduced.
  • a fluid channel may, for example, be understood to mean a bore in one of the substrates, or else a corresponding groove on a surface of one of the substrates.
  • Corresponding larger cavities, such as, for example, microreaction chambers, or also further fluidic conductors introduced into the fluidic structure, are analogously included in the term of the fluid channel.
  • the at least one connecting channel can penetrate a subregion of one of the substrates mentioned, or even several subregions or entire substrates simultaneously.
  • the connecting channel can also penetrate through corresponding intermediate substrates.
  • the at least one connecting channel can be simple or even branched.
  • this at least one connecting channel can advantageously also penetrate at least one of the abovementioned sealing materials (which are then advantageously in the cured state) and also, for example, at least one conductor wall of at least one fluidic conductor.
  • Various methods of physical, mechanical or chemical nature can be used to produce this at least one connecting channel, which are optimally adapted to the materials used, the substrate or the sealing materials and / or the conductor walls of the fluidic conductors.
  • a mechanical drilling method or milling method or additionally or alternatively also a stamping method can be used.
  • a corresponding laser beam method for example laser drilling or laser ablation, can also be used.
  • CC> 2 lasers or other gas lasers or even Nd: YAG lasers or other solid-state lasers can be used in continuous operation or in pulsed operation.
  • Such mechanical methods or laser beam methods are optimally accompanied by appropriate suction measures to absorb accumulating dust particles in the manufacture of the at least one connecting channel.
  • the method can be modified in such a way that at least one further substrate is used in addition to the at least one base substrate with the at least one externally accessible opening.
  • this can produce a corresponding layer structure of the fluidic structure, which in particular makes it possible to produce fluid channels, reaction chambers or similar cavities in the interior. of the fluidic structure of staric aposiacnx.
  • at least one intermediate substrate and / or a cover substrate can be applied to the at least one base substrate.
  • the at least one cover substrate and / or the at least one intermediate substrate partially closes off the at least one opening.
  • these may be one or more unstructured intermediate substrates and at least one structured cover substrate, wherein, for example, the at least one cover substrate has at least one fluid channel.
  • Further fluidic cavities for example reaction chambers or else further fluidic conductors can be introduced into the cover substrate.
  • the at least one opening in the at least one base substrate can be designed as a groove (see above), which is accessible from its longer side from a surface of the at least one base substrate and at its end face from an end face of the at least one base substrate.
  • the opening in particular a groove
  • an intermediate substrate in particular an unstructured intermediate substrate
  • Further structures on the base substrate for example fluid channels, which are introduced in the form of further grooves along this surface in the at least one base substrate, can be closed in this process by the at least one intermediate substrate so that form closed fluid channels.
  • one or more structured cover substrates can be applied to this layer structure consisting of the at least one base substrate and the at least one intermediate substrate.
  • these cover substrates may, in turn, have fluid channels, for example corresponding grooves on a surface of the at least one cover substrate, which are advantageously in turn completely or partially closed during application to the other substrates. Again, this creates closed fluidic conductors.
  • at least one appropriately structured cover substrate can be applied directly to the at least one base substrate without using a corresponding non-structured intermediate substrate.
  • the layer structure can be designed in such a way that at least one fluid channel comes to lie above or in the vicinity of the at least one opening in the finished structured fluidic structure. This considerably facilitates the connection of this at least one fluid channel to the at least one inner lumen of the at least one fluidic conductor by means of at least one connecting channel.
  • the method may be performed such that a portion of a fluidic conductor is introduced into an opening, then fluid sealing material is introduced and cured, and then a insectsbbrat is applied to the base substrate. Subsequently, for example by means of a laser, a bore is produced through the intermediate substrate, the hardened sealing material and the conductor wall of the fluidic conductor to the inner lumen of the fluidic conductor.
  • a cover substrate for example a cover substrate with a surface of the same structured fluid channels, for example corresponding grooves, can then be applied to this structure, wherein advantageously one or more fluid channels of this cover substrate come to rest above said bore.
  • a three-dimensional fluidic structure with closed fluid channels and a fluid-permeable connection between the inner lumen of the fluidic conductor and a fluid channel of the fluidic structure can be produced by layered construction.
  • the method can also be carried out such that first a section of a fluidic conductor is introduced into an opening, then a fluid sealing material is introduced into the opening and this is then completely or partially closed with an intermediate substrate. After curing of the fluid sealing material then, for example, the intermediate substrate can be removed again. This is particularly advantageous if planar surfaces are to be produced along the base substrate of the fluidic structure, which should not be interrupted by the cured fluid sealing material.
  • a corresponding layer structure of a plurality of substrates for example a base substrate, an intermediate substrate and a cover substrate
  • various methods can be used to connect these substrates.
  • the selection of a suitable method is naturally dependent on the corresponding properties, in particular the material selection of the substrates used.
  • bonding methods can be used for bonding the substrates or even welding processes, in particular laser welding methods or ultrasonic welding methods.
  • laser or ultrasonic welding methods can be advantageously used in the connection of corresponding plastic substrates.
  • thermal bonding methods can also be used.
  • a corresponding fluidic structure in particular a fluidic structure produced according to the method described in one of its embodiments, is also proposed.
  • the fluidic Structure has at least one base substrate with at least one externally accessible opening, at least one at least one inner lumen and at least one conductor wall having fluidic conductor, wherein at least a portion of the at least one fluidic conductor is disposed in the at least one opening, at least one in the at least one opening introduced hardenable sealing material in the cured state, wherein the curable sealing material at least one space between at least one opening and at least one fluidic conductor completely or partially fills, at least one fluid channel and at least one connecting channel between at least one inner lumen of at least one fluidi- see conductor and at least one fluid channel, wherein the at least one connecting channel penetrates at least one conductor wall.
  • the configuration of said elements can be advantageously chosen according to the above embodiments and embodiments.
  • the method described in one of its embodiments and a corresponding fluidic structure produced by this method have many decisive advantages over conventional methods and method products, for example according to the above-mentioned prior art.
  • a dead volume of a fluidic connection between one or more fluidic conductors and a substrate for example the remaining part of a fluidic structure, can be greatly reduced or reproducibly realized by the described method.
  • the curable fluid sealing material can completely fill a possible opening which remains between the at least one fluidic conductor and the wall of the at least one opening, in particular only at the locations where cavities or openings are required for the purpose of producing the at least one connecting channel, corresponding material is removed or displaced.
  • the location of the fluidic connection between one or more fluidic conductors and the remaining components of a fluidic structure can be freely selected and defined.
  • the position of the at least one connecting channel can be largely freely defined.
  • a plurality of fluid channels can be simultaneously connected to a single fluidic conductor, for example, by producing a plurality of connection channels connecting the inner lumen of the fluidic conductor with a plurality of conductor channels. In this way, in particular distribution systems can be easily produced, which are not feasible with the methods described above, known from the prior art.
  • the described V experienced the at least one fluidic conductor is not exposed to high mechanical stress.
  • the at least one fluidic conductor in particular a pipe or hose end, does not have to be pushed against a stop.
  • the method described requires no complex adjustment steps, as they are indispensable in many prior art methods.
  • no axial bores must be inserted into a base substrate for a conductor channel present in a base substrate. It is particularly simple when the corresponding portion of the fluidic conductor can be easily inserted from above into a corresponding groove and does not have to be pushed from the front into an opening.
  • the method described also has the advantage of high reproducibility.
  • the curable fluid sealing material can in particular completely fill the cavity between the fluidic conductor and the wall of the opening and, for example, also completely close the fluidic conductor, in particular a tube or hose end.
  • the actual fluidic connection between one or more fluid channels in one or more of the substrates and the inner surface of the fluidic conductor is then produced, in particular after the curing of the fluidic sealing material.
  • the fluidic connection in particular the at least one fluidic connection channel, does not depend on how far the fluid sealing material flows into the inner lumen of the fluidic conductor.
  • this method is also suitable in particular for series use, in particular mass production of medical diagnostic equipment, analytical apparatus or microreaction chambers.
  • FIG. 1 shows a sectional view of a fluidic structure according to the invention from the side;
  • Figure 2 is a sectional view of an alternative to Figure 1 fluidic structure in top view
  • FIG. 3 shows an intermediate product during the production of a fluidic structure according to the invention with a base substrate and a fluidic conductor;
  • Figure 4A shows a first embodiment of an embedded in a base substrate opening in a sectional view in front view
  • FIG. 4B shows an embodiment with a trapezoidal opening cross-section, which is an alternative to FIG. 4A;
  • Figure 4C is an alternative to Figure 4A and 4B embodiment with U-shaped cross section
  • Figure 4D is an alternative to Figures 4A to 4C embodiment of an opening in the form of a recessed into a base substrate bore with a rectangular
  • Figure 5 shows an embodiment of an opening in the form of a recess in a
  • FIG. 6 shows an intermediate product during the production of a fluidic structure according to the invention with a base substrate, a fluidic conductor and an intermediate substrate in the form of a film;
  • Figure 7 is an alternative to Figure 6 embodiment of an intermediate product with a
  • FIG. 8 is a sectional view of an intermediate product of a fluidic structure with a supply channel for the supply of a curable fluid sealing material in top view;
  • FIG. 9 shows an intermediate product during the production according to the invention of a fluidic structure according to the invention with a base substrate, a fluidic conductor, an intermediate substrate and a fluid sealing material;
  • FIG. 10 shows an intermediate product according to FIG. 9 after removal of the intermediate substrate
  • FIG. 11 shows an intermediate substrate in the production according to the invention of a fluidic structure with a base substrate, a fluidic conductor, a hardened sealing material, an intermediate substrate and a connecting channel, which penetrates the intermediate substrate, the sealing material and a conductor wall of the fluidic conductor;
  • FIG. 12 shows a schematic flowchart of an embodiment of a method according to the invention for producing a fluidic structure.
  • FIG. 1 shows a first exemplary embodiment of a fluidic structure 110 according to the invention in a sectional view from the side.
  • the structure has a fluidic chip 112, which is produced in layered construction, as well as a fluidic conductor 114 with a conductor wall 116 and an inner lumen 118.
  • the conductor wall 116 is made of silicone in this embodiment.
  • the term conductor wall in FIG. 1 identifies the lateral boundary wall of the fluidic conductor 114.
  • the fluidic chip has a base substrate 120, in which an opening 122 is embedded. Furthermore, the structure has two further substrates, namely an intermediate substrate 124 and a cover substrate 126, which are applied to the base substrate in the stated sequence. While the intermediate substrate 124 is unstructured in this embodiment, the cover substrate 126 in this example has a fluid channel 128 that directly adjoins the intermediate substrate 124 such that the intermediate substrate 124 forms a wall of the fluid channel 128.
  • a connection between the fluidic conductor 114 in the form of a tube and the fluidic chip 112 is made by placing an open end 130 of the fluidic conductor 114 in the opening 122 in the base substrate 120.
  • the open end 130 of the fluidic conductor 114 is surrounded by a sealing material 132.
  • This sealing material 132 completely or partially fills the volume of the opening 122 around the open end 130 of the fluidic conductor 114 in such a way that a conductor Opening 134 is completely sealed by the Dichtmatenal 132.
  • the sealing material 132 directly adjoins the intermediate substrate 124.
  • the open end 130 of the fluidic conductor 114 is also firmly connected by the sealing material 132 with the fluidic chip 112, such that considerable force is required to remove the fluidi- see conductor 114 from the fluidic chip 112.
  • the sealing material 132 thus gives the connection between the fluidic conductor 114 and the fluidic chip 112 a high mechanical stability in addition to the sealing effect mentioned.
  • the fluidic structure 110 has a connection channel 136, which in this embodiment has a cylindrical shape and which connects the fluid channel 128 in the cover substrate 126 with the inner lumen 118 of the fluidic conductor 114.
  • the connecting channel 136 penetrates the unstructured intermediate substrate 124, the sealing material 132 and the conductor wall 116 of the fluidic conductor 114.
  • the connecting channel 136 thus forms a connection between the inner lumen 118 of the fluidic conductor 114 that can be freely flowed through by a fluid, for example a liquid or a gas and the fluidic chip 112, in particular the fluid channel 128 ago.
  • the fluidic structure 110 has only one fluid channel 128 disposed in the cover substrate 126.
  • the fluidic structure 110 can also have further fluid channels 128, which can also be accommodated in the base substrate 120, for example or additionally. If the fluid channels are received only in the base substrate 120, the entire fluidic connection between the fluidic conductor 114 and the fluidic chip 112 in a single substrate (the base substrate 120) is realized.
  • the fluid channel 128 is arranged at the interface between two substrates, in this case at the interface between the cover substrate 126 and the intermediate substrate 124
  • Substrates 120, 124, 126 are arranged, for example in the form of holes.
  • other fluidic cavities for example microreaction chambers
  • Figure 2 is an alternative to Figure 1 embodiment of a fluidic structure 110 in a sectional view in top view, wherein the devislurnen 118 of the fluidi- see conductor 114 is connected in this embodiment with two fluid channels 128 via connection channels 136.
  • the connection channels 128 are formed in the base substrate 120, for example in the form of trenches or grooves, which, for example, at the interface between the base substrate 120 and the intermediate substrate 124 (see Figure 1) are arranged. After being covered by the intermediate substrate 124, these grooves in the base substrate 120 thus form closed fluid channels 128.
  • connection channels 136 are provided, wherein a connection channel 136 runs parallel to an axis 210 of the fluidic conductor 114 and thus directly in the conductor opening 134 of the fluidic conductor 114 fluidic conductor 114 opens.
  • a second connection channel 136 runs perpendicular to the axis 210 of the fluidic conductor and penetrates the sealing material 132 and the lateral conductor wall 116 of the fluidic conductor 114. In this way, the inner lumen 118 of the fluidic conductor 114 is connected to a plurality of fluid channels 128.
  • the production of the connecting channels 136 can be done in this exemplary embodiment, for example, by milling or laser ablation, whereas the connecting channel 136 is advantageously carried out in the embodiment of Figure 1 by mechanical drilling or laser drilling.
  • FIGS. 3 to 11 which respectively represent intermediate products and the schematic flowchart according to FIG. 12, an inventive production method of a fluidic structure 110, for example according to the embodiment variants shown in FIGS. 1 and 2, will be described below. It should be noted that, in particular, the method illustrated in FIG. 12 does not necessarily have to be carried out in the sequence shown and that additional method steps, not shown in FIG. 12, can be performed.
  • an opening 122 is introduced into a base substrate 120.
  • This opening 122 can be configured in various ways. Various embodiments of this opening 122 are shown in FIGS. 4A to 4D and in FIG.
  • the opening 122 may have a groove formed in a surface 310 of the base substrate 120, as shown in FIGS. 4A to 4C.
  • This groove can in particular have a rectangular cross section (FIG. 4A), a trapezoidal cross section (FIG. 4B) or a U-shaped cross section (FIG. 4C). In the trapezoidal cross-section according to FIG.
  • the opening 122 may also have a bore, as shown for example in Figure 4D.
  • This hole may be, for example, a blind hole.
  • the bore may in particular have a rectangular or round cross-section.
  • the opening 122 can also be designed in the form of a simple cutout on the surface 310 of the base substrate 120. Further embodiments, for example, with an alternative cross-section (for example, V-shaped cross section) of the groove or opening 122 are conceivable. Subsequently, (step 1212 in FIG.
  • a section 130 of a fluidic conductor 114 is inserted into the opening 122 in the base substrate 120, as shown in FIG.
  • the inserted portion 130 is the open end of a fluidic conductor 114 formed as a tube.
  • insertion of the open end 130 is correspondingly "insertion" the fluidic conductor 114 into the opening 122 to understand.
  • the fluidic conductor 114 is smaller in its outer dimensions than the bore 122, no force is required in this embodiment, in contrast to the prior art for this insertion of the open end 130 into the opening 122, so that in particular the risk of damage to the fluidic conductor 114 is reduced.
  • the surface 310 of the base substrate 120 as shown in Figures 6 and 7, covered by an unstructured intermediate substrate 124, wherein in the embodiment shown in Figures 6 and 7, in which the opening 122 has the shape of one with its long side to Surface 310 open toward the groove and with its narrow side toward the end face 610 of the base substrate 120 has opened groove, the opening 122 along the surface 310 at least partially closed.
  • the intermediate substrate 124 is a thin film, for example a plastic film (eg a plastic film having polycarbonate as the material), in the exemplary embodiment according to FIG Platelets (eg, also a plastic film having polycarbonate as the material).
  • a curable fluid sealing material 132 is introduced into the opening 122, such that the sealing material 132 sealingly fills the remaining cavity between the conductor wall 116 of the fluidic conductor 114 and the wall of the cavity 122.
  • the sealing material 132 may also partially penetrate into the Porteröffhung 134 of the fluidic conductor 114.
  • the unstructured intermediate substrate 124 limits the filling level of the sealing material 132 such that the sealing material 132 is flush with the surface 310 of the base substrate 120.
  • the intermediate substrate 124 terminates in front of the end face 610 of the base substrate 120 in the exemplary embodiments illustrated in FIGS.
  • the fluidic curable sealing material 132 is filled, for example, from the end face 610 into the opening 122 of the base substrate 120, as can be seen with reference to FIGS. 9 and 10 (filling direction 910).
  • filling channels 810 can be used. In the exemplary embodiment shown in FIG. 8, these filling channels 810 are formed as trenches along the surface 210 of the base substrate 120, wherein these trenches extend perpendicular to the opening 122.
  • the filling channels 810 have an extended Zu Kunststoff ⁇ Anlagen 812, in which the curable fluid sealing material 132 can be filled to then flow along the filling channels 810 in the opening 122.
  • volume changes of the curable fluid sealing material 132 can be compensated, for example by avoiding sealing material 132 during hardening into the filling channels 810.
  • stresses are avoided during curing.
  • a light-curing adhesive such as Wellomer UV4032, which can be hardened in particular by the use of UV light, can be used in this exemplary embodiment, for example.
  • the curable fluid sealing material 132 is cured accordingly, so that the open end 130 of the fluidic conductor 114 is firmly fixed in the opening 122 and the conductor opening 132 is sealed.
  • sealing material 132 can penetrate slightly into the conductor opening 134 of the open end 130 of the fluidic conductor 114 and thus additionally increase the sealing effect and the mechanical stability of the connection.
  • the curing of the sealing material 132 may, as described above, completely or partially. Furthermore, various techniques for curing can be used, as also described above, in particular curing under the action of light, for example under the action of UV light. This exposure to light may occur, for example, through the intermediate substrate 124 or also through the base substrate 120, in which case advantageously the intermediate substrate 124 and / or the base substrate 120 are transparent with respect to the wavelength of light used. A localized action of light, for example in the form of a laser beam or by means of a shadow mask, can also take place.
  • the intermediate substrate 124 may optionally remain on the base substrate 120, particularly when the intermediate substrate 124 is a thin film, or alternatively removed from the base substrate 120.
  • the intermediate substrate 124 has not been learned and thus forms an integral part of the layer structure of the fluidic chip 112.
  • a connecting channel 136 is exposed to the inner lumen 118 of the fluidic conductor 114 (see method step 1218 in FIG. 12), as illustrated, for example, in FIG.
  • the connecting channel 136 extends perpendicular to the axis 210 of the fluidic conductor 114 through the intermediate substrate 124, the (now hardened) sealing material 132 and the conductor wall 116 of the fluidic conductor 114.
  • This opening can be made, for example, by means of a mechanical drill or preferably zugt be generated by means of a laser, in particular a CCV laser or excimer laser.
  • the intermediate product shown in FIG. 11 is supplemented to form the fluidic structure 110 illustrated in FIG. 1 by applying a cover substrate 126 to the intermediate substrate 128.
  • this cover substrate 126 has a fluid channel 128, which has been introduced into the cover substrate 126, for example by milling, etching, laser ablation or other methods.
  • the fluid channel 128 is arranged in this case and the cover substrate 126 is aligned with the base substrate 120 such that the fluid channel 128 comes to lie above the connecting channel 136 to the inner 118 of the fluidic conductor 114.
  • the substrates 126, 124, and 120 may be joined together by various suitable joining techniques.
  • the substrates can be welded with a suitable laser or even glued.
  • a suitable clamping technique is conceivable which presses the individual substrates 120, 124, 126 together and which, if necessary, can be released again.

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Abstract

En particulier dans le domaine du diagnostic médical, de l'analyse ou des microréacteurs, il est souvent nécessaire de coupler des conduites fluidiques (114) à certaines structures fluidiques, par exemple une puce fluidique (112). L'invention concerne donc un procédé pour fabriquer une structure fluidique (110), consistant d'abord à pratiquer une ouverture (122), accessible de l'extérieur, dans au moins un substrat de base (120) de la structure fluidique (110). Au moins une section (130) d'une conduite fluidique (114), en particulier d'un tube ou d'un tuyau, est ensuite introduite partiellement dans ladite au moins une ouverture (122). Au moins un matériau d'étanchéité fluide durcissable (132) est introduit dans ladite au moins une ouverture (122). Ledit au moins un matériau d'étanchéité fluide (132) est ensuite entièrement ou partiellement durci, par exemple sous l'effet de rayons électromagnétiques ou bien sous effet thermique. Ensuite, au moins un canal de liaison (136) est réalisé entre au moins une lumière intérieure (118) de ladite au moins une conduite fluidique (114) et au moins un canal fluidique (128) de la structure fluidique (110). Ce canal de liaison (136) peut être réalisé, par exemple, par des procédés mécaniques, tels que l'alésage ou le fraisage, ou bien par des procédés d'ablation laser, des procédés d'alésage laser, par gravure par voie humide ou sèche et par d'autres procédés. Le procédé décrit peut être mis en oeuvre, en particulier, de manière reproductible, de sorte qu'il est également approprié à la fabrication en série de structures fluidiques (110). De plus, des structures fluidiques (110), fabriquées selon le procédé décrit, présentent de faibles volumes morts de la liaison fluidique, ces volumes morts pouvant être réalisés de manière reproductible. En outre, plusieurs canaux fluidiques (128) peuvent être reliés simultanément à la lumière intérieure (118) d'une conduite fluidique (114) et une liaison sûre, mécaniquement stable, peut être établie entre la conduite fluidique (114) et une puce fluidique (112).
EP05846530A 2005-01-05 2005-12-22 Structure fluidique et procede de realisation d'une structure fluidique Withdrawn EP1833607A1 (fr)

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DE102005000799A DE102005000799A1 (de) 2005-01-05 2005-01-05 Fluidische Struktur und Verfahren zum Erzeugen einer fluidischen Struktur
PCT/EP2005/013910 WO2006072405A1 (fr) 2005-01-05 2005-12-22 Structure fluidique et procede de realisation d'une structure fluidique

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