WO1998039804A1 - Columnar-grained polycrystalline solar cell substrate and improved method of manufacture - Google Patents
Columnar-grained polycrystalline solar cell substrate and improved method of manufacture Download PDFInfo
- Publication number
- WO1998039804A1 WO1998039804A1 PCT/US1998/003972 US9803972W WO9839804A1 WO 1998039804 A1 WO1998039804 A1 WO 1998039804A1 US 9803972 W US9803972 W US 9803972W WO 9839804 A1 WO9839804 A1 WO 9839804A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- silicon
- sheet
- nucleation
- layer
- setter
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 127
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 239000000758 substrate Substances 0.000 title claims abstract description 16
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 140
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 136
- 239000010703 silicon Substances 0.000 claims abstract description 136
- 230000006911 nucleation Effects 0.000 claims abstract description 66
- 238000010899 nucleation Methods 0.000 claims abstract description 66
- 239000000463 material Substances 0.000 claims abstract description 59
- 239000007788 liquid Substances 0.000 claims abstract description 25
- 230000000694 effects Effects 0.000 claims abstract description 20
- 239000000155 melt Substances 0.000 claims abstract description 18
- 239000002210 silicon-based material Substances 0.000 claims abstract description 7
- 238000000137 annealing Methods 0.000 claims abstract description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 24
- 238000000576 coating method Methods 0.000 claims description 16
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 15
- 239000011248 coating agent Substances 0.000 claims description 14
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 13
- 230000007613 environmental effect Effects 0.000 claims description 13
- 239000007789 gas Substances 0.000 claims description 13
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 12
- 230000015572 biosynthetic process Effects 0.000 claims description 11
- 150000004767 nitrides Chemical class 0.000 claims description 10
- 229910052757 nitrogen Inorganic materials 0.000 claims description 10
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 8
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 8
- 238000009792 diffusion process Methods 0.000 claims description 8
- 238000012545 processing Methods 0.000 claims description 8
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 8
- 239000003795 chemical substances by application Substances 0.000 claims description 7
- 229910002804 graphite Inorganic materials 0.000 claims description 7
- 239000010439 graphite Substances 0.000 claims description 7
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 7
- 229910052786 argon Inorganic materials 0.000 claims description 6
- 229910052799 carbon Inorganic materials 0.000 claims description 6
- 229910052732 germanium Inorganic materials 0.000 claims description 6
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 6
- 238000002844 melting Methods 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 6
- 230000003287 optical effect Effects 0.000 claims description 6
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 5
- 229910052796 boron Inorganic materials 0.000 claims description 5
- 239000001257 hydrogen Substances 0.000 claims description 5
- 229910052739 hydrogen Inorganic materials 0.000 claims description 5
- 150000001247 metal acetylides Chemical class 0.000 claims description 5
- 239000013078 crystal Substances 0.000 claims description 4
- 229910001873 dinitrogen Inorganic materials 0.000 claims description 4
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- 238000006243 chemical reaction Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000011065 in-situ storage Methods 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- 238000002360 preparation method Methods 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- 239000011863 silicon-based powder Substances 0.000 claims description 3
- 230000002269 spontaneous effect Effects 0.000 claims description 3
- MARUHZGHZWCEQU-UHFFFAOYSA-N 5-phenyl-2h-tetrazole Chemical compound C1=CC=CC=C1C1=NNN=N1 MARUHZGHZWCEQU-UHFFFAOYSA-N 0.000 claims description 2
- KTSFMFGEAAANTF-UHFFFAOYSA-N [Cu].[Se].[Se].[In] Chemical compound [Cu].[Se].[Se].[In] KTSFMFGEAAANTF-UHFFFAOYSA-N 0.000 claims description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 2
- 238000005229 chemical vapour deposition Methods 0.000 claims description 2
- 239000001307 helium Substances 0.000 claims description 2
- 229910052734 helium Inorganic materials 0.000 claims description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 2
- 230000010354 integration Effects 0.000 claims description 2
- 229910052743 krypton Inorganic materials 0.000 claims description 2
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 claims description 2
- 229910052754 neon Inorganic materials 0.000 claims description 2
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 claims description 2
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims description 2
- 229910052760 oxygen Inorganic materials 0.000 claims description 2
- 239000001301 oxygen Substances 0.000 claims description 2
- 239000010453 quartz Substances 0.000 claims description 2
- -1 refractory boards Substances 0.000 claims description 2
- 238000005507 spraying Methods 0.000 claims description 2
- 238000009736 wetting Methods 0.000 claims description 2
- 238000010422 painting Methods 0.000 claims 2
- 239000000654 additive Substances 0.000 claims 1
- 230000000996 additive effect Effects 0.000 claims 1
- 238000010924 continuous production Methods 0.000 claims 1
- 239000007858 starting material Substances 0.000 claims 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 abstract description 9
- 239000010409 thin film Substances 0.000 abstract description 6
- 235000012431 wafers Nutrition 0.000 abstract description 4
- 230000035882 stress Effects 0.000 description 8
- 238000007792 addition Methods 0.000 description 5
- 230000006798 recombination Effects 0.000 description 5
- 238000005215 recombination Methods 0.000 description 5
- 238000000605 extraction Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 238000007711 solidification Methods 0.000 description 4
- 230000008023 solidification Effects 0.000 description 4
- 238000011109 contamination Methods 0.000 description 3
- 230000002939 deleterious effect Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000008646 thermal stress Effects 0.000 description 3
- 239000000470 constituent Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000004886 process control Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000007670 refining Methods 0.000 description 2
- 238000010408 sweeping Methods 0.000 description 2
- 238000010345 tape casting Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 206010010144 Completed suicide Diseases 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- PWKWDCOTNGQLID-UHFFFAOYSA-N [N].[Ar] Chemical compound [N].[Ar] PWKWDCOTNGQLID-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000003466 anti-cipated effect Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000010309 melting process Methods 0.000 description 1
- 230000005499 meniscus Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000011856 silicon-based particle Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/186—Particular post-treatment for the devices, e.g. annealing, impurity gettering, short-circuit elimination, recrystallisation
- H01L31/1872—Recrystallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic System
- H01L31/182—Special manufacturing methods for polycrystalline Si, e.g. Si ribbon, poly Si ingots, thin films of polycrystalline Si
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/546—Polycrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/122—Polycrystalline
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12528—Semiconductor component
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP53863598A JP2001516324A (en) | 1997-03-04 | 1998-03-02 | Columnar crystalline granular polycrystalline solar cell substrate and improved manufacturing method |
AU66754/98A AU739048B2 (en) | 1997-03-04 | 1998-03-02 | Columnar-grained polycrystalline solar cell substrate and improved method of manufacture |
CA002283334A CA2283334A1 (en) | 1997-03-04 | 1998-03-02 | Columnar-grained polycrystalline solar cell substrate and improved method of manufacture |
EP98908812A EP0978146A4 (en) | 1997-03-04 | 1998-03-02 | Columnar-grained polycrystalline solar cell substrate and improved method of manufacture |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US3941897P | 1997-03-04 | 1997-03-04 | |
US60/039,418 | 1997-03-04 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1998039804A1 true WO1998039804A1 (en) | 1998-09-11 |
Family
ID=21905352
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1998/003972 WO1998039804A1 (en) | 1997-03-04 | 1998-03-02 | Columnar-grained polycrystalline solar cell substrate and improved method of manufacture |
Country Status (6)
Country | Link |
---|---|
US (2) | US6111191A (en) |
EP (1) | EP0978146A4 (en) |
JP (1) | JP2001516324A (en) |
AU (1) | AU739048B2 (en) |
CA (1) | CA2283334A1 (en) |
WO (1) | WO1998039804A1 (en) |
Cited By (1)
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---|---|---|---|---|
US8633483B2 (en) | 2007-06-26 | 2014-01-21 | Massachusetts Institute Of Technology | Recrystallization of semiconductor wafers in a thin film capsule and related processes |
Families Citing this family (50)
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AUPO638997A0 (en) * | 1997-04-23 | 1997-05-22 | Unisearch Limited | Metal contact scheme using selective silicon growth |
AU749571B2 (en) * | 1998-07-02 | 2002-06-27 | Astropower Inc. | Silicon thin-film, integrated solar cell, module, and methods of manufacturing the same |
US6472248B2 (en) * | 1999-07-04 | 2002-10-29 | Canon Kabushiki Kaisha | Microcrystalline series photovoltaic element and process for fabrication of same |
JP2003128411A (en) * | 2001-10-18 | 2003-05-08 | Sharp Corp | Silicon plate, method for producing silicon plate and solar cell |
DE10392291B4 (en) * | 2002-02-14 | 2013-01-31 | Rec Silicon Inc. | Energy-efficient process for growing polycrystalline silicon |
AU2003256825A1 (en) * | 2002-07-31 | 2004-02-16 | Astropower, Inc. | Method and apparatus for manufacturing net shape semiconductor wafers |
US20070034251A1 (en) * | 2003-07-25 | 2007-02-15 | Ge Energy (Usa) Llc | Semiconductor elements having zones of reduced oxygen |
US7777928B2 (en) * | 2005-02-28 | 2010-08-17 | Chad Byron Moore | Electrode enhancements for fiber-based displays |
US7656365B2 (en) * | 2005-03-28 | 2010-02-02 | Chad Byron Moore | Double-sided fiber-based displays |
US8106853B2 (en) * | 2005-12-12 | 2012-01-31 | Nupix, LLC | Wire-based flat panel displays |
US8089434B2 (en) | 2005-12-12 | 2012-01-03 | Nupix, LLC | Electroded polymer substrate with embedded wires for an electronic display |
US8166649B2 (en) * | 2005-12-12 | 2012-05-01 | Nupix, LLC | Method of forming an electroded sheet |
US7572334B2 (en) * | 2006-01-03 | 2009-08-11 | Applied Materials, Inc. | Apparatus for fabricating large-surface area polycrystalline silicon sheets for solar cell application |
JP2007213825A (en) * | 2006-02-07 | 2007-08-23 | Matsushita Electric Ind Co Ltd | Nonaqueous electrolyte secondary battery, anode activator and anode of the same, as well as manufacturing method of nonaqueous electrolyte secondary battery, anode activator, and anode of the same |
KR20080109778A (en) * | 2006-03-13 | 2008-12-17 | 나노그램 코포레이션 | Thin silicon or germanium sheets and photovoltaics formed from thin sheets |
WO2008060704A2 (en) * | 2006-06-02 | 2008-05-22 | Innovalight, Inc. | Photoactive materials containing group iv nanostructures and optoelectronic devices made therefrom |
US20080023070A1 (en) * | 2006-07-28 | 2008-01-31 | Sanjai Sinha | Methods and systems for manufacturing polycrystalline silicon and silicon-germanium solar cells |
US20080063855A1 (en) * | 2006-09-07 | 2008-03-13 | Maxim Kelman | Semiconductor thin films formed from group iv nanoparticles |
US20080072953A1 (en) * | 2006-09-27 | 2008-03-27 | Thinsilicon Corp. | Back contact device for photovoltaic cells and method of manufacturing a back contact device |
US7608146B2 (en) | 2006-09-28 | 2009-10-27 | Bp Corporation North America Inc. | Method and apparatus for the production of crystalline silicon substrates |
US7776724B2 (en) * | 2006-12-07 | 2010-08-17 | Innovalight, Inc. | Methods of filling a set of interstitial spaces of a nanoparticle thin film with a dielectric material |
US20080171425A1 (en) * | 2006-12-13 | 2008-07-17 | Dmitry Poplavskyy | Methods of forming an epitaxial layer on a group iv semiconductor substrate |
US7569462B2 (en) * | 2006-12-13 | 2009-08-04 | Applied Materials, Inc. | Directional crystallization of silicon sheets using rapid thermal processing |
US7718707B2 (en) * | 2006-12-21 | 2010-05-18 | Innovalight, Inc. | Method for preparing nanoparticle thin films |
JP4838703B2 (en) * | 2006-12-26 | 2011-12-14 | 富士電機株式会社 | Method for manufacturing disk substrate for magnetic recording medium, disk substrate for magnetic recording medium, method for manufacturing magnetic recording medium, magnetic recording medium, and magnetic recording apparatus |
JP5062767B2 (en) * | 2007-01-25 | 2012-10-31 | 独立行政法人産業技術総合研究所 | Silicon substrate manufacturing apparatus and manufacturing method |
JP2008184376A (en) * | 2007-01-31 | 2008-08-14 | Sharp Corp | Polycrystalline silicon, polycrystalline silicon substrate and its manufacturing method and photoelectric conversion element using polycrystal silicon substrate |
JP4411331B2 (en) * | 2007-03-19 | 2010-02-10 | 信越化学工業株式会社 | Silicon substrate for magnetic recording medium and manufacturing method thereof |
EP2140483A1 (en) * | 2007-04-04 | 2010-01-06 | Innovalight, Inc. | Methods for optimizing thin film formation with reactive gases |
US20080295882A1 (en) * | 2007-05-31 | 2008-12-04 | Thinsilicon Corporation | Photovoltaic device and method of manufacturing photovoltaic devices |
US8968438B2 (en) * | 2007-07-10 | 2015-03-03 | Innovalight, Inc. | Methods and apparatus for the in situ collection of nucleated particles |
US20090053878A1 (en) * | 2007-08-21 | 2009-02-26 | Maxim Kelman | Method for fabrication of semiconductor thin films using flash lamp processing |
US20090208770A1 (en) * | 2008-02-14 | 2009-08-20 | Ralf Jonczyk | Semiconductor sheets and methods for fabricating the same |
US7851336B2 (en) * | 2008-03-13 | 2010-12-14 | Innovalight, Inc. | Method of forming a passivated densified nanoparticle thin film on a substrate |
US8247312B2 (en) * | 2008-04-24 | 2012-08-21 | Innovalight, Inc. | Methods for printing an ink on a textured wafer surface |
US20090280336A1 (en) * | 2008-05-08 | 2009-11-12 | Ralf Jonczyk | Semiconductor sheets and methods of fabricating the same |
US8445364B2 (en) * | 2008-06-02 | 2013-05-21 | Corning Incorporated | Methods of treating semiconducting materials including melting and cooling |
US9567691B2 (en) * | 2008-06-20 | 2017-02-14 | Varian Semiconductor Equipment Associates, Inc. | Melt purification and delivery system |
US8049097B2 (en) * | 2008-08-11 | 2011-11-01 | General Electric Company | Solar cell including cooling channels and method for fabrication |
JP5436101B2 (en) * | 2008-09-05 | 2014-03-05 | 株式会社半導体エネルギー研究所 | Method for manufacturing semiconductor device |
KR20110114617A (en) * | 2009-01-07 | 2011-10-19 | 알이씨 실리콘 인코포레이티드 | Solidification of molten material over moving bed of divided solid material |
EP2356696A4 (en) * | 2009-05-06 | 2013-05-15 | Thinsilicon Corp | Photovoltaic cells and methods to enhance light trapping in semiconductor layer stacks |
US20110114156A1 (en) * | 2009-06-10 | 2011-05-19 | Thinsilicon Corporation | Photovoltaic modules having a built-in bypass diode and methods for manufacturing photovoltaic modules having a built-in bypass diode |
KR101247916B1 (en) * | 2009-06-10 | 2013-03-26 | 씬실리콘 코포레이션 | Photovoltaic modules and methods for manufacturing photovoltaic modules having tandem semiconductor layer stacks |
US20120273792A1 (en) * | 2010-01-20 | 2012-11-01 | Integrated Photovoltaic, Inc. | Zone Melt Recrystallization of Thin Films |
WO2011105538A1 (en) * | 2010-02-25 | 2011-09-01 | 産機電業株式会社 | Method for manufacturing solar cell using silicon powder |
US8168467B2 (en) * | 2010-03-17 | 2012-05-01 | James P Campbell | Solar cell method of fabrication via float glass process |
US8129215B1 (en) | 2011-04-01 | 2012-03-06 | James P Campbell | Method for producing high temperature thin film silicon layer on glass |
US8987583B2 (en) | 2012-12-01 | 2015-03-24 | Ann B Campbell | Variable optical density solar collector |
US10680281B2 (en) * | 2017-04-06 | 2020-06-09 | GM Global Technology Operations LLC | Sulfide and oxy-sulfide glass and glass-ceramic films for batteries incorporating metallic anodes |
Citations (3)
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---|---|---|---|---|
US4087571A (en) * | 1971-05-28 | 1978-05-02 | Fairchild Camera And Instrument Corporation | Controlled temperature polycrystalline silicon nucleation |
US5279686A (en) * | 1991-02-20 | 1994-01-18 | Canon Kabushiki Kaisha | Solar cell and method for producing the same |
US5336335A (en) * | 1992-10-09 | 1994-08-09 | Astropower, Inc. | Columnar-grained polycrystalline solar cell and process of manufacture |
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US5057163A (en) * | 1988-05-04 | 1991-10-15 | Astropower, Inc. | Deposited-silicon film solar cell |
DE4133644A1 (en) * | 1991-10-11 | 1993-04-15 | Nukem Gmbh | SEMICONDUCTOR COMPONENT, METHOD FOR THE PRODUCTION THEREOF AND THE ARRANGEMENT USED FOR THIS |
JP3322440B2 (en) * | 1993-06-24 | 2002-09-09 | 三洋電機株式会社 | Method for producing thin-film polycrystalline silicon |
-
1998
- 1998-03-02 AU AU66754/98A patent/AU739048B2/en not_active Ceased
- 1998-03-02 WO PCT/US1998/003972 patent/WO1998039804A1/en active Search and Examination
- 1998-03-02 US US09/033,155 patent/US6111191A/en not_active Expired - Lifetime
- 1998-03-02 CA CA002283334A patent/CA2283334A1/en not_active Abandoned
- 1998-03-02 EP EP98908812A patent/EP0978146A4/en not_active Withdrawn
- 1998-03-02 JP JP53863598A patent/JP2001516324A/en active Pending
-
2000
- 2000-02-01 US US09/495,853 patent/US6207891B1/en not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4087571A (en) * | 1971-05-28 | 1978-05-02 | Fairchild Camera And Instrument Corporation | Controlled temperature polycrystalline silicon nucleation |
US5279686A (en) * | 1991-02-20 | 1994-01-18 | Canon Kabushiki Kaisha | Solar cell and method for producing the same |
US5336335A (en) * | 1992-10-09 | 1994-08-09 | Astropower, Inc. | Columnar-grained polycrystalline solar cell and process of manufacture |
US5496416A (en) * | 1992-10-09 | 1996-03-05 | Astropower, Inc. | Columnar-grained polycrystalline solar cell and process of manufacture |
Non-Patent Citations (1)
Title |
---|
See also references of EP0978146A4 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8633483B2 (en) | 2007-06-26 | 2014-01-21 | Massachusetts Institute Of Technology | Recrystallization of semiconductor wafers in a thin film capsule and related processes |
US9932689B2 (en) | 2007-06-26 | 2018-04-03 | Massachusetts Institute Of Technology | Semiconductor wafers recrystallized in a partially surrounding thin film capsule |
Also Published As
Publication number | Publication date |
---|---|
US6111191A (en) | 2000-08-29 |
JP2001516324A (en) | 2001-09-25 |
CA2283334A1 (en) | 1998-09-11 |
EP0978146A1 (en) | 2000-02-09 |
AU6675498A (en) | 1998-09-22 |
US6207891B1 (en) | 2001-03-27 |
EP0978146A4 (en) | 2000-08-09 |
AU739048B2 (en) | 2001-10-04 |
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