WO1998039732A3 - Chipkartenmodul und diesen umfassende chipkarte - Google Patents

Chipkartenmodul und diesen umfassende chipkarte Download PDF

Info

Publication number
WO1998039732A3
WO1998039732A3 PCT/DE1998/000602 DE9800602W WO9839732A3 WO 1998039732 A3 WO1998039732 A3 WO 1998039732A3 DE 9800602 W DE9800602 W DE 9800602W WO 9839732 A3 WO9839732 A3 WO 9839732A3
Authority
WO
WIPO (PCT)
Prior art keywords
chip card
chip
card module
module
contact surfaces
Prior art date
Application number
PCT/DE1998/000602
Other languages
English (en)
French (fr)
Other versions
WO1998039732A2 (de
Inventor
Josef Mundigl
Detlef Houdeau
Peter Stampka
Michael Huber
Frank Pueschner
Original Assignee
Siemens Ag
Josef Mundigl
Detlef Houdeau
Peter Stampka
Michael Huber
Frank Pueschner
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag, Josef Mundigl, Detlef Houdeau, Peter Stampka, Michael Huber, Frank Pueschner filed Critical Siemens Ag
Publication of WO1998039732A2 publication Critical patent/WO1998039732A2/de
Publication of WO1998039732A3 publication Critical patent/WO1998039732A3/de

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

Die Erfindung betrifft einen Chipkartenmodul (1), welcher einen Chipträger (2), elektrisch leitende Kontaktflächen (3) und einen Halbleiterchip umfaßt, worin dieser Halbleiterchip in einem SMT-Gehäuse (4) angeordnet ist und die Kontaktierung mit den Kontaktflächen (3) über die nach außen aus dem Gehäuse (4) geführten Anschlußbeine (5) erfolgt. Die erfindungsgemäßen Chipkartenmodule sind einfach herstellbar und können in einer geringen Bauteilhöhe realisiert werden. Zudem ist der Halbleiterchip gut gegen mechanische Beschädigungen geschützt. Die Erfindung betrifft außerdem eine Chipkarte (7), die den erfindungsgemäßen Chipkartenmodul (1) umfaßt.
PCT/DE1998/000602 1997-03-03 1998-03-02 Chipkartenmodul und diesen umfassende chipkarte WO1998039732A2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19708615.2 1997-03-03
DE1997108615 DE19708615C1 (de) 1997-03-03 1997-03-03 Chipkartenmodul und diesen umfassende Chipkarte

Publications (2)

Publication Number Publication Date
WO1998039732A2 WO1998039732A2 (de) 1998-09-11
WO1998039732A3 true WO1998039732A3 (de) 1998-12-17

Family

ID=7822092

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1998/000602 WO1998039732A2 (de) 1997-03-03 1998-03-02 Chipkartenmodul und diesen umfassende chipkarte

Country Status (2)

Country Link
DE (1) DE19708615C1 (de)
WO (1) WO1998039732A2 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19921230B4 (de) * 1999-05-07 2009-04-02 Giesecke & Devrient Gmbh Verfahren zum Handhaben von gedünnten Chips zum Einbringen in Chipkarten
DE10248386B4 (de) * 2002-10-17 2006-08-31 Giesecke & Devrient Gmbh Tragbarer elektronischer Datenträger mit integriertem Display
DE10311696A1 (de) * 2003-03-17 2004-10-07 Infineon Technologies Ag Chipkarte
DE10324043B4 (de) * 2003-05-27 2006-08-31 Giesecke & Devrient Gmbh Kartenförmiger elektronischer Datenträger, Funktionsinlett dafür und ihre Herstellungsverfahren
EP1676471B1 (de) * 2003-10-15 2011-06-01 Chimei InnoLux Corporation Elektronisches bauelement und verfahren zu dessen herstellung
DE112017000497T5 (de) * 2016-03-29 2018-11-15 Sekisui Polymatech Co., Ltd. Flexible Leiterplatte und Verfahren zur Herstellung einer flexiblen Leiterplatte

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2617668A1 (fr) * 1987-07-03 1989-01-06 Radiotechnique Compelec Dispositif comportant un circuit electronique monte sur un support souple et carte souple le comprenant
EP0424262A1 (de) * 1989-10-20 1991-04-24 STMicroelectronics S.A. Tragbare, mit Bausteinen verbindbare Elektronik
DE4022829A1 (de) * 1990-07-18 1992-01-23 Werner Vogt Tragbare speicherkarte
FR2684236A1 (fr) * 1991-11-27 1993-05-28 Gemplus Card Int Dispositif de connexion de circuit integre.
DE19620025A1 (de) * 1996-05-17 1997-11-20 Siemens Ag Trägerelement für einen Halbleiterchip

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19500925C2 (de) * 1995-01-16 1999-04-08 Orga Kartensysteme Gmbh Verfahren zur Herstellung einer kontaktlosen Chipkarte

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2617668A1 (fr) * 1987-07-03 1989-01-06 Radiotechnique Compelec Dispositif comportant un circuit electronique monte sur un support souple et carte souple le comprenant
EP0424262A1 (de) * 1989-10-20 1991-04-24 STMicroelectronics S.A. Tragbare, mit Bausteinen verbindbare Elektronik
DE4022829A1 (de) * 1990-07-18 1992-01-23 Werner Vogt Tragbare speicherkarte
FR2684236A1 (fr) * 1991-11-27 1993-05-28 Gemplus Card Int Dispositif de connexion de circuit integre.
DE19620025A1 (de) * 1996-05-17 1997-11-20 Siemens Ag Trägerelement für einen Halbleiterchip

Also Published As

Publication number Publication date
WO1998039732A2 (de) 1998-09-11
DE19708615C1 (de) 1998-07-23

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