WO1998034451A1 - Methods and compositions for ionizing radiation shielding - Google Patents
Methods and compositions for ionizing radiation shielding Download PDFInfo
- Publication number
- WO1998034451A1 WO1998034451A1 PCT/IB1998/000207 IB9800207W WO9834451A1 WO 1998034451 A1 WO1998034451 A1 WO 1998034451A1 IB 9800207 W IB9800207 W IB 9800207W WO 9834451 A1 WO9834451 A1 WO 9834451A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- composition according
- radiation
- radiation shielding
- shielding composition
- shielding
- Prior art date
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3135—Double encapsulation or coating and encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01077—Iridium [Ir]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2924/01079—Gold [Au]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU57775/98A AU5777598A (en) | 1997-01-30 | 1998-01-06 | Methods and compositions for ionizing radiation shielding |
CA002278838A CA2278838A1 (en) | 1997-01-30 | 1998-01-06 | Methods and compositions for ionizing radiation shielding |
JP53267698A JP2001511202A (en) | 1997-01-30 | 1998-01-06 | Cross-reference to methods and compositions for ionizing radiation shielding materials |
EP98901469.1A EP0956749B1 (en) | 1997-01-30 | 1998-01-06 | Methods and compositions for ionizing radiation shielding |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US79125697A | 1997-01-30 | 1997-01-30 | |
US08/791,256 | 1997-01-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO1998034451A1 true WO1998034451A1 (en) | 1998-08-06 |
WO1998034451B1 WO1998034451B1 (en) | 1998-10-15 |
Family
ID=25153139
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/IB1998/000207 WO1998034451A1 (en) | 1997-01-30 | 1998-01-06 | Methods and compositions for ionizing radiation shielding |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0956749B1 (en) |
JP (1) | JP2001511202A (en) |
AU (1) | AU5777598A (en) |
CA (1) | CA2278838A1 (en) |
WO (1) | WO1998034451A1 (en) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2000026964A1 (en) * | 1998-11-03 | 2000-05-11 | Aeroflex Utmc Microelectronic Systems Inc. | Raised pedestal radiation shield for sensitive electronics |
WO2000071173A2 (en) * | 1999-05-21 | 2000-11-30 | Minimed Inc. | Device and method for circuit protection during radiation sterilization |
WO2002043146A1 (en) * | 2000-11-21 | 2002-05-30 | Kerafol Keramische Folien Gmbh | Ferrite film |
WO2002043456A2 (en) * | 2000-11-20 | 2002-05-30 | Parker-Hannifin, Inc. | Interference mitigation through conductive thermoplastic composite materials |
US6594156B1 (en) | 2000-04-24 | 2003-07-15 | Minimed Inc. | Device and method for circuit protection during radiation sterilization |
US9293680B2 (en) | 2011-06-06 | 2016-03-22 | Gentherm Incorporated | Cartridge-based thermoelectric systems |
US9306143B2 (en) | 2012-08-01 | 2016-04-05 | Gentherm Incorporated | High efficiency thermoelectric generation |
US9719701B2 (en) | 2008-06-03 | 2017-08-01 | Gentherm Incorporated | Thermoelectric heat pump |
US10270141B2 (en) | 2013-01-30 | 2019-04-23 | Gentherm Incorporated | Thermoelectric-based thermal management system |
US10991869B2 (en) | 2018-07-30 | 2021-04-27 | Gentherm Incorporated | Thermoelectric device having a plurality of sealing materials |
US11152557B2 (en) | 2019-02-20 | 2021-10-19 | Gentherm Incorporated | Thermoelectric module with integrated printed circuit board |
CN113990540A (en) * | 2021-09-28 | 2022-01-28 | 哈尔滨工业大学 | Flash device resistant to heavy ion single event effect and preparation method thereof |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4509806B2 (en) * | 2005-01-18 | 2010-07-21 | 株式会社日立メディコ | IC package and X-ray CT apparatus using the same |
KR101171733B1 (en) * | 2009-09-03 | 2012-08-10 | 박영웅 | Packing Materials of Semiconductor Integrated Circuit for Single Type Package which Contains Tungsten Compounds |
US20140106635A1 (en) * | 2011-09-23 | 2014-04-17 | Planideia Confecção De Vestuário De Proteção Ltda. -Epp | Radiopaque carbon-carbon linked elastomeric materials, preparation method and uses of same |
JP6173664B2 (en) * | 2012-08-07 | 2017-08-02 | 櫻護謨株式会社 | Rubber sheet, rubber hose and rubber bag |
JP6046428B2 (en) * | 2012-09-07 | 2016-12-14 | 帝人株式会社 | Radiation shielding sheet |
JP6433134B2 (en) * | 2013-03-19 | 2018-12-05 | 株式会社ディ・アンド・ディ | Coating type radiation shielding material |
CN105720042A (en) * | 2016-02-03 | 2016-06-29 | 中电海康集团有限公司 | Anti-interference processing method for electronic parts and components |
US11011473B2 (en) | 2018-12-17 | 2021-05-18 | Samsung Electronics Co., Ltd. | Semiconductor package |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5202536A (en) * | 1992-02-03 | 1993-04-13 | Schlegel Corporation | EMI shielding seal with partial conductive sheath |
US5304750A (en) * | 1988-05-27 | 1994-04-19 | G + H Montage Gmbh | Absorber for electromagnetic and acoustic waves |
US5561265A (en) * | 1993-03-24 | 1996-10-01 | Northern Telecom Limited | Integrated circuit packaging |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1291721A (en) * | 1969-05-29 | 1972-10-04 | Atomic Energy Authority Uk | Improvements in nuclear reactors |
JPS60179696A (en) * | 1984-02-27 | 1985-09-13 | 三菱電線工業株式会社 | Radiation shielding material |
FR2570001B1 (en) * | 1984-09-07 | 1987-04-03 | Tech Milieu Ionisant | PROCESS FOR THE DEPOSITION OF A MATERIAL CONSTITUTED IN MAJOR PART BY A METAL, AN ALLOY, BORON AND / OR A CERAMIC SUBSTANCE, USEFUL FOR THE PRODUCTION OF ARMORING OR BIOLOGICAL SCREENS |
FR2584853B1 (en) * | 1985-07-12 | 1992-02-21 | Inf Milit Spatiale Aeronaut | DEVICE FOR HARDENING, BY INSERTS, AN ELECTRONIC COMPONENT WITH RESPECT TO RADIATION |
US5160374A (en) * | 1990-07-24 | 1992-11-03 | The United States Of America As Represented By The Secretary Of The Air Force | Process and apparatus for preventing the pulse discharge of insulators in ionizing radiation |
JPH0827388B2 (en) * | 1990-11-08 | 1996-03-21 | 動力炉・核燃料開発事業団 | Heat resistant radiation shielding material |
-
1998
- 1998-01-06 CA CA002278838A patent/CA2278838A1/en not_active Abandoned
- 1998-01-06 WO PCT/IB1998/000207 patent/WO1998034451A1/en active Application Filing
- 1998-01-06 EP EP98901469.1A patent/EP0956749B1/en not_active Expired - Lifetime
- 1998-01-06 JP JP53267698A patent/JP2001511202A/en active Pending
- 1998-01-06 AU AU57775/98A patent/AU5777598A/en not_active Abandoned
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5304750A (en) * | 1988-05-27 | 1994-04-19 | G + H Montage Gmbh | Absorber for electromagnetic and acoustic waves |
US5202536A (en) * | 1992-02-03 | 1993-04-13 | Schlegel Corporation | EMI shielding seal with partial conductive sheath |
US5561265A (en) * | 1993-03-24 | 1996-10-01 | Northern Telecom Limited | Integrated circuit packaging |
Non-Patent Citations (1)
Title |
---|
See also references of EP0956749A4 * |
Cited By (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2000026964A1 (en) * | 1998-11-03 | 2000-05-11 | Aeroflex Utmc Microelectronic Systems Inc. | Raised pedestal radiation shield for sensitive electronics |
WO2000071173A2 (en) * | 1999-05-21 | 2000-11-30 | Minimed Inc. | Device and method for circuit protection during radiation sterilization |
WO2000071173A3 (en) * | 1999-05-21 | 2001-04-19 | Minimed Inc | Device and method for circuit protection during radiation sterilization |
US6594156B1 (en) | 2000-04-24 | 2003-07-15 | Minimed Inc. | Device and method for circuit protection during radiation sterilization |
US6880242B2 (en) | 2000-04-24 | 2005-04-19 | Minimed Inc. | Method for circuit protection during radiation sterilization |
WO2002043456A2 (en) * | 2000-11-20 | 2002-05-30 | Parker-Hannifin, Inc. | Interference mitigation through conductive thermoplastic composite materials |
WO2002043456A3 (en) * | 2000-11-20 | 2003-05-22 | Parker Hannifin Inc | Interference mitigation through conductive thermoplastic composite materials |
WO2002043146A1 (en) * | 2000-11-21 | 2002-05-30 | Kerafol Keramische Folien Gmbh | Ferrite film |
US10473365B2 (en) | 2008-06-03 | 2019-11-12 | Gentherm Incorporated | Thermoelectric heat pump |
US9719701B2 (en) | 2008-06-03 | 2017-08-01 | Gentherm Incorporated | Thermoelectric heat pump |
US9293680B2 (en) | 2011-06-06 | 2016-03-22 | Gentherm Incorporated | Cartridge-based thermoelectric systems |
US9306143B2 (en) | 2012-08-01 | 2016-04-05 | Gentherm Incorporated | High efficiency thermoelectric generation |
US10270141B2 (en) | 2013-01-30 | 2019-04-23 | Gentherm Incorporated | Thermoelectric-based thermal management system |
US10784546B2 (en) | 2013-01-30 | 2020-09-22 | Gentherm Incorporated | Thermoelectric-based thermal management system |
US10991869B2 (en) | 2018-07-30 | 2021-04-27 | Gentherm Incorporated | Thermoelectric device having a plurality of sealing materials |
US11075331B2 (en) | 2018-07-30 | 2021-07-27 | Gentherm Incorporated | Thermoelectric device having circuitry with structural rigidity |
US11223004B2 (en) | 2018-07-30 | 2022-01-11 | Gentherm Incorporated | Thermoelectric device having a polymeric coating |
US11152557B2 (en) | 2019-02-20 | 2021-10-19 | Gentherm Incorporated | Thermoelectric module with integrated printed circuit board |
CN113990540A (en) * | 2021-09-28 | 2022-01-28 | 哈尔滨工业大学 | Flash device resistant to heavy ion single event effect and preparation method thereof |
Also Published As
Publication number | Publication date |
---|---|
AU5777598A (en) | 1998-08-25 |
EP0956749A4 (en) | 2006-02-08 |
CA2278838A1 (en) | 1998-08-06 |
EP0956749B1 (en) | 2015-05-27 |
EP0956749A1 (en) | 1999-11-17 |
JP2001511202A (en) | 2001-08-07 |
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